CN217158146U - Die bonding conveying mechanism and die bonding machine - Google Patents
Die bonding conveying mechanism and die bonding machine Download PDFInfo
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- CN217158146U CN217158146U CN202220713557.XU CN202220713557U CN217158146U CN 217158146 U CN217158146 U CN 217158146U CN 202220713557 U CN202220713557 U CN 202220713557U CN 217158146 U CN217158146 U CN 217158146U
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Abstract
This application is applicable to solid brilliant technical field, relates to a solid brilliant conveying mechanism and solid brilliant machine, and wherein solid brilliant machine includes the board, still including the feed bin lifting unit, two sets of material loading manipulators, two sets of wafer platforms, two sets of support platforms, the solid brilliant platform of plugging into of locating the board, wherein: the bin lifting assembly is used for providing the wafer; the two groups of feeding manipulators are arranged on two sides of the stock bin lifting assembly and are used for taking materials from the stock bin lifting assembly; the two groups of wafer platforms are respectively arranged on one side of the two groups of feeding manipulators; the two groups of support platforms are respectively positioned at one side of the two groups of wafer platforms and are used for conveying the supports, and the wafer platforms take the wafers down from the corresponding feeding mechanical arms and fix the wafers on the adjacent supports; the die bonding connection platform is used for conveying the bracket to another adjacent bracket platform; this application structure is succinct, sets up feed bin lifting unit and two sets of material loading manipulators, when improving material loading, getting material efficiency, has still reduced the shake of board, has improved the life of production efficiency and board, and the practicality is strong.
Description
Technical Field
The application belongs to the technical field of die bonding, and particularly relates to a die bonding conveying mechanism and a die bonding machine.
Background
At present, in the die bonding process, a single die bonding swing arm mechanism drives a suction nozzle to reciprocate through a die supply position and a die bonding position, and the position of a support is adjusted by combining a support transfer mechanism, so that die bonding at different positions of the support is realized.
Because the single die bonding swing arm mechanism can only perform die bonding operation on one position of the support at each time, the manual feeding time interval of the equipment is long, and the manpower utilization efficiency cannot be better improved, so that the die bonding efficiency is low, and the utilization rate of the mechanism cannot be better improved in a one-to-one mode of the equipment mechanism; and the single equipment single swing arm mode easily causes the instability of the machine and the jitter.
SUMMERY OF THE UTILITY MODEL
To above-mentioned technical problem, this application provides a solid brilliant conveying mechanism and solid brilliant machine, has solved the long problem that leads to work efficiency low, single swing arm mode easily to lead to the board unstable of the artifical material loading time interval of solid brilliant machine among the prior art at least.
The application provides a solid brilliant conveying mechanism includes the board, still including connect in the feed bin lifting unit, two sets of material loading manipulators, two sets of wafer platform, two sets of support platforms, solid brilliant platform of plugging into of board, wherein:
the bin lifting assembly is used for providing wafers;
the two groups of feeding manipulators are arranged on two sides of the stock bin lifting assembly and are used for taking materials from the stock bin lifting assembly;
the two groups of wafer platforms are respectively arranged on one side of the two groups of feeding mechanical arms and are used for bearing the wafers grabbed by the adjacent feeding mechanical arms;
the two groups of support platforms are respectively positioned at one side of the two groups of wafer platforms, and the wafer platforms convey the wafers to one side of the support platforms;
one of the two support platforms is used for conveying a support and conveying the support to the solid crystal connection platform, and the solid crystal connection platform is used for conveying the support to the other adjacent support platform.
In one embodiment, the bin lift assembly comprises a mounting base and a loading tray, a pan basket bin connected to the mounting base, wherein:
the feeding tray comprises a bottom plate lifting assembly and a bin lifting bottom plate connected to the bottom plate lifting assembly; the bottom plate lifting assembly is used for driving the stock bin lifting bottom plate to lift;
the tray lifting basket bin is connected to the bin lifting bottom plate and comprises a plurality of chip trays and positioning pieces; the wafer is accommodated in the chip rocking disc, and the chip rocking discs are stacked and arranged at intervals along the longitudinal direction; the positioning piece is used for enabling the chip rocking disc to be located at a preset position.
In an embodiment, the feeding tray further includes an inductive switch assembly and an optical fiber amplifier electrically connected to the inductive switch assembly, wherein:
the inductive switch assembly comprises a plurality of inductive switches, and each inductive switch is respectively arranged on one side of each chip rocking disc.
In an embodiment, the tray-shaking and basket-lifting bin further comprises a bearing frame and a plurality of sliding filler strips connected to the bearing frame, the plurality of chip trays are longitudinally stacked and spaced in the bearing frame, each sliding filler strip is respectively arranged below each chip tray, and the chip trays are abutted to the corresponding sliding filler strips.
In one embodiment, the loading robot comprises a robot base and a loading mechanism connected to the robot base, wherein:
the feeding mechanism comprises a carrying cross arm, a first cylinder, a second cylinder, a clamping jaw upper plate and a clamping jaw lower plate, wherein the first cylinder, the second cylinder, the clamping jaw upper plate and the clamping jaw lower plate are arranged on the carrying cross arm; the clamping jaw upper plate is connected with the first cylinder, the clamping jaw lower plate is connected with the second cylinder, and the first cylinder and the second cylinder can drive the clamping jaw upper plate and the clamping jaw lower plate to be close to or far away from each other.
In one embodiment, the robot base further comprises a carrying motor connected to the robot base, a lead screw and a lead screw nut seat;
one end of the screw rod is connected with the carrying motor, the other end of the screw rod penetrates through the screw rod nut seat and is in threaded fit with the screw rod nut seat, and the screw rod nut seat is connected to the manipulator base in a sliding mode along the axial direction of the screw rod; the carrying cross arm is connected to the feed screw nut seat.
In one embodiment, the wafer stage includes a first stage, a second stage, a rotation assembly, and a rocker positioning assembly, wherein:
the second platform is connected with the first platform in a sliding mode, the rotating assembly is connected with the second platform in a sliding mode, the sliding direction of the first platform is perpendicular to that of the second platform, and the sliding direction of the second platform is perpendicular to the rotating axis of the rotating assembly;
the rocking disc positioning assembly is connected to the rotating assembly, and the rotating assembly is used for driving the rocking disc positioning assembly to rotate.
In one embodiment, the rocking disc positioning assembly comprises a rocking disc positioning frame and a plurality of rocking disc positioning cylinders connected to the rocking disc positioning frame;
and the shaking plate positioning cylinders extend out to clamp the chip shaking plate on the shaking plate positioning frame.
The application also provides a die bonder, which comprises the die bonder conveying mechanism and two die bonder assemblies connected to the machine table, wherein the two die bonder assemblies are respectively arranged above the two support platforms.
In one embodiment, the die bonding assembly comprises a vertical column, and a double swing arm assembly, a die taking lens assembly and a die bonding lens assembly which are connected to the vertical column;
the crystal taking lens assembly and the crystal fixing lens assembly are respectively positioned on two sides of the double-swing-arm assembly.
This application leads to the long problem that leads to work efficiency low, the single swing arm mode leads to the board unstable easily to the artifical material loading time interval of solid brilliant machine in the prior art and makes the improvement design, has following beneficial effect:
1. the feeding and taking efficiency is improved, the time length of taking intervals is reduced, and the working efficiency is improved;
2. the two groups of feeding manipulators are arranged to act simultaneously, so that the whole machine table is more balanced, the operation of the die bonder is more stable, and the machine table has less jitter;
this application structure is succinct, sets up feed bin lifting unit and two sets of material loading manipulators, when improving material loading, getting material efficiency, has still reduced the shake of board, has improved the life of production efficiency and board, and the practicality is strong.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic perspective view of a die bonder provided in an embodiment of the present application.
Fig. 2 is a schematic perspective view of a bin lifting assembly in the die bonder shown in fig. 1.
Fig. 3 is a schematic perspective view of a feeding manipulator in the die bonder shown in fig. 1.
Fig. 4 is a schematic perspective view of an adjusting platform in the die bonder shown in fig. 1.
Fig. 5 is a partially enlarged view of the die bonder shown in fig. 1.
Fig. 6 is a schematic perspective view of a die bonder docking platform in the die bonder shown in fig. 1.
Fig. 7 is a schematic perspective view of a die bonder assembly in the die bonder shown in fig. 1.
The designations in the figures mean:
1. a machine platform;
2. a bin lifting assembly; 21. a mounting seat; 22. a feeding tray; 221. a base plate lifting assembly; 222. a stock bin lifting bottom plate; 223. an inductive switch assembly; 224. an optical fiber amplifier;
23. a pan and basket bin; 231. shaking the chip tray; 232. a positioning member; 233. a sliding filler strip; 234. a load-bearing frame;
3. a feeding manipulator; 31. a manipulator base; 311. carrying a motor; 312. a screw rod; 313. a screw nut seat; 314. a cross arm compression plate;
32. a feeding mechanism; 321. carrying a cross arm; 322. a first cylinder; 323. a second cylinder; 324. a connecting plate; 325. a clamping jaw upper plate; 326. a lower plate of the clamping jaw;
4. a wafer stage; 41. a first platform; 42. a second platform; 43. a rotating assembly; 44. a rocking disc positioning assembly; 441. a rocking disc positioning frame; 442. a rocking disc positioning cylinder;
5. a support platform; 51. a transverse conveying platform; 52. a longitudinal conveying platform; 53. a rack transport table;
6. a die bonding assembly; 61. a column; 62. a double swing arm assembly; 63. taking a crystal lens assembly; 64. a solid crystal lens assembly;
7. a die bonding connection platform; 71. a platform foundation; 72. a connecting and conveying mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," etc. indicate orientations or positional relationships based on those shown in the drawings, which are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
To explain the technical solutions of the present application, the following description is made with reference to specific drawings and examples.
Example one
The die bonding conveying mechanism provided by the first embodiment of the application is provided with the stock bin lifting assembly and the feeding manipulator, so that the feeding and taking efficiency is improved; meanwhile, two groups of feeding manipulators, two groups of wafer platforms, two groups of support platforms and two groups of die fixing assemblies are arranged, so that the balance and stability of the machine table are guaranteed, and the shaking of the machine table in the operation process is reduced.
Referring to fig. 1, the present embodiment provides a die bonder, which includes a machine table 1, a bin lifting assembly 2, two sets of feeding manipulators 3, two sets of wafer platforms 4, two sets of support platforms 5, and a die bonding connection platform 7.
The machine table 1 is used for providing a fixed foundation for the bin lifting assembly 2, the two groups of feeding mechanical arms 3, the two groups of wafer platforms 4, the two groups of support platforms 5 and the solid crystal connection platform 7, and the bin lifting assembly 2, the two groups of feeding mechanical arms 3, the two groups of wafer platforms 4, the two groups of support platforms 5 and the solid crystal connection platform 7 are connected to the machine table 1.
The magazine lifting assembly 2 is used for feeding, i.e. supplying, the wafers.
Two sets of material loading manipulators 3 are arranged on two sides of the bin lifting assembly 2 respectively and are used for taking materials from the bin lifting assembly 2 and placing the materials on the wafer platform 4.
Two sets of wafer platform 4 locate one side of two sets of material loading manipulators 3 respectively, and material loading manipulator 3 places the wafer on wafer platform 4, and wafer platform 4 is used for bearing the wafer that consecutive material loading manipulator 3 snatched and transports the wafer to support platform 5 by side to finely tune the position of wafer.
The two groups of support platforms 5 are respectively arranged on one side of the two groups of wafer platforms 4 and are used for providing a support and conveying the support after die bonding to the die bonding connection platform 7.
The die bonding connection platform 7 is positioned between the two groups of support platforms 5, the support subjected to die bonding is conveyed to the die bonding connection platform 7 by one group of support platforms 5, and the die bonding connection platform 7 conveys the support subjected to die bonding to the other group of support platforms 5.
The action process of the embodiment is as follows: the two groups of feeding manipulators 3 take the wafers from the bin lifting assembly 2 and are respectively placed on the two groups of wafer platforms 4; the two groups of wafer platforms 4 respectively convey the wafers to the adjacent support platforms 5; the bracket platform 5 on one side conveys the bracket; after the wafer is fixed in a half area of the support, the wafer fixing work is completed by half, and then the support platform 5 conveys the wafer-fixed support to the wafer fixing connection platform 7; and the die bonding connection platform 7 conveys half of the die bonding supports to the other support platform 5 so as to complete the rest die bonding work, and after the die bonding work is finished, the corresponding support platform 5 conveys the supports to the next procedure, so that a die bonding period is completed.
During die bonding, the die on the die platform 4 needs to be bonded to the designated area of the support on the support platform 5, so as to form a thermal or electrical path and provide conditions for subsequent wire bonding.
In the first half period of a die bonding period, the wafer is fixed in a preset half area of the bracket, and the half area is a half area of the bracket close to the die bonding connection platform 7; as the carrier is transported to the other side of the base 1, the die bonding operation proceeds to the second half cycle, where the wafer is bonded to the remaining half area of the carrier blank.
The beneficial effect of this embodiment lies in: a bin lifting assembly 2 is arranged, and a feeding manipulator 3 is arranged on each of two sides of the bin lifting assembly 2, so that the feeding and taking efficiency is improved; the two groups of support platforms 5 are arranged, the die bonding operation is divided into die bonding operation of two half supports, the two support platforms 5 sequentially carry out die bonding operation on the same support, and when the rear support platform 5 works, the front support platform 5 can carry out die bonding operation on the next support, so that the feeding time interval is reduced, and the labor efficiency and the die bonding operation efficiency are improved; set up two sets of material loading manipulators 3 simultaneous movement, can make solid brilliant machine operation more stable, board 1 shake is littleer.
Referring to fig. 1, optionally, two sets of feeding manipulators 3 are disposed on two opposite sides of the bin lifting assembly 2, so that the machine table 1 is more balanced, and shaking is reduced better.
Referring to fig. 2, in an embodiment, the bin lift assembly 2 includes a mounting base 21, and a tray 22 and a tray basket bin 23 disposed on the mounting base 21.
The feeding tray 22 comprises a bottom plate lifting assembly 221 and a bin lifting bottom plate 222 connected to the bottom plate lifting assembly 221; the bottom plate lifting assembly 221 is used for driving the bin lifting bottom plate 222 to lift.
The floor elevating assembly 221 may be various types of elevating members such as a linear expansion cylinder, a ball screw, a belt transfer structure.
The tray basket bin 23 is connected to the bin lifting bottom plate 222 and comprises a bearing frame 234, a plurality of chip tray 231 and a positioning part 232, wherein the plurality of chip tray 231 is longitudinally stacked; specifically, the carrying frame 234 is connected to the bin lifting bottom plate 222, the plurality of chip trays 231 are stacked in the carrying frame 234, and the chip trays 231 are used for accommodating wafers.
The positioning member 232 is used for positioning the chip tray 231 at a preset position; the positioning members 232 are connected to the carrying frame 234, and each chip tray 231 corresponds to at least one positioning member 232.
Optionally, the positioning element 232 is a magnet, a magnet fixing plate fixedly connected to the bearing frame 234 is disposed beside each chip rocking disc 231, and the magnet is connected to the magnet fixing plate; the preset position is an edge-leaning position, and when the chip rocking disc 231 is placed on the bearing frame 234, the magnet adsorbs the chip rocking disc 231 to lean on the edge, so that the feeding manipulator 3 can grab the chip.
Optionally, the feeding tray 22 further includes an inductive switch assembly 223 and a fiber amplifier 224.
The inductive switch assembly 223 comprises a plurality of inductive switches, each inductive switch is respectively arranged on one side of each chip rocking disc 231, specifically, the inductive switches are fixedly connected to the bearing frame 234, and the inductive switches are used for sensing whether the chip rocking discs 231 lean against the side and sensing whether the chip rocking discs 231 exist at corresponding positions.
The inductive switch may be any type of inductive switch, such as a light-sensitive switch, a microwave-sensitive switch, an ultrasonic-sensitive switch, a piezoelectric-sensitive switch, an electromagnetic-sensitive switch.
The optical fiber amplifier 224 is electrically connected with each inductive switch, and the optical fiber amplifier 224 can amplify the position signal sensed by the inductive switch and transmit the position signal to external equipment, so that whether the chip rocking disc 231 is close to the side or not can be sensed accurately, and the external equipment can warn through the signal transmitted by the optical fiber amplifier 224.
The chip rocking disc 231 is close to the side and can ensure that the position of each chip rocking disc 231 is the same, so that the feeding manipulator 3 can grab the same position when grabbing each chip rocking disc 231.
Optionally, the tray basket storage bin 23 further includes a plurality of sliding filler strips 233, each sliding filler strip 233 is disposed below each chip tray 231, each chip tray 231 abuts against the corresponding sliding filler strip 233, that is, the sliding filler strip 233 fixedly connected to the support frame 234 is disposed below each chip tray 231, the sliding filler strips 233 can be used for lubricating the chip tray 231, so that the chip tray 231 can be smoothly put into the support frame 234 or the chip tray 231 can be conveniently taken down from the smooth support frame 234, and friction loss is reduced.
Optionally, the plurality of inductive switches are respectively a plurality of correlation optical fiber sensors and a plurality of photoelectric sensors, wherein a correlation optical fiber sensor and a photoelectric sensor are arranged beside each chip rocking disc 231, wherein the correlation optical fiber sensors are used for detecting whether the chip rocking discs 231 are close to the side, and the photoelectric sensors are used for detecting whether the chip rocking discs 231 exist.
The action process of the embodiment is as follows: after the chip tray 231 is removed from the carrying frame 234 by the loading manipulator 3, the bottom plate lifting assembly 221 controls the carrying frame 234 to be lifted or lowered so that the loading manipulator 3 can grasp the chip tray 231 next time; the worker places a new chip rocking disc 231 on the vacant position of the bearing frame 234, and the magnet on the positioning piece 232 adsorbs the chip rocking disc 231 to lean against the side; the inductive switch component 223 is used for detecting whether the chip rocking disc 231 is close to the edge or not and whether the chip rocking disc 231 exists or not, if a certain chip rocking disc 231 does not close to the edge, the corresponding inductive switch is triggered, a signal is sent to external equipment through the optical fiber amplifier 224, and workers are warned through the external equipment; if the chip tray 231 is not placed on a certain layer of the carrying frame 234, the corresponding inductive switch is triggered, and a signal is sent to the external device through the optical fiber amplifier 224, so that the external device warns the staff.
The beneficial effect of this embodiment lies in: the utility model provides a concrete structure of feed bin lifting unit 2 to material feeding manipulator 3 gets the material, through setting up inductive switch subassembly 223 and setting element 232, make every chip shake dish 231 can both be located same definite position, so that material feeding manipulator 3 is better gets the material, and can guarantee that material feeding manipulator 3 is every time to get the material position homogeneous phase, and material feeding manipulator 3 of being convenient for shakes the dish 231 with the chip and puts into wafer platform 4.
Referring to fig. 3, in an embodiment, the loading robot 3 includes a robot base 31 and a loading mechanism 32.
The manipulator base 31 is used for providing a fixed base for the feeding mechanism 32, and the feeding mechanism 32 is connected to the manipulator base 31.
The feeding mechanism 32 is used for taking and shaking the tray from the stock bin lifting assembly 2, and the feeding mechanism 32 comprises a carrying cross arm 321, a first air cylinder 322, a second air cylinder 323, a clamping jaw upper plate 325 and a clamping jaw lower plate 326.
The transfer crossbar 321 is used to provide a fixed base for the first cylinder 322, the second cylinder 323, the upper jaw plate 325, and the lower jaw plate 326, and the transfer crossbar 321 is connected to the robot base 31.
The clamping jaw upper plate 325 and the clamping jaw lower plate 326 are oppositely arranged, the clamping jaw upper plate 325 is connected with the first air cylinder 322, and the clamping jaw lower plate 326 is connected with the second air cylinder 323; the first air cylinder 322 can drive the clamping jaw upper plate 325 to move towards the direction close to or away from the clamping jaw lower plate 326, the second air cylinder 323 can drive the clamping jaw lower plate 326 to move towards the direction close to or away from the clamping jaw upper plate 325, under the action of the first air cylinder 322 and the second air cylinder 323, the clamping jaw upper plate 325 and the clamping jaw lower plate 326 can mutually approach and clamp the chip rocking disc 231, and the clamping jaw upper plate 325 and the clamping jaw lower plate 326 can also mutually depart and put down the chip rocking disc 231.
Optionally, the feeding mechanism 32 further includes a connecting plate 324, one end of the connecting plate 324 is connected to the first cylinder 322, and the other end of the connecting plate 324 is connected to the clamping jaw upper plate 325, and the first cylinder 322 drives the clamping jaw upper plate 325 to move synchronously through the connecting plate 324 when extending and retracting.
Optionally, the manipulator base 31 further includes a carrying motor 311, a lead screw 312, and a lead screw nut seat 313.
The carrying motor 311 is fixedly connected to the robot base 31, the lead screw 312 is rotatably connected to the robot base 31, and the lead screw nut holder 313 is slidably connected to the robot base 31.
The carrying motor 311 may be various types of motors, such as a servo motor, a stepping motor.
One end of the screw 312 is connected with the carrying motor 311, and the carrying motor 311 can drive the screw 312 to rotate; the other end of the screw 312 penetrates through the screw nut seat 313 and is in threaded fit with the screw nut seat 313, specifically, a through hole is formed in the screw nut seat 313, an internal thread is formed on the inner wall of the through hole, the screw 312 penetrates through the through hole and is in threaded fit with the internal thread, and the screw 312 rotates to drive the screw nut seat 313 to slide on the manipulator base 31, so that the feeding mechanism 32 is driven to move.
Further, a cross arm pressing plate 314 is fixedly connected to the screw nut seat 313, the cross arm pressing plate 314 presses and fixes the carrying cross arm 321 to the screw nut seat 313, and the fixing connection mode of the cross arm pressing plate 314 may be a bolt connection, a snap connection, or other various fixing connection modes.
The action process of the embodiment is as follows: when the material needs to be taken, the carrying motor 311 is started, the feed mechanism 32 is driven to move towards the bin lifting assembly 2 through the screw 312 and the screw nut seat 313, and the clamping jaw upper plate 325 and the clamping jaw lower plate 326 enter the bin lifting assembly 2 and are respectively positioned at the upper side and the lower side of the target chip rocking disc 231; then, the first air cylinder 322 and the second air cylinder 323 are started to drive the clamping jaw upper plate 325 and the clamping jaw lower plate 326 to approach each other and clamp the chip rocking disc 231; then the carrying motor 311 is started, the feed mechanism 32 is driven to move towards the direction far away from the stock bin lifting assembly 2 through the screw 312 and the screw nut seat 313, and the chip rocking disc 231 is taken out; when the chip tray 231 moves above the platen 4, the first cylinder 322 and the second cylinder 323 are activated to move the upper jaw plate 325 and the lower jaw plate 326 away from each other and release the chip tray 231, so as to place the chip tray 231 on the platen 4.
The beneficial effect of this embodiment lies in: the specific structure of the feeding manipulator 3 is provided, so that the feeding manipulator 3 can smoothly take out the chip rocking disc 231 from the bin lifting assembly and place the chip rocking disc on the wafer platform 4; the clamping jaw upper plate 325 and the clamping jaw lower plate 326 are driven to synchronously move, so that the chip rocking disc 231 can be stably clamped.
Referring to fig. 4, in one embodiment, the platen 4 includes a first platen 41, a second platen 42, a rotation assembly 43, and a rocking disk positioning assembly 44.
The first platform 41 is fixedly connected to the frame, the second platform 42 is slidably connected to the first platform 41, the rotating assembly 43 is slidably connected to the second platform 42, the chip rocking disc 231 is placed on the rotating assembly 43, the sliding direction of the first platform 41 is perpendicular to the sliding direction of the second platform 42, the sliding direction of the second platform 42 is perpendicular to the rotating axis of the rotating assembly 43, specifically, the second platform 42 can move on the first platform 41 along the Y-axis direction, and the rotating assembly 43 can move on the second platform 42 along the X-axis direction, so that the position of the rotating assembly 43 can be adjusted, and the chip rocking disc 231 can be conveyed to the side of the die bonder 6.
The rocking disc positioning component 44 is connected to the rotating component 43, the rotating component 43 can drive the rocking disc positioning component 44 to rotate, and the rocking disc positioning component 44 is used for bearing the chip rocking disc 231.
The rotating assembly 43 may be a rotary cylinder, a rotary motor, a speed reducer, a belt transmission structure, or other various common rotating structures.
Optionally, the first platform 41 and the second platform 42 are both three-rail or four-rail platforms, so that jitter is reduced, stability is improved, and conveying accuracy is improved.
Optionally, the rocker paddle positioning assembly 44 includes a rocker paddle positioning frame 441 and a plurality of rocker paddle positioning cylinders 442.
The rocking disc positioning frame 441 is used for bearing the chip rocking disc 231, the plurality of rocking disc positioning cylinders 442 extend out to clamp the chip rocking disc 231 on the rocking disc positioning frame 441, and specifically, positioning grooves are formed in the chip rocking disc 231, and when the rocking disc positioning cylinders 442 extend out, piston rods of the rocking disc positioning cylinders 442 enter the corresponding positioning grooves, so that the chip rocking disc 231 is clamped and positioned on the rocking disc positioning frame 441.
The positioning groove may be formed in the bottom surface of the chip tray 231 or may be formed in the side surface of the chip tray 231.
The action process of the embodiment is as follows: when the feeding manipulator 3 places the chip rocking disc 231 in the rocking disc positioning frame 441, the plurality of rocking disc positioning cylinders 442 extend out, and the chip rocking disc 231 is fixed at the center of the rocking disc positioning frame 441; then, the first platform 41 and the second platform 42 convey the chip swing disc 231 to the die bonding assembly 6, and the rotating assembly 43 drives the swing disc positioning assembly 44 to rotate for fine adjustment.
The beneficial effect of this embodiment lies in: a specific structure of the wafer platform 4 is provided, so that the wafer rocking disc 231 is accurately and stably conveyed to the side of the die bonding assembly 6; and a rocking disc positioning frame 441 and a rocking disc positioning cylinder 442 are arranged, so that each chip rocking disc 231 can be positioned at the same determined position in the rocking disc positioning frame 441.
Referring to fig. 5, in one embodiment, the support platform 5 is movable in two mutually perpendicular directions to transport the support under the die attach assembly 6 or to transport the support to the die attach platform 7.
Specifically, the support platform 5 comprises a transverse conveying platform 51, a longitudinal conveying platform 52 and a support conveying platform 53; the support conveying table 53 is slidably connected to the longitudinal conveying platform 52, the longitudinal conveying platform 52 is slidably connected to the transverse conveying platform 51, and the transverse conveying platform 51 is connected to the machine table 1; the longitudinal conveying platform 52 can drive the support conveying table 53 to move along the X-axis direction, and the transverse conveying platform 51 can drive the longitudinal conveying platform 52 to move along the Y-axis direction.
The transverse conveying platform 51, the longitudinal conveying platform 52 and the support conveying platform 53 can be various types of conveying structures, such as a belt conveying structure, a trackless air cylinder, a telescopic cylinder matched with a slide rail and the like.
Referring to fig. 6, in an embodiment, the die bonding connection platform 7 is used for transferring a stent on one stent platform 5 to another adjacent stent platform 5, specifically, the die bonding connection platform 7 includes a platform base 71 connected to the machine platform 1 and a connection conveying mechanism 72 disposed on the platform base 71, and the connection conveying mechanism 72 is used for conveying the stent from one stent platform 5 to another stent platform 5; the docking conveyor mechanism 72 may be any of a variety of types of conveyor structures, such as a belt conveyor, a trackless cylinder, a telescoping cylinder-coupled slide, and the like.
Example two
Referring to fig. 1, on the basis of the first embodiment, the present embodiment provides a die bonder, which includes a die bonding conveying mechanism.
The die bonder further comprises two die bonder assemblies 6 connected to the machine table 1, the two die bonder assemblies 6 are respectively located above the two support platforms 5, the wafer platform 4 can convey wafers to the sides of the die bonder assemblies 6, the support platforms 5 convey the supports to the lower sides of the die bonder assemblies 6, and the die bonder assemblies 6 take the wafers off the wafer platform 4 and bond the wafers on the supports.
Referring to fig. 7, in an embodiment, the die attach assembly 6 includes a column 61, a double swing arm assembly 62, a taking lens assembly 63, and a die attach lens assembly 64.
The upright post 61 is used for providing a fixed foundation for the double-swing-arm assembly 62, the crystal taking lens assembly 63 and the crystal fixing lens assembly 64, and the double-swing-arm assembly 62, the crystal taking lens assembly 63 and the crystal fixing lens assembly 64 are connected to the upright post 61.
The double swing arm assembly 62 is used for respectively taking and fixing the crystal, so that the crystal fixing efficiency is improved, and the double swing arm assembly 62 is widely applied to the crystal fixing machine in the prior art, so that the details are not described herein.
The crystal taking lens assembly 63 and the crystal fixing lens assembly 64 are respectively located on two opposite sides of the double-swing-arm assembly 62 and used for detecting the position of the correction chip, so that crystal taking and crystal fixing of the double-swing-arm assembly 62 are facilitated.
The action process of the application is as follows: the two groups of feeding manipulators 3 take the chip rocking discs 231 from the bin lifting assembly 2 and are respectively placed on the two groups of wafer platforms 4, specifically, the carrying motor 311 is started to drive the feeding mechanism 32 to move towards the bin lifting assembly 2 through the screw 312 and the screw nut seat 313, so that the clamping jaw upper plate 325 and the clamping jaw lower plate 326 enter the bin lifting assembly 2 and are respectively positioned at the upper side and the lower side of the target chip rocking disc 231; then, the first air cylinder 322 and the second air cylinder 323 are started to drive the clamping jaw upper plate 325 and the clamping jaw lower plate 326 to approach each other and clamp the chip rocking disc 231; then the carrying motor 311 is started, the feed mechanism 32 is driven to move towards the bin lifting component 2 in the direction away from the feed bin through the screw 312 and the screw nut seat 313, and the chip rocking disc 231 is taken out; when the chip rocking disc 231 moves above the wafer platform 4, the first air cylinder 322 and the second air cylinder 323 are started to drive the clamping jaw upper plate 325 and the clamping jaw lower plate 326 to be away from each other and loosen the chip rocking disc 231, so that the chip rocking disc 231 is placed on the wafer platform 4;
the two groups of wafer platforms 4 respectively convey wafers to the adjacent bracket platforms 5, specifically, when the feeding manipulator 3 places the chip rocking disc 231 in the rocking disc positioning frame 441, the multiple rocking disc positioning cylinders 442 extend out, and fix the chip rocking disc 231 at the center of the rocking disc positioning frame 441; then, the first platform 41 and the second platform 42 convey the chip rocking disc 231 to the side of the die bonding assembly 6, and the rotating assembly 43 drives the rocking disc positioning assembly 44 to rotate for fine adjustment;
the support platform 5 at one side conveys the support, the die bonding assembly 6 takes the die from the chip rocking disc 231 and bonds the die on the support, at the moment, the die is fixed at one side of the support, and the die bonding work on the support is half completed;
then the bracket platform 5 conveys the bracket after the die bonding to a die bonding connection platform 7; the die bonding connection platform 7 conveys half of the die bonding supports to the other support platform 5, the other die bonding assembly 6 takes out the die from the adjacent chip rocking disc 231 and finishes the rest die bonding work, and then the support platform 5 conveys the supports to the next process.
The beneficial effect of this application lies in:
1. a bin lifting assembly 2 is arranged, and a feeding manipulator 3 is arranged on each of two sides of the bin lifting assembly 2, so that the feeding and taking efficiency is improved;
2. two groups of feeding manipulators 3 are arranged to act simultaneously, so that the die bonder can operate more stably, and the machine table 1 shakes less;
3. the feeding manipulator 3 adopts a form of synchronous movement and clamping of double cylinders, so that the chip rocking disc 231 is clamped more firmly;
4. set up two sets of supporting platforms 5, two sets of supporting platforms 5 carry out half solid brilliant work respectively, and two supporting platforms 5 are in proper order to the solid brilliant operation of same support, and when rear supporting platform 5 during operation, preceding supporting platform 5 can carry out solid brilliant operation to next support, has improved solid brilliant efficiency.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. The utility model provides a solid brilliant conveying mechanism, includes board (1), its characterized in that, still including connect in feed bin lifting unit (2), two sets of material loading manipulator (3), two sets of wafer platform (4), two sets of support platform (5), solid brilliant platform (7) of plugging into of board (1), wherein:
the bin lifting assembly (2) is used for providing wafers;
the two groups of feeding manipulators (3) are arranged on two sides of the stock bin lifting assembly (2) and are used for grabbing the wafers from the stock bin lifting assembly (2);
the two groups of wafer platforms (4) are respectively arranged on one side of the two groups of feeding mechanical arms (3) and are used for bearing the wafers grabbed by the adjacent feeding mechanical arms (3);
the two groups of support platforms (5) are respectively positioned at one side of the two groups of wafer platforms (4), and the wafer platforms (4) convey the wafers to one side of the support platforms (5);
the die bonding connection platform (7) is arranged between the two support platforms (5), wherein one support platform (5) is used for providing a support and conveying the support to the die bonding connection platform (7); the die bonding connection platform (7) is used for conveying the bracket to the other bracket platform (5).
2. The die bonding conveying mechanism according to claim 1, wherein the bin lifting assembly (2) comprises a mounting seat (21) arranged on the machine table (1), a feeding tray (22) connected to the mounting seat (21), and a tray basket bin (23), wherein:
the feeding tray (22) comprises a bottom plate lifting assembly (221) and a bin lifting bottom plate (222) connected to the bottom plate lifting assembly (221); the bottom plate lifting assembly (221) is used for driving the stock bin lifting bottom plate (222) to lift;
the tray lifting basket bin (23) is connected to the bin lifting bottom plate (222) and comprises a plurality of chip trays (231) and positioning pieces (232); the wafer is accommodated in the chip rocking disc (231), and the chip rocking discs (231) are stacked and arranged at intervals along the longitudinal direction; the positioning piece (232) is used for enabling the chip rocking disc (231) to be located at a preset position.
3. The die bonding conveying mechanism according to claim 2, wherein the loading tray (22) further comprises an inductive switch assembly (223) and an optical fiber amplifier (224) electrically connected to the inductive switch assembly (223), wherein:
the inductive switch assembly (223) comprises a plurality of inductive switches, and each inductive switch is respectively arranged on one side of each chip rocking disc (231).
4. The die bonding conveying mechanism according to claim 2, wherein the tray lifting bin (23) further comprises a bearing frame (234) and a plurality of sliding filler strips (233) connected to the bearing frame (234), the plurality of chip trays (231) are longitudinally stacked and are positioned in the bearing frame (234) at intervals, each sliding filler strip (233) is respectively arranged below each chip tray (231), and the chip trays (231) are abutted against the corresponding sliding filler strips (233).
5. The die bonding conveying mechanism according to any one of claims 1-4, wherein the feeding manipulator (3) comprises a manipulator base (31) and a feeding mechanism (32) arranged on the manipulator base (31), wherein:
the feeding mechanism (32) comprises a conveying cross arm (321), a first air cylinder (322), a second air cylinder (323), a clamping jaw upper plate (325) and a clamping jaw lower plate (326) which are arranged on the conveying cross arm (321); the clamping jaw upper plate (325) is connected with the first air cylinder (322), the clamping jaw lower plate (326) is connected with the second air cylinder (323), and the first air cylinder (322) and the second air cylinder (323) can drive the clamping jaw upper plate (325) and the clamping jaw lower plate (326) to be close to or far away from each other.
6. The die bonding conveying mechanism according to claim 5, wherein the robot base (31) further comprises a carrying motor (311) connected to the robot base (31), a lead screw (312) and a lead screw nut seat (313);
one end of the screw rod (312) is connected with the carrying motor (311), and the other end of the screw rod (312) penetrates through the screw rod nut seat (313) and is in threaded fit with the screw rod nut seat (313); the screw rod nut seat (313) is connected to the manipulator base (31) in a sliding manner along the axial direction of the screw rod (312); the carrying cross arm (321) is connected to the feed screw nut seat (313).
7. The die bonding conveying mechanism according to claim 2, wherein the wafer platform (4) comprises a first platform (41), a second platform (42), a rotating assembly (43) and a rocking disc positioning assembly (44), wherein:
the first platform (41) is arranged on the machine table (1), the second platform (42) is connected to the first platform (41) in a sliding manner, the rotating assembly (43) is connected to the second platform (42) in a sliding manner, the sliding direction of the first platform (41) is perpendicular to the sliding direction of the second platform (42), and the sliding direction of the second platform (42) is perpendicular to the rotation axis of the rotating assembly (43);
the rocking disc positioning component (44) is connected to the rotating component (43), and the rotating component (43) is used for driving the rocking disc positioning component (44) to rotate.
8. The die bonding conveying mechanism according to claim 7, wherein the rocking disc positioning assembly (44) comprises a rocking disc positioning frame (441) and a plurality of rocking disc positioning cylinders (442) connected to the rocking disc positioning frame (441);
the plurality of rocking disc positioning cylinders (442) extend out to clamp the chip rocking disc (231) on the rocking disc positioning frame (441).
9. A die bonder, comprising the die bonder conveying mechanism as set forth in any one of claims 1 to 8;
the die bonder further comprises two die bonder assemblies (6) connected to the machine table (1), wherein the two die bonder assemblies (6) are respectively arranged above the two support platforms (5).
10. The die bonder of claim 9, wherein the die bonder assembly (6) comprises a vertical column (61), and a double-swing-arm assembly (62), a die-taking lens assembly (63) and a die bonder lens assembly (64) connected to the vertical column (61);
the crystal taking lens assembly (63) and the crystal fixing lens assembly (64) are respectively positioned at two sides of the double-swing-arm assembly (62).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220713557.XU CN217158146U (en) | 2022-03-29 | 2022-03-29 | Die bonding conveying mechanism and die bonding machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220713557.XU CN217158146U (en) | 2022-03-29 | 2022-03-29 | Die bonding conveying mechanism and die bonding machine |
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| CN217158146U true CN217158146U (en) | 2022-08-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524946A (en) * | 2024-01-08 | 2024-02-06 | 无锡昌鼎电子有限公司 | Double-wire bare chip test sorting machine |
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2022
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524946A (en) * | 2024-01-08 | 2024-02-06 | 无锡昌鼎电子有限公司 | Double-wire bare chip test sorting machine |
| CN117524946B (en) * | 2024-01-08 | 2024-04-09 | 无锡昌鼎电子有限公司 | Double-wire bare chip test sorting machine |
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