Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to propose that diamond Multi-wire cutting device and cutting method, the device can be by adding wabbler mechanism and pressure
Automatically it compensates and obtains stable line bow value, and then improve yield, improve warpage, TTV and nanotopography.
The invention discloses a kind of diamond Multi-wire cutting devices, according to an embodiment of the invention, the diamond multi-wire cutting
Cutting device includes:
Fixed plate,
Elevating mechanism, the elevating mechanism include lifting cylinder and hoistable platform, and the lifting cylinder is arranged in the liter
It is connected on drop platform and with the bottom wall of the fixed plate;
Wabbler mechanism, the wabbler mechanism include fixed part, pivot pin and rotating part, and the fixed part and the rotating part are logical
It crosses pivot pin to be rotatably attached relatively, the fixed part is connected with the bottom wall of the hoistable platform, and the bottom end of the rotating part is suitable
In installation crystal bar to be cut;
Pressure detection mechanism, including pressure sensor device, the pressure sensor device are arranged in the wabbler mechanism and institute
It states between elevating mechanism, the pressure sensor device can collect the diamond Multi-wire cutting device and perceive in the process of running
The pressure value of line bow.
The diamond Multi-wire cutting device of the above embodiment of the present invention has rocking equipment as a result, and rocking equipment can be with
Different cutting position carry out it is opposite swing, reduce in cutting process initial position and change pair to final end position forced area
The influence of line bow, to be effectively improved angularity.Meanwhile diamond Multi-wire cutting device has pressure detection in above-described embodiment
Mechanism, the contact that pressure detection mechanism can be bent by wabbler mechanism with line, the size of perception line bow pressure, and then be stability contorting
Line bow provides reference frame.Therefore, it may be implemented to keep line bow steady using the diamond Multi-wire cutting device of the embodiment of the present invention
It is fixed, yield is improved, warpage, TTV and nanotopography are improved.
In addition, diamond Multi-wire cutting device according to the above embodiment of the present invention can also have following additional technology
Feature:
In some embodiments of the invention, the pressure detection mechanism includes: control processing unit, the control processing
Device is connected with the pressure sensor device, the control processing unit and the elevating mechanism and/or the wabbler mechanism phase
Even, the control processing unit, which is analyzed and processed the pressure value that the pressure sensor device is fed back and passes through, adjusts the liter
Descending mechanism or/and the wabbler mechanism carry out self-compensating pressure.
In some embodiments of the invention, the stable line bow value is 1-3mm.
In some embodiments of the invention, the elevating mechanism further includes limit feeding column, and the limit feeding column is set
It sets between the hoistable platform and the fixed plate, and parallel with the lifting cylinder.
According to another aspect of the present invention, it is multi-thread using diamond described in preceding embodiment that the invention also provides a kind of
The method of cutter device cutting silicon rod, in this method, the swing angleWherein: θxTo cut
Angle at the x of position, θMFor the angle of maximum location of cut, R is boule diameter, and x is the Cutting Length in direction of feed.
In some embodiments of the invention, the rotating part is 0-12 degree in the swing angle of maximum cutting area.
In some embodiments of the invention, the rotating part is 6~12 degree in the swing angle of maximum cutting area.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
The invention discloses a kind of diamond Multi-wire cutting devices, according to an embodiment of the invention, as shown in Figure 1, the gold
Hard rock Multi-wire cutting device includes: fixed plate 10, elevating mechanism 20, wabbler mechanism 30 and pressure detection mechanism 40, wherein described
Elevating mechanism 20 includes lifting cylinder 21 and hoistable platform 22, the lifting cylinder 21 be arranged on the hoistable platform 22 and with
The bottom wall of the fixed plate 10 is connected;
The wabbler mechanism 30 includes fixed part 31, pivot pin 32 and rotating part 33, the fixed part 31 and the rotating part
33 are rotatably attached by the way that pivot pin 32 is opposite, and the fixed part 31 is connected with the bottom wall of the hoistable platform 22, the rotation
The bottom end in portion 33 is suitable for installing crystal bar to be cut;
The pressure detection mechanism 40, including pressure sensor device 41, the setting of pressure sensor device 41 are shaken described
Between swinging mechanism 30 and the elevating mechanism 20, the pressure sensor device 41 can collect the wabbler mechanism 30 in operational process
The pressure value of the line bow of middle perception;
The diamond Multi-wire cutting device of the above embodiment of the present invention has wabbler mechanism as a result, and wabbler mechanism can be with
Different cutting position carry out it is opposite swing, reduce in cutting process initial position and change pair to final end position forced area
The influence of line bow, to be effectively improved angularity.Meanwhile diamond Multi-wire cutting device has pressure detection in above-described embodiment
The size of line bow pressure value is collected in mechanism, the contact that pressure detection mechanism can be bent by wabbler mechanism with line, and then to stablize control
Line bow value processed provides reference frame.Therefore, it may be implemented to keep line using the diamond Multi-wire cutting device of the embodiment of the present invention
Bow is stablized, and yield is improved, and improves warpage, TTV and nanotopography.
The present invention be based on inventors have found that line bow whether it is stable can by the pressure between diamond wire and silicon rod into
Row characterization, i.e., if when pressure remained steady between diamond wire and silicon rod, line bow value also tends towards stability.Therefore, pass through prison
The pressure surveyed between diamond wire and silicon rod can learn whether line bow is stable indirectly, and then can be further by adjusting technique
So that line bow keeps stablizing, improves crystal bar cutting yield, improves warpage, TTV and nanotopography.
In order to more accurately monitor the pressure between diamond wire and silicon rod and carry out pressure compensation, according to the present invention
Embodiment, above-mentioned pressure detection mechanism 40 includes: control processing unit 42, the control processing unit 42 and pressure biography
Induction device 41 is connected, and the control processing unit 42 is connected with the elevating mechanism 20 and/or the wabbler mechanism 30, at control
The pressure value that reason device 42 feeds back the pressure sensor device 41 is analyzed and processed, and further by adjusting the lifting
Mechanism 20 or/and the wabbler mechanism 30 carry out self-compensating pressure.
Specifically, after pressure sensor device 41 is collected into pressure value, pressure value is fed back into control device 42, control dress
It sets 42 to handle by analysis, if discovery line bow pressure value is excessive or too small, command signal is transferred to by control processing unit 42
Elevating mechanism 20, elevating mechanism 20 bend line and carry out self-compensating pressure by the lifting of adjusting lifting cylinder 21;Or at control
Command signal is transferred to wabbler mechanism 30 by reason device 42, and wabbler mechanism 30 waves the rotation angle of rotating part 33 by adjusting,
Line is bent and carries out self-compensating pressure;Or control processing unit 42 sends command signal to elevating mechanism 20 and wobbler simultaneously
Structure 30, elevating mechanism 20 pass through the lifting for adjusting lifting cylinder 21, and wabbler mechanism 30 waves the rotation of rotating part 33 by adjusting
Angle, while realizing the pressure compensation bent to line.Line bow value is stablized, then reel 50 bears to stablize from the pressure of crystal bar,
The damage that stable line bow value can reduce by 50 groove of reel promotes the service life of reel 50.Above-mentioned self-compensating pressure function can
It greatly improves cutting efficiency and does not influence angularity, and the stability of cutting quality can be increased.
According to a particular embodiment of the invention, stable line bow value is 1-3mm.It is made reference as a result, with the normal line bow value,
The practical line bow value being calculated is adjusted, is adjusted to it in stable range, it is possible thereby to significantly improve crystal bar
It cuts yield, improve warpage, TTV and nanotopography.Such as by adding wabbler mechanism and pressure detection device in Fig. 3, not
With cutting position, under different cutting areas, line bow size remains stable.
It should be noted that " line bow value " herein is the minimum point and coiling that the line of diamond wire bends with reference to Fig. 1~2
Take turns the distance of highest point.
According to another aspect of the present invention, it is multi-thread using diamond described in preceding embodiment that the invention also provides a kind of
The method of cutter device cutting silicon rod in this method, controls the swing angle of rotating partWherein: θx
For the angle at cutting position x, θMFor the angle of maximum location of cut, R is boule diameter, and x is cutting in direction of feed
Cut length.
The diamond Multi-wire cutting device cutting silicon rod for using above-described embodiment as a result, waves dress by further controlling
The setting for setting swing angle makes it adjust the swing angle of rocking equipment at any time according to the variation of cutting position, reduces start bit
Set the forced area variation of final end position.And the variation for reducing forced area can effectively improve the situation of line bow,
And the situation of line bow directly influences whether the result of angularity.Therefore, can have by using above-mentioned formula control swing angle
Effect improves angularity and nanotopography, reduces TTV.
In addition, above-mentioned cutting method of the invention, when cutting area increases, swing angle becomes larger, such as Fig. 4 institute
Show, and then the stability of cutting can be increased.Such as crystal bar is measured by adding wabbler mechanism and pressure detection device in Fig. 5
The change value of thickness for cutting wafer obtained adds the face of the wafer of rocking equipment and pressure detection device compared with normal
Color is deeper (more evenly), and color fluctuating is smaller, and pattern thickness is more evenly.It is filled in Fig. 6 by adding wabbler mechanism and pressure detection
It sets, measurement crystal bar cuts the TTV value of wafer obtained and warp (angularity) is tested, and compared with normal, add and waves
The TTV value and warp value of the wafer of device and pressure detection device are reduced.(TTV test method: GB/T29507-2013 silicon
Piece flatness, thickness and total thickness variations test automatic non-contact scanning method;Angularity test method: GB/T32280-2015 silicon
Piece angularity tests automatic non-contact scanning method.)
According to a particular embodiment of the invention, swing angle θ of the rotating part in maximum cutting area in above-mentioned formulaMFor 0-
12 degree, preferably 6-12 degree.
Therefore, the diamond Multi-wire cutting device of the above embodiment of the present invention and cutting method at least have following advantages it
One:
(1) mortar cutting power unstable principal element when reducing multi-wire saw can reduce yield damage when production
It loses.
(2) improve diamond multi-wire saw because with few wave caused by cutting power difference before line sending and loop line of line amount
The problem of shape TTV, and improve nanotopography simultaneously.
(3) self-compensating pressure function can greatly improve cutting efficiency and not influence angularity, and can increase cutting quality
Stability.On the other hand stable line bow represents reel and bears the pressure from diamond-stable, can reduce reel ditch
The damage of slot promotes the service life of reel.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
It can be combined in any suitable manner in a or multiple embodiment or examples.In addition, without conflicting with each other, the technology of this field
The feature of different embodiments or examples described in this specification and different embodiments or examples can be combined by personnel
And combination.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.