CN210925685U - Tank body heat dissipation device - Google Patents
Tank body heat dissipation device Download PDFInfo
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- CN210925685U CN210925685U CN201921512574.1U CN201921512574U CN210925685U CN 210925685 U CN210925685 U CN 210925685U CN 201921512574 U CN201921512574 U CN 201921512574U CN 210925685 U CN210925685 U CN 210925685U
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Abstract
The utility model discloses a jar body heat abstractor, including the heat dissipation jar body, by the radiating piece, heat conduction spare, closing cap device and heat conduction base plate, the internal at least existence one of heat dissipation jar is used for placing the cavity that is used by the radiating piece, is arranged in the cavity by the radiating piece in, and the heat dissipation jar body is with heat conduction base plate contact heat conduction, forms a cooling surface on the heat dissipation jar body of its contact jaw, and the heat conduction spare is filled by the radiating piece with in the gap that the cavity formed, closing cap device lid is at the opening part of the heat dissipation jar body, will be sealed in the heat dissipation jar body by the radiating piece, is provided with the bulge structure on the cooling surface of the heat dissipation jar body, the cooling surface through the bulge structure, with the heat conduction base plate realizes closely attached and accomplishes the heat exchange. Also provide a jar body heat abstractor simultaneously, can be than present traditional scheme, have more the advantage in the aspect of cost, compatibility and heat dissipation.
Description
Technical Field
The utility model relates to a radiator field, concretely relates to jar body heat abstractor.
Background
The magnetic device is an electronic component frequently used in various electrical equipment and generally consists of a magnetic core and a coil. Components such as cores and coils often generate a large amount of heat when the magnetic device is operated. Therefore, when the electrical equipment works, if the serious heating magnetic device is not radiated in time, the service life of the coil of the magnetic device can be shortened, and the working efficiency of the magnetic device can be greatly reduced. In order to ensure the high efficiency and long-time operation of the magnetic device, the magnetic device needs to be effectively radiated.
At present, a common way for heat dissipation of a magnetic device is to arrange the magnetic device in a high thermal conductivity tank, fill the tank with a thermal conductive adhesive, fill the gap between the magnetic device and the tank with the thermal conductive adhesive, and then attach the high thermal conductivity tank to a heat dissipation substrate. Therefore, heat generated by the magnetic device can be conducted to the high-heat-conduction tank body through the heat-conducting glue and then conducted to the heat-dissipation substrate through the high-heat-conduction tank body.
The inventor discovers that:
first, the current connection methods of the tank and the heat dissipation substrate have some limitations. The comparatively general current scheme is that the screw hole with the installation sets up in the lateral wall of the heat dissipation jar body to increased the size of lateral wall, reduced space utilization. Meanwhile, another scheme is also provided, namely the screw hole is designed in the contact surface of the heat dissipation tank body and the heat dissipation substrate, so that the size of the side wall can be reduced, but if a screw is effectively driven into the screw hole, the screw hole needs to be deep enough, so that the heat dissipation surface of the heat dissipation tank body, which is in contact with the heat dissipation substrate, cannot be too thin. At least the bottom surface of the screw hole is drilled, and the thickness of the screw hole cannot be too thin, because the thickness is too thin, threads of the screw hole are few, and the screw cannot effectively lock the screw hole. If the thickness of the heat dissipation surface is increased, the space utilization rate of the inner part of the tank body is affected. Meanwhile, if the heat dissipation tank body of the scheme is closely attached to the heat dissipation substrate, a plurality of screw holes are needed to be matched with the heat dissipation substrate in an installation mode, so that the problem that a plurality of hole positions are aligned is solved, and the heat dissipation tank body is inconvenient to install.
Secondly, most of the existing heat dissipation tank bodies are designed into integrally formed tank bodies, and some tank bodies are designed into a one-step forming structure by adopting a casting method, but the cost of a casting mold is higher, the period is longer, and meanwhile, if the size of a magnetic device is changed, the compatibility of the mold is poor. The second-time casting tank body is limited in material, needs to be made of metal materials with poor heat conduction such as cast steel, and is poor in heat conductivity and heat dissipation effect. Some jar bodies adopt the mode of machining to realize integrated into one piece, and the manufacturing cost of this kind of mode is high, and production efficiency is low. In addition, some existing heat dissipation tank bodies are formed by bending a metal sheet into a box-shaped structure and then welding the metal sheet. The heat dissipation tank body manufactured by the method has thinner heat dissipation wall and insufficient heat conductivity, and is only suitable for heat dissipation of magnetic devices with small heat dissipation capacity.
Disclosure of Invention
The utility model aims to solve the technical problem that a jar body heat abstractor, in the aspect of the installation with space utilization more traditional mode more ideal. Also provide a jar body heat abstractor simultaneously, can be than present traditional scheme, have more the advantage in the aspect of cost, compatibility and heat dissipation.
The utility model discloses a realize through following technical scheme: a tank body heat dissipation device comprises a heat dissipation tank body, a heat dissipation part, a heat conduction part and a heat conduction substrate, wherein at least one cavity used for placing the heat dissipation part is arranged in the heat dissipation tank body, the heat dissipation part is arranged in the cavity, the heat dissipation tank body is in contact with the heat conduction substrate for heat conduction, a heat dissipation surface is formed on the heat dissipation tank body of the contact end of the heat dissipation tank body, the heat conduction part is filled in a gap formed by the heat dissipation part and the cavity, a protruding structure is arranged on the heat dissipation surface of the heat dissipation tank body, and the heat dissipation surface is tightly attached to the heat conduction substrate through the protruding.
As an optimized technical scheme, the heat dissipation tank body is directly contacted with the surface of the heat conduction substrate through the heat dissipation surface, or a high heat conduction material is arranged between the heat dissipation tank body and the heat conduction substrate, the heat of the heat dissipation surface is conducted onto the heat conduction plate through the high heat conduction material, and the high heat conduction material refers to a material with the heat conductivity larger than that of air.
As an optimized technical scheme, the protruding structure is more than one protruding part arranged on the heat dissipation tank body, and the heat dissipation surface of the heat dissipation tank body is fixedly connected with the heat conduction substrate through the protruding structure, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
According to the preferable technical scheme, the convex portion is provided with a threaded hole, the heat dissipation substrate comprises a metal substrate and a fastening positioning hole, the fastening positioning hole is in positioning assembly with the protruding structure, and a substrate screw is locked into the threaded hole of the convex portion from the bottom of the heat dissipation substrate, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
As a preferred technical scheme, an insulating part is arranged between the body of the heat-radiating piece and the heat-radiating tank body and used for insulating and isolating the heat-radiating piece and the heat-radiating tank body.
As a preferable technical solution, the heat conducting member is a heat conducting medium with a heat conduction coefficient larger than that of air, and the heat conducting medium is filled in a gap formed by the heat dissipating member and the cavity.
As a preferable technical scheme, the heat dissipation tank body is of an integrally formed structure or a structure formed by a plurality of metal parts.
A tank body heat dissipation device comprises a heat dissipation tank body, a heat dissipation part, a heat conduction part, a sealing device and a heat conduction substrate, wherein at least one cavity used for placing the heat dissipation part is arranged in the heat dissipation tank body, the heat dissipation part is arranged in the cavity, the heat dissipation tank body is in contact with the heat conduction substrate for heat conduction, a heat dissipation surface is formed on the heat dissipation tank body at the contact end of the heat dissipation tank body, the heat conduction part is filled in a gap formed by the heat dissipation part and the cavity, the sealing device covers the opening of the heat dissipation tank body and seals the heat dissipation part in the heat dissipation tank body, and the heat dissipation tank body is an.
As a preferred technical solution, the assembled heat dissipation tank includes a bottom groove, a first baffle and a second baffle, the bottom groove forms the cavity heat dissipation surface and two opposite side surfaces of the cavity, and the first baffle and the second baffle form the other two opposite side surfaces of the cavity.
As the preferred technical scheme, a protruding structure is arranged on the heat dissipation surface of the cavity on the bottom groove, and the heat dissipation surface is tightly adsorbed and connected with the heat conduction plate through the protruding structure.
As an optimized technical scheme, the protruding structure is more than one protruding part arranged on the heat dissipation tank body, and the heat dissipation surface of the heat dissipation tank body is fixedly connected with the heat conduction substrate through the protruding structure, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
According to the preferable technical scheme, the convex portion is provided with a threaded hole, the heat dissipation substrate comprises a metal substrate and a fastening positioning hole, the fastening positioning hole is in positioning assembly with the protruding structure, and a substrate screw is locked into the threaded hole of the convex portion from the bottom of the heat dissipation substrate, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
According to a preferable technical scheme, the cover sealing device comprises a cover sealing plate and fastening screws, the cover sealing plate is sealed on the heat dissipation tank body through the fastening screws, the cover sealing plate is provided with a plurality of holes, heat dissipation pins are arranged on the heat dissipation piece, and the heat dissipation pins of the heat dissipation piece extend out of the holes and the top of the cover sealing plate.
As a preferred technical scheme, an insulating part is arranged between the body of the heat-radiating piece and the heat-radiating tank body and used for insulating and isolating the heat-radiating piece and the heat-radiating tank body.
As a preferable technical solution, the heat conducting member is a heat conducting medium with a heat conduction coefficient larger than that of air, and the heat conducting medium is filled in a gap formed by the heat dissipating member and the cavity.
As an optimized technical scheme, the heat dissipation tank body is directly contacted with the surface of the heat conduction substrate through the heat dissipation surface, or the heat dissipation tank body and the heat conduction substrate are directly provided with high heat conduction materials, the heat of the heat dissipation surface is conducted onto the heat conduction plate through the high heat conduction materials, and the high heat conduction materials refer to materials with heat conductivity larger than air.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a perspective view of a first embodiment of the utility model;
figure 2 is a cross-sectional view of a first embodiment of the invention;
FIG. 3 is a perspective view of a first embodiment of a heat-dissipating can of the present invention;
fig. 4 is a second perspective view of the heat-dissipating can body according to the first embodiment of the present invention;
fig. 5 is a perspective view of a second embodiment of the utility model;
figure 6 is a perspective view of a bottom trough of a second embodiment of the utility model;
figure 7 is a front view of a sump according to a second embodiment of the invention;
figure 8 is a front view of a baffle of a second embodiment of the invention;
figure 9 is a top view of a second embodiment baffle of the invention;
fig. 10 is a first perspective view of a heat-dissipating can body according to a second embodiment of the present invention;
fig. 11 is a second perspective view of a heat dissipation can according to a second embodiment of the present invention.
Reference numbers of the drawings:
100- -tank heat sink; 10- -heat dissipation tank; 11- -a chamber; 12- -a side wall; 13- -a heat dissipating surface; 14- -a protruding structure; 20- -a heat sink; 21- -the heat sink body; 22- -heat sink pins; 30- -capping means; 31- -cover plate; 32- -cover plate fastening screws; 40- -thermally conductive substrate; 41- -metal substrate; 42- -fastening the locating hole; 43- -substrate screw; 51- -a thermally conductive member; 52- -an insulator; 200- -assembling a heat dissipation tank body; 60- -bottom groove; 61- -bottom plate; 62- -outer panel; 63- -spacer plate; 64- -protruding fastening structure; 65- -undercut screw hole; 70- -first baffle; 71- -upright column; 72- -cover plate screw holes; 73- -tank assembly screw holes; 80- -a second baffle; 90- -screw.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Example 1
In a first embodiment of the present invention, a tank heat sink apparatus 100 is provided. Please refer to fig. 1-4. The device comprises a heat dissipation tank body 10, a heat-to-be-dissipated member 20, a heat conduction member 51 and a heat conduction substrate 40. The heat-dissipating can body 10 is surrounded by a side wall 12 and a heat-dissipating surface 13 to form at least one cavity 11, the heat-dissipating member 20 is disposed in the cavity 11, and the heat-conducting member 51 is filled in a gap formed between the heat-dissipating member 20 and the cavity 11. The heat dissipation surface 13 is provided with a protruding structure 14, and the heat dissipation surface 13 of the heat dissipation tank body 20 is tightly connected with the heat conduction substrate 40 through the protruding structure 14, so that the heat dissipation surface 13 is tightly attached to the heat conduction substrate 40. Obviously, the close attachment may mean that the heat dissipation surface 13 directly contacts the heat conduction substrate 40, or a material with high thermal conductivity is tightly sandwiched between the heat dissipation surface 13 and the heat conduction substrate 40, and the heat of the heat dissipation surface 13 is conducted to the heat conduction substrate through the material with high thermal conductivity, which includes but is not limited to heat conduction silicone grease, heat conduction pad, heat conduction insulating silicon adhesive tape, heat conduction glue, heat conduction mud, heat conduction metal, etc.
In the first embodiment of the present invention, the protruding structure 14 of the heat dissipating surface 13 is a rivet pin, and a sufficiently deep thread is provided in the rivet pin. The heat dissipation substrate 40 includes a metal substrate 41 and a fastening hole 42. The fastening positioning hole 42 is required to be matched with the protruding structure 14, and then connected to the protruding structure 14 through the substrate screw 43, so that the heat dissipation surface 13 is tightly attached to the heat conduction substrate 40.
The thickness of the heat dissipating surface 13 of the heat dissipating can 10 is preferably as thin as possible while maintaining the structural strength, since heat can be efficiently transferred to the heat dissipating substrate 40. In the embodiment of the first aspect of the present invention, the thickness of the heat dissipating surface 13 is only 2mm, and it is very difficult to attach the fastening screw thread to the plate, but this embodiment can ensure reliable fastening and minimum thickness of the heat dissipating surface 13 because the heat dissipating surface 13 is provided with the protruding structure 14 and the protruding structure 14 is provided with the fastening screw thread with enough thickness, and meanwhile, the protruding structure 14 does not occupy the space of the cavity 11, which can improve the utilization rate of the cavity 11. Meanwhile, in the embodiment of the first aspect of the present invention, the thickness of the sidewall 12 only needs to satisfy the thickness required for heat dissipation, and enough positions often need to be added to the sidewall 12 to set up fastening threaded holes or other fastening devices in the past. In addition, the heat dissipating surface 13 is to be mounted on the heat dissipating substrate 40, and how to precisely align the plurality of fastening members of the heat dissipating tank with the plurality of fastening members of the heat dissipating substrate 40 is a subject of improving the production efficiency. In the embodiment of the first aspect of the present invention, the protruding structure 14 and the fastening positioning hole 42 protrude from each other and are recessed from each other, so that alignment and positioning are easy.
In the embodiment of the first aspect of the present invention, after the heat-dissipating member 20 is placed in the cavity 11, the cover plate 31 covers the opening of the cavity 11, and is fastened by the cover plate 31 and the fastening screw 32. The blanking plate 31 presents a plurality of holes so as to be extended from the holes by the heat spreader pins 22. Between the heat-sink-body 21 and the heat-dissipating can 10, there is an insulating member 52, which mainly serves to insulate and isolate the heat-sink 20 from the heat-dissipating can 10.
Example 2
The second embodiment of the present invention provides an assembled heat dissipation tank 200, see fig. 5-11, wherein the assembled heat dissipation tank 200 has three assembly cavities, which are assembled by a bottom groove 60, a first baffle 70, a second baffle 80, and screws 90. The heat sink 20 is placed in the assembly cavity, and the heat conducting glue is filled in a gap formed by the heat sink 20 and the assembly cavity. The cover means 30 covers the opening of the assembly chamber.
Referring to fig. 6 and 7, the bottom slot 60 is composed of a bottom plate 61, an outer side plate 62, a partition plate 63, a protruding fastening structure 64 and a bottom slot screw hole 65. The bottom groove 60 is integrally formed by extrusion, and then machining is performed on an integrally formed initial structure, so that the size structure of the upper parts of the bottom plate 61, the outer side plate 62 and the partition plate 63 which cannot be adjusted by the extrusion process is adjusted, and the structures which cannot be added by the extrusion processes such as screw holes, rivets, riveting columns and the like are added. The male fastening structures 64 are riveted studs machined into the base plate 61. The male fastening structures 64 are used to secure the heat sink can to the heat sink base plate. The utility model discloses in second aspect embodiment figure 4, a plurality of cavitys have been constituteed to bottom plate 61, outer panel 62 and space bar 63, and in practical application, can adjust the quantity of space bar 63 to adjust heat dissipation cavity's quantity, if space bar 63 quantity is 0, then heat dissipation cavity's quantity also can be 1.
Referring to fig. 8 and 9, the first barrier 70 and the second barrier 80 are metal plates having a certain thickness. The thickness of the metal plate is related to the heat transfer requirements and the structural requirements. The first baffle 70 includes a column 71, a cover plate screw hole 72, and a tank assembly screw hole 73. The upright column 71 is used for being mounted on a PCB and is used for positioning and fixing. The cover plate screw holes 72 are used to mount the cover plate. The can assembly screw holes 73 are used to mount the first baffle 70 to the sump 60. The second baffle 80 in this embodiment is similar in construction to the second baffle 70.
Since the assembled heat dissipation tank 200 is formed in an assembled manner, flexibility in tank design is increased. In the same embodiment, the heat sink can is made up of an extruded bottom channel 60 and simple metal plates 70, 80. So the flexibility of jar body design and the efficiency nature of processing have been compromise.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (18)
1. The utility model provides a jar body heat abstractor, includes the heat dissipation jar body, by the radiating piece, heat-conducting piece, closing cap device and heat conduction base plate, the internal at least cavity that exists of heat dissipation jar is used for placing by the radiating piece usefulness, is arranged in the cavity by the radiating piece, the heat dissipation jar body is heat-conducting with the contact of heat conduction base plate, forms a radiating surface on the heat dissipation jar body of its contact end, heat-conducting piece is filled by the radiating piece with in the gap that the cavity formed, closing cap device lid is at heat dissipation jar body opening part, will be sealed in the heat dissipation jar body by the heat-radiating device, its: the heat dissipation surface of the heat dissipation tank body is provided with a protruding structure, and the heat dissipation surface is closely attached to the heat conduction substrate and completes heat exchange through the protruding structure.
2. The can heat sink of claim 1, wherein: the heat dissipation tank body is in direct contact with the surface of the heat conduction substrate through the heat dissipation surface, or the heat dissipation tank body and the heat conduction substrate are directly provided with high heat conduction materials, the heat conduction of the heat dissipation surface is conducted to the heat conduction substrate through the high heat conduction materials, and the high heat conduction materials refer to materials with heat conductivity larger than air.
3. The can heat sink of claim 1, wherein: the protruding structure is more than one protruding part arranged on the heat dissipation tank body, and the heat dissipation surface of the heat dissipation tank body is fixedly connected with the heat conduction substrate through the protruding structure, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
4. The can heat sink of claim 3, wherein: the bottom of the convex part is provided with a threaded hole, the heat dissipation substrate comprises a metal substrate and a fastening positioning hole, the fastening positioning hole is in positioning assembly with the protruding structure, and a substrate screw is locked into the threaded hole of the convex part from the bottom of the heat dissipation substrate, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
5. The can heat sink of claim 1, wherein: the cover sealing device comprises a cover sealing plate and a fastening screw, and the cover sealing plate is sealed on the heat dissipation tank body through the fastening screw.
6. The can heat sink of claim 5, wherein: the cover sealing plate is provided with a plurality of holes, the heat-radiating pins are arranged on the heat-radiating piece, and the heat-radiating pins of the heat-radiating piece extend out of the holes at the top of the cover sealing plate.
7. The can heat sink of claim 1, wherein: an insulating part is arranged between the body of the heat-radiating piece and the heat-radiating tank body and used for insulating and isolating the heat-radiating piece and the heat-radiating tank body.
8. The can heat sink of claim 1, wherein: the heat conducting element is a heat conducting medium with a heat conduction coefficient larger than that of air, and the heat conducting medium is filled in a gap formed by the heat radiating element and the cavity.
9. The can heat sink of claim 1, wherein: the heat dissipation tank body is of an integrally formed structure.
10. The utility model provides a jar body heat abstractor, includes the heat dissipation jar body, by the radiating piece, heat-conducting piece, closing cap device and heat conduction base plate, the internal at least cavity that exists of heat dissipation jar is used for placing by the radiating piece usefulness, is arranged in the cavity by the radiating piece, the heat dissipation jar body is heat-conducting with the contact of heat conduction base plate, forms a radiating surface on the heat dissipation jar body of its contact end, heat-conducting piece is filled by the radiating piece with in the gap that the cavity formed, closing cap device lid is at heat dissipation jar body opening part, will be sealed in the heat dissipation jar body by the heat-radiating device, its: the heat dissipation tank body is an assembled heat dissipation tank body.
11. The can heat sink of claim 10, wherein: the assembled heat dissipation tank body comprises a bottom groove, a first baffle and a second baffle, wherein the bottom groove is formed in the cavity heat dissipation surface and two opposite side surfaces of the cavity, and the first baffle and the second baffle are formed in the other two opposite side surfaces of the cavity.
12. The can heat sink of claim 11, wherein: the cavity radiating surface on the bottom groove is provided with a convex structure, and the radiating surface is closely adsorbed and connected with the heat conducting plate through the convex structure.
13. The can heat sink of claim 12, wherein: the protruding structure is more than one protruding part arranged on the heat dissipation tank body, and the heat dissipation surface of the heat dissipation tank body is fixedly connected with the heat conduction substrate through the protruding structure, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
14. The can heat sink of claim 13, wherein: the bottom of the convex part is provided with a threaded hole, the heat dissipation substrate comprises a metal substrate and a fastening positioning hole, the fastening positioning hole is in positioning assembly with the protruding structure, and a substrate screw is locked into the threaded hole of the convex part from the bottom of the heat dissipation substrate, so that the heat dissipation surface is tightly attached to the heat conduction substrate.
15. The can heat sink of claim 10, wherein: the cover sealing device comprises a cover sealing plate and fastening screws, the cover sealing plate is sealed on the heat dissipation tank body through the fastening screws, the cover sealing plate is provided with a plurality of holes, heat dissipation pins are arranged on the heat dissipation piece, and the heat dissipation pins of the heat dissipation piece extend out of the holes at the top of the cover sealing plate.
16. The can heat sink of claim 10, wherein: an insulating part is arranged between the body of the heat-radiating piece and the heat-radiating tank body and used for insulating and isolating the heat-radiating piece and the heat-radiating tank body.
17. The can heat sink of claim 10, wherein: the heat conducting element is a heat conducting medium with a heat conduction coefficient larger than that of air, and the heat conducting medium is filled in a gap formed by the heat radiating element and the cavity.
18. The can heat sink of claim 10, wherein: the heat dissipation tank body is in direct contact with the surface of the heat conduction substrate through the heat dissipation surface, or the heat dissipation tank body and the heat conduction substrate are directly provided with high heat conduction materials, the heat conduction of the heat dissipation surface is conducted to the heat conduction substrate through the high heat conduction materials, and the high heat conduction materials refer to materials with heat conductivity larger than air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921512574.1U CN210925685U (en) | 2019-09-11 | 2019-09-11 | Tank body heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921512574.1U CN210925685U (en) | 2019-09-11 | 2019-09-11 | Tank body heat dissipation device |
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| Publication Number | Publication Date |
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| CN210925685U true CN210925685U (en) | 2020-07-03 |
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| CN201921512574.1U Active CN210925685U (en) | 2019-09-11 | 2019-09-11 | Tank body heat dissipation device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113273323A (en) * | 2020-08-14 | 2021-08-17 | 深圳欣锐科技股份有限公司 | Heat dissipation assembly and assembly method thereof |
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2019
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113273323A (en) * | 2020-08-14 | 2021-08-17 | 深圳欣锐科技股份有限公司 | Heat dissipation assembly and assembly method thereof |
| CN113273323B (en) * | 2020-08-14 | 2023-05-02 | 深圳欣锐科技股份有限公司 | Heat dissipation assembly and assembly method thereof |
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