CN212840782U - Heat dissipation LED wick - Google Patents
Heat dissipation LED wick Download PDFInfo
- Publication number
- CN212840782U CN212840782U CN202022185099.0U CN202022185099U CN212840782U CN 212840782 U CN212840782 U CN 212840782U CN 202022185099 U CN202022185099 U CN 202022185099U CN 212840782 U CN212840782 U CN 212840782U
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- Prior art keywords
- heat dissipation
- top surface
- led
- heat
- baffle
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 239000004411 aluminium Substances 0.000 claims description 13
- 230000002146 bilateral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 17
- 238000009825 accumulation Methods 0.000 abstract description 7
- 238000009434 installation Methods 0.000 description 10
- 241000217776 Holocentridae Species 0.000 description 8
- 238000005286 illumination Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a heat dissipation LED wick, which comprises an aluminum substrate and LED chips, wherein the bottom surface of the aluminum substrate is symmetrically provided with the LED chips, the top surface of the aluminum substrate is provided with a copper plate, the middle part of the top surface of the copper plate is provided with heat dissipation fins, the two sides of the top surface of the copper plate are symmetrically provided with baffles, the middle part of the inner side wall of each baffle is integrally formed with a support block, the top surface of the support block is provided with a transverse plate, the top surface of the transverse plate is provided with a through hole, a micro fan is arranged in the inner cavity of the through hole, the bottom surface of the aluminum substrate is provided with a transparent heat conduction silica gel layer, the utility model can accelerate the dissipation of heat on the heat dissipation fins through the micro fan, improve the heat dissipation efficiency of the copper plate, reduce the heat accumulation, and then can play the radiating effect to the LED chip.
Description
Technical Field
The utility model relates to a LED lamp technical field specifically is a heat dissipation LED wick.
Background
With the emergence of the white light of the LED, the lighting industry has started a secondary revolution, and the LED is used as a light source, so that the LED is energy-saving, environment-friendly and long in service life, and meets the environment-friendly, energy-saving and low-carbon products advocated by the state. The cost of LED lamps is reduced with the increasing LED technology, and energy saving lamps and incandescent lamps are inevitably replaced by LED lamps. At present, the nation places more and more importance on the problems of energy conservation and environmental protection, and the LED lamps are vigorously used, particularly, the LED street lamps are used in the project of street lamp modification of the government, and the potential of replacing energy-saving lamps and incandescent lamps by visible LED lamps is pointed out.
However, the existing LED lamp wick has the following disadvantages:
when the existing LED lamp wick is used, the heat dissipation performance of the LED lamp wick is insufficient, so that the surface of the LED lamp wick is easy to gather heat, the aging of the LED lamp wick is easy to accelerate, the service life of the LED lamp wick is shortened, and the later maintenance cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation LED wick to solve current LED wick among the above-mentioned background art when using, because self heat dispersion is not enough, thereby make LED wick surface gather the heat easily, and then accelerate the ageing of LED wick easily, so that reduced the life of LED wick, strengthened the cost of later maintenance again.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation LED lamp wick comprises an aluminum substrate and LED chips, wherein the LED chips are symmetrically arranged on the surface of the bottom of the aluminum substrate, the copper plate is arranged on the top surface of the aluminum substrate, the heat dissipation fins are arranged in the middle of the top surface of the copper plate, baffles are symmetrically arranged on two sides of the top surface of the copper plate, a supporting block is integrally formed in the middle of the inner side wall of each baffle, a transverse plate is arranged on the top surface of the support block, a through hole is formed in the top surface of the transverse plate, a micro fan is arranged in the inner cavity of the through hole, a transparent heat-conducting silica gel layer is arranged on the bottom surface of the aluminum substrate and passes through the micro fan, can accelerate the heat dissipation on the radiating fins, improve the radiating efficiency of the copper plate, reduce the heat accumulation on the surface of the LED chip, through transparent heat conduction silica gel layer, can play the effect of protection LED chip, can play the function of fine heat conduction again, and then can play the radiating effect to the LED chip.
Preferably, the LED chips are specifically provided with a plurality of groups, and the plurality of groups of LED chips are distributed in an array manner, so that the illumination brightness can be improved, and the use requirements can be further met.
Preferably, the transverse plate is rotatably connected with the supporting block through a screw, so that an installation foundation can be provided for the supporting block through the baffle, and the transverse plate can be fixed on the supporting block through the screw, so that the use safety of the transverse plate can be improved.
Preferably, the through holes are specifically provided with three groups, the inner diameter of each through hole is the same as the outer diameter of each micro fan, so that the three groups of micro fans can be installed through the three groups of through holes, the micro fans can stably run, the dissipation of heat on the radiating fins can be accelerated by the three groups of micro fans, the radiating efficiency of the radiating fins is improved, and the heat accumulation on the surface of the LED chip is reduced.
Preferably, transparent heat conduction silica gel layer wraps up in LED chip surface to can play the effect of protection LED chip through transparent heat conduction silica gel layer, can play the effect of fine heat conduction again, and then can play the heat dissipation function to the LED chip.
Preferably, the fixing strip is installed at the top of the outer side wall of the baffle, and the screw hole is formed in the surface of the fixing strip, so that the fixing strip can be conveniently installed and fixed through the screw hole, and the aluminum substrate can be installed through the baffle and the copper plate.
The utility model provides a heat dissipation LED wick possesses following beneficial effect:
(1) the utility model discloses a be equipped with the LED chip in aluminium base board bottom surface symmetry, thereby can make aluminium base board fixed to the installation of LED chip, and then can make the steady operation of LED chip, because the LED chip specifically is equipped with a plurality of groups, and multiunit LED chip is array distribution, thereby can improve illumination intensity, and then satisfy the user demand, through surface mounting at aluminium base board top, and copper top surface mid-mounting has radiating fin, thereby can provide the support to equipment such as radiating fin through the copper, can play fine heat conduction effect again, and then can be with the heat transfer of aluminium base board to radiating fin in, through radiating fin, the heat that can transmit to the copper volatilizees, and then can play through the copper to aluminium base board radiating effect, the safety in utilization of LED chip has been improved.
(2) The utility model is provided with the baffle plates symmetrically arranged on both sides of the top surface of the copper plate, and the middle part of the inner side wall of the baffle plate is integrally provided with the support block, meanwhile, the top surface of the supporting block is provided with a transverse plate which is rotationally connected with the supporting block through a screw, so that the supporting block can be provided with an installation foundation through the baffle plate, thereby the cross plate can be fixed on the support block by the screw, so as to improve the use safety of the cross plate, three groups of through holes are arranged on the top surface of the cross plate, the inner cavity of the through hole is provided with the micro fan, the inner diameter of the through hole is the same as the outer diameter of the micro fan, thereby not only being capable of installing three groups of micro fans through three groups of through holes, but also being capable of leading the micro fans to run stably, therefore, the three groups of micro fans can accelerate the dissipation of heat on the radiating fins, the radiating efficiency of the radiating fins is improved, and the heat accumulation on the surface of the LED chip is reduced.
(3) The utility model discloses a be equipped with transparent heat conduction silica gel layer on aluminium base board bottom surface, and transparent heat conduction silica gel layer wraps up in LED chip surface, thereby can play the effect of protection LED chip through transparent heat conduction silica gel layer, can play the effect of fine heat conduction again, and then can play the heat dissipation function to the LED chip, through installing the fixed strip at baffle lateral wall top, and the screw has been seted up on the fixed strip surface, thereby can conveniently fix the fixed strip installation through the screw, and then play aluminium base board installation effect through baffle and copper.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic sectional structure of the present invention;
fig. 3 is a schematic side view of the present invention;
fig. 4 is a schematic top view of the present invention.
In the figure: 1. an aluminum substrate; 2. an LED chip; 3. a copper plate; 4. a heat dissipating fin; 5. a baffle plate; 501. a support block; 6. a transverse plate; 7. a through hole; 8. a micro fan; 9. a transparent heat-conducting silica gel layer; 10. a fixing strip; 11. and a screw hole.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1-4, the utility model provides a technical solution: a heat dissipation LED lamp wick comprises an aluminum substrate 1 and LED chips 2, the LED chips 2 are symmetrically arranged on the bottom surface of the aluminum substrate 1, a copper plate 3 is arranged on the top surface of the aluminum substrate 1, heat dissipation fins 4 are arranged in the middle of the top surface of the copper plate 3, baffle plates 5 are symmetrically arranged on two sides of the top surface of the copper plate 3, a support block 501 is integrally formed in the middle of the inner side wall of each baffle plate 5, a transverse plate 6 is arranged on the top surface of each support block 501, through holes 7 are formed in the top surface of each transverse plate 6, micro fans 8 are arranged in the inner cavities of the through holes 7, a transparent heat conduction silica gel layer 9 is arranged on the bottom surface of the aluminum substrate 1, heat dissipation on the heat dissipation fins 4 can be accelerated through the micro fans 8, the heat dissipation efficiency of the copper plate 3 is improved, the heat accumulation of, and the LED heat dissipation structure can play a good heat conduction function, and further can play a heat dissipation effect on the LED chip 2.
The LED chips 2 are specifically provided with a plurality of groups, and the plurality of groups of LED chips 2 are distributed in an array manner, so that the illumination brightness can be improved, and the use requirements can be further met.
The transverse plate 6 is rotatably connected with the supporting block 501 through screws, so that an installation foundation can be provided for the supporting block 501 through the baffle 5, and the transverse plate 6 can be fixed on the supporting block 501 through the screws, so that the use safety of the transverse plate 6 can be improved.
The through holes 7 are specifically provided with three groups, the inner diameter of each through hole 7 is the same as the outer diameter of each micro fan 8, so that the three groups of micro fans 8 can be installed through the three groups of through holes 7, and the micro fans 8 can run stably, so that the three groups of micro fans 8 can accelerate the dissipation of heat on the radiating fins 4, the radiating efficiency of the radiating fins 4 is improved, and the heat accumulation on the surface of the LED chip 2 is reduced.
Transparent heat conduction silica gel layer 9 wraps up in LED chip 2 surface to can play the effect of protection LED chip 2 through transparent heat conduction silica gel layer 9, can play the effect of fine heat conduction again, and then can play the heat dissipation function to LED chip 2.
Fixing strip 10 is installed at 5 lateral wall tops of baffle, screw 11 has been seted up on fixing strip 10 surface to can conveniently install fixedly through screw 11 to fixing strip 10, and then play aluminium base board 1 installation effect through baffle 5 and copper 3.
It should be noted that, in operation, the LED chips 2 are symmetrically arranged on the bottom surface of the aluminum substrate 1, so that the aluminum substrate 1 can be fixedly mounted on the LED chips 2, and the LED chips 2 can stably operate, and since the LED chips 2 are specifically provided with a plurality of groups and a plurality of groups of LED chips 2 are distributed in an array form, so that the illumination brightness can be improved, and the use requirement can be met, the copper plate 3 is mounted on the top surface of the aluminum substrate 1, and the heat dissipation fins 4 are mounted in the middle of the top surface of the copper plate 3, so that the copper plate 3 can support the heat dissipation fins 4 and play a good heat conduction role, and further the heat of the aluminum substrate 1 can be transferred to the heat dissipation fins 4, and the heat transferred from the copper plate 3 can be volatilized through the heat dissipation fins 4, and further play a role of dissipating heat of the aluminum substrate 1 through the copper plate, the safety of the LED chip 2 is improved, the baffle plates 5 are symmetrically arranged on two sides of the top surface of the copper plate 3, the support block 501 is integrally formed in the middle of the inner side wall of the baffle plate 5, the transverse plate 6 is arranged on the top surface of the support block 501, the transverse plate 6 is rotatably connected with the support block 501 through the screw, so that the support block 501 can be provided with an installation foundation through the baffle plates 5, the transverse plate 6 can be fixed on the support block 501 through the screw, the safety of the transverse plate 6 can be improved, the three groups of through holes 7 are formed in the top surface of the transverse plate 6, the micro fans 8 are arranged in the inner cavities of the through holes 7, the inner diameter of each through hole 7 is the same as the outer diameter of each micro fan 8, the three groups of through holes 7 can be used for installing the three groups of micro fans 8, the micro fans 8 can stably run, and, the heat dissipation efficiency of radiating fin 4 is improved, the heat accumulation on the surface of LED chip 2 is reduced, through being equipped with transparent heat conduction silica gel layer 9 on aluminium base board 1 bottom surface, and transparent heat conduction silica gel layer 9 wraps up in LED chip 2 surface, thereby can play the effect of protection LED chip 2 through transparent heat conduction silica gel layer 9, can play the effect of fine heat conduction again, and then can play the heat dissipation function to LED chip 2, through installing fixed strip 10 at 5 lateral wall tops of baffle, and screw 11 has been seted up on fixed strip 10 surface, thereby can conveniently install fixedly to fixed strip 10 through screw 11, and then play the installation effect to aluminium base board 1 through baffle 5 and copper 3.
It should be noted that, the utility model relates to a heat dissipation LED wick, including aluminium base board 1, LED chip 2, copper 3, radiating fin 4, baffle 5, tray 501, diaphragm 6, through-hole 7, miniature fan 8, transparent heat conduction silica gel layer 9, fixed strip 10 and screw 11, the part is general standard component or the part that technical staff in the field knows, its structure and principle all can learn through the technical manual or learn through conventional experimental method for this technical staff, and above-mentioned electrical components is by the nimble selection of technical staff in the field, the installation and accomplish the circuit debugging, guarantee that each equipment can normal operating, do not too much restriction requirement here.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat dissipation LED wick, includes aluminium base board (1) and LED chip (2), aluminium base board (1) bottom surface symmetry is equipped with LED chip (2), its characterized in that: aluminum base board (1) top surface mounting has copper (3), copper (3) top surface mid-mounting has radiating fin (4), baffle (5) are installed to copper (3) top surface bilateral symmetry, baffle (5) inside wall middle part integrated into one piece has tray (501), tray (501) top surface mounting has diaphragm (6), through-hole (7) have been seted up to diaphragm (6) top surface, micro-fan (8) are installed to through-hole (7) inner chamber, aluminum base board (1) bottom surface is equipped with transparent heat conduction silica gel layer (9).
2. The heat dissipation LED wick of claim 1, wherein: the LED chips (2) are specifically provided with a plurality of groups, and the plurality of groups of LED chips (2) are distributed in an array manner.
3. The heat dissipation LED wick of claim 1, wherein: the transverse plate (6) is rotatably connected with the support block (501) through a screw.
4. The heat dissipation LED wick of claim 1, wherein: the through holes (7) are specifically provided with three groups, and the inner diameter of each through hole (7) is the same as the outer diameter of the micro fan (8).
5. The heat dissipation LED wick of claim 1, wherein: the transparent heat-conducting silica gel layer (9) is wrapped on the surface of the LED chip (2).
6. The heat dissipation LED wick of claim 1, wherein: fixing strips (10) are installed at the top of the outer side wall of the baffle (5), and screw holes (11) are formed in the surfaces of the fixing strips (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022185099.0U CN212840782U (en) | 2020-09-29 | 2020-09-29 | Heat dissipation LED wick |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022185099.0U CN212840782U (en) | 2020-09-29 | 2020-09-29 | Heat dissipation LED wick |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212840782U true CN212840782U (en) | 2021-03-30 |
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ID=75150327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022185099.0U Expired - Fee Related CN212840782U (en) | 2020-09-29 | 2020-09-29 | Heat dissipation LED wick |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212840782U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115325518A (en) * | 2022-09-01 | 2022-11-11 | 苏州法雷尔自动化科技有限公司 | Line scanning light source |
-
2020
- 2020-09-29 CN CN202022185099.0U patent/CN212840782U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115325518A (en) * | 2022-09-01 | 2022-11-11 | 苏州法雷尔自动化科技有限公司 | Line scanning light source |
| CN115325518B (en) * | 2022-09-01 | 2023-11-14 | 苏州法雷尔自动化科技有限公司 | Line sweeps light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210330 |