CN210967526U - System for real-time supervision laser beam machining performance - Google Patents
System for real-time supervision laser beam machining performance Download PDFInfo
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- CN210967526U CN210967526U CN201921582157.4U CN201921582157U CN210967526U CN 210967526 U CN210967526 U CN 210967526U CN 201921582157 U CN201921582157 U CN 201921582157U CN 210967526 U CN210967526 U CN 210967526U
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Abstract
A system for monitoring laser processing performance in real time relates to the technical field of laser processing, and comprises a laser processing system, a laser detection system, a ray detection system, a precision clamp and a PC module, wherein the laser processing system and the laser detection system share the laser, the light splitting module, the reflector and the gathering module, and are all positioned at the same side of the precision clamp, the ray detection system comprises a ray source and a ray detector, the PC module is connected with the laser detector and the ray detector through signal wires, the precision clamp is sleeved on the plate, just relative panel of precision clamp can follow x, y direction parallel movement, along u, i direction rotary motion, the utility model discloses a processing laser beam and detection laser beam are produced by same laser instrument, have simplified on-line measuring system's structure, reduce laser instrument and relevant optical element's quantity, have reduced system cost.
Description
Technical Field
The utility model relates to a laser beam machining field, concretely relates to system of real-time supervision laser beam machining performance.
Background
The laser has the characteristics of high resolution, high efficiency, no tool abrasion and the like, is widely applied to the processing of various materials with complex structures, can be used for the fine processing of various materials, but has the problems of thermal damage, microcrack, nano-grade change layer and the like in the laser processing, and influences the normal use performance of the processed materials; meanwhile, along with the development of the refinement trend of the laser processing size, the processing size which can be realized at present reaches below 10 mu m, and the detection requirement cannot be finished by the conventional detection means.
Along with the characteristics of complexity and precision trend development of a machining structure required by a workpiece and high cost of a part, the laser machining process needs to be monitored in real time, normal machining in each time is ensured, problems existing in machining are found in time, and feedback and loss stopping are made in time.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to avoid the weak point among the prior art and provide a system of real-time supervision laser beam machining performance, this system has simplified on-line measuring system's structure, reduces laser instrument and relevant optical element's quantity, the lowering system cost.
The purpose of the utility model is realized through the following technical scheme: the utility model provides a system for real-time supervision laser beam machining performance, including laser beam machining system, laser beam detection system, ray detection system, precision clamp and PC module, laser beam machining system includes fixed connection's laser instrument, beam splitting module, speculum and gathering module in proper order, laser beam detection system includes fixed connection's laser instrument, beam splitting module, speculum, gathering module and through signal connection's laser detector in proper order, wherein laser beam machining system and laser beam detection system share laser instrument, beam splitting module, speculum and gathering module, and all lie in the same one side of precision clamp, ray detection system includes ray source and ray detector, ray detector with laser beam machining system all lies in the same one side of precision clamp, the ray source lies in the opposite side of precision clamp, the PC module passes through the signal line and is connected with laser detector and ray detector, the precision clamp is sleeved on the plate, and the precision clamp can move in parallel along the x and y directions and rotate along the u and i directions relative to the plate.
The plate comprises an upper copper foil on the upper layer, a PI layer on the middle layer and a lower copper foil on the bottom layer.
The precision clamp is used for adjusting the angle in the u direction, the adjusting range is 0-45 degrees, meanwhile, the precision clamp can rotate in the i direction, the rotating angle is 0-360 degrees, and the rotating speed is 0-500 rpm.
Preferably, the precision clamp is used for adjusting the angle along the u direction, the adjusting range is 10-30 degrees, meanwhile, the precision clamp can rotate along the i direction, the rotating angle is 60-250 degrees, and the rotating speed is 100-300 rpm.
Preferably, the precision clamp is angularly adjusted along the u direction, the adjustment range is 20 degrees, and simultaneously the precision clamp can rotate along the i direction, the rotation angle is 150 degrees, and the rotation speed is 200 rpm.
Compared with the prior art, the system for monitoring the laser processing composite material in real time has the advantages that: because the processing laser beam and the detection laser beam are generated by the same laser, the structure of the online detection system is simplified, the number of the lasers and related optical elements is reduced, and the system cost is reduced.
Drawings
The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived from the following drawings without inventive effort.
Fig. 1 is a schematic diagram of the system structure of the present invention;
FIG. 2 is a schematic structural view of the present invention with only ray detection;
FIG. 3 is a schematic structural view of the present invention with laser detection and radiation detection;
fig. 4 is a schematic structural diagram of the present invention for two kinds of detection of composite boards;
FIG. 5 is a schematic structural diagram of the present invention for two kinds of detection of the same material complex hole;
in the figure, 1-laser, 2-laser beam, 21-processing laser beam, 22-detection laser beam, 3-beam splitting module, 4-reflector, 5-focusing module, 6-precision clamp, 7-plate, 71-first micropore, 72-second micropore, 701-upper copper foil, 702-PI layer, 703-lower copper foil, 721-upper cylindrical hole, 722-middle cylindrical hole, 723-lower conical hole, 8-ray source, 9-ray, 10-ray detector, 11-signal line, 12-laser detector and 13-PC module.
Detailed Description
The following description will further describe the embodiments of the present invention with reference to the drawings and examples, but the present invention is not limited thereto.
Example 1:
as shown in fig. 1, a plate 7 is clamped (deflection angle is 0, horizontal clamping), the laser 1 outputs laser beams 2 with the wavelength of 355nm, the pulse width of 50ns, the power of 20W and the repetition frequency of 100kHz, the laser beams are divided into processing laser beams 21 with the wavelength of 355nm, the pulse width of 50ns, the power of 19W and the repetition frequency of 100kHz and detection laser beams 22 with the wavelength of 355nm, the pulse width of 50ns, the power of 0.5W and the repetition frequency of 100kHz by a light splitting module 3, the processing laser beams 21 are focused by a focusing module 5 and adjusted with the position angle of 5 degrees and processing paths (spiral processing) to process first micropores 71 on the plate 7, the detection laser beams 22 are focused by the focusing module 5 and adjusted with the position angle of 5 degrees, are reflected by a laser detector 12 on the hole wall of the first micropores 71 and transmit information to a PC module 13 through a signal line 11, and outputting corresponding detection information such as surface roughness, microcracks and the like, and adjusting the laser output of the laser 1, the power regulation of the light splitting module 3, the position of the precision clamp 6 and the like by the PC module 13 according to requirements.
Example 2:
as shown in fig. 2: the plate 7 is clamped (deflection angle is 0, horizontal clamping is performed), the output parameters of the laser 1 are 1064nm, 50ps pulse width, 10W power and 80kHz laser beam 2, the laser beam is divided into a 1064nm, 50ps pulse width, 8W power and 80kHz processing laser beam 21 and a 1064nm pulse width, 50ps pulse width, 0W power and 80kHz detection laser beam 22 through a light splitting module 3, the processing laser beam 21 is focused through a focusing module 5 and adjusts the position angle to 5 degrees and a processing path (spiral processing) to process a second micropore 72 on the plate 7, a radiation source 8 emits a ray 9 (X ray), the ray 9 (X ray) transmits through a first micropore 71 which is processed on the plate 7, is absorbed by a ray detector 10, transmits information to a PC module 13 through a signal line 11, and outputs corresponding detection information, such as surface topography, shape, etc.
Example 3:
as shown in fig. 3, a plate 7 is clamped (deflection angle is 0, horizontal clamping), the laser 1 outputs laser beam 2 with wavelength of 533nm, pulse width of 50fs, power of 8W and repetition frequency of 90kHz, and is divided into machining laser beam 21 with wavelength of 533nm, pulse width of 50fs, power of 5W and repetition frequency of 90kHz and detection laser beam 22 with wavelength of 533nm, pulse width of 50fs, power of 0.2W and repetition frequency of 90kHz by a beam splitting module 3, the machining laser beam 21 is focused by a focusing module 5 and adjusted with position angle of 5 ° and a machining path (spiral machining) to machine a second micropore 72 on the plate 7, the detection laser beam 22 is focused by the focusing module 5 and adjusted with position angle of 5 ° and reflected by a laser detector 12 on the pore wall of the second micropore 72, and transmits information to a PC module 13 through a signal line 11, corresponding detection information such as surface roughness, microcracks and the like is output, the PC module 13 adjusts the laser output of the laser 1, the power adjustment of the light splitting module 3, the position of the precision clamp 6 and the like according to requirements, meanwhile, the ray source 8 emits rays 9 (X rays) which penetrate through the first micropores 71 which are processed on the plate 7 and are absorbed by the ray detector 10, the information is transmitted to the PC module 13 through the signal line 11, and the corresponding detection information such as surface appearance, shape and the like is output.
Example 4:
as shown in fig. 1 and 4, a plate 7 is clamped (deflection angle is 0, horizontal clamping), the plate 7 is a typical FPC, and is composed of an upper copper foil 701, a lower copper foil 703 and a PI layer 702 in the middle, the laser 1 outputs laser beams 2 with a wavelength of 355nm, a pulse width of 170ns, a power of 5W and a repetition frequency of 90kHz, the laser beams are divided into a processing laser beam 21 with a wavelength of 355nm, a pulse width of 170ns, a power of 4W and a repetition frequency of 90kHz and a detection laser beam 22 with a wavelength of 355nm, a pulse width of 170ns, a power of 0.2W and a repetition frequency of 90kHz through a splitting module 3, the processing laser beam 21 is focused by a focusing module 5 and adjusts a position angle of 5 ° and a processing path (spiral processing) to process a second micropore 72 on the plate 7, the detection laser beam 22 is focused by the focusing module 5 and adjusts a position angle of 5 ° to be reflected by a hole wall of the second micropore 72 and absorbed by a laser detector 12, when the second micropore 72 on the copper foil layer 701 is processed, the laser detection system detects the interface between the copper foil layer 701 and the PI layer 702 and transmits the information to the PC module 13, the PC module 13 reduces the output power of the laser 1, the output power is divided into a processing laser beam 21 with the wavelength of 355nm, the pulse width of 170ns, the power of 3W and the repetition frequency of 90kHz, and a detection laser beam 22 with the wavelength of 355nm, the pulse width of 170ns, the power of 0.1W and the repetition frequency of 90kHz through the light splitting module 3, the processing detection of the PI layer 702 is continuously completed, and the processing of the second micropore 72 of the copper foil layer 703 is completed by analogy in sequence; meanwhile, the radiation source 8 emits radiation 9 (X-ray) which transmits through the processed first micropores 71 of the plate 7, is absorbed by the radiation detector 10, and transmits information to the PC module 13 through the signal line 11, and outputs corresponding detection information, such as surface morphology, shape, and the like.
Example 5
As shown in fig. 1 and 5, the plate 7 is clamped (the deflection angle is 5 ° in the u direction), the second micro-hole 72 of the plate 7 is divided into an upper cylindrical hole 721, a middle cylindrical hole 722, and a lower conical hole 723, the output parameters of the laser 1 are a laser beam 2 with a wavelength of 1064nm, a pulse width of 170ns, a power of 10W, and a repetition frequency of 90kHz, the laser beam is divided into a processing laser beam 21 with a wavelength of 1064nm, a pulse width of 170ns, a power of 8W, and a repetition frequency of 90kHz through the splitting module 3, and a detection laser beam 22 with a wavelength of 1064nm, a pulse width of 170ns, a power of 1W, and a repetition frequency of 90kHz, the processing laser beam 21 is focused by the focusing module 5 and adjusted to a position angle of 0 ° and a processing path (concentric circle processing) to process the second micro-hole 72 on the plate 7, the detection laser beam 22 is focused by the focusing module 5 and adjusted to a position angle of 0 ° and reflected by, when the processing of the upper cylindrical hole 721 is completed, the PC module 13 adjusts the output power of the laser 1 according to the processing requirements, and the PC module 13 divides the laser into a processing laser beam 21 with a wavelength of 533nm, a pulse width of 170ns, a power of 4W, a repetition frequency of 90kHz and a detection laser beam 22 with a wavelength of 533nm, a pulse width of 170ns, a power of 1W, a repetition frequency of 90kHz through the spectroscopic module 3, and continues to complete the processing of the middle cylindrical hole 722, and meanwhile, when the laser detection system detects the processed second micro-hole 72 in real time and feeds back the information to the PC module 13, the closed-loop control is completed, and the processing of the lower conical hole 723 is completed by analogy in sequence; meanwhile, the radiation source 8 emits radiation 9 (X-ray) which penetrates through the processed first micropores 71 of the plate 7, is absorbed by the radiation detector 10, transmits information to the PC module 13 through the signal line 11, and outputs corresponding detection information, such as surface morphology, shape, and the like.
Through the above 5 embodiments, embodiment 1 only has laser detection, embodiment 2 only has ray detection, embodiment 3 has two kinds of detections of laser and ray, embodiment 4 aims at two kinds of detections of composite board, embodiment 5 aims at two kinds of detections of the same material complicated hole, so that it can be seen that the two kinds of detections can be carried out independently, real-time monitoring of laser processing performance can be realized, regulation and control of laser processing structure and performance can be realized by utilizing a PC module, processing of sectional special-shaped holes can be realized, and nondestructive online detection of laser processing shape can also be realized.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. A system for monitoring laser processing performance in real time is characterized in that: including laser processing system, laser detecting system, ray detecting system, precision clamp and PC module, laser processing system includes fixed connection's laser instrument, beam splitting module, speculum and gathering module in proper order, laser detecting system includes fixed connection's laser instrument, beam splitting module, speculum, gathering module and through signal connection's laser detector in proper order, wherein laser processing system and laser detecting system share laser instrument, beam splitting module, speculum and gathering module, and all lie in the same one side of precision clamp, ray detecting system includes ray source and ray detector, ray detector with laser processing system all lies in the same one side of precision clamp, the ray source lies in the opposite side of precision clamp, the PC module passes through the signal line and is connected with laser detector and ray detector, the precision clamp cover is established on panel, and the precision clamp can move in parallel along the x and y directions and rotate along the u and i directions relative to the plate.
2. The system for monitoring laser processing performance in real time according to claim 1, wherein: the plate comprises an upper copper foil on the upper layer, a PI layer on the middle layer and a lower copper foil on the bottom layer.
3. The system for monitoring laser processing performance in real time according to claim 1, wherein: the precision clamp carries out angle adjustment along the u direction, and the control range is 0 ~ 45, can rotate along the i direction simultaneously, and rotation angle is 0 ~ 360, and the rotation speed is 0 ~ 500 rpm.
4. The system of claim 3, wherein the laser processing performance is monitored in real time by: the precision clamp is used for adjusting the angle in the u direction, the adjusting range is 10-30 degrees, meanwhile, the precision clamp can rotate in the i direction, the rotating angle is 60-250 degrees, and the rotating speed is 100-300 rpm.
5. The system for monitoring laser processing performance in real time according to claim 4, wherein: the precision clamp is used for carrying out angle adjustment along the u direction, the adjustment range is 20 degrees, meanwhile, the precision clamp can rotate along the i direction, the rotation angle is 150 degrees, and the rotation speed is 200 rpm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921582157.4U CN210967526U (en) | 2019-09-23 | 2019-09-23 | System for real-time supervision laser beam machining performance |
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| CN201921582157.4U CN210967526U (en) | 2019-09-23 | 2019-09-23 | System for real-time supervision laser beam machining performance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110587159A (en) * | 2019-09-23 | 2019-12-20 | 广东工业大学 | System and method for monitoring laser processing performance in real time |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110587159A (en) * | 2019-09-23 | 2019-12-20 | 广东工业大学 | System and method for monitoring laser processing performance in real time |
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