CN210801096U

CN210801096U - High-heat-dissipation aluminum substrate for LED lamp

Info

Publication number: CN210801096U
Application number: CN201922128271.6U
Authority: CN
Inventors: 钟刚; 吕玉刚
Original assignee: Suzhou Tianxing Energy Co ltd
Current assignee: Suzhou Tianxing Energy Co ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2020-06-19
Anticipated expiration: 2029-12-02

Abstract

The utility model relates to a LED lamp is with aluminium base board of high heat dissipation, including aluminium base board, aluminium base board top is equipped with the heat-conducting plate, heat-conducting plate top fixedly connected with LED lamp mounting panel, first fixed block of aluminium base board bottom fixedly connected with, second fixed block, just both ends about first fixed block, second fixed block difference fixed connection are aluminium base board, fixedly connected with heat dissipation aluminium foil between first fixed block, the second fixed block, the radiating groove has evenly been seted up to LED lamp mounting panel bottom, heat-conducting plate top fixedly connected with heat dissipation hemisphere, the equal fixedly connected with fixed plate in the LED mounting panel left and right sides, LED mounting panel top still evenly is provided with the heat dissipation arch, and overall structure has effectively increased heat radiating area, has better radiating effect, can effectively improve the life of radiating efficiency and LED lamps and lanterns.

Description

High-heat-dissipation aluminum substrate for LED lamp

Technical Field

The utility model relates to a LED lamp is with aluminium base board of high heat dissipation belongs to LED lamps and lanterns technical field.

Background

With the development of the times, the living standard of people is continuously improved, people generate knowledge of light rays on semiconductor materials, the application of LED lamps is more and more extensive, from the initial LED lamp is used as an indicating light source of instruments and meters to the later LED lamps with various light colors are widely applied to traffic signal lamps and illuminating lamps, meanwhile, the LED lamps generate good economic benefits and social benefits, compared with common fluorescent lamps, the LED lamps can generate a large amount of heat when being used, if the heat cannot be dissipated timely, the light of the LED lamps can be exhausted until products are scrapped in advance, therefore, the heat dissipation of the LED lamps is very important, the existing LED lamps mainly utilize a substrate to dissipate heat, but a metal plate with fast heat conduction is easy to conduct electricity, electric leakage accidents occur, the traditional heat dissipation is realized only by dissipating the heat at the bottom of the LED lamps, and the heat dissipation from a heat source of the LED lamps can not be realized, therefore, the heat dissipation efficiency is poor, the popularization and the use are not facilitated, and the following device is provided without solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem who solves overcomes current defect, provides LED lamp is with aluminium base board of high heat dissipation, has effectively increased heat radiating area, has better radiating effect, can effectively improve the life of radiating efficiency and LED lamps and lanterns, can effectively solve the problem in the background art.

In order to solve the technical problem, the utility model provides a following technical scheme:

the high-heat-dissipation aluminum substrate for the LED lamp comprises an aluminum substrate, wherein a heat conduction plate is arranged at the top of the aluminum substrate, an LED lamp mounting plate is fixedly connected to the top of the heat conduction plate, a first fixing block and a second fixing block are fixedly connected to the bottom of the aluminum substrate, the first fixing block and the second fixing block are respectively and fixedly connected to the left end and the right end of the aluminum substrate, a heat dissipation aluminum foil is fixedly connected between the first fixing block and the second fixing block, heat dissipation grooves are uniformly formed in the bottom of the LED lamp mounting plate, heat dissipation hemispheres are fixedly connected to the top of the heat conduction plate, fixing plates are fixedly connected to the left side and.

Further, heat dissipation silicone grease is coated between the heat conduction plate and the aluminum substrate.

Further, a threaded hole is formed in the fixing plate, and the LED mounting plate penetrates through the threaded hole through a screw to be fixedly connected with the heat conducting plate.

Further, the number of the heat dissipation hemispheres is equal to that of the heat dissipation grooves, and the size and the shape of the heat dissipation hemispheres are matched with those of the heat dissipation grooves.

Further, the heat dissipation aluminum foils are arranged into four pieces, and the distance between every two adjacent heat dissipation aluminum foils is 2 mm.

Further, the heat dissipation aluminum foil is arranged to be of a net structure, and heat dissipation holes are formed in the heat dissipation aluminum foil.

The utility model discloses beneficial effect: high heat dissipation aluminium base board for LED lamp, the heat radiating area has effectively been increased through the heat dissipation arch that sets up on the LED mounting panel, the radiating efficiency of heat from LED mounting panel department has been increased, the heat of LED lamp mounting panel department is conducted to heat-conducting plate department through radiating groove and heat dissipation hemisphere, the heat dissipates away through heat dissipation aluminium foil and louvre in proper order, heat exchange efficiency has been improved, overall structure has effectively increased heat radiating area, better radiating effect has, can effectively improve the life of radiating efficiency and LED lamps and lanterns.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a structural view of a high heat dissipation aluminum substrate for an LED lamp.

Fig. 2 is the utility model discloses aluminium base board LED lamp mounting panel structure chart of high heat dissipation for LED lamp.

Fig. 3 is the aluminum foil structure diagram of the high heat dissipation aluminum substrate for the LED lamp.

Reference numbers in the figures: 1. an aluminum substrate; 2. a heat conducting plate; 3. an LED lamp mounting plate; 4. a first fixed block; 5. a second fixed block; 6. a fixing plate; 7. a heat dissipation protrusion; 8. a heat dissipation hemisphere; 9. a heat sink; 10. a heat-dissipating aluminum foil; 11. a threaded hole; 12. and (4) heat dissipation holes.

Detailed Description

The present invention will be further described with reference to the following embodiments, wherein the drawings are for illustrative purposes only and are not intended to be limiting, and in order to better illustrate the embodiments of the present invention, some components of the drawings may be omitted, enlarged or reduced and do not represent the size of an actual product.

Example 1

As shown in fig. 1-3, the high heat dissipation aluminum substrate for LED lamps comprises an aluminum substrate 1, a heat conduction plate 2 is arranged on the top of the aluminum substrate 1, an LED lamp mounting plate 3 is fixedly connected to the top of the heat conduction plate 2, a first fixing block 4 and a second fixing block 5 are fixedly connected to the bottom of the aluminum substrate 1, the first fixing block 4 and the second fixing block 5 are respectively and fixedly connected to the left end and the right end of the aluminum substrate 1, a heat dissipation aluminum foil 10 is fixedly connected between the first fixing block 4 and the second fixing block 5, heat dissipation grooves 9 are uniformly formed in the bottom of the LED lamp mounting plate 3, a heat dissipation hemisphere 8 is fixedly connected to the top of the heat conduction plate 2, fixing plates 6 are fixedly connected to the left side and the right side of.

In this embodiment, a heat-dissipating silicone grease is further coated between the heat-conducting plate 2 and the aluminum substrate 1.

In this embodiment, the fixing plate 6 is provided with a threaded hole 11, and the LED mounting plate 3 is fixedly connected to the heat conducting plate 2 through the threaded hole 11 by a screw.

In the present embodiment, the number of the heat dissipation hemispheres 8 is equal to the number of the heat dissipation grooves 9, and the size and shape of the heat dissipation hemispheres 8 are matched with the size and shape of the heat dissipation grooves 9.

In this embodiment, the heat dissipation aluminum foils 10 are provided in four pieces, and the distance between adjacent heat dissipation aluminum foils 10 is set to be 2 mm.

In this embodiment, the heat dissipation aluminum foil 10 is configured as a mesh structure, and the heat dissipation holes 12 are disposed on the heat dissipation aluminum foil 10.

Example 2

The heat-dissipating aluminum foil 10 can be replaced by a heat-dissipating copper foil, so that the heat-conducting efficiency is further improved.

The utility model discloses improve in: high heat dissipation aluminium base board for LED lamp, heat radiating area has effectively been increased through the heat dissipation arch 7 that sets up on the LED mounting panel 3, the radiating efficiency of heat from LED mounting panel 3 has been increased, the heat of LED lamp mounting panel 3 department conducts to heat-conducting plate 2 department through radiating groove 9 and heat dissipation hemisphere 8, the heat is gone out through heat

dissipation aluminium foil

10 and 12 losses of louvre in proper order, heat exchange efficiency has been improved, overall structure has effectively increased heat radiating area, better radiating effect has, can effectively improve the life of radiating efficiency and LED lamps and lanterns.

The foregoing is an embodiment of the preferred embodiment of the present invention, showing and describing the basic principles and main features of the present invention and the advantages of the present invention, it should be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, and the foregoing embodiments and descriptions are only illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the present invention, which fall within the scope of the present invention as claimed, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

High heat dissipation aluminium base board for LED lamp, including aluminium base board (1), its characterized in that: the LED lamp is characterized in that a heat conducting plate (2) is arranged at the top of the aluminum base plate (1), a LED lamp mounting plate (3) is fixedly connected to the top of the heat conducting plate (2), a first fixing block (4) and a second fixing block (5) are fixedly connected to the bottom of the aluminum base plate (1) respectively, heat dissipation aluminum foils (10) are fixedly connected between the first fixing block (4) and the second fixing block (5), heat dissipation grooves (9) are formed in the bottom of the LED lamp mounting plate (3), heat dissipation hemispheres (8) are fixedly connected to the top of the heat conducting plate (2), fixing plates (6) are fixedly connected to the left side and the right side of the LED lamp mounting plate (3), and heat dissipation protrusions (7) are further uniformly arranged at the top of the LED lamp mounting plate (3).
2. The aluminum substrate with high heat dissipation for the LED lamp according to claim 1, wherein: and heat dissipation silicone grease is also coated between the heat conducting plate (2) and the aluminum substrate (1).
3. The aluminum substrate with high heat dissipation for the LED lamp according to claim 1, wherein: threaded holes (11) are formed in the fixing plate (6), and the LED lamp mounting plate (3) penetrates through the threaded holes (11) through screws to be fixedly connected with the heat conducting plate (2).
4. The aluminum substrate with high heat dissipation for the LED lamp according to claim 1, wherein: the number of the heat dissipation hemispheres (8) is equal to that of the heat dissipation grooves (9), and the heat dissipation hemispheres (8) are matched with the heat dissipation grooves (9) in size and shape.
5. The aluminum substrate with high heat dissipation for the LED lamp according to claim 1, wherein: the heat dissipation aluminum foils (10) are arranged into four pieces, and the distance between every two adjacent heat dissipation aluminum foils (10) is 2 mm.
6. The aluminum substrate with high heat dissipation for the LED lamp according to claim 1, wherein: the heat dissipation aluminum foil (10) is of a net structure, and heat dissipation holes (12) are formed in the heat dissipation aluminum foil (10).