CN110370477A - Diamond Multi-wire cutting device and cutting method - Google Patents
Diamond Multi-wire cutting device and cutting method Download PDFInfo
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- CN110370477A CN110370477A CN201910671681.7A CN201910671681A CN110370477A CN 110370477 A CN110370477 A CN 110370477A CN 201910671681 A CN201910671681 A CN 201910671681A CN 110370477 A CN110370477 A CN 110370477A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 77
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 37
- 239000010432 diamond Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 69
- 230000003028 elevating effect Effects 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 239000013078 crystal Substances 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 230000006641 stabilisation Effects 0.000 claims 1
- 238000011105 stabilization Methods 0.000 claims 1
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008676 import Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 230000008447 perception Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention proposes diamond Multi-wire cutting device and cutting methods, wherein cutter device includes: fixed plate, elevating mechanism, wabbler mechanism, pressure detection mechanism, wherein, elevating mechanism includes lifting cylinder and hoistable platform, and lifting cylinder is arranged on hoistable platform and is connected with the bottom wall of fixed plate；Wabbler mechanism includes fixed part, pivot pin and rotating part, and fixed part is rotatably attached with rotating part by the way that pivot pin is opposite, and fixed part is connected with the bottom wall of hoistable platform, and the bottom end of rotating part is suitable for installing crystal bar to be cut；Pressure detection mechanism includes pressure sensor device, and the pressure sensor device is arranged between the wabbler mechanism and the elevating mechanism, and the wabbler mechanism can perceive the pressure of line bow in the process of running, and the pressure sensor device can obtain the line bow pressure value.The device obtains stable line bow value and adding wabbler mechanism and self-compensating pressure, and then improves yield, improves warpage, TTV and nanotopography.
Description
Technical field
The present invention is suitable for crystal bar cutting technique field, specifically, the present invention relates to diamond Multi-wire cutting device and cutting
Segmentation method.
Background technique
Mortar multi-wire saw is to generate cutting power by carborundum powder and the mutual opposite grinding of silicon rod at present, so needing to control
Process stream it is more a variety of and process time demand is long, and diamond multi-wire saw mode mainly will by diamond
Silicon material on silicon rod excavates generation cutting power, can simplify process conditions and substantially shortens the process time of cutting, but technique
The shortening of time also results in the unstability of cutting, and photovoltaic material is relatively low for the requirement of its flatness of flat column, so
Diamond multi-wire saw can import completely and have no effect on yield, but semiconductor silicon rod be it is cylindric, can be with when cutting production
Time, which generates significantly to change via cutting contact area, causes cutting stability worse, and causes the influence of yield, so
The multi-wire saw of semiconductor silicon rod imports diamond multi-line cutting process and needs further Improvement.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to propose that diamond Multi-wire cutting device and cutting method, the device can be by adding wabbler mechanism and pressure
Automatically it compensates and obtains stable line bow value, and then improve yield, improve warpage, TTV and nanotopography.
The invention discloses a kind of diamond Multi-wire cutting devices, according to an embodiment of the invention, the diamond multi-wire cutting
Cutting device includes:
Fixed plate,
Elevating mechanism, the elevating mechanism include lifting cylinder and hoistable platform, and the lifting cylinder is arranged in the liter
It is connected on drop platform and with the bottom wall of the fixed plate；
Wabbler mechanism, the wabbler mechanism include fixed part, pivot pin and rotating part, and the fixed part and the rotating part are logical
It crosses pivot pin to be rotatably attached relatively, the fixed part is connected with the bottom wall of the hoistable platform, and the bottom end of the rotating part is suitable
In installation crystal bar to be cut；
Pressure detection mechanism, including pressure sensor device, the pressure sensor device are arranged in the wabbler mechanism and institute
It states between elevating mechanism, the pressure sensor device can collect the diamond Multi-wire cutting device and perceive in the process of running
The pressure value of line bow.
The diamond Multi-wire cutting device of the above embodiment of the present invention has rocking equipment as a result, and rocking equipment can be with
Different cutting position carry out it is opposite swing, reduce in cutting process initial position and change pair to final end position forced area
The influence of line bow, to be effectively improved angularity.Meanwhile diamond Multi-wire cutting device has pressure detection in above-described embodiment
Mechanism, the contact that pressure detection mechanism can be bent by wabbler mechanism with line, the size of perception line bow pressure, and then be stability contorting
Line bow provides reference frame.Therefore, it may be implemented to keep line bow steady using the diamond Multi-wire cutting device of the embodiment of the present invention
It is fixed, yield is improved, warpage, TTV and nanotopography are improved.
In addition, diamond Multi-wire cutting device according to the above embodiment of the present invention can also have following additional technology
Feature:
In some embodiments of the invention, the pressure detection mechanism includes: control processing unit, the control processing
Device is connected with the pressure sensor device, the control processing unit and the elevating mechanism and/or the wabbler mechanism phase
Even, the control processing unit, which is analyzed and processed the pressure value that the pressure sensor device is fed back and passes through, adjusts the liter
Descending mechanism or/and the wabbler mechanism carry out self-compensating pressure.
In some embodiments of the invention, the stable line bow value is 1-3mm.
In some embodiments of the invention, the elevating mechanism further includes limit feeding column, and the limit feeding column is set
It sets between the hoistable platform and the fixed plate, and parallel with the lifting cylinder.
According to another aspect of the present invention, it is multi-thread using diamond described in preceding embodiment that the invention also provides a kind of
The method of cutter device cutting silicon rod, in this method, the swing angleWherein: θxTo cut
Angle at the x of position, θMFor the angle of maximum location of cut, R is boule diameter, and x is the Cutting Length in direction of feed.
In some embodiments of the invention, the rotating part is 0-12 degree in the swing angle of maximum cutting area.
In some embodiments of the invention, the rotating part is 6~12 degree in the swing angle of maximum cutting area.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of diamond Multi-wire cutting device according to an embodiment of the invention.
Fig. 2 is the amplification effect figure of the part Fig. 1 a-quadrant.
Fig. 3 is the relational graph of line bow size and cutting position according to an embodiment of the invention.
Fig. 4 is the relational graph of swing angle and cutting position according to an embodiment of the invention.
Fig. 5 is the nanotopography figure of crystal column surface after cutting according to an embodiment of the invention.
Fig. 6 is wafer TTV according to an embodiment of the invention and warp value.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
The invention discloses a kind of diamond Multi-wire cutting devices, according to an embodiment of the invention, as shown in Figure 1, the gold
Hard rock Multi-wire cutting device includes: fixed plate 10, elevating mechanism 20, wabbler mechanism 30 and pressure detection mechanism 40, wherein described
Elevating mechanism 20 includes lifting cylinder 21 and hoistable platform 22, the lifting cylinder 21 be arranged on the hoistable platform 22 and with
The bottom wall of the fixed plate 10 is connected；
The wabbler mechanism 30 includes fixed part 31, pivot pin 32 and rotating part 33, the fixed part 31 and the rotating part
33 are rotatably attached by the way that pivot pin 32 is opposite, and the fixed part 31 is connected with the bottom wall of the hoistable platform 22, the rotation
The bottom end in portion 33 is suitable for installing crystal bar to be cut；
The pressure detection mechanism 40, including pressure sensor device 41, the setting of pressure sensor device 41 are shaken described
Between swinging mechanism 30 and the elevating mechanism 20, the pressure sensor device 41 can collect the wabbler mechanism 30 in operational process
The pressure value of the line bow of middle perception；
The diamond Multi-wire cutting device of the above embodiment of the present invention has wabbler mechanism as a result, and wabbler mechanism can be with
Different cutting position carry out it is opposite swing, reduce in cutting process initial position and change pair to final end position forced area
The influence of line bow, to be effectively improved angularity.Meanwhile diamond Multi-wire cutting device has pressure detection in above-described embodiment
The size of line bow pressure value is collected in mechanism, the contact that pressure detection mechanism can be bent by wabbler mechanism with line, and then to stablize control
Line bow value processed provides reference frame.Therefore, it may be implemented to keep line using the diamond Multi-wire cutting device of the embodiment of the present invention
Bow is stablized, and yield is improved, and improves warpage, TTV and nanotopography.
The present invention be based on inventors have found that line bow whether it is stable can by the pressure between diamond wire and silicon rod into
Row characterization, i.e., if when pressure remained steady between diamond wire and silicon rod, line bow value also tends towards stability.Therefore, pass through prison
The pressure surveyed between diamond wire and silicon rod can learn whether line bow is stable indirectly, and then can be further by adjusting technique
So that line bow keeps stablizing, improves crystal bar cutting yield, improves warpage, TTV and nanotopography.
In order to more accurately monitor the pressure between diamond wire and silicon rod and carry out pressure compensation, according to the present invention
Embodiment, above-mentioned pressure detection mechanism 40 includes: control processing unit 42, the control processing unit 42 and pressure biography
Induction device 41 is connected, and the control processing unit 42 is connected with the elevating mechanism 20 and/or the wabbler mechanism 30, at control
The pressure value that reason device 42 feeds back the pressure sensor device 41 is analyzed and processed, and further by adjusting the lifting
Mechanism 20 or/and the wabbler mechanism 30 carry out self-compensating pressure.
Specifically, after pressure sensor device 41 is collected into pressure value, pressure value is fed back into control device 42, control dress
It sets 42 to handle by analysis, if discovery line bow pressure value is excessive or too small, command signal is transferred to by control processing unit 42
Elevating mechanism 20, elevating mechanism 20 bend line and carry out self-compensating pressure by the lifting of adjusting lifting cylinder 21；Or at control
Command signal is transferred to wabbler mechanism 30 by reason device 42, and wabbler mechanism 30 waves the rotation angle of rotating part 33 by adjusting,
Line is bent and carries out self-compensating pressure；Or control processing unit 42 sends command signal to elevating mechanism 20 and wobbler simultaneously
Structure 30, elevating mechanism 20 pass through the lifting for adjusting lifting cylinder 21, and wabbler mechanism 30 waves the rotation of rotating part 33 by adjusting
Angle, while realizing the pressure compensation bent to line.Line bow value is stablized, then reel 50 bears to stablize from the pressure of crystal bar,
The damage that stable line bow value can reduce by 50 groove of reel promotes the service life of reel 50.Above-mentioned self-compensating pressure function can
It greatly improves cutting efficiency and does not influence angularity, and the stability of cutting quality can be increased.
According to a particular embodiment of the invention, stable line bow value is 1-3mm.It is made reference as a result, with the normal line bow value,
The practical line bow value being calculated is adjusted, is adjusted to it in stable range, it is possible thereby to significantly improve crystal bar
It cuts yield, improve warpage, TTV and nanotopography.Such as by adding wabbler mechanism and pressure detection device in Fig. 3, not
With cutting position, under different cutting areas, line bow size remains stable.
It should be noted that " line bow value " herein is the minimum point and coiling that the line of diamond wire bends with reference to Fig. 1~2
Take turns the distance of highest point.
According to another aspect of the present invention, it is multi-thread using diamond described in preceding embodiment that the invention also provides a kind of
The method of cutter device cutting silicon rod in this method, controls the swing angle of rotating partWherein: θx
For the angle at cutting position x, θMFor the angle of maximum location of cut, R is boule diameter, and x is cutting in direction of feed
Cut length.
The diamond Multi-wire cutting device cutting silicon rod for using above-described embodiment as a result, waves dress by further controlling
The setting for setting swing angle makes it adjust the swing angle of rocking equipment at any time according to the variation of cutting position, reduces start bit
Set the forced area variation of final end position.And the variation for reducing forced area can effectively improve the situation of line bow,
And the situation of line bow directly influences whether the result of angularity.Therefore, can have by using above-mentioned formula control swing angle
Effect improves angularity and nanotopography, reduces TTV.
In addition, above-mentioned cutting method of the invention, when cutting area increases, swing angle becomes larger, such as Fig. 4 institute
Show, and then the stability of cutting can be increased.Such as crystal bar is measured by adding wabbler mechanism and pressure detection device in Fig. 5
The change value of thickness for cutting wafer obtained adds the face of the wafer of rocking equipment and pressure detection device compared with normal
Color is deeper (more evenly), and color fluctuating is smaller, and pattern thickness is more evenly.It is filled in Fig. 6 by adding wabbler mechanism and pressure detection
It sets, measurement crystal bar cuts the TTV value of wafer obtained and warp (angularity) is tested, and compared with normal, add and waves
The TTV value and warp value of the wafer of device and pressure detection device are reduced.(TTV test method: GB/T29507-2013 silicon
Piece flatness, thickness and total thickness variations test automatic non-contact scanning method；Angularity test method: GB/T32280-2015 silicon
Piece angularity tests automatic non-contact scanning method.)
According to a particular embodiment of the invention, swing angle θ of the rotating part in maximum cutting area in above-mentioned formulaMFor 0-
12 degree, preferably 6-12 degree.
Therefore, the diamond Multi-wire cutting device of the above embodiment of the present invention and cutting method at least have following advantages it
One:
(1) mortar cutting power unstable principal element when reducing multi-wire saw can reduce yield damage when production
It loses.
(2) improve diamond multi-wire saw because with few wave caused by cutting power difference before line sending and loop line of line amount
The problem of shape TTV, and improve nanotopography simultaneously.
(3) self-compensating pressure function can greatly improve cutting efficiency and not influence angularity, and can increase cutting quality
Stability.On the other hand stable line bow represents reel and bears the pressure from diamond-stable, can reduce reel ditch
The damage of slot promotes the service life of reel.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
It can be combined in any suitable manner in a or multiple embodiment or examples.In addition, without conflicting with each other, the technology of this field
The feature of different embodiments or examples described in this specification and different embodiments or examples can be combined by personnel
And combination.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (7)
1. a kind of diamond Multi-wire cutting device characterized by comprising
Fixed plate,
Elevating mechanism, the elevating mechanism include lifting cylinder and hoistable platform, and the lifting cylinder setting is flat in the lifting
It is connected on platform and with the bottom wall of the fixed plate；
Wabbler mechanism, the wabbler mechanism include fixed part, pivot pin and rotating part, and the fixed part and the rotating part pass through axis
Pin is opposite to be rotatably attached, and the fixed part is connected with the bottom wall of the hoistable platform, and the bottom end of the rotating part is suitable for peace
Fill crystal bar to be cut；
Pressure detection mechanism, including pressure sensor device, the pressure sensor device are arranged in the wabbler mechanism and the liter
Between descending mechanism, the pressure sensor device can collect the line bow that the diamond Multi-wire cutting device perceives in the process of running
Pressure value.
2. diamond Multi-wire cutting device according to claim 1, which is characterized in that the pressure detection mechanism includes:
Processing unit is controlled, the control processing unit is connected with the pressure sensor device, the control processing unit and institute
It states elevating mechanism and/or the wabbler mechanism is connected, the pressure that the control processing unit feeds back the pressure sensor device
Value, which is analyzed and processed and passes through, adjusts the elevating mechanism or/and wabbler mechanism progress self-compensating pressure.
3. diamond Multi-wire cutting device according to claim 2, which is characterized in that the stabilization line bow value of line bow is
1-3mm。
4. diamond Multi-wire cutting device according to claim 1, which is characterized in that the elevating mechanism further includes limit
Column is fed, the limit feeding column is arranged between the hoistable platform and the fixed plate, and parallel with the lifting cylinder.
5. a kind of method using the described in any item diamond Multi-wire cutting device cutting silicon rods of claim 1-4, feature
It is, controls the swing angle of the rotating partWherein: θxFor the angle at cutting position x, θM
For the angle of maximum location of cut, R is boule diameter, and x is the Cutting Length in direction of feed.
6. according to the method described in claim 5, it is characterized in that, the rotating part is in the swing angle of maximum cutting area
0-12 degree.
7. according to the method described in claim 5, it is characterized in that, the rotating part is in the swing angle of maximum cutting area
6~12 degree.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910671681.7A CN110370477A (en) | 2019-07-24 | 2019-07-24 | Diamond Multi-wire cutting device and cutting method |
| US17/279,600 US20220134600A1 (en) | 2019-07-24 | 2020-07-24 | Method for cutting silicon rod and apparatus for dimaond multi-wire cutting |
| PCT/CN2020/104070 WO2021013238A1 (en) | 2019-07-24 | 2020-07-24 | Method for cutting silicon rod and diamond multi-wire cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910671681.7A CN110370477A (en) | 2019-07-24 | 2019-07-24 | Diamond Multi-wire cutting device and cutting method |
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| Publication Number | Publication Date |
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| CN110370477A true CN110370477A (en) | 2019-10-25 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910671681.7A Pending CN110370477A (en) | 2019-07-24 | 2019-07-24 | Diamond Multi-wire cutting device and cutting method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111923261A (en) * | 2020-07-17 | 2020-11-13 | 苏州赛万玉山智能科技有限公司 | Control method and control system for cutting crystal bar by diamond wire |
| WO2021013238A1 (en) * | 2019-07-24 | 2021-01-28 | 徐州鑫晶半导体科技有限公司 | Method for cutting silicon rod and diamond multi-wire cutting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202507408U (en) * | 2012-04-05 | 2012-10-31 | 江西金葵能源科技有限公司 | Intelligent device for automatically adjusting speed of cutting silicon pieces with diamond wire |
| CN105382951A (en) * | 2015-12-16 | 2016-03-09 | 哈尔滨秋冠光电科技有限公司 | Sapphire curved surface multi-line cutting method and device thereof |
| CN207373492U (en) * | 2017-11-06 | 2018-05-18 | 福建北电新材料科技有限公司 | A kind of cutting mechanism for improving carborundum crystal bar cutting quality |
| CN108608591A (en) * | 2016-12-12 | 2018-10-02 | 上海新昇半导体科技有限公司 | Improve the System of HS-WEDM of crystal column surface cutting pattern |
| CN210732873U (en) * | 2019-07-24 | 2020-06-12 | 徐州鑫晶半导体科技有限公司 | Diamond multi-wire cutting device |
-
2019
- 2019-07-24 CN CN201910671681.7A patent/CN110370477A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202507408U (en) * | 2012-04-05 | 2012-10-31 | 江西金葵能源科技有限公司 | Intelligent device for automatically adjusting speed of cutting silicon pieces with diamond wire |
| CN105382951A (en) * | 2015-12-16 | 2016-03-09 | 哈尔滨秋冠光电科技有限公司 | Sapphire curved surface multi-line cutting method and device thereof |
| CN108608591A (en) * | 2016-12-12 | 2018-10-02 | 上海新昇半导体科技有限公司 | Improve the System of HS-WEDM of crystal column surface cutting pattern |
| CN207373492U (en) * | 2017-11-06 | 2018-05-18 | 福建北电新材料科技有限公司 | A kind of cutting mechanism for improving carborundum crystal bar cutting quality |
| CN210732873U (en) * | 2019-07-24 | 2020-06-12 | 徐州鑫晶半导体科技有限公司 | Diamond multi-wire cutting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021013238A1 (en) * | 2019-07-24 | 2021-01-28 | 徐州鑫晶半导体科技有限公司 | Method for cutting silicon rod and diamond multi-wire cutting device |
| CN111923261A (en) * | 2020-07-17 | 2020-11-13 | 苏州赛万玉山智能科技有限公司 | Control method and control system for cutting crystal bar by diamond wire |
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