CN210982990U - Display device - Google Patents

Abstract

The utility model discloses a display device, including backlight unit and display panel, backlight unit includes the circuit board, miniature emitting diode, protective layer and transparent substrate, set up the laminating layer between protective layer and transparent substrate, be used for laminating protective layer and transparent substrate, the refracting index of laminating layer is greater than transparent substrate's refracting index, adopt laminating layer closely with protective layer and transparent substrate after, light is emergent angle increase behind transparent substrate, make emergent light coverage increase, from this can make the light of Mini L ED outgoing to the boundary position diffusion between the adjacent Mini L ED, thereby make the emergent luminance of the light directly over Mini L ED more be close with boundary position's emergent luminance, improve the uneven problem of backlight unit luminance.

Description

Display device

Technical Field

The utility model relates to a show technical field, especially relate to a display device.

Background

With the development of display technology, liquid crystal display technology is widely used in the display field. The lcd panel itself cannot emit light, and the backlight module is required to provide the required brightness for displaying. Due to the limitation of the characteristics of the liquid crystal panel, light leakage occurs to different degrees, and the improvement of the contrast ratio has a bottleneck. Therefore, a scheme for performing local dimming (local dimming) on the backlight module is provided, and backlights in different areas can be independently controlled, so that when the backlight brightness corresponding to a high-brightness part in a displayed image can be maximized, and the backlight brightness corresponding to a dark part in the image can be reduced, so that the displayed image can achieve better contrast.

The micro light Emitting Diode (Mini L light Emitting Diode, abbreviated as Mini L ED) as backlight has become a current hotspot in the liquid crystal display technology, and is different from the traditional liquid crystal display backlight scheme adopting the lateral entrance of a light guide plate, and a huge amount of Mini L ED is adopted as a backlight source, so that the backlight thinning can be realized, the more refined dynamic control can be realized, and the dynamic contrast of the liquid crystal display is improved.

The Mini L ED lamp plate can be through the luminous of circuit board drive Mini L ED after each Mini L ED chip of welding, the emergent light of Mini L ED incides the air gap earlier and then incides optical film layers such as diffuser plate, because the refracting index of air medium is little, when inciting into the diffusion layer, because the refraction effect of light, the emergence of light is little can reduce, make the facula scope of final irradiation on the diffuser plate less, thereby it is lighter above Mini L ED to lead to backlight unit, the uneven problem of luminance that the position is darker at two Mini L ED junctions.

SUMMERY OF THE UTILITY MODEL

The utility model provides a display device for increase Mini L ED's light-emitting irradiation range changes the uneven problem of backlight unit luminance.

The utility model provides a display device, include:

the backlight module is used for providing backlight;

the display panel is positioned on the light emitting side of the backlight module and used for displaying images;

the backlight module includes:

the miniature light-emitting diode lamp panel is used as a backlight source;

the miniature LED lamp plate includes:

the circuit board has the functions of bearing and supporting and is used for providing power;

the micro light-emitting diode is positioned on the circuit board;

the protective layer covers the micro light-emitting diode and the circuit board and is used for packaging and protecting the micro light-emitting diode;

the backlight module further comprises:

the transparent substrate is positioned on one side of the protective layer, which is far away from the micro light-emitting diode;

the laminating layer is positioned between the protective layer and the transparent substrate and is used for laminating the protective layer and the transparent substrate; the refractive index of the laminating layer is larger than that of the transparent substrate.

In a possible implementation manner, in the above display device provided by the present invention, the refractive index of the adhesion layer is greater than or equal to the refractive index of the protection layer.

In a possible implementation manner, in the display device provided by the present invention, the refractive index of the protective layer is 1.4 to 1.6.

In a possible implementation manner, in the display device provided by the present invention, the refractive index of the transparent substrate is 1.4 to 1.5.

In a possible implementation manner, in the above display device provided by the present invention, the thickness of the adhesion layer is less than 0.1 mm.

In a possible implementation manner, in the above display device provided by the present invention, the thickness of the transparent substrate satisfies the light mixing distance of the micro light emitting diode.

In a possible implementation manner, in the display device provided by the present invention, the thickness of the transparent substrate is 1mm to 3 mm.

In a possible implementation manner, the utility model provides an in the above-mentioned display device, the miniature light emitting diode lamp plate still includes:

the reflecting coating is positioned on one side of the circuit board close to the micro light-emitting diode; the reflective coating includes a fenestration for exposing the micro light-emitting diode.

In a possible implementation manner, in the display device provided by the present invention, the size of the micro light emitting diode is 50 μm to 300 μm.

In a possible implementation manner, in the above display device provided by the present invention, the backlight module further includes:

the diffusion plate is positioned on one side of the transparent substrate, which is far away from the protective layer;

and the optical membrane is positioned on one side of the diffusion plate, which is far away from the transparent substrate.

The utility model discloses beneficial effect as follows:

the utility model provides a display device, including backlight unit, a display panel, be located backlight unit's light-emitting side, be used for image display, backlight unit includes miniature emitting diode lamp plate, as the backlight, miniature emitting diode lamp plate includes the circuit board, has the bearing and support effect, be used for providing electric power, miniature emitting diode, be located the circuit board, the protective layer covers miniature emitting diode and circuit board, be used for the encapsulation protection miniature emitting diode, backlight unit still includes the transparent substrate, be located the protective layer and deviate from one side of miniature emitting diode, and the laminating layer is located between protective layer and the transparent substrate, be used for laminating protective layer and transparent substrate, the refracting index of laminating layer is greater than the refracting index of transparent substrate, adopt the laminating layer closely with protective layer and transparent substrate after, do not have the air bed between protective layer and the transparent substrate, because the refracting index of laminating layer is greater than the refracting index of transparent substrate, the outgoing angle when consequently light incides to transparent substrate by the laminating layer can increase, make the emergent light of Mini L ED to the boundary position diffusion between the adjacent Mini L ED, thereby make the uneven border position of the light just above the MIN L and the laminating light near the luminance problem of backlight unit more improvement.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a backlight module according to an embodiment of the present invention;

fig. 3 is one of emergent light path diagrams of a backlight module according to an embodiment of the present invention;

fig. 4 is a second outgoing light path diagram of the backlight module according to the embodiment of the present invention;

fig. 5 is a third outgoing light path diagram of the backlight module according to the embodiment of the present invention;

fig. 6 is a fourth light path diagram of the backlight module according to the embodiment of the present invention;

fig. 7 is a second schematic cross-sectional view illustrating a backlight module according to an embodiment of the present invention;

fig. 8 is a schematic top view of a backlight module according to an embodiment of the present invention;

fig. 9 is a third schematic cross-sectional view of a backlight module according to an embodiment of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words for expressing the position and direction described in the present invention are all the explanations given by taking the drawings as examples, but can be changed according to the needs, and the changes are all included in the protection scope of the present invention. The drawings of the present invention are only for illustrating the relative positional relationship and do not represent true proportions.

Fig. 1 is a schematic structural diagram of a display device provided by an embodiment of the present invention, as shown in fig. 1, an embodiment of the present invention provides a display device including:

a backlight module 100 for providing backlight; the backlight module 100 can uniformly emit light in the whole light emitting surface, and is used for providing light with sufficient brightness and uniform distribution for the display panel, so that the display panel can normally display images.

The display panel 200 is located on the light emitting side of the backlight module 100 for displaying images. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the transmittance and color of light incident to the pixel unit from the backlight module 100, so that the light transmitted by all the pixel units forms a displayed image.

The embodiment of the utility model provides an above-mentioned display device can be display devices such as liquid crystal display, LCD TV, also can be for mobile terminal such as cell-phone, panel computer, intelligent album adopt backlight unit to provide backlight among the display device, modulate by the light of display panel to backlight unit outgoing, realize image display the utility model provides a backlight unit can adopt Mini L ED lamp plate as the light source, and Mini L ED's size is littleer for traditional L ED, adopts huge Mini L ED as the backlight, can realize more refined dynamic control, promotes LCD display's dynamic contrast.

Fig. 2 is one of the schematic cross-sectional structural diagrams of the backlight module provided in the embodiment of the present invention, as shown in fig. 2, an embodiment of the present invention provides an embodiment of the backlight module 100 including a micro led lamp panel 10, a transparent substrate 14 and a bonding layer 15.

The micro led lamp panel 10 includes a circuit board 11, a micro led 12, and a protective layer 13.

The circuit board 11 has a bearing and supporting function, and is used for providing power. In the embodiment of the present invention, the circuit board 11 is used for providing a driving electrical signal for the micro light emitting diode 12. The micro light-emitting diode 12 and the circuit board 11 are manufactured separately, the surface of the circuit board 11 comprises a plurality of windows for welding the micro light-emitting diodes, the windows comprise two bonding pads for welding electrodes of the micro light-emitting diodes respectively, after the micro light-emitting diodes 12 are manufactured, the micro light-emitting diodes 12 are transferred to the upper side of the windows of the bonding pads of the circuit board 11, the micro light-emitting diodes 12 are welded on the circuit board 11 through processes such as reflow soldering and the like, and therefore the micro light-emitting diodes 12 can be driven to emit light through input signals of the control circuit board 11.

In a specific implementation, the Circuit Board 11 may be a Printed Circuit Board (PCB), where the PCB includes an electronic Circuit and an insulating layer, and the insulating layer exposes a pad of the electronic Circuit, which is soldered to the micro light emitting diode 12, and covers the rest of the electronic Circuit.

Alternatively, the circuit board 11 may be an array substrate formed by fabricating a thin film transistor driving circuit on a substrate, the surface of the array substrate may have a connection electrode (i.e., the pad in the window) connected to the thin film transistor driving circuit, and the electrodes of the micro light emitting diodes 12 may be soldered to the connection electrodes in a one-to-one correspondence manner. The substrate or the substrate base plate of the above circuit board 11 may be made of a flexible material to form a flexible display device.

In the embodiment of the present invention, the circuit board 11 is plate-shaped, and the whole is rectangular or square. The length of the circuit board 11 is 200mm-800mm, and the width is 100mm-500 mm. According to the size of the display device, in the embodiment of the present invention, the display device may include a plurality of circuit boards 11, and the circuit boards 11 are connected in a splicing manner to provide backlight. In order to avoid the optical problem caused by the splicing of the circuit boards 11, the splicing seams between the adjacent circuit boards 11 are as small as possible, and even seamless splicing is realized.

And the micro light-emitting diode 12 is positioned on the circuit board 11. The micro light emitting diode 12 is soldered on the pad of the circuit board 11, and the micro light emitting diode 12 is different from a common light emitting diode, which is specifically referred to as a micro light emitting diode chip. Since the micro led 12 has a small size, the light emitting chip is advantageous to control dynamic light emission to a smaller partition, which is advantageous to improve the contrast of a picture. In an embodiment of the present invention, the micro light emitting diode 102 may be a monochromatic micro light emitting diode with a size of 50 μm to 300 μm.

The protective layer 13 covers the micro light emitting diode 12 and the circuit board 11, and the protective layer 13 is used for packaging the micro light emitting diode 12, so that the micro light emitting diode is effectively prevented from falling off, being wet and the like. The material used for the protective layer 13 includes silicon gel, epoxy resin or other colloid material with higher transmittance. In practical applications, the micro light emitting diodes 12 may be formed on the surface by spraying or spot coating.

In the embodiment of the present invention, the whole layer of the protection layer 13 is formed on the surfaces of the circuit board 11 and the micro light emitting diode 12 by the whole layer spraying method, so that the manufacturing method can effectively improve the production efficiency and the packaging effect of the micro light emitting diode 12 is better.

And the transparent substrate 14 is positioned on the side of the protective layer 13, which faces away from the micro light-emitting diode 12. The embodiment of the utility model provides an in transparent substrate, adopt high printing opacity material to make. The transparent substrate is capable of transmitting light from the micro-leds 12 and serves to support the diffuser plate. The material of the transparent substrate 14 may be selected from at least one of polymethyl methacrylate or polycarbonate, but is not limited thereto, and the transparent substrate 14 may be made of other high-reflectivity, low-absorbance materials. The light is reflected for many times in the transparent substrate 14, and the attenuation of the light in the transparent substrate 14 can be reduced as much as possible by adopting a material with high reflectivity and low absorptivity, so that the light utilization rate of the backlight module is improved, and the power consumption is reduced. The transparent substrate 14 acts as a support structure for the diffuser plate, allowing the light emitted by the micro-leds 12 to be sufficiently mixed before reaching the diffuser plate.

In the embodiment of the present invention, the thickness of the transparent substrate 14 satisfies the light mixing distance of the micro light emitting diode 12, so that the emergent light of the micro light emitting diode can be fully mixed when reaching the diffusion plate, thereby ensuring the backlight effect. In the embodiment of the present invention, the thickness of the transparent substrate 14 is not greater than 10 mm.

In specific implementation, in order to limit the overall thickness of the backlight module, an acrylic plate can be used to manufacture the transparent substrate, and the thickness is 1mm-3 mm. The larger the thickness of the transparent substrate 14, the stronger the reduction effect on the emergent light, and the smaller the size of the micro-leds 12, and compared with the conventional leds, the pitch of the micro-leds 12 can be made smaller, so the light mixing distance of the micro-leds 12 can be much smaller compared with the conventional leds, and then the transparent substrate 14 is set within the range of 1mm-3mm, so the light mixing requirement of the micro-leds 12 can be satisfied, and the reduction effect on the light by the transparent substrate 14 can be reduced.

The interval of miniature emitting diode 12 is less than the ratio, can't set up the support in order to support the diffuser plate in miniature emitting diode 12's array, the embodiment of the utility model provides an in, set up transparent substrate in one side that protective layer 13 deviates from miniature emitting diode 12, can also regard as the support of diffuser plate, directly place the diffuser plate on transparent substrate 14 to overcome above-mentioned problem.

Fig. 3 is one of the emergent light path diagrams of the backlight module according to the embodiment of the present invention, as shown in fig. 3, in practical application, the transparent substrate 14 can be directly placed above the protective layer 13 to meet the requirement of use, but there is a space gap between the protective layer 13 and the transparent substrate 14, and the optical film layers in the backlight module all belong to the optical medium relative to the air medium, the light with the emergent angle θ 1 from the micro light emitting diode 12 is firstly incident into the medium of the protective layer 13, then the incident angle of the light when incident into the interface between the protective layer 13 and the air layer is θ 1, and the refraction angle of the light when passing through the interface and being emitted into the air is θ 2. As shown in fig. 3, the refractive index of the protective layer 13 is n1, the refractive index of air is n0, and there are: n1sin θ 1 ═ n0sin θ 2; and the refractive index n1 of the protective layer 13 is greater than the refractive index n0 of the air medium, so the refraction angle theta 2 when the light is incident into the air through the protective layer 13 is greater than the incident angle theta 1, i.e. the exit angle when the light is incident into the air medium is larger, if the light incident into the air is directly incident into the position of the diffusion plate, the radius of the coverage area of the diffusion plate by the light is d 1.

However, the light needs to enter the transparent substrate 14 again after entering the air layer, the refraction angle of the light exiting into the transparent substrate 14 through the interface is θ 3, the refractive index of the transparent substrate 14 is n2, and according to the refraction law: n0sin θ 2 — n2sin θ 3. And the refractive index n2 of the transparent substrate 14 is greater than the refractive index n0 of the air medium, so the refraction angle theta 3 of the light ray entering the transparent substrate 14 through the air layer is smaller than the incident angle theta 2, i.e. the exit angle of the light ray after entering the transparent substrate 14 becomes smaller, and then after passing through the transparent substrate 14, the radius of the range covered by the final light ray on the diffusion plate is d 2.

As can be seen from fig. 3, the light coverage on the diffuser plate is reduced by the transparent substrate 14, which causes the problem of uneven brightness in which the brightness above the Mini L ED is large and the brightness at the boundary between the Mini L ED is small.

In order to overcome the above problems, in the embodiment of the present invention, as shown in fig. 2, a bonding layer 15 is further disposed in the backlight module, and is located between the protective layer 13 and the transparent substrate 14, for bonding the protective layer 13 and the transparent substrate 14, that is, the embodiment of the present invention fills the air gap between the original protective layer 13 and the transparent substrate 14 with a bonding material, so as to reduce the difference between the refractive index of the gap position and the refractive index of the transparent substrate 14.

Fig. 4 is a second exit optical path diagram of the backlight module according to the embodiment of the present invention, as shown in fig. 4, when light emitted from the micro light emitting diode 12 with the same exit angle θ 1 enters the medium of the protective layer 13, the incident angle of the light entering the interface between the protective layer 13 and the adhesive layer 15 is θ 1, and the refraction angle of the light passing through the interface and exiting into the adhesive layer 15 is θ 2'. As shown in fig. 4, the refractive index of the protective layer 13 is n1, the refractive index of the adhesive layer 15 is n3, and the following are provided according to the law of refraction: n1sin θ 1 ═ n3sin θ 2'; the refractive index difference between the protective layer 13 and the adhesive layer 15 is much smaller than the refractive index difference between the protective layer 13 and the air medium, so that the refractive angle θ 2' when the light enters the adhesive layer 15 through the protective layer 13 is not much different from the incident angle θ 1, that is, the exit angle when the light enters the adhesive layer 15 is not greatly changed.

Then, after the light enters the lamination layer 15, the light needs to enter the transparent substrate 14 again, the refraction angle of the light exiting to the transparent substrate 14 through the interface is θ 3', the refractive index of the transparent substrate 14 is n2, and according to the refraction law, there are: n3sin θ 2 '═ n2sin θ 3'. And the refractive index n2 of the transparent substrate 14 is greater than the refractive index n3 of the adhesive layer 15, so the refraction angle θ 3 'of the light entering the transparent substrate 14 through the adhesive layer 15 is smaller than the incident angle θ 2', that is, the exit angle of the light after entering the transparent substrate 14 becomes larger, and after passing through the transparent substrate 14, the radius of the final coverage range of the light on the diffuser plate is d 3.

As can be seen from a comparison between fig. 3 and fig. 4, after the protective layer 13 and the transparent substrate 14 are tightly bonded by the bonding layer 15, the exit angle of the light passing through the transparent substrate 14 is increased from the original θ 3 to the present θ 3', and then the radius of the light coverage is also increased from the original d2 to the present d3., so that the light exiting from the Mini L ED can be diffused to the boundary position between the neighboring Mini L ED, and the light exiting brightness directly above the Mini L ED is closer to the light exiting brightness at the boundary position, thereby improving the problem of uneven brightness.

In view of the total reflection problem of light incident on two media with different refractive indexes, the embodiment of the present invention provides that the refractive index n3 of the adhesive layer 15 is greater than or equal to the refractive index n1 of the protective layer 13.

The light may be totally reflected when entering the optically thinner medium from the optically denser medium, so that the total reflection of the light may limit the exit angle of the light in each film of the backlight module. As shown in fig. 3, if the transparent substrate 14 is placed directly above the protective layer 13, an air gap is present between the protective layer 13 and the transparent substrate 14, forming an air layer. The air medium is an optically hydrophobic medium relative to the optical film medium in the backlight module, so that the total reflection of light cannot be avoided when the light is incident into the air from the optical film of the backlight module.

Fig. 5 is a third light path diagram of the backlight module according to the embodiment of the present invention, as shown in fig. 5, if the transparent substrate 14 is directly placed on the protection layer 13, the large-angle light emitted from the micro light emitting diode 12 is firstly incident into the protection layer 13, and the refractive index n1 of the protection layer 13 is greater than the refractive index n0 of the air layer, when the emergent angle α 1 of the light is also the incident angle of the light incident into the interface between the protection layer 13 and the air layer, and when the emergent angle is greater than the critical angle of the interface, the light cannot be incident into the air layer, and is all reflected back to the protection layer 13.

In order to overcome the above total reflection problem, a material with a lower refractive index is required to be used to manufacture the protection layer 13, when the refractive index n1 of the protection layer is 1.41, the critical angle for generating total reflection is 44 degrees, that is, only the light with the exit angle smaller than 44 degrees among the light rays emitted from the micro light emitting diode 12 can be incident into the air, and then the light rays can be used as the backlight provided by the backlight module, so that the utilization rate of the light source is lower.

Fig. 6 is a fourth of an outgoing light path diagram of the backlight module provided in the embodiment of the present invention, as shown in fig. 6, after the protective layer 13 and the transparent substrate 14 are tightly attached by the adhesive layer 15, the light of the same angle α 1 emitted from the micro light emitting diode 12 is firstly incident into the protective layer 13, and the refractive index n3 of the adhesive layer 15 is greater than or equal to the refractive index n1 of the protective layer 13, when the light is incident into the adhesive layer 15 through the protective layer 13, the light is incident into the optically denser medium by the optically thinner medium, and the total reflection phenomenon cannot occur, therefore, no matter how large the incident angle of the light is, the light can be incident into the adhesive layer 15 by the protective layer 13.

In practical application, the refractive index of the adhesive layer 15 can be set to be close to the refractive index of the protective layer 13, so that light can be ensured to be smoothly incident from the protective layer 13 to the adhesive layer 15, and the emergent angle of the light when the light is emergent to the adhesive layer 15 is not excessively changed, the refractive index n3 of the adhesive layer 15 is larger than the refractive index n2 of the transparent substrate 14, so that the emergent angle of the light when the light is emergent from the adhesive layer 15 to the transparent substrate 14 is further increased, the emergent angle of the Mini L ED light is not greatly influenced, the emergent light can cover the boundary position between the Mini L ED, the difference of emergent brightness between the position right above the Mini ED L and the boundary position is reduced, and the problem of uneven brightness is effectively solved.

In specific implementation, the protective layer 13 may be made of colloidal materials such as silica gel and epoxy resin, and the refractive index may be 1.4-1.6; the transparent substrate 14 may be made of plastic, such as polymethyl methacrylate (PMMA) or polymethylpentene copolymer (TPX), and has a refractive index of 1.4-1.5; the adhesive layer 15 can be made of colloidal materials such as silica gel and epoxy resin, or can be a transparent double-sided adhesive layer, and the refractive index can be 1.4-1.6.

The materials used by the protective layer 13, the transparent substrate 14 and the laminating layer 15 are reasonably selected, so that the difference of the refractive indexes of the protective layer 13, the transparent substrate 14 and the laminating layer 15 is small, the refractive index of the laminating layer 15 is larger than or equal to that of the protective layer 13, and the refractive index of the laminating layer 15 is larger than that of the transparent substrate 14, so that the total reflection phenomenon of large-angle emergent light of light emitted by the micro light-emitting diode 12 at the interface of the three films can be effectively avoided, and the emergent angle of the light incident on the transparent substrate 14 and the films above the transparent substrate can be enlarged.

For example, when the refractive index of the protective layer 13 is 1.54 and the refractive index of the transparent substrate is 1.45, the 60-degree outgoing light from the micro light emitting diode 12 satisfies the following relation of 1.54 × sin60 ° -1.45 × sin θ, and θ is the outgoing angle when the light is transmitted to the transparent substrate 14, so that the outgoing angle of the 60-degree light from the micro light emitting diode when the light enters the transparent substrate 14 can be calculated to be 60.45 degrees, which is much larger than the outgoing angle of the backlight module in the prior art.

In the embodiment of the present invention, the thickness of the laminating layer 15 is much smaller than the thickness of the transparent substrate 14, and the thickness of the laminating layer 15 can be set smaller than 0.1mm under normal conditions. The smaller the thickness of the adhesive layer 15, the smaller the influence of the adhesive layer 15 on the position of the light beam offset, so that the influence of the adhesive layer 15 on the position of the emergent light can be ignored when designing the layout of the micro light emitting diode 12, and the design procedure can be simplified.

Fig. 7 is a second schematic cross-sectional view of a backlight module according to an embodiment of the present invention, as shown in fig. 7, a Mini L ED lamp panel according to an embodiment of the present invention further includes a reflective coating 16 located on a side of the circuit board 11 close to the micro light emitting diodes 12, fig. 8 is a schematic top view of the backlight module shown in fig. 7, as shown in fig. 8, the reflective coating 16 includes a window 161 for exposing the micro light emitting diodes 12.

The reflective coating 16 is located on the surface of the circuit board 11 facing the micro light emitting diode 12, and the reflective coating 16 may be a protective layer located above the circuit board, and when the reflective material is coated on the surface of the circuit board 11, the protective layer has a reflective function at the same time, and can reflect the light incident to one side of the circuit board 11, so as to improve the utilization efficiency of the light. In the embodiment of the present invention, the reflective coating 16 may be made of white oil or the like.

After the wiring of the circuit board, a layer of white oil material is coated on the surface of the circuit board, and the position of the pad p for welding the micro light-emitting diode 12 is exposed through etching and other processes. In the embodiment of the present invention, the above-mentioned protective layer with reflection function is called as a reflective coating, as shown in fig. 8, the reflective coating 16 has a window 161 for exposing and welding the pad p of the micro light emitting diode, and in the following manufacturing process, the micro light emitting diode 12 is welded on the corresponding pad of the circuit board, so that the micro light emitting diode 12 is located in the corresponding window 161.

Fig. 9 is a third schematic view of a cross-sectional structure of a backlight module according to an embodiment of the present invention, as shown in fig. 9, the embodiment of the present invention provides a backlight module further including: a diffuser plate 17 and an optical film 18.

And the diffusion plate 17 is positioned on the side of the transparent substrate 14, which faces away from the protective layer 13. The scattering material in the diffusion plate can continuously refract and reflect the passing light, so that the effect of scattering the light is achieved, and the effect of light uniformization is further achieved. The diffuser plate is made of at least one material selected from the group consisting of polymethyl methacrylate (PMMA), Polycarbonate (PC), polystyrene-based material (PS) and polypropylene (PP).

An optical film 18 is located on the side of the diffuser plate 17 facing away from the transparent substrate 14. The optical film set 18 may include one or more of a prism film, a quantum dot film, a diffusion sheet, a reflective polarizer, etc., and these films are added to the backlight module in order to adapt the backlight module to various practical applications. For example, the prism sheet may change the exit angle of light, thereby changing the viewable angle of the display device. The quantum dot film can provide quantum dot luminescence with higher monochromaticity, and is applied to quantum dot televisions to improve the display color gamut of the televisions. The reflective polarizer can improve the utilization rate of light, and simultaneously, the emergent light has polarization property, thereby omitting the use of the polarizer under the liquid crystal display panel.

The embodiment of the utility model provides a display device, including backlight unit, a display panel, a protective layer, a transparent substrate, and an adhesive layer, wherein, the backlight unit includes a miniature light-emitting diode lamp plate as a backlight source, the miniature light-emitting diode lamp plate is a circuit board with bearing and supporting functions and used for providing electric power, the miniature light-emitting diode is arranged on the circuit board, the protective layer covers the miniature light-emitting diode and the circuit board and used for packaging and protecting the miniature light-emitting diode, the backlight unit also includes a transparent substrate arranged at one side of the protective layer deviating from the miniature light-emitting diode, and the adhesive layer is arranged between the protective layer and the transparent substrate and used for adhering the protective layer and the transparent substrate, the refractive index of the adhesive layer is larger than that of the transparent substrate, after the protective layer and the transparent substrate are tightly adhered by the adhesive layer, no air layer exists between the protective layer and the transparent substrate, because the refractive index of the adhesive layer is larger than that of the transparent substrate, the outgoing angle when the light incides to the transparent substrate by the adhesive layer can increase, the outgoing light coverage of outgoing light can be made Mini L ED to adjacent Mini L position diffusion, thereby make the border light L and the border brightness of.

While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A display device, comprising:

the backlight module is used for providing backlight;

the display panel is positioned on the light emitting side of the backlight module and used for displaying images;

the backlight module includes:

the miniature light-emitting diode lamp panel is used as a backlight source;

the miniature LED lamp plate includes:

the circuit board has the functions of bearing and supporting and is used for providing power;

the micro light-emitting diode is positioned on the circuit board;

the protective layer covers the micro light-emitting diode and the circuit board and is used for packaging and protecting the micro light-emitting diode;

the backlight module further comprises:

the transparent substrate is positioned on one side of the protective layer, which is far away from the micro light-emitting diode;

the laminating layer is positioned between the protective layer and the transparent substrate and is used for laminating the protective layer and the transparent substrate; the refractive index of the laminating layer is larger than that of the transparent substrate.

2. The display device of claim 1, wherein a refractive index of the conforming layer is greater than or equal to a refractive index of the protective layer.

3. The display device according to claim 2, wherein the protective layer has a refractive index of 1.4 to 1.6.

4. The display device according to claim 1, wherein the transparent substrate has a refractive index of 1.4 to 1.5.

5. The display device of claim 1, wherein the conforming layer has a thickness of less than 0.1 mm.

6. The display device according to claim 1, wherein a thickness of the transparent substrate satisfies a light mixing distance of the micro light emitting diode.

7. The display device according to claim 6, wherein the transparent substrate has a thickness of 1mm to 3 mm.

8. The display device of any one of claims 1-7, wherein the micro light emitting diode light panel further comprises:

the reflecting coating is positioned on one side of the circuit board close to the micro light-emitting diode; the reflective coating includes a fenestration for exposing the micro light-emitting diode.

9. The display device according to any one of claims 1 to 7, wherein the micro light emitting diode has a size of 50 μm to 300 μm.

10. The display device according to any one of claims 1 to 7, wherein the backlight module further comprises:

the diffusion plate is positioned on one side of the transparent substrate, which is far away from the protective layer;

and the optical membrane is positioned on one side of the diffusion plate, which is far away from the transparent substrate.

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