CN210351763U - Dampproofing and waterproofing's integrated circuit board - Google Patents
Dampproofing and waterproofing's integrated circuit board Download PDFInfo
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- CN210351763U CN210351763U CN201920890852.0U CN201920890852U CN210351763U CN 210351763 U CN210351763 U CN 210351763U CN 201920890852 U CN201920890852 U CN 201920890852U CN 210351763 U CN210351763 U CN 210351763U
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Abstract
The utility model discloses a dampproofing and waterproofing's integrated circuit board, including the circuit base plate layer, fixedly connected with panel layer on the circuit base plate layer, the waterproof rete of fixedly connected with on the panel layer, be equipped with the heat dissipation chamber between waterproof rete and the panel layer, fixedly connected with backup pad on the heat dissipation chamber, be equipped with the heat dissipation passageway between hem portion and the waterproof rete, the fixed internal thread pipe of bottom four corners department fixedly connected with on the circuit base plate layer. The heat that the device circuit board produced is discharged through heat dissipation chamber and heat dissipation channel, simultaneously through heat conduction silicone grease layer, heat conduction efficiency has been strengthened greatly to heat conduction copper sheet and heat conduction silica gel piece, circuit board radiating efficiency has been improved, effectively avoided because the heat piles up the phenomenon that causes circuit board high temperature and humidity, the life of circuit board has been prolonged, simultaneously through waterproof membrane layer, the cooperation of silica gel drier layer and bleeder vent, be convenient for carry out dry absorption to the steam by heat production, waterproof and dampproofing effect has been strengthened.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to dampproofing and waterproofing's integrated circuit board.
Background
The integrated circuit board is a carrier for loading an integrated circuit, but the integrated circuit board is usually taken on, and the integrated circuit board is mainly formed by silica gel, so the integrated circuit board is generally green, and the integrated circuit board with a waterproof and moistureproof structure at present is usually provided with a waterproof film directly on the circuit board, so the heat dissipation efficiency of the circuit board is seriously influenced, the high temperature of the circuit board generates steam, and the waterproof and moistureproof effect on the circuit board is poor and needs to be improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a dampproofing and waterproofing's integrated circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a dampproofing and waterproofing's integrated circuit board, includes circuit substrate layer, fixedly connected with panel layer on the circuit substrate layer, the waterproof rete of fixedly connected with on the panel layer, be equipped with the heat dissipation chamber between waterproof rete and the panel layer, fixedly connected with backup pad on the heat dissipation chamber, fixedly connected with heat conduction copper sheet on the lateral wall of backup pad, the inside packing of waterproof rete has silica gel drier layer, the both sides integration fixedly connected with hem portion of waterproof rete, be equipped with the heat dissipation passageway between hem portion and the waterproof rete, the fixed internal thread pipe of bottom four corners fixedly connected with on circuit substrate layer department.
Preferably, the waterproof membrane layer is internally provided with an installation cavity which is matched and connected with the silica gel desiccant layer.
This setting is convenient for install silica gel drier layer, simultaneously through the combined action of waterproof rete and silica gel drier layer, is convenient for carry out waterproof, dampproofing, dry protection of moulding mildew to the circuit board.
Preferably, the bottom of the installation cavity is provided with air holes which are uniformly distributed and communicated with the heat dissipation cavity.
This setting is convenient for silica gel drier layer and heat dissipation chamber layer to carry out abundant contact to be convenient for carry out the drying absorption to the steam by heat production, dampproofing effectual.
Preferably, the upper end of the panel layer is coated with a heat-conducting silicone layer.
This setting has strengthened heat conduction efficiency, is convenient for improve the radiating efficiency of circuit board to be favorable to prolonging its life.
Preferably, a heat-conducting silica gel sheet is fixedly connected to the inner side of the edge folding part.
This setting has further strengthened heat conduction efficiency of heat dissipation channel to be favorable to further improving circuit board radiating efficiency, effectively avoided because the heat piles up the phenomenon that causes high temperature and steam, it is good to the protective effect of circuit board.
Preferably, the outer wall of the bottom of the fixed internal thread pipe is fixedly connected with an anti-slip gasket.
This setting is convenient for the circuit board installation and is used, and the steadiness is high, and the installation is firm.
Compared with the prior art, the utility model discloses a technological effect and advantage: this dampproofing and waterproofing's integrated circuit board, the heat that the circuit board produced is discharged through heat dissipation chamber and heat dissipation channel, simultaneously through heat conduction silicone grease layer, heat conduction efficiency has been strengthened greatly to heat conduction copper sheet and heat conduction silica gel piece, circuit board radiating efficiency has been improved, effectively avoided because the heat piles up the phenomenon that causes circuit board high temperature and humidity, the life of circuit board has been prolonged, simultaneously through waterproof membrane layer, the cooperation of silica gel drier layer and bleeder vent, be convenient for carry out dry absorption to the steam by heat production, dampproofing and waterproofing effect has effectively been strengthened.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention;
fig. 3 is the bottom structure diagram of the installation cavity of the present invention.
In the figure: 1. a circuit substrate layer; 2. fixing the internal threaded pipe; 3. an anti-slip gasket; 4. a panel layer; 5. a thermally conductive silicone layer; 6. a waterproof film layer; 7. a mounting cavity; 8. a silica gel desiccant layer; 9. air holes are formed; 10. a support plate; 11. a heat dissipation cavity; 12. a thermally conductive copper sheet; 13. a hem part; 14. a heat dissipation channel; 15. a heat-conducting silica gel sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-3, a dampproofing and waterproofing's integrated circuit board, including circuit substrate layer 1, fixedly connected with panel layer 4 on the circuit substrate layer 1, the waterproof rete 6 of fixedly connected with on the panel layer 4, be equipped with heat dissipation chamber 11 between waterproof rete 6 and the panel layer 4, fixedly connected with backup pad 10 on the heat dissipation chamber 11, fixedly connected with heat conduction copper sheet 12 on the lateral wall of backup pad 10, the inside packing of waterproof rete 6 has silica gel drier layer 8, the both sides integration fixedly connected with hem portion 13 of waterproof rete 6, be equipped with heat dissipation channel 14 between hem portion 13 and the waterproof rete 6, the fixed internal thread pipe 2 of bottom four corners fixedly connected with on circuit substrate layer 1.
The waterproof membrane layer 6 is internally provided with an installation cavity 7 which is matched and connected with the silica gel desiccant layer 8; be convenient for install silica gel drier layer 8, simultaneously through the combined action of waterproof rete 6 and silica gel drier layer 8, be convenient for carry out waterproof, dampproofing, dry protection of moulding mildew to the circuit board.
The bottom of the mounting cavity 7 is provided with air holes 9 which are uniformly distributed, and the air holes 9 are communicated with the heat dissipation cavity 11; the silica gel desiccant layer 8 and the heat dissipation cavity 11 layer are in full contact conveniently, so that steam generated by heat is dried and absorbed conveniently, and the moisture-proof effect is good.
The upper end of the panel layer 4 is coated with a heat-conducting silicone layer 5; the heat conduction efficiency is enhanced, the heat dissipation efficiency of the circuit board is convenient to improve, and the service life of the circuit board is prolonged.
A heat-conducting silica gel sheet 15 is fixedly connected to the inner side of the edge folding part 13; the heat conduction efficiency of the heat dissipation channel 14 is further enhanced, so that the heat dissipation efficiency of the circuit board is further improved, the phenomena of high temperature and steam caused by heat accumulation are effectively avoided, and the protection effect on the circuit board is good.
The outer wall of the bottom of the fixed internal threaded pipe 2 is fixedly connected with an anti-skid gasket 3; the circuit board installation of being convenient for is used, and the steadiness is high, and the installation is firm.
It is specific, during the use, the heat that the circuit board produced is discharged through heat dissipation chamber 11 and heat dissipation channel 14, simultaneously through heat conduction silicone grease layer 5, heat conduction copper sheet 12 and heat conduction silica gel piece 15 have strengthened heat conduction efficiency greatly, circuit board radiating efficiency has been improved, effectively avoided because the heat piles up the phenomenon that causes circuit board high temperature and humidity, the life of circuit board has been prolonged, simultaneously through waterproof rete 6, the cooperation of silica gel drier layer 8 and bleeder vent 9, be convenient for carry out the drying absorption to the steam by heat production, the dampproofing and waterproofing effect has effectively been strengthened.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. A dampproofing and waterproofing's integrated circuit board, includes circuit base plate layer (1), its characterized in that: fixedly connected with panel layer (4) on circuit base plate layer (1), waterproof rete (6) of fixedly connected with is gone up on panel layer (4), be equipped with heat dissipation chamber (11) between waterproof rete (6) and panel layer (4), fixedly connected with backup pad (10) is gone up in heat dissipation chamber (11), fixedly connected with heat conduction copper sheet (12) on the lateral wall of backup pad (10), the inside packing of waterproof rete (6) has silica gel drier layer (8), the both sides integration fixedly connected with hem portion (13) of waterproof rete (6), be equipped with heat dissipation channel (14) between hem portion (13) and waterproof rete (6), the fixed internal thread pipe (2) of bottom four corners fixedly connected with of circuit base plate layer (1).
2. The moisture and water resistant integrated circuit board of claim 1, wherein: the waterproof film layer (6) is internally provided with an installation cavity (7) which is connected with the silica gel desiccant layer (8) in a matching way.
3. The integrated circuit board of claim 2, wherein: the bottom of the mounting cavity (7) is provided with air holes (9) which are uniformly distributed, and the air holes (9) are communicated with the heat dissipation cavity (11).
4. The moisture and water resistant integrated circuit board of claim 1, wherein: the upper end of the panel layer (4) is coated with a heat-conducting silicone grease layer (5).
5. The moisture and water resistant integrated circuit board of claim 1, wherein: and a heat-conducting silica gel sheet (15) is fixedly connected to the inner side of the flanging part (13).
6. The moisture and water resistant integrated circuit board of claim 1, wherein: and an anti-slip gasket (3) is fixedly connected to the outer wall of the bottom of the fixed internal thread pipe (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920890852.0U CN210351763U (en) | 2019-06-14 | 2019-06-14 | Dampproofing and waterproofing's integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920890852.0U CN210351763U (en) | 2019-06-14 | 2019-06-14 | Dampproofing and waterproofing's integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351763U true CN210351763U (en) | 2020-04-17 |
Family
ID=70185798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920890852.0U Expired - Fee Related CN210351763U (en) | 2019-06-14 | 2019-06-14 | Dampproofing and waterproofing's integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210351763U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112283645A (en) * | 2020-11-11 | 2021-01-29 | 苏州市东莱德照明有限公司 | Matrix LED open-air panel lamp |
| CN112888151A (en) * | 2021-01-12 | 2021-06-01 | 兴宁市精维进电子有限公司 | High-density high-frequency multilayer flexible circuit board |
-
2019
- 2019-06-14 CN CN201920890852.0U patent/CN210351763U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112283645A (en) * | 2020-11-11 | 2021-01-29 | 苏州市东莱德照明有限公司 | Matrix LED open-air panel lamp |
| CN112283645B (en) * | 2020-11-11 | 2022-05-20 | 苏州市东莱德照明有限公司 | Matrix LED open-air panel lamp |
| CN112888151A (en) * | 2021-01-12 | 2021-06-01 | 兴宁市精维进电子有限公司 | High-density high-frequency multilayer flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200417 |