CN210603349U - Pneumatic sensor adopting COB (chip on board) process design - Google Patents

Pneumatic sensor adopting COB (chip on board) process design Download PDF

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Publication number
CN210603349U
CN210603349U CN201921835587.2U CN201921835587U CN210603349U CN 210603349 U CN210603349 U CN 210603349U CN 201921835587 U CN201921835587 U CN 201921835587U CN 210603349 U CN210603349 U CN 210603349U
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nmos
asic
back plate
output
shell
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CN201921835587.2U
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Chinese (zh)
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崔明
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Dongguan YEJIA Electronic Technology Co.,Ltd.
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Guangdong Yejia Acoustic Technology Co Ltd
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Abstract

The utility model discloses an adopt pneumatic sensor of COB process design comprises shell, back plate, gasket, cavity, vibrating diaphragm, ASIC piece, NMOS piece, electric capacity and the circuit board that from the top down set gradually, first through-hole has been seted up at the top middle part of shell, the back plate supports the top of solid at the shell intracavity. The utility model discloses, the welding has an ASIC chip (wafer bare chip), a high-power NMOS (wafer bare chip) and an electric capacity on the PCBA of adoption COB technology design. The ASIC and the NMOS are bonded by gold wires, the ASIC is responsible for the logic processing of signals, and the load output is completely output by the NMOS. Certainly, when the output pin of the ASIC is at a high level, the NMOS is turned on to output, otherwise, the NMOS is turned off to output, so that the pneumatic sensor can be finally increased to 6A current output from the original 3A current, the size of the sensor can be reduced, the sensor can be smaller, and the problems of small output power, low customization and single function in the prior art are solved.

Description

Pneumatic sensor adopting COB (chip on board) process design
Technical Field
The utility model relates to an electron cigarette sensor technical field specifically is an adopt COB technological design's pneumatic sensor.
Background
The existing electronic cigarette sensor in the market is usually integrated with an ASIC (application specific integrated circuit) special chip, can realize signal acquisition and processing and low-power (less than 3A) heating load output, and is mainly used for disposable electronic cigarettes. The obvious disadvantages are small output power, low customization and single function.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an adopt pneumatic sensor of COB technology design, improved output, can promote to 6A current output by original 3A electric current to still can reduce the volume of sensor, can make it smaller and more exquisite, it is little to have solved prior art output, and customizable is low, the problem of function singleness.
In order to achieve the above object, the utility model provides a following technical scheme: a pneumatic sensor designed by a COB process comprises a shell, a back plate, a gasket, a cavity, a vibrating diaphragm, an ASIC sheet, an NMOS sheet, a capacitor and a circuit board which are sequentially arranged from top to bottom, wherein the middle part of the top of the shell is provided with a first through hole, the back plate is propped against the top in the cavity of the shell, the surface of the back plate is provided with a second through hole communicated with the first through hole, the cavity is sleeved on the inner side of the shell and corresponds to the lower part of the back plate, the gasket is propped against between the back plate and the cavity, the bottom of the shell far away from the first through hole is through, a hook fastener is integrally formed on the inner side of the through end, the inner side of the hook fastener is buckled with the edge bottom of the circuit board, the vibrating diaphragm is sleeved on the inner side of the cavity, the top of the vibrating diaphragm is propped against the bottom of the back plate, the bottom of the vibrating diaphragm is propped against the top, and the ASIC sheet and the NMOS sheet are bound through a gold wire, and the capacitor is packaged at the top of the circuit board.
Preferably, the top of the housing is covered and connected with a dust screen covering the first through hole.
Preferably, the number of the second through holes formed in the back plate is not less than 3.
Preferably, the capacitor is a 0402-104 patch capacitor.
Preferably, the gasket is annular.
Compared with the prior art, the beneficial effects of the utility model are as follows: sensor inside contains a PCBA among the prior art, and the welding has an ASIC chip (sot23-5 encapsulation) and an electric capacity (0402 encapsulation) on this PCBA usually, and ASIC chip and the responsible signal processing are responsible for control load output again here, and the utility model discloses, then the welding has an ASIC chip (wafer bare chip), a high-power NMOS (wafer bare chip) and an electric capacity on the PCBA who adopts COB technology design. The ASIC and the NMOS are bonded by gold wires, the ASIC is responsible for the logic processing of signals, and the load output is completely output by the NMOS. Certainly, when the output pin of the ASIC is at a high level, the NMOS is turned on to output, otherwise, the NMOS is turned off to output, compared with the prior art, the pneumatic sensor in the scheme can be increased to 6A current output from the original 3A current, the size of the sensor can be reduced, the sensor is smaller, and the problems of small output power, low customization and single function in the prior art are solved.
Drawings
Fig. 1 is a schematic structural view of a sensor according to the present invention in a perspective view after disassembly;
fig. 2 is a schematic structural diagram of a cross-sectional view of an assembled front view of the sensor of the present invention.
In the figure: 1-shell, 2-back plate, 3-gasket, 4-cavity, 5-vibrating diaphragm, 6-ASIC sheet, 7-NMOS sheet, 8-capacitor, 9-circuit board, 10-first through hole, 11-second through hole, 12-hook buckle, 13-encapsulating glue, 14-gold thread and 15-dustproof net.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 2, the present invention provides a technical solution: a pneumatic sensor designed by a COB process comprises a shell 1, a back plate 2, a gasket 3, a cavity 4, a vibrating diaphragm 5, an ASIC sheet 6, an NMOS sheet 7, a capacitor 8 and a circuit board 9 which are sequentially arranged from top to bottom, wherein a first through hole 10 is formed in the middle of the top of the shell 1, a dust screen 15 covering the first through hole 10 is connected to the top of the shell 1 in a covering manner, specifically, the shell can be fixed by screws or bonding, the function is to prevent particles in smoke from entering electronic components in the smoke, the back plate 2 is fixedly propped against the top in the cavity of the shell 1, a second through hole 11 communicated with the first through hole 10 is formed in the surface of the back plate 2, the number of the second through holes 11 is not less than 3, the conduction between the sensor and an electronic cigarette channel is realized through the first through hole 10 and the second through hole 11, the cavity 4 is sleeved on the inner side of the shell 1 and corresponds to the lower part of the back plate, the gasket 3 is supported and fixed between the back plate 2 and the cavity 4, the gasket 3 is in a hollow ring shape, the bottom of the shell 1 far away from the first through hole 10 is through, and a hook buckle 12 is integrally formed at the inner side of the through end, the inner side of the hook buckle 12 is buckled with the bottom of the edge of the circuit board 9, the circuit board 9 is convenient to disassemble and assemble in a buckling mode, the vibrating diaphragm 5 is sleeved at the inner side of the cavity 4, the top of the vibrating diaphragm is propped against the bottom of the back plate 2, the bottom of the ASIC chip is pressed against the top of the circuit board 9, the ASIC chip 6 and the NMOS chip 7 are encapsulated on the top of the circuit board 9 through encapsulating glue 13, and the ASIC chip 6 and the NMOS chip 7 are bound through a gold wire 14, the ASIC is responsible for the logic processing of signals, the load output is completely based on the NMOS output, and when the output pin of the ASIC is high level, the NMOS is turned on to output, otherwise, the NMOS is turned off to output, the capacitor 8 is packaged at the top of the circuit board 9, and the capacitor 8 adopts 0402-104 chip capacitor.
Compared with the ASIC chip in the prior art, the pneumatic sensor is responsible for signal processing and load output control, the ASIC is responsible for signal logic processing, the load output is completely output by NMOS, the pneumatic sensor can be increased from the original 3A current to 6A current output, the size of the sensor can be reduced, the pneumatic sensor is smaller, and the problems of small output power, low customization and single function in the prior art are solved.
The working principle is as follows: this adopt pneumatic sensor of COB technology design, the PCBA that adopts COB technology design has welded an ASIC chip (wafer bare chip), a high-power NMOS (wafer bare chip) and a electric capacity. The ASIC and the NMOS are bonded by gold wires, the ASIC is responsible for the logic processing of signals, the load output is completely output by the NMOS and can be increased to 6A current output from the original 3A current, and the size of the sensor can be reduced, so that the sensor is smaller.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides an adopt pneumatic sensor of COB technology design, comprises from the top down shell (1), back plate (2), gasket (3), cavity (4), vibrating diaphragm (5), ASIC piece (6), NMOS piece (7), electric capacity (8) and circuit board (9) that set gradually, its characterized in that: the middle part of the top of the shell (1) is provided with a first through hole (10), the back plate (2) is fixedly propped against the top in the cavity of the shell (1), the surface of the back plate is provided with a second through hole (11) communicated with the first through hole (10), the cavity (4) is sleeved on the inner side of the shell (1) and corresponds to the lower part of the back plate (2), the gasket (3) is fixedly propped between the back plate (2) and the cavity (4), the bottom of the shell (1) far away from the first through hole (10) is through, a hook buckle (12) is integrally formed on the inner side of the through end, the inner side of the hook buckle (12) is buckled with the bottom of the edge of the circuit board (9), the vibrating diaphragm (5) is sleeved on the inner side of the cavity (4) and the top of the back plate (2) is propped against the bottom of the back plate, the bottom of the vibrating diaphragm is propped against the top of the circuit board (9), the ASIC (6) and the NMOS (7) are both encapsulated by encapsulating glue (, and the ASIC sheet (6) and the NMOS sheet (7) are bound through a gold wire (14), and the capacitor (8) is packaged on the top of the circuit board (9).
2. The pneumatic sensor designed by the COB process of claim 1, wherein: the top of the shell (1) is connected with a dust screen (15) which covers the first through hole (10).
3. The pneumatic sensor designed by the COB process of claim 1, wherein: the number of the second through holes (11) formed in the back plate (2) is not less than 3.
4. The pneumatic sensor designed by the COB process of claim 1, wherein: the capacitor (8) adopts a 0402-104 patch capacitor.
5. The pneumatic sensor designed by the COB process of claim 1, wherein: the gasket (3) is annular.
CN201921835587.2U 2019-10-29 2019-10-29 Pneumatic sensor adopting COB (chip on board) process design Active CN210603349U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921835587.2U CN210603349U (en) 2019-10-29 2019-10-29 Pneumatic sensor adopting COB (chip on board) process design

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921835587.2U CN210603349U (en) 2019-10-29 2019-10-29 Pneumatic sensor adopting COB (chip on board) process design

Publications (1)

Publication Number Publication Date
CN210603349U true CN210603349U (en) 2020-05-22

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Application Number Title Priority Date Filing Date
CN201921835587.2U Active CN210603349U (en) 2019-10-29 2019-10-29 Pneumatic sensor adopting COB (chip on board) process design

Country Status (1)

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CN (1) CN210603349U (en)

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Effective date of registration: 20200918

Address after: 523710 Guangdong Province, Dongguan city Tangxia town Longbei Village Dragon Po Road 2 building B

Patentee after: Dongguan YEJIA Electronic Technology Co.,Ltd.

Address before: 523710 6th floor, building B, No.2 Longpu Road, longbeiling village, Tangxia Town, Dongguan City, Guangdong Province

Patentee before: Guangdong Yejia Acoustic Technology Co.,Ltd.