CN210956602U

CN210956602U - Automatic wafer testing machine table

Info

Publication number: CN210956602U
Application number: CN201921947918.1U
Authority: CN
Inventors: 魏盘生
Original assignee: Shanghai Magic Valley Ic Technology Co ltd
Current assignee: Shanghai Magic Valley Ic Technology Co ltd
Priority date: 2019-11-13
Filing date: 2019-11-13
Publication date: 2020-07-07
Anticipated expiration: 2029-11-13

Abstract

The utility model provides an automatic change wafer test board belongs to wafer detection technology field, include the under casing and install the L type support in under casing upper portion edge, the probe is installed to L type support bottom, under casing upper portion is provided with first conveyer belt, and the wafer that awaits measuring is placed at first conveyer belt upper portion interval, and L type support is connected with the runner through the rotary drum rotation towards one side of under casing, be provided with a plurality of the wafers that await measuring that are used for picking up first conveyer belt upper portion on the outer disc of runner and get the material subassembly, the inside drive assembly who is used for driving runner intermittent type pivoted that is provided with of runner. The embodiment of the utility model provides an in, order about runner intermittent type through drive assembly and rotate, and then drive and get material subassembly intermittent type circular motion, pick up the wafer that awaits measuring on first conveyer belt upper portion to the probe below to the cooperation probe is accomplished and is detected, need not artifical too much intervention, has the advantage that degree of automation is high, detection efficiency is high.

Description

Automatic wafer testing machine table

Technical Field

The utility model belongs to the technical field of the wafer detects, specifically an automatic change wafer test board.

Background

In the wafer production process, the electrical properties of the wafer need to be tested, and in general, probes need to be contacted with pads on the wafer for detection.

The existing wafer detection equipment has the defect of low automation degree, when the wafer is detected, the wafer needs to be manually installed on a detection station, and the wafer needs to be manually taken down from the detection station after the wafer is detected, so that the wafer detection efficiency is low, and the detection requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a not enough to above-mentioned prior art, the technical problem who solves provides an automatic wafer test board.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides an automatic change wafer test board, includes the under casing and installs the L type support in under casing upper portion edge, the probe is installed to L type support bottom, under casing upper portion is provided with first conveyer belt, and the wafer that awaits measuring is placed at first conveyer belt upper portion interval, and L type support is connected with the runner through the rotary drum rotation towards one side of under casing, be provided with a plurality of material subassemblies of getting that are used for picking up the wafer that awaits measuring on first conveyer belt upper portion on the outer disc of runner, the inside drive assembly that is used for driving runner intermittent type pivoted that is provided with of runner.

As a further improvement of the utility model: the driving assembly comprises a half gear arranged at the eccentric position of the middle part of the rotating wheel and a plurality of tooth sheets arranged on the inner ring of the rotating wheel, the half gear is meshed with the tooth sheets, and the half gear is controlled by an external motor to rotate.

As a further improvement of the utility model: get the material subassembly including fixed a support section of thick bamboo that sets up on the outer disc of runner and install the activity post of keeping away from runner one end at a support section of thick bamboo, the one end that the support section of thick bamboo was kept away from to the activity post is installed and is used for absorbing the sucking disc of awaiting measuring the wafer.

As a further improvement of the utility model: one end of the movable column extends into the supporting cylinder and is matched with the supporting cylinder in an elastic and telescopic manner.

As a further improvement of the present invention: the supporting cylinder is internally provided with a baffle plate, and the baffle plate is connected with the movable column through a spring.

As a further improvement of the present invention: the supporting cylinder is internally provided with a material pushing cylinder, the output end of the material pushing cylinder is connected with a push rod, and the push rod penetrates through the baffle and extends into the movable column.

As a further improvement of the present invention: and a second conveying belt used for receiving the detected wafer is arranged above the first conveying belt.

As a further improvement of the present invention: a groove is formed in the first conveying belt, and steps matched with the wafer to be detected are arranged in the groove.

Compared with the prior art, the beneficial effects of the utility model are that:

the embodiment of the utility model provides an in, order about runner intermittent type through drive assembly and rotate, and then drive and get material subassembly intermittent type circular motion, pick up the wafer that awaits measuring on first conveyer belt upper portion to the probe below to the cooperation probe is accomplished and is detected, need not artifical too much intervention, has the advantage that degree of automation is high, detection efficiency is high.

Drawings

FIG. 1 is a schematic diagram of an automated wafer tester;

FIG. 2 is a left side view of an automated wafer test machine;

FIG. 3 is a schematic view of a material pick-up assembly of an automated wafer test machine;

FIG. 4 is an enlarged view taken at A in FIG. 1;

FIG. 5 is a schematic view of a portion of a first conveyor belt of an automated wafer test machine;

in the figure: the device comprises a 1-L-shaped support, 2-probes, 3-rotating wheels, 4-second conveying belts, 5-first conveying belts, 6-bottom boxes, 7-grooves, 8-wafers to be tested, 9-suckers, 10-material taking assemblies, 11-supporting cylinders, 12-material pushing cylinders, 13-springs, 14-movable columns, 15-push rods, 16-baffles, 17-tooth sheets, 18-half gears and 19-rotating drums.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-4, the embodiment provides an automatic wafer testing machine, which includes a bottom box 6 and an L-shaped support 1 installed at an edge of an upper portion of the bottom box 6, a probe 2 is installed at a bottom of the L-shaped support 1, a first conveying belt 5 is installed at an upper portion of the bottom box 6, wafers 8 to be tested are placed at intervals on the upper portion of the first conveying belt 5, a rotating wheel 3 is rotatably connected to one side of the L-shaped support 1 facing the bottom box 6 through a rotating drum 19, a plurality of material taking assemblies 10 for picking up the wafers 8 to be tested on the upper portion of the first conveying belt 5 are arranged on an outer circumferential surface of the rotating wheel 3, and a driving assembly for driving the rotating wheel 3 to rotate.

Place the wafer 8 that awaits measuring on 5 upper portions of first conveyer belt, the wafer 8 that awaits measuring is carried to the under casing 6 top through first conveyer belt 5, drive assembly drive runner 3 rotates, drive and get material subassembly 10 circular motion, thereby pick up the wafer 8 that awaits measuring on 5 upper portions of first conveyer belt, pick up and remove the wafer 8 that awaits measuring to the probe 2 below after accomplishing again, utilize probe 2 to carry out the electrical property test to a plurality of chips on the wafer 8 that awaits measuring, because drive assembly orders about 3 intermittent type rotations of runner, when runner 3 will await measuring wafer 8 and rotate to probe 2 bottoms, runner 3 at this moment is in the stagnation state, in order to guarantee that probe 2 has sufficient check-out time.

Specifically, the driving assembly comprises a half gear 18 arranged at the eccentric position of the middle part of the rotating wheel 3 and a plurality of tooth plates 17 arranged on the inner ring of the rotating wheel 3, the half gear 18 is meshed with the tooth plates 17, and the half gear 18 is controlled by an external motor to rotate (not shown).

The external motor drives the half gear 18 to rotate, and when the half gear 18 is meshed with the tooth piece 17, the half gear 18 drives the rotating wheel 3 to rotate so as to drive the material taking assembly 10 to do circular motion; when the half gear 18 is disengaged from the toothed sheet 17, the runner 3 is in a standstill state, and intermittent rotation of the runner 3 is realized.

Specifically, get material subassembly 10 including fixed setting up a support section of thick bamboo 11 on the outer disc of runner 3 and install the activity post 14 of keeping away from 3 one end of runner at a support section of thick bamboo 11, the one end that a support section of thick bamboo 11 was kept away from to activity post 14 is installed and is used for absorbing the sucking disc 9 of awaiting measuring wafer 8.

When a set of material taking assembly 10 rotates to the bottom of the rotating wheel 3, the wafer 8 to be detected on the first conveying belt 5 is sucked through the sucking disc 9, the wafer 8 to be detected is brought to the bottom of the probe 2 along with the continuous rotation of the rotating wheel 3, the rotating wheel 3 stops under the action of the driving assembly, and the detection is carried out by matching with the probe 2.

Furthermore, one end of the movable column 14 extends into the support cylinder 11 and is elastically matched with the support cylinder 11 in a telescopic manner.

When the rotating wheel 3 drives the material taking assembly 10 to rotate, the bottom of the rotating wheel 3 moves towards the inside of the supporting cylinder 11 when the suction cup 9 is in contact with the wafer 8 to be detected, and meanwhile, the suction cup 9 is supported on the wafer 8 to be detected, so that the adsorption of the wafer 8 to be detected is completed.

Specifically, a baffle 16 is arranged inside the support cylinder 11, and the baffle 16 is connected with the movable column 14 through a spring 13.

Further, a material pushing cylinder 12 is further arranged inside the supporting cylinder 11, an output end of the material pushing cylinder 12 is connected with a push rod 15, and the push rod 15 penetrates through the baffle 16 and extends into the movable column 14.

After the wafer 8 to be tested is detected, the pushing cylinder 12 is used for controlling the push rod 15 to extend, the wafer adsorbed on the sucking disc 9 is ejected out, the wafer is separated from the sucking disc 9, and automatic unloading of the wafer is completed.

Further, a second conveyor belt 4 for receiving the detected wafer is further arranged above the first conveyor belt 5.

The detected wafer is pushed to the first conveying belt 4 through the push rod 15, and conveying work is finished.

The working principle of the embodiment is as follows: place the wafer 8 that awaits measuring on 5 upper portions of first conveyer belt, the wafer 8 that awaits measuring is carried to the under casing 6 top through first conveyer belt 5, drive assembly drive runner 3 rotates, drive and get material subassembly 10 circular motion, thereby pick up the wafer 8 that awaits measuring on 5 upper portions of first conveyer belt, pick up and remove the wafer 8 that awaits measuring to the probe 2 below after accomplishing again, utilize probe 2 to carry out the electrical property test to a plurality of chips on the wafer 8 that awaits measuring, because drive assembly orders about 3 intermittent type rotations of runner, when runner 3 will await measuring wafer 8 and rotate to probe 2 bottoms, runner 3 at this moment is in the stagnation state, in order to guarantee that probe 2 has sufficient check-out time.

Example 2

Referring to fig. 1 and 5, in a process of taking a wafer 8 to be tested to the bottom of a probe 2 by a material taking assembly 10, since the wafer 8 to be tested actually turns over, which requires that when the wafer 8 to be tested is initially placed on the upper portion of a first conveyor belt 5, a chip side of the wafer 8 to be tested faces downward, in order to prevent the chip side of the wafer 8 to be tested from contacting with the first conveyor belt 5 and causing damage, in this embodiment, compared with embodiment 1, a groove 7 is formed in the first conveyor belt 5, a step adapted to the wafer 8 to be tested is disposed in the groove 7, and the wafer 8 to be tested is embedded into the groove 7, so that the wafer 8 to be tested is prevented from directly contacting with the first conveyor belt 5 and causing damage to the chip.

The embodiment of the utility model provides an in, order about 3 intermittent type rotations of runner through drive assembly, and then drive and get 10 intermittent type circular motion of material subassembly, pick up the wafer 8 that awaits measuring on 5 upper portions of first conveyer belt to 2 below of probe to the cooperation probe is accomplished and is detected, need not artifical too much intervention, has the advantage that degree of automation is high, detection efficiency is high.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides an automatic change wafer test board, includes under casing (6) and installs L type support (1) in under casing (6) upper portion edge, probe (2) are installed to L type support (1) bottom, a serial communication port, under casing (6) upper portion is provided with first conveyer belt (5), and wafer (8) that await measuring are placed to first conveyer belt (5) upper portion interval, and one side of L type support (1) orientation under casing (6) is rotated through rotary drum (19) and is connected with runner (3), be provided with a plurality of material subassemblies (10) of getting that are used for picking up wafer (8) that await measuring on first conveyer belt (5) upper portion on the outer disc of runner (3), runner (3) inside is provided with and is used for driving runner (3) intermittent type pivoted drive assembly.

2. The automatic wafer testing machine station as claimed in claim 1, wherein the driving assembly comprises a half gear (18) disposed at the eccentric center of the rotating wheel (3) and a plurality of teeth (17) mounted on the inner ring of the rotating wheel (3), the half gear (18) and the teeth (17) are engaged with each other, and the half gear (18) is controlled by an external motor to rotate.

3. The automatic wafer testing machine platform of claim 1, wherein the material taking assembly (10) comprises a supporting cylinder (11) fixedly arranged on the outer circumferential surface of the rotating wheel (3) and a movable column (14) installed at one end of the supporting cylinder (11) far away from the rotating wheel (3), and a suction cup (9) for sucking the wafer (8) to be tested is installed at one end of the movable column (14) far away from the supporting cylinder (11).

4. The automatic wafer testing machine as claimed in claim 3, wherein one end of the movable column (14) extends into the supporting cylinder (11) and is elastically and telescopically engaged with the supporting cylinder (11).

5. The automatic wafer testing machine station as claimed in claim 4, wherein a baffle (16) is disposed inside the supporting cylinder (11), and the baffle (16) is connected to the movable column (14) through a spring (13).

6. The automatic wafer testing machine platform of claim 5, wherein a pushing cylinder (12) is further disposed inside the supporting cylinder (11), an output end of the pushing cylinder (12) is connected to a push rod (15), and the push rod (15) penetrates through the baffle (16) and extends into the movable column (14).

7. The automated wafer testing machine station according to claim 6, wherein a second conveyor belt (4) for receiving the inspected wafer is further disposed above the first conveyor belt (5).

8. The automatic wafer testing machine station as claimed in claim 1 or 7, wherein the first conveyor belt (5) is provided with a groove (7), and a step adapted to the wafer (8) to be tested is disposed in the groove (7).