CN210732873U - Diamond multi-wire cutting device - Google Patents
Diamond multi-wire cutting device Download PDFInfo
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- CN210732873U CN210732873U CN201921178864.7U CN201921178864U CN210732873U CN 210732873 U CN210732873 U CN 210732873U CN 201921178864 U CN201921178864 U CN 201921178864U CN 210732873 U CN210732873 U CN 210732873U
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Abstract
The utility model provides a multi-wire cutting device of diamond, include: the device comprises a fixed plate, a lifting mechanism, a swinging mechanism and a pressure detecting mechanism, wherein the lifting mechanism comprises a lifting cylinder and a lifting platform, and the lifting cylinder is arranged on the lifting platform and is connected with the bottom wall of the fixed plate; the swinging mechanism comprises a fixed part, a shaft pin and a rotating part, the fixed part and the rotating part are relatively and rotatably connected through the shaft pin, the fixed part is connected with the bottom wall of the lifting platform, and the bottom end of the rotating part is suitable for mounting a crystal bar to be cut; the pressure detection mechanism comprises a pressure sensing device, the pressure sensing device is arranged between the swing mechanism and the lifting mechanism, the swing mechanism can sense the pressure of a wire bow in the operation process, the pressure sensing device can obtain the pressure value of the wire bow, and the device obtains a stable wire bow value by additionally arranging the swing mechanism and automatically compensating the pressure, so that the yield is improved, and the warpage, TTV and nano morphology are improved.
Description
Technical Field
The utility model discloses be suitable for crystal bar cutting technical field, particularly, the utility model relates to a multi-line cutting device of diamond.
Background
The prior multi-line cutting of the mortar generates cutting capability by mutually and oppositely grinding silicon carbide powder and silicon rods, so that more process materials are needed to be controlled, the process time requirement is longer, the multi-line cutting method of diamond mainly uses diamond to dig out silicon material on the silicon rod to generate cutting capability, can simplify the process conditions and greatly shorten the cutting process time, but the cutting instability is caused by the shortening of the process time, the requirement on the flatness of the photovoltaic material in a square column shape is lower, therefore, the multi-line cutting of diamond can be completely introduced without affecting the yield, but the semiconductor silicon rod is cylindrical, the cutting contact area is greatly changed with time during the cutting production, which results in worse cutting stability and causes the influence of yield, therefore, the multi-wire cutting introduction of the semiconductor silicon rod into the diamond multi-wire cutting process needs to be further researched and improved.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, an object of the utility model is to provide a diamond multi-wire cutting device, the device can obtain stable line bow value through addding wabbler mechanism and pressure automatic compensation, and then improves the yield, improves warpage, TTV and nanometer appearance.
The utility model discloses a multi-wire cutting device of diamond, according to the utility model discloses an embodiment, this multi-wire cutting device of diamond includes:
a fixing plate is arranged on the base plate,
the lifting mechanism comprises a lifting cylinder and a lifting platform, and the lifting cylinder is arranged on the lifting platform and is connected with the bottom wall of the fixing plate;
the swinging mechanism comprises a fixed part, a shaft pin and a rotating part, the fixed part and the rotating part are relatively and rotatably connected through the shaft pin, the fixed part is connected with the bottom wall of the lifting platform, and the bottom end of the rotating part is suitable for mounting a crystal bar to be cut;
the pressure sensing mechanism comprises a pressure sensing device, the pressure sensing device is arranged between the swing mechanism and the lifting mechanism, and the pressure sensing device can collect the pressure value of the wire bow sensed by the diamond multi-wire cutting device in the operation process;
therefore, the utility model discloses multi-wire cutting device of diamond has the pendulous device, and the pendulous device can carry out relative swing along with the cutting position of difference, reduces among the cutting process initial position to the influence of final end position atress area change to the line bow to effectively improve the angularity. Meanwhile, the diamond multi-wire cutting device in the embodiment is provided with the pressure detection mechanism, and the pressure detection mechanism can sense the pressure of the wire arch through the contact between the swinging mechanism and the wire arch, so that a reference basis is provided for stabilizing the wire arch. Therefore, adopt the utility model discloses multi-wire cutting device of diamond can realize keeping the line bow stable, improves the yield, improves warpage, TTV and nanometer appearance.
In addition, according to the utility model discloses the multi-wire cutting device of diamond can also have following additional technical characterstic:
in some embodiments of the present invention, the pressure detecting mechanism includes: and the control processing device is connected with the pressure sensing device, is connected with the lifting mechanism and/or the swinging mechanism, analyzes and processes the pressure value fed back by the pressure sensing device and automatically compensates the pressure by adjusting the lifting mechanism or/and the swinging mechanism.
In some embodiments of the invention, the wire bow has a stable wire bow value of 1-3 mm.
In some embodiments of the present invention, the rotating portion swings at an angle of 0 to 12 degrees.
In some embodiments of the present invention, the lifting mechanism further comprises a spacing feeding column, the spacing feeding column is disposed between the lifting platform and the fixing plate, and is parallel to the lifting cylinder.
Drawings
Fig. 1 is a schematic structural diagram of a diamond multi-wire cutting device according to an embodiment of the present invention.
Fig. 2 is an enlarged view of a region a of fig. 1.
Fig. 3 is a graph of wire bow size versus cutting position according to one embodiment of the present invention.
Fig. 4 is a diagram of the relationship of the rocking angle to the cutting position according to an embodiment of the present invention.
Fig. 5 is a nanotopography of a surface of a wafer after dicing in accordance with an embodiment of the present invention.
Fig. 6 shows TTV and warp values for a wafer according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
The utility model discloses a multi-wire cutting device of diamond, according to the utility model discloses an embodiment, as shown in figure 1, this multi-wire cutting device of diamond includes: a fixed plate 10, a lifting mechanism 20, a swinging mechanism 30 and a pressure detecting mechanism 40, wherein,
the lifting mechanism 20 comprises a lifting cylinder 21 and a lifting platform 22, and the lifting cylinder 21 is arranged on the lifting platform 22 and connected with the bottom wall of the fixing plate 10;
the swing mechanism 30 comprises a fixed part 31, a shaft pin 32 and a rotating part 33, the fixed part 31 and the rotating part 33 are relatively and rotatably connected through the shaft pin 32, the fixed part 31 is connected with the bottom wall of the lifting platform 22, and the bottom end of the rotating part 33 is suitable for mounting a crystal bar to be cut;
the pressure detecting mechanism 40 includes a pressure sensing device 41, the pressure sensing device 41 is disposed between the swing mechanism 30 and the lifting mechanism 20, and the pressure sensing device 41 collects a pressure value of the wire bow sensed by the swing mechanism 30 during the operation process;
therefore, the utility model discloses multi-wire cutting device of diamond has wabbler mechanism, and wabbler mechanism can carry out the relative swing along with the cutting position of difference, reduces among the cutting process initial position to the influence of final end position atress area change to the line bow to effectively improve the angularity. Meanwhile, the diamond multi-wire cutting device in the embodiment is provided with the pressure detection mechanism, and the pressure detection mechanism can be contacted with the wire bow through the swinging mechanism to collect the pressure value of the wire bow, so that a reference basis is provided for stabilizing the wire bow value. Therefore, adopt the utility model discloses multi-wire cutting device of diamond can realize keeping the line bow stable, improves the yield, improves warpage, TTV and nanometer appearance.
The utility model discloses a whether the line bow is stable can characterize through the pressure between diamond wire and the silicon rod based on the inventor discovery, if pressure between diamond wire and the silicon rod when remaining stable promptly, the line bow value also tends to stably. Therefore, whether the wire bow is stable or not can be indirectly known by monitoring the pressure between the diamond wire and the silicon rod, so that the wire bow can be further kept stable by adjusting the process, the cutting yield of the crystal bar is improved, and the warpage, TTV and nano morphology are improved.
In order to monitor the pressure between diamond wire and the silicon rod more accurately and carry out pressure compensation, according to the utility model discloses an embodiment, above-mentioned pressure is listened mechanism 40 and is included: the control processing device 42 is connected with the pressure sensing device 41, the control processing device 42 is connected with the lifting mechanism 20 and/or the swing mechanism 30, the control processing device 42 analyzes and processes the pressure value fed back by the pressure sensing device 41, and further performs pressure automatic compensation by adjusting the lifting mechanism 20 or/and the swing mechanism 30.
Specifically, after the pressure sensing device 41 collects the pressure value, the pressure value is fed back to the control device 42, the control device 42 performs analysis processing, if the pressure value of the wire bow is too large or too small, the control processing device 42 transmits a command signal to the lifting mechanism 20, and the lifting mechanism 20 performs pressure automatic compensation on the wire bow by adjusting the lifting of the lifting cylinder 21; or the control processing device 42 transmits the command signal to the swing mechanism 30, and the swing mechanism 30 automatically compensates the pressure of the wire bow by adjusting the rotation angle of the swing rotation part 33; or the control processing device 42 transmits the command signal to the lifting mechanism 20 and the swinging mechanism 30 at the same time, the lifting mechanism 20 adjusts the lifting of the lifting cylinder 21, and the swinging mechanism 30 adjusts the rotation angle of the swinging rotating part 33, and meanwhile, the pressure compensation of the wire bow is realized. The line bow value is stable, the reel 50 bears the pressure from the crystal rod stably, and the stable line bow value can reduce the damage of the grooves of the reel 50 and prolong the service life of the reel 50. The automatic pressure compensation function can greatly improve the cutting efficiency without influencing the warping degree, and can improve the stability of the cutting quality.
According to a specific embodiment of the present invention, the stable wire bow value is 1-3 mm. Therefore, the standard wire bow value is used as a reference, and the actual wire bow value obtained by calculation is adjusted to be within the stable range, so that the cutting yield of the crystal bar can be remarkably improved, and the warpage, TTV and nano morphology can be improved. For example, in fig. 3, by adding a swing mechanism and a pressure detecting device, the size of the wire bow is always stable at different cutting positions and different cutting areas.
In reference to fig. 1 to 2, the "bow value" herein is the distance between the lowest point of the diamond wire bow and the highest point of the reel.
According to an embodiment of the present invention, in the method for cutting a silicon rod, the diamond multi-wire cutting device may control a swing angle θ of the rotating part according to the following formulax，
Wherein: thetaxAs an angle at the cutting position x, thetaMThe angle at the maximum cutting position, R, is the ingot diameter, and x is the cutting length in the feed direction.
Therefore, the diamond multi-wire cutting device of the embodiment is used for cutting the silicon rod, the swing angle of the swing device is adjusted at any time according to the change of the cutting position by further controlling the setting of the swing angle of the swing device, and the change of the stress area from the initial position to the final end position is reduced. The condition of the wire bow can be effectively improved by reducing the change of the stress area, and the condition of the wire bow directly influences the warping degree result. Therefore, the warping degree and the nanometer morphology can be effectively improved and the TTV can be reduced by adopting the formula to control the rocking angle.
In addition, the utility model discloses an above-mentioned cutting method when cutting the bulky time of face, sways the angle grow, as shown in FIG. 4, and then can increase the stability of cutting. For example, in fig. 5, by adding the swing mechanism and the pressure detection device, the thickness variation value of the wafer obtained by cutting the ingot is measured, and compared with the normal state, the wafer with the added swing mechanism and the pressure detection device has darker color (more uniform), smaller color fluctuation and more uniform profile thickness. In fig. 6, the TTV value and warp (warp) of the wafer obtained by cutting the ingot are measured by adding the swing mechanism and the pressure detecting device, and the TTV value and warp (warp) of the wafer are reduced compared with the normal value. (TTV test method: GB/T29507-2013 silicon wafer flatness, thickness and total thickness change test automatic non-contact scanning method; warpage test method: GB/T32280-2015 silicon wafer warpage test automatic non-contact scanning method.)
According to the specific embodiment of the present invention, the swing angle θ of the rotating part in the maximum cutting area in the above formulaMIs 0 to 12 degrees, preferably 6 to 12 degrees.
Therefore, the diamond multi-wire cutting device and the cutting method of the embodiment of the invention have at least one of the following advantages:
(1) the main factor of unstable mortar cutting capability during multi-line cutting is reduced, and the yield loss during production can be reduced.
(2) The problem of wavy TTV caused by the difference of cutting capacity before wire feeding and wire returning due to small wire consumption in multi-wire cutting of diamond is solved, and the nano-morphology is improved at the same time.
(3) The automatic pressure compensation function can greatly improve the cutting efficiency without influencing the warping degree, and can increase the stability of the cutting quality. On the other hand, a stable wire bow represents that the reel is subjected to stable pressure from the diamond, and damage to the reel grooves can be reduced, thus prolonging the service life of the reel.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (5)
1. A diamond multi-wire sawing device characterized by comprising:
a fixing plate is arranged on the base plate,
the lifting mechanism comprises a lifting cylinder and a lifting platform, and the lifting cylinder is arranged on the lifting platform and is connected with the bottom wall of the fixing plate;
the swinging mechanism comprises a fixed part, a shaft pin and a rotating part, the fixed part and the rotating part are relatively and rotatably connected through the shaft pin, the fixed part is connected with the bottom wall of the lifting platform, and the bottom end of the rotating part is suitable for mounting a crystal bar to be cut;
the pressure detection mechanism comprises a pressure sensing device, the pressure sensing device is arranged between the swing mechanism and the lifting mechanism, and the pressure sensing device can collect the pressure value of the wire bow sensed by the diamond multi-wire cutting device in the operation process.
2. The diamond multi-wire sawing device according to claim 1, wherein the pressure detection mechanism comprises:
and the control processing device is connected with the pressure sensing device, is connected with the lifting mechanism and/or the swinging mechanism, analyzes and processes the pressure value fed back by the pressure sensing device and automatically compensates the pressure by adjusting the lifting mechanism or/and the swinging mechanism.
3. The diamond multi-wire sawing device according to claim 2, wherein the wire bow has a stable wire bow value of 1-3 mm.
4. The diamond multi-wire cutting device according to claim 3, wherein the angle of the swing of the rotating part is 0 to 12 degrees.
5. The diamond multi-wire cutting device according to claim 1, wherein the lifting mechanism further comprises a limit feeding column disposed between the lifting platform and the fixing plate and parallel to the lifting cylinder.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921178864.7U CN210732873U (en) | 2019-07-24 | 2019-07-24 | Diamond multi-wire cutting device |
| US17/279,600 US20220134600A1 (en) | 2019-07-24 | 2020-07-24 | Method for cutting silicon rod and apparatus for dimaond multi-wire cutting |
| PCT/CN2020/104070 WO2021013238A1 (en) | 2019-07-24 | 2020-07-24 | Method for cutting silicon rod and diamond multi-wire cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921178864.7U CN210732873U (en) | 2019-07-24 | 2019-07-24 | Diamond multi-wire cutting device |
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| CN210732873U true CN210732873U (en) | 2020-06-12 |
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| CN201921178864.7U Active CN210732873U (en) | 2019-07-24 | 2019-07-24 | Diamond multi-wire cutting device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110370477A (en) * | 2019-07-24 | 2019-10-25 | 徐州鑫晶半导体科技有限公司 | Diamond Multi-wire cutting device and cutting method |
| CN112060378A (en) * | 2020-07-30 | 2020-12-11 | 长治高测新材料科技有限公司 | Wire cutting process for large-diameter silicon slice diamond for IC |
| WO2021013238A1 (en) * | 2019-07-24 | 2021-01-28 | 徐州鑫晶半导体科技有限公司 | Method for cutting silicon rod and diamond multi-wire cutting device |
| CN113997437A (en) * | 2021-09-23 | 2022-02-01 | 隆基绿能科技股份有限公司 | Silicon rod processing method and silicon wafer |
-
2019
- 2019-07-24 CN CN201921178864.7U patent/CN210732873U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110370477A (en) * | 2019-07-24 | 2019-10-25 | 徐州鑫晶半导体科技有限公司 | Diamond Multi-wire cutting device and cutting method |
| WO2021013238A1 (en) * | 2019-07-24 | 2021-01-28 | 徐州鑫晶半导体科技有限公司 | Method for cutting silicon rod and diamond multi-wire cutting device |
| CN112060378A (en) * | 2020-07-30 | 2020-12-11 | 长治高测新材料科技有限公司 | Wire cutting process for large-diameter silicon slice diamond for IC |
| CN112060378B (en) * | 2020-07-30 | 2022-07-22 | 乐山高测新能源科技有限公司 | Wire cutting process for large-diameter silicon slice diamond for IC |
| CN113997437A (en) * | 2021-09-23 | 2022-02-01 | 隆基绿能科技股份有限公司 | Silicon rod processing method and silicon wafer |
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Address after: 221004 No.66, Yangshan Road, Xuzhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Address before: 221004 No.66, Yangshan Road, Xuzhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20230523 Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 221004 No.66, Yangshan Road, Xuzhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. |
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