CN210924043U - Laser fixing and packaging structure for optical device - Google Patents
Laser fixing and packaging structure for optical device Download PDFInfo
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- CN210924043U CN210924043U CN201922204009.5U CN201922204009U CN210924043U CN 210924043 U CN210924043 U CN 210924043U CN 201922204009 U CN201922204009 U CN 201922204009U CN 210924043 U CN210924043 U CN 210924043U
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Abstract
The utility model belongs to the technical field of the optical communication module is made, especially, relate to a fixed packaging structure of laser for optical device. The heat dissipation device comprises an airtight shell, wherein the airtight shell is provided with an installation fixing hole penetrating through the bottom of the shell, and a heat dissipation substrate is embedded in the installation fixing hole; the edge of the heat dissipation substrate is hermetically connected with the hermetic sealing shell through welding, and the laser chip assembly is arranged in the hermetic sealing shell; the laser chip assembly is attached to the upper surface of the heat dissipation substrate. The utility model discloses an improve and be used for on the fixed packaging structure of laser instrument for the optical device fixedly, encapsulate at airtight shell structure and manufacturing method, when guaranteeing the high-speed heat dissipation of laser instrument heat source, effective control material and processing cost realize improving the fixed encapsulation performance of laser instrument and reduce the economic benefits and social benefits unification of production manufacturing cost simultaneously.
Description
Technical Field
The utility model belongs to the technical field of the optical communication module is made, especially, relate to a fixed packaging structure of laser for optical device.
Background
The optical module is widely applied to the field of optical communication, and the TOSA and ROSA optical devices are core components in the optical module. A circuit board PCBA in the optical device supplies power to a laser (the circuit board is connected with the laser through a gold wire), the laser emits light, and the light is collimated and coupled into an optical fiber through a lens. Therefore, the position precision among the laser, the lens and the optical fiber assembly directly determines the quality of optical transmission, the heat dissipation of the optical device also directly influences the working performance of the laser, and the quality of the heat dissipation efficiency also influences the position precision related to the optical path through thermal deformation. The prior art structure adopts a kovar alloy integral airtight shell 1 to fix and package a PCBA, a laser, a lens and an optical fiber assembly to finish the fixed alignment of an optical path, the heat dissipation requirement of a laser mounting area in an optical device is very high, the heat dissipation efficiency of the mounting area directly determines the performance of an optical module, and the consideration of comprehensive cost, materials and processing difficulty, the existing optical device packaging shell on the market is mainly divided into two types, namely a tungsten copper material airtight shell product with high heat dissipation and high matching performance of thermal expansion CTE and chip materials, tungsten copper is a material with good heat conductivity and good matching degree of CTE and laser chip CTE, but the price of the tungsten copper material is much higher than that of the kovar alloy, the market price of the tungsten copper is about 1200RMB/KG, the kovar alloy is about 200RMB/KG, meanwhile, the hardness of the tungsten copper material is very high, the machining cost is high, and the laser welding performance of the tungsten copper is poorer than that of the kovar alloy, moreover, the optical module package airtight housing 1 is generally characterized by a deep cavity, and the machining amount and the material consumption are large, so that the material and the machining cost of the product are very high, and the wide popularization is difficult. The other is a kovar alloy airtight shell product, and the kovar alloy material is characterized in that the matching degree of CTE and a laser chip is good, the laser welding performance of the material and an optical fiber assembly is good, but the thermal conductivity is poor, so that the heat dissipation performance of the product is poor, the laser and the airtight shell 1 are difficult to dissipate heat quickly, and the photoelectric conversion efficiency stability of the laser is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a have higher thermal expansion coefficient matching degree, the radiating efficiency is high simultaneously, fixed packaging structure of laser instrument for the optical device with low costs.
A laser fixing and packaging structure for an optical device comprises an airtight shell 1, wherein the airtight shell 1 is provided with a mounting and fixing hole 1a penetrating through the bottom of the shell, and a heat dissipation substrate 3 is embedded in the mounting and fixing hole 1 a; the edge of the heat dissipation substrate 3 is hermetically connected with the airtight shell 1 through welding, and the laser chip assembly 2 is arranged in the airtight shell 1; the laser chip assembly 2 is attached to the upper surface of the heat dissipating substrate 3.
Through setting up through-type installation fixed orifices 1a and radiating basal plate 3, can be so that the heat that laser chip subassembly 2 produced directly conducts to the sealed casing outside through radiating basal plate 3, reduce the heat and detain in airtight casing inside, improve laser chip's radiating efficiency by a wide margin, reduce laser chip's operating temperature, promote optical device's performance. The heat dissipation substrate 3 has small specification size within 5mmX5mmX0.5mm, simple structure, low manufacturing cost and little influence on the manufacturing cost of the whole airtight shell.
The further improvement of the laser fixing and packaging structure for the optical device further comprises that a heat dissipation groove 1e which is opposite to and communicated with the installation fixing hole 1a is arranged at the bottom of the airtight shell 1, the edge of the heat dissipation substrate 3 is adapted to the heat dissipation groove 1e, a silver-copper solder prefabricated sheet 9 which is adapted to the shape of the groove bottom is arranged in the groove bottom of the heat dissipation groove 1e, and the heat dissipation substrate 3 is embedded and welded in the heat dissipation groove 1 e; the upper surface of the heat dissipation substrate 3 is provided with a mounting groove 3a, and the size and the shape of the mounting groove 3a are matched with the lower end of the laser chip component 2; the laser chip assembly 2 is welded in the mounting groove 3a after passing through the mounting fixing hole 1 a.
The further improvement of the laser fixing and packaging structure for the optical device further comprises a first optical lens 4 and a second optical lens which are arranged in the airtight shell 1; and a circuit board 5 embedded on the airtight housing 1; the airtight shell 1 is provided with a mounting opening 1c, and the circuit board 5 is inserted from the mounting opening 1c and then fixed; the airtight shell 1 is also provided with an optical fiber hole 1d, and the second optical lens covers the optical fiber hole 1 d; the first optical lens 4 is arranged between the laser chip assembly 2 and the second optical lens; an optical fiber is arranged at the optical fiber hole 1 d; the laser chip assembly 2, the first optical lens 4 and the second optical lens are arranged in a collinear manner, so that laser light is directly incident into the optical fiber hole 1d along the first optical lens 4 and the second optical lens.
The further improvement of the laser fixing and packaging structure for the optical device further comprises a first optical lens 4 and a second optical lens which are arranged in the airtight shell 1; and a circuit board 5 embedded on the airtight housing 1; the airtight shell 1 is provided with a mounting opening 1c, and the circuit board 5 is inserted from the mounting opening 1c and then fixed; the airtight shell 1 is also provided with an optical fiber hole 1d, and the second optical lens covers the optical fiber hole 1 d; the first optical lens 4 is arranged between the laser chip assembly 2 and the second optical lens; an optical fiber is arranged at the optical fiber hole 1 d; the laser chip assembly further comprises a light path control device arranged between the laser chip assembly 2 and the first optical lens 4 and/or between the first optical lens 4 and the second optical lens;
the further improvement of the laser fixing and packaging structure for the optical device further comprises that the heat dissipation substrate 3 is made of tungsten copper; the first optical lens 4 is a coupling lens, and the second optical lens is a collimating lens; the light path control means refers to a mirror or a refractor.
The beneficial effects are that:
the utility model discloses an improve and be used for on the fixed packaging structure of laser instrument (TOSA, ROSA) for the optical device fixed, encapsulation at airtight shell structure and manufacturing method, when guaranteeing the high-efficient radiating of laser instrument heat source, effective control material and processing cost realize improving the fixed encapsulation performance of laser instrument and reduce the economic benefits and social benefits unification of production manufacturing cost simultaneously. The utility model discloses can fine satisfy the tungsten copper material of requirement at heat source region with heat conductivity and CTE to adopt through type structural design, this kind of mode is for integration kovar shell, only increases a thin slice structure's heat dissipation base plate 3, is not the deep cavity structure, expends the material very little, and consequently the processing cost increases very little, but has effectively improved the thermal diffusivity of original structure, has realized the coordination of low-cost and high accuracy high performance, cooperates the utility model provides a manufacturing approach, when guaranteeing that the product precision can satisfy device performance and light path requirement in batches, utilizes two processing, throws except that the surplus clears up the welding slag simultaneously, realizes that chip pastes the regional surface of dress clean, and is not remained, has guaranteed the high accuracy high performance of product.
Drawings
Fig. 1 is an assembly diagram of the internal structure of the laser fixing and packaging structure for an optical device according to the present invention;
(the top cover of the housing has been removed to facilitate display of the internal structure);
fig. 2 is a bottom view of the airtight housing 1 of the laser fixing and packaging structure for an optical device according to the present invention.
Detailed Description
The present invention will be described in detail with reference to the following specific examples.
The utility model relates to a fixed packaging structure of laser for optical device, including TOSA, ROSA etc. the fixed packaging structure of laser for optical device is one of the core hardware of trades such as fiber-optical communication, mainly used for protecting optical device, guarantees that the continuous effectual collimation coupling of laser advances structures such as optic fibre, and under general condition, optical device producer purchases outside or oneself produces airtight casing 1 (divide into box-shaped casing and the apron at top), later with laser chip subassembly and optical element etc. or fix in airtight casing 1 inside; the main materials and properties of the conventional laser fixing and packaging structure for the optical device are shown in table 1:
TABLE 1 Properties of materials commonly used for laser fixing and packaging structure for optical device
One conventional design of the hermetic enclosure of the optical device is made of a kovar alloy material, but as shown in table 1, the kovar alloy has poor thermal conductivity, and heat near the chip assembly is difficult to be efficiently conducted away, and meanwhile, the laser chip assembly 2 is located inside the hermetic enclosure 1, so that heat is accumulated inside the hermetic enclosure and difficult to be conducted away, and thus, although the cost is low, the heat dissipation performance of the product is poor, and the product is difficult to be applied to a product with high power heat dissipation requirement. The other conventional design adopts tungsten copper material to make the packaging shell, and the heat dissipation performance and the matching performance of the chip component mounting thermal expansion coefficient are good, but the manufacturing cost is high, and the batch practicability is not strong.
The utility model discloses in, change traditional structural design scheme, through the regional setting of subsides at laser chip subassembly 2 and run through the structure to with the welding of radiating basal plate 3 among the running through structure, for airtight casing 1 of full structure pure tungsten copper material, the production that can the effective control batch manufacturing rises originally, for the seal structure that plays of full structure kovar alloy material, can improve the heat dispersion of device greatly, the photoelectric conversion efficiency and the stability of lifting into laser chip.
The description is given with reference to the specific embodiments:
example one
As shown in fig. 1, for this reason, the present invention provides an improved laser fixing and packaging structure for an optical device, which is characterized in that the structure comprises an airtight housing 1, wherein an installation fixing hole 1a penetrating through the bottom of the housing is formed in the airtight housing 1, and a heat dissipation substrate 3 is embedded in the installation fixing hole 1 a; the edge of the radiating substrate 3 is hermetically connected with the airtight shell 1 by welding, and the radiating substrate 3 is made of tungsten copper; the laser chip component 2 is arranged in the airtight shell 1; the laser chip assembly 2 is attached to the upper surface of the heat dissipation substrate 3; the edge of the heat dissipation substrate 3 is hermetically connected with the edge of the mounting fixing hole 1a through welding to ensure the sealing performance of the airtight shell 1;
in the specific implementation, the airtight housing 1 is integrally sealed at a later stage for convenience of processing, and a box-shaped housing part is processed in a production line, and finally a sealing cover is fixed on the housing part (for convenience of showing an internal structure, only the housing part is included in fig. 1).
In the traditional structure, most heat all need be conducted away through airtight casing 1, and the heat that the laser instrument sent stops in airtight casing 1 for a long time, can not obtain effective cooling, the utility model discloses heat dissipation base plate 3 has been set up, the laser instrument chip sets up on heat dissipation base plate 3 through the welded mode rather than the lug weld in airtight casing 1 bottom, and this change makes the laser instrument chip subassembly can be with most heat direct conduction to heat dissipation base plate 3 to utilize cooling medium such as directness and outside gas or structure direct contact's heat dissipation base plate 3 to realize dispelling the heat fast, the directness that most heat can be quick is derived to airtight casing 1 outside, can not long-time be detained inside airtight casing 1, and then very big promotion radiating efficiency. Through surveying, adopt the utility model discloses the product that structure and manufacturing method obtained, in laser instrument working process, each performance has obvious promotion, and actual conditions is as shown in table 3:
TABLE 3 present product and the cost and performance comparison of the present invention
Example two
As shown in fig. 2, further, in order to improve the positioning accuracy of the optical device laser fixing and packaging structure, reduce the processing difficulty, and improve the heat dissipation performance, in this embodiment, the bottom of the airtight housing 1 is provided with a heat dissipation groove 1e facing and communicating with the mounting fixing hole 1a, the edge of the heat dissipation substrate 3 is adapted to the heat dissipation groove 1e, a silver-copper solder preform 9 adapted to the shape of the groove bottom is provided in the groove bottom of the heat dissipation groove 1e, and the heat dissipation substrate 3 is embedded and welded in the heat dissipation groove 1 e; the upper surface of the heat dissipation substrate 3 is provided with a mounting groove 3a, and the size and the shape of the mounting groove 3a are matched with the lower end of the laser chip component 2; the laser chip assembly 2 is welded in the mounting groove 3a after passing through the mounting fixing hole 1 a.
In the specific implementation process, the laser fixing and packaging structure for the optical device further comprises a first optical lens 4 and a second optical lens which are arranged inside the airtight shell 1; and a circuit board 5 embedded on the airtight housing 1; the airtight shell 1 is provided with a mounting opening 1c, and the circuit board 5 is inserted from the mounting opening 1c and then fixed; the airtight shell 1 is also provided with an optical fiber hole 1d, and the second optical lens covers the optical fiber hole 1 d; the first optical lens 4 is arranged between the laser chip assembly 2 and the second optical lens; an optical fiber is arranged at the optical fiber hole 1 d; the laser chip assembly 2, the first optical lens 4 and the second optical lens are arranged in a collinear manner, so that laser light is directly incident into the optical fiber hole 1d along the first optical lens 4 and the second optical lens.
In a preferred embodiment, the heat dissipation substrate 3 is a tungsten copper substrate to achieve high heat dissipation performance; the first optical lens 4 is a coupling lens and the second optical lens is a collimating lens.
EXAMPLE III
To meet more functional requirements and structural solutions; in the embodiment, the laser chip assembly further comprises a light path control device arranged between the laser chip assembly 2 and the first optical lens 4 and/or between the first optical lens 4 and the second optical lens; the optical path control device refers to a reflecting mirror or a refracting mirror, and can freely control an optical propagation path, a shunt path and the like so as to meet diversified requirements.
Example four
In order to reduce the degree of difficulty of manufacturing, improve the performance of product precision in order to guarantee the fixed packaging structure of laser for optical device, the utility model also provides a fixed packaging structure manufacturing method of laser for optical device, include following step:
s1, processing the airtight shell 1, wherein the allowance of the installation surface of the first optical lens 4 is 0.1-0.2 mm, and the allowance of the optical fiber hole 1d is 0.1-0.2 mm;
s2, processing the heat dissipation substrate 3, and reserving a margin of 0.1-0.2 mm on the upper surface;
s3, pre-plating nickel on the surface of the heat dissipation substrate 3 by 0.5-2 mu m;
in the foregoing steps S1 and S2, the portion of the laser chip assembly inserted into the mounting hole 1a is processed to the fitting dimension, and the processing requirement is reduced because the processing margin is retained;
s4, welding the airtight shell 1 and the heat dissipation substrate 3;
s5, finishing the upper surface of the heat dissipation substrate 3, the mounting surface of the first optical lens 4 and the mounting fixing hole 1a, removing welding slag and processing defects, and ensuring the parallelism and dimensional accuracy of the upper surface of the heat dissipation substrate 3 and the mounting surface of the first optical lens 4;
s6, carrying out nickel plating and gold plating treatment on the surface of the airtight shell assembly;
in the traditional process, a common manufacturer firstly manufactures two independent parts and finally braze welds the two parts in a gas-tight manner to form a finished product. Thus, it is difficult to achieve a sufficiently high accuracy. The reason is that assembly positioning error during welding and deformation caused by high-temperature baking at 800 ℃ of silver-copper brazing exist, and welding flux is easy to exist on the upper surface of the radiating substrate 3 after welding, so that the yield of finished products is difficult to reach more than 90%, and the manufacturing cost is higher due to quality problems.
The utility model discloses in through remaining enough allowances, the required precision to auxiliary assembly such as anchor clamps or positioning die descends by a wide margin, in this embodiment, the technology is AgCu28 brazing during the welding, welding temperature 800 ~ 820 ℃, keep warm for 3 minutes, the gas tightness < 1 × 10-9Pa · m3/s, for guaranteeing the device performance, the parallelism 0.015mm of the installation face of heat dissipation base plate 3 upper surface and first optical lens 4, size precision 0.01mm, soldering lug thickness 0.02 ~ 0.05mm during the welding.
The utility model discloses an among the manufacturing method, airtight casing 1 is provided with installation fixed orifices 1a, installation fixed orifices 1a is as the location benchmark between heat dissipation base plate 3 and laser chip subassembly 2 and the airtight casing 1 in the manufacturing process, extra positioning fixture etc. has been saved in original manufacturing approach on the one hand, on the other hand can be based on size and position between installation fixed orifices 1a and airtight casing 1 and the laser chip subassembly 2 when making manufacturing, realize earlier thick positioning welding through the mode of leaving the surplus, the effect of back finish machining to installation size. The other important purpose of reserving allowance on the mounting surface is to completely remove surface welding slag and processing defects at one time by eliminating the allowance until the size is reached after later welding is finished; in the traditional process, welding slag is remained on the mounting surface after the end face is machined, the performance and the appearance of the laser are affected, the laser is very difficult to clean, an additional treatment flow is needed, and the production cost is increased.
It is to be noted that, in the foregoing embodiment, the heat dissipation substrate 3 is made of a material having a good thermal conductivity and a high matching degree of thermal expansion coefficient, which is generally tungsten copper or aluminum nitride in the prior art, and other materials may be used according to the development of material technology.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. A laser fixing and packaging structure for an optical device is characterized by comprising an airtight shell (1), wherein an installation fixing hole (1a) penetrating through the bottom of the shell is formed in the airtight shell (1), and a heat dissipation substrate (3) is embedded in the installation fixing hole (1 a); the edge of the heat dissipation substrate (3) is hermetically connected with the airtight shell (1) through welding, and the laser chip assembly (2) is arranged in the airtight shell (1); the laser chip assembly (2) is attached to the upper surface of the heat dissipation substrate (3).
2. The optical device laser fixing and packaging structure according to claim 1, wherein the bottom of the hermetic case (1) is provided with a heat sink (1e) opposite to and communicating with the mounting hole (1a), the edge of the heat sink substrate (3) is adapted to the heat sink (1e), a silver-copper solder preform (9) having a shape adapted to the bottom of the heat sink (1e) is provided in the bottom of the heat sink (1e), and the heat sink substrate (3) is embedded and soldered in the heat sink (1 e); the upper surface of the heat dissipation substrate (3) is provided with a mounting groove (3a), and the size and the shape of the mounting groove (3a) are matched with the lower end of the laser chip component (2); the laser chip component (2) penetrates through the mounting fixing hole (1a) and then is welded in the mounting groove (3 a).
3. The optical device laser fixing and packaging structure according to claim 1, further comprising a first optical lens (4), a second optical lens disposed inside the hermetic case (1); and a circuit board (5) embedded in the airtight housing (1); the airtight shell (1) is provided with a mounting opening (1c), and the circuit board (5) is inserted from the mounting opening (1c) and then fixed; the airtight shell (1) is also provided with an optical fiber hole (1d), and the second optical lens covers the optical fiber hole (1 d); the first optical lens (4) is arranged between the laser chip assembly (2) and the second optical lens; an optical fiber is arranged at the optical fiber hole (1 d);
the laser chip component (2), the first optical lens (4) and the second optical lens are arranged in a collinear manner, so that light emitted by the laser chip component enters the optical fiber hole (1d) directly along the first optical lens (4) and the second optical lens.
4. The optical device laser fixing and packaging structure according to claim 1, further comprising a first optical lens (4), a second optical lens disposed inside the hermetic case (1); and a circuit board (5) embedded in the airtight housing (1); the airtight shell (1) is provided with a mounting opening (1c), and the circuit board (5) is inserted from the mounting opening (1c) and then fixed; the airtight shell (1) is also provided with an optical fiber hole (1d), and the second optical lens covers the optical fiber hole (1 d); the first optical lens (4) is arranged between the laser chip assembly (2) and the second optical lens; an optical fiber is arranged at the optical fiber hole (1 d);
the laser chip assembly further comprises a light path control device arranged between the laser chip assembly (2) and the first optical lens (4) and/or between the first optical lens (4) and the second optical lens.
5. The optical device laser fixing and packaging structure according to claim 4, wherein the heat-dissipating substrate (3) is made of tungsten copper, the first optical lens (4) is a coupling lens, and the second optical lens is a collimating lens; the light path control device refers to a reflecting mirror or a refracting mirror.
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| CN201922204009.5U CN210924043U (en) | 2019-12-10 | 2019-12-10 | Laser fixing and packaging structure for optical device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110764203A (en) * | 2019-12-10 | 2020-02-07 | 武汉优信技术股份有限公司 | Laser fixing and packaging structure for optical device and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110764203A (en) * | 2019-12-10 | 2020-02-07 | 武汉优信技术股份有限公司 | Laser fixing and packaging structure for optical device and manufacturing method thereof |
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