CN210807810U - Circuit board and electronic device - Google Patents
Circuit board and electronic device Download PDFInfo
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- CN210807810U CN210807810U CN201922039986.4U CN201922039986U CN210807810U CN 210807810 U CN210807810 U CN 210807810U CN 201922039986 U CN201922039986 U CN 201922039986U CN 210807810 U CN210807810 U CN 210807810U
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- circuit board
- mounting
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- component
- mounting groove
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Abstract
The utility model discloses a circuit board and electron device, this circuit board includes: the substrate is provided with a mounting surface, and the mounting surface is provided with a mounting groove; the electronic component comprises a first component and a second component, wherein the height of the first component is smaller than that of the second component, the first component is arranged on the mounting surface, and the second component is arranged in the mounting groove. The utility model discloses aim at reducing the thickness of circuit board, and then reduce electron device's thickness.
Description
Technical Field
The utility model relates to a circuit board technical field, in particular to circuit board and electronic device who uses this circuit board.
Background
At present, the requirement of users on the thickness of the whole mobile phone and other electronic devices is continuously increased, and users are more and more inclined to products with thinner thickness. The height of the circuit board in the conventional electronic device is determined by the height of the highest device in the package, and the thickness of the plastic package body is increased due to the fact that the heights of different electronic components are different, and the thickness of the circuit board is increased, and the thickness of the electronic device is affected.
The above description is only for the purpose of aiding understanding of the technical solutions of the present application and does not represent an admission of prior art.
SUMMERY OF THE UTILITY MODEL
The present invention provides a circuit board and an electronic device, which are used to reduce the thickness of the circuit board and further reduce the thickness of the electronic device.
In order to achieve the above object, the present invention provides a circuit board including:
the substrate is provided with a mounting surface, and the mounting surface is provided with a mounting groove; and
the electronic component comprises a first component and a second component, wherein the height of the first component is smaller than that of the second component, the first component is arranged on the mounting surface, and the second component is arranged in the mounting groove.
In one embodiment, the distance between the second device and the side wall of the mounting groove is greater than or equal to 0.1 mm.
In an embodiment, the circuit board further includes a first pad disposed on the mounting surface and a second pad disposed in the mounting groove, the first pad is connected to the second pad through a bonding wire, the first device is disposed on the first pad, and the second device is disposed on the second pad.
In an embodiment, a bottom of the second pad facing the second device is provided with a tin layer, and the second device is connected with the second pad through the tin layer.
In one embodiment, the mounting surface is provided with a mounting channel which is communicated with the mounting groove and is adjacent to the mounting groove, and the welding wire is arranged in the mounting channel.
In one embodiment, the width of the installation channel is 0.07mm to 0.08 mm.
In one embodiment, the electronic component includes a plurality of the first devices, and the plurality of the first devices are arranged on the mounting surface at intervals;
and/or, electronic components includes a plurality of the second device, the installation face is equipped with a plurality of intervals the mounting groove sets up, each the second device is equipped with one in the mounting groove.
In one embodiment, the first device is a chip or a die;
and/or the second device is a resistive, capacitive or inductive or bottom pad device.
In one embodiment, the circuit board further includes a protective layer covering the electronic component and connected to the mounting surface.
The utility model also provides an electron device, including the circuit board, this circuit board is the aforesaid the circuit board.
The utility model discloses technical scheme's circuit board is through setting up the mounting groove on the base plate, locates the mounting groove with the higher second device of height among the electronic components to reduce the difference in height between second device and the first device, thereby realize reducing the whole thickness of circuit board, and then effectively reduce electron device's thickness.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the circuit board of the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a circuit board 100. It is understood that the circuit board 100 is applicable to electronic devices, such as mobile phones, tablet computers, notebook computers, etc., and is not limited thereto.
Referring to fig. 1, in an embodiment of the present invention, the circuit board 100 includes a substrate 1 and an electronic component 2 disposed on the substrate 1, wherein the substrate 1 has a mounting surface 11, and the mounting surface 11 is provided with a mounting groove 12; the electronic component 2 comprises a first component 21 and a second component 22, wherein the height of the first component 21 is smaller than that of the second component 22, the first component 21 is arranged on the mounting surface 11, and the second component 22 is arranged in the mounting groove 12.
The utility model discloses technical scheme's circuit board 100 is through setting up mounting groove 12 on base plate 1, locates mounting groove 12 with the higher second device 22 of height in electronic components 2 to reduce the difference in height between second device 22 and the first device 21, thereby realize reducing circuit board 100's whole thickness, and then effectively reduce electron device's thickness.
It is understood that the circuit board 100 may be a printed circuit board, and the material thereof may be FR4 epoxy resin board; or the circuit board 100 may be a flexible circuit board 100, and the material of the flexible circuit board 100 is any one of polydimethylsilane, polyimide, polyethylene, polyvinylidene fluoride, and natural rubber. Or the circuit board 100 is a combination of a rigid circuit board 100 and a flexible circuit board 100, and the number of circuit layers may be a single layer, a double layer or a multilayer.
In the present embodiment, a plurality of electronic components 2 are provided on the substrate 1 of the circuit board 100, that is, a plurality of electronic components 2 are integrated on the substrate 1. It is understood that a plurality of electronic components 2 may be disposed on the same surface of the substrate 1, and of course, in order to improve the utilization rate of the circuit board 100, a plurality of electronic components 2 may be disposed on opposite surfaces of the substrate 1.
It is understood that the substrate 1 is used for mounting the electronic component 2, and in order to make the circuit board 100 present different states, such as a hard circuit board 100, a flexible circuit board 100 or a printed circuit board, the material of the substrate 1 may be selected to be a hard material, such as FR4 epoxy resin board, of course, the material of the substrate 1 may be selected to be a soft material, such as any one of polydimethylsilane, polyimide, polyethylene, polyvinylidene fluoride, natural rubber, etc., and is not limited herein.
In an embodiment of the present invention, the manufacturing process of the circuit board 100 may include:
firstly, wiring a substrate 1, and determining the thickness of the substrate 1 and the arrangement position of an electronic component 2;
determining the depth and the position of the mounting groove 12 on the substrate 1 according to the overall thickness requirement of the circuit board 100 after welding and the arrangement position of the electronic component 2; the mounting groove 12 and the circuit and the connecting hole of the layer formed on the substrate 1 should not affect each other except for the board layer electrically connected with the mounted electronic component 2;
making the forming layer of the mounting groove 12 into a hole of the mounting groove 12 according to the size and the position of the mounting groove 12;
the mounting surface 11 forming layer is pressed, and the mounting surface 11 forming layer and the mounting groove 12 forming layer are integrally pressed.
It is understood that the electronic component 2 may be electrically connected to the substrate 1 by soldering or other connection methods.
In one embodiment, as shown in FIG. 1, the distance between the second component 22 and the side wall of the mounting groove 12 is greater than or equal to 0.1 mm. It will be appreciated that the dimensions of the mounting slot 12 are larger than the dimensions of the second component 22, and such arrangement facilitates the installation of the second component 22 in the mounting slot 12, thereby preventing damage to the second component 22 during installation. In the present embodiment, the distance between the periphery of the second component 22 and the side wall of the mounting groove 12 is greater than or equal to 0.1 mm.
In the embodiment, the general conventional thickness of the substrate 1 in the circuit board 100 is 0.6mm to 1.2mm, and the depth of the mounting groove 12 is smaller than the thickness of the circuit board 100. Optionally, the depth of the mounting groove 12 is greater than or equal to 1/5 of the thickness of the circuit board 100, and less than or equal to 4/5 of the thickness of the circuit board 100.
In order to ensure the neatness and no burr/burr of the circuit board 100, the notch of the mounting groove 12 and the edge of the sidewall of the mounting groove 12 on the substrate 1 need to be arranged neatly and without any burr/burr. When the second device 22 is mounted in the mounting groove 12, no glue overflow occurs, and it is ensured that no gap occurs after the press-fitting.
In one embodiment, the depth of the mounting groove 12 is different to suit the heights of different electronic components 2, and is selected according to the height of the second component 22 to be mounted.
In an embodiment, as shown in fig. 1, the circuit board 100 further includes a first pad 3 disposed on the mounting surface 11 and a second pad 4 disposed in the mounting groove 12, the first pad 3 is connected to the second pad 4 by a bonding wire 5, the first device 21 is disposed on the first pad 3, and the second device 22 is disposed on the second pad 4.
By providing the first pads 3 on the mounting surface 11 of the substrate 1, the first devices 21 of the electronic component 2 can be provided on the first pads 3 by soldering, so that electrical connection with the lines inside the substrate 1 is achieved through the first pads 3. By arranging the second bonding pads 4 in the mounting groove 12, the second devices 22 in the electronic component 2 can be arranged on the second bonding pads 4 by welding, so that the second bonding pads 4 are electrically connected with the circuits inside the substrate 1.
In the present embodiment, in order to realize the electrical connection between the first device 21 and the second device 22 of the electronic component 2, the first pad 3 is connected to the second pad 4 by a bonding wire 5. It is understood that the material of the first pad 3 and the second pad 4 may be the same or different, and is not limited herein. The material and structure of the first bonding pad 3 and the second bonding pad 4 are similar to those of the existing bonding pad, and are not described herein again.
In an embodiment, as shown in fig. 1, a side of the second pad 4 facing the second device 22 is provided with a tin layer 41, and the second device 22 is connected to the second pad 4 through the tin layer 41.
It will be appreciated that by providing the tin layer 41 on the second pad 4, the second device 22 can be easily and stably connected to the second pad 4 through the tin layer 41. In the present embodiment, the tin layer 41 may be disposed by plating on the surface of the second device 22 facing the second pad 4, so that the second device 22 can be inserted into the mounting groove 12 of the substrate 1 by mounting the second device 22 on the second pad 4 in the mounting groove 12 and then fixing and completing the electrical connection by reflow.
In one embodiment, as shown in fig. 1, the mounting surface 11 is provided with a mounting channel 13 adjacent to the mounting groove 12 and communicated with the mounting groove 12, and the welding wire 5 is arranged in the mounting channel 13. It can be understood that the mounting channel 13 is arranged on the substrate 1, and the bonding wire 5 is arranged on the mounting channel 13, so that the protection of the bonding wire 5 is facilitated, and the damage of the bonding wire 5 and the poor contact caused by the poor contact are avoided.
It is understood that the mounting channel 13 may be a mounting hole, a through hole, or the like, and the mounting channel 13 extends in the thickness direction of the substrate 1. In this embodiment, as shown in fig. 1, the mounting channel 13 includes a first section and a second section that are communicated with each other, the first section is vertically disposed to extend from the mounting surface 11 of the substrate 1, the second section is vertically disposed to the first section, and the second section is flush with the bottom wall of the mounting groove 12, so that the bonding wire 5 can be conveniently connected to the second bonding pad 4 on the bottom wall of the mounting groove 12 without affecting the mounting of the second device 22.
In one embodiment, the width of the installation channel 13 is 0.07mm to 0.08 mm. It can be understood that the width of the mounting channel 13 is 0.07mm, 0.08mm, etc., and setting the width of the mounting channel 13 in this range is beneficial to ensuring the normal passing of the bonding wire 5 and ensuring that the bonding wire 5 does not have poor contact.
In one embodiment, as shown in fig. 1, the electronic component 2 includes a plurality of the first devices 21, and the plurality of the first devices 21 are disposed at intervals on the mounting surface 11.
It is understood that a plurality of the first devices 21 may be the same electronic component 2, but of course, a plurality of the first devices 21 may also be different electronic components 2, and a plurality of the first devices 21 are disposed on the mounting surface 11 at intervals and disposed on the first pads 3, so that the plurality of the first devices 21 are electrically connected through the first pads 3.
In one embodiment, the device includes a plurality of second devices 22, the mounting surface 11 is provided with a plurality of mounting slots 12 arranged at intervals, and each second device 22 is provided in one of the mounting slots 12.
It is understood that a plurality of the second devices 22 may be the same electronic component 2, and of course, a plurality of the second devices 22 may also be different electronic components 2. In one embodiment, a plurality of the second devices 22 are spaced in the mounting groove 12, and the second devices 22 are electrically connected through the second pads 4. In another embodiment, the mounting surface 11 is provided with a plurality of mounting grooves 12 arranged at intervals, each second component 22 is arranged in one of the mounting grooves 12, and the second components 22 in different mounting grooves 12 are electrically connected through bonding wires.
In the present embodiment, the specific number and arrangement of the mounting grooves 12 are not limited as long as the wiring and the use of the circuit board 100 are facilitated.
In one embodiment, the first device 21 may be selected as a chip or a die. The second device 22 may be selected as a resistive, capacitive or inductive or bottom pad device.
In one embodiment, as shown in fig. 1, the circuit board 100 further includes a protective layer 6, and the protective layer 6 covers the device and is connected to the mounting surface 11.
It can be understood that, by providing the protective layer 6, the electronic component 2 on the substrate 1 can be protected by the protective layer 6, thereby improving the service life of the circuit board 100.
In one embodiment, the number of the protective layers 6 is one, two or more, and the protective layers 6 cover the electronic components 2 on the substrate 1 and are connected with the mounting surface 11, so as to improve the service life of the circuit board 100. Alternatively, the material of the protective layer 6 may be resin.
The utility model discloses still provide an electronic device, including circuit board 100, the concrete structure of this circuit board 100 refers to above-mentioned embodiment, because this electronic device has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The utility model discloses in, through set up mounting groove 12 on base plate 1, higher second device 22 is installed in mounting groove 12 among the electronic components 2 to effectively reduce the difference in height between first device 21 and the second device 22, so can reduce the height of whole circuit board 100. The utility model discloses a circuit board 100 can be under the same encapsulation height, and integrated more electronic components 2 have improved circuit board 100's integrated level, simultaneously, reduce the external pin of encapsulation, can shorten the signal and walk the distance of line, reduce the encapsulation loss.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A circuit board, comprising:
the substrate is provided with a mounting surface, and the mounting surface is provided with a mounting groove; and
the electronic component comprises a first component and a second component, wherein the height of the first component is smaller than that of the second component, the first component is arranged on the mounting surface, and the second component is arranged in the mounting groove.
2. The circuit board of claim 1, wherein a distance between the second device and the side wall of the mounting slot is greater than or equal to 0.1 mm.
3. The circuit board of claim 1, further comprising a first pad disposed on the mounting surface and a second pad disposed in the mounting slot, the first pad being connected to the second pad by a wire bond, the first device being disposed on the first pad, and the second device being disposed on the second pad.
4. The circuit board of claim 3, wherein a bottom of the second pad facing the second device is provided with a tin layer, the second device being connected to the second pad through the tin layer.
5. The circuit board of claim 3, wherein said mounting surface is provided with a mounting channel adjacent to said mounting slot in communication with said mounting slot, said bonding wire being disposed in said mounting channel.
6. The circuit board of claim 5, wherein the width of the mounting channel is 0.07mm to 0.08 mm.
7. The circuit board according to any one of claims 1 to 6, wherein the electronic component includes a plurality of the first devices, and the plurality of the first devices are arranged at intervals on the mounting surface;
and/or, electronic components includes a plurality of the second device, the installation face is equipped with a plurality of intervals the mounting groove sets up, each the second device is equipped with one in the mounting groove.
8. The circuit board of claim 7, wherein the first device is a chip or die;
and/or the second device is a resistive, capacitive or inductive or bottom pad device.
9. The circuit board according to any one of claims 1 to 6, further comprising a protective layer that covers the electronic component and is connected to the mounting surface.
10. An electronic device comprising a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922039986.4U CN210807810U (en) | 2019-11-22 | 2019-11-22 | Circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922039986.4U CN210807810U (en) | 2019-11-22 | 2019-11-22 | Circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210807810U true CN210807810U (en) | 2020-06-19 |
Family
ID=71226456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922039986.4U Active CN210807810U (en) | 2019-11-22 | 2019-11-22 | Circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210807810U (en) |
-
2019
- 2019-11-22 CN CN201922039986.4U patent/CN210807810U/en active Active
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