CN210596303U - PCB gold plating groove anode assembly - Google Patents
PCB gold plating groove anode assembly Download PDFInfo
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- CN210596303U CN210596303U CN201921169809.1U CN201921169809U CN210596303U CN 210596303 U CN210596303 U CN 210596303U CN 201921169809 U CN201921169809 U CN 201921169809U CN 210596303 U CN210596303 U CN 210596303U
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Abstract
The utility model relates to an anode component of a PCB gold plating groove, which relates to the technical field of electroplating devices and comprises an electroplating groove, an anode platinum net group is arranged in the electroplating bath, a separation component is arranged on the anode platinum net group, the separation component separates the anode platinum net group into a plurality of secondary anode platinum nets, a fixing component is arranged in the electroplating bath, the secondary anode platinum nets are fixed with the electroplating bath through the fixing component, the anode platinum net group and the independent secondary anode platinum net are arranged, so that the current and voltage on the secondary anode platinum net can be conveniently adjusted, when the thicknesses of the plating layers of the PCB are different, the corresponding thickness of the plating layer of the PCB is correspondingly formed by adjusting the current and the voltage on the corresponding secondary anode platinum net, the electroplating effect is good, meanwhile, the secondary anode platinum nets are convenient to fix by arranging the fixing component, and the adjacent secondary anode platinum nets are prevented from being in series leakage by arranging the separation component.
Description
Technical Field
The utility model belongs to the technical field of electroplate device technique and specifically relates to a PCB gilding groove positive pole subassembly is related to.
Background
In the surface treatment process of the PCB, the procedures of pickling, full-plate copper electroplating, pattern transfer, acid oil removal, secondary countercurrent rinsing, microetching, secondary pickling, tinning, secondary countercurrent rinsing, gold acid, pattern copper electroplating, secondary countercurrent rinsing, nickel plating, secondary washing, citric acid leaching, gold plating, recovery, 2-3 grade pure water washing, drying and the like are required to be carried out in sequence, wherein most of the procedures need to be finished in electroplating baths, different electroplating baths are often stored in different electroplating baths, and therefore the PCB needs to be frequently transferred among the electroplating baths. And the gold finger part of the PCB needs to be plated with gold in order to strengthen the conductivity.
However, the above-described technique has the following drawbacks: the PCB board floating frame can be provided with a plurality of PCB boards, the gold fingers of different PCB boards have different requirements on the gold plating thickness, the direct current and the voltage of the electroplating of the technology are the same, the thickness of the electroplated gold layer is the same, and extra cost is generated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a PCB gilding groove positive pole subassembly electroplates effectually, is convenient for control cladding material thickness's advantage.
The above object of the present invention can be achieved by the following technical solutions: an anode assembly of a PCB gold plating groove comprises a plating groove, wherein an anode platinum net group is arranged in the plating groove, a separation assembly is arranged on the anode platinum net group, the anode platinum net group is separated into a plurality of secondary anode platinum nets by the separation assembly, a fixing assembly is arranged in the plating groove, and the secondary anode platinum nets are fixed with the plating groove through the fixing assembly.
Implement above-mentioned technical scheme, it sets up solitary secondary positive pole platinum net through setting up positive pole platinum net group, be convenient for adjust the current-voltage on the secondary positive pole platinum net, it is different at PCB board cladding material thickness, correspond through the current-voltage on the secondary positive pole platinum net that the adjustment corresponds and form corresponding PCB cladding material thickness, it is effectual to electroplate, set up fixed subassembly simultaneously and be convenient for fixed secondary positive pole platinum net, it avoids adjacent secondary positive pole platinum net to take place the electric leakage and establishes ties to set up the partition subassembly.
The utility model discloses further set up to: the fixing assembly comprises a hanging rail erected on the electroplating bath, a plurality of inverted U-shaped hanging plates are arranged on the hanging rail, and the secondary anode platinum net is fixed with the lower ends of the hanging plates.
By implementing the technical scheme, the hanging rail is arranged to be convenient for fixing on the electroplating bath, and meanwhile, the U-shaped hanging plate is convenient for fixing the secondary anode platinum net at the lower end.
The utility model discloses further set up to: the top end of the hanging plate is provided with an inverted U-shaped lifting hasp.
Implement above-mentioned technical scheme, be equipped with the lift hasp of "U" shape and be convenient for lift the hitch plate together with secondary positive pole platinum net, be convenient for change secondary positive pole platinum net.
The utility model discloses further set up to: each hanging rail is provided with 6 secondary anode platinum nets, 3 rectifiers are correspondingly arranged in the side wall of the electroplating bath, and 2 secondary anode platinum nets are connected in series on the corresponding rectifiers.
By implementing the technical scheme, 6 secondary anode platinum nets are arranged, and 2 secondary anode platinum nets are compiled into a group and connected in series on an independent rectifier, so that the current and voltage of the 2 secondary anode platinum nets can be conveniently adjusted, and the thickness of different PCB (printed circuit board) gold fingers can be conveniently adjusted.
The utility model discloses further set up to: the separation component comprises 2 plastic isolation blocks arranged on the hanging rail, and the plastic isolation blocks are distributed among gaps of the secondary anode platinum nets connected with the secondary ballasts.
By implementing the technical scheme, the 2 plastic isolation blocks divide the 6 secondary anode platinum nets into three areas, so that electric leakage among the secondary anode platinum nets is avoided.
The utility model discloses further set up to: the side wall of the electroplating bath is provided with a plurality of plastic clamping frames, and the hanging connection rail is in lap joint with the plastic clamping frames.
Implement above-mentioned technical scheme, set up plastics joint frame, it is firm to be convenient for fix the articulated rail. The slipping of the hanging rail is reduced.
The utility model discloses further set up to: the end parts of the two ends of the hanging and connecting rail are provided with positioning bolts which are horizontally arranged, and the positioning bolts are abutted to the plastic clamping frame.
Implement above-mentioned technical scheme, set up positioning bolt and be convenient for through positioning bolt and plastics joint frame joint, be convenient for fixed plastics joint frame reduces rocking of plastics joint frame.
The utility model discloses further set up to: the hanging rail on the electroplating bath and the corresponding anode platinum net group are provided with 4, wherein 2 are positioned in the middle of the electroplating bath and divide the electroplating bath into 2 independent electroplating areas.
By implementing the technical scheme, the 4 anode platinum net groups are arranged to separate the electroplating bath into 2 independent electroplating areas, so that the number of the PCB boards to be electroplated at one time is increased, and the production efficiency is increased.
To sum up, the utility model discloses a beneficial technological effect does:
1. the utility model discloses an anode component of a PCB gold plating groove, which comprises a plating groove, wherein an anode platinum net group is arranged in the plating groove, the anode platinum net group is provided with a separation component which separates the anode platinum net group into a plurality of secondary anode platinum nets, a fixing component is arranged in the electroplating bath, the secondary anode platinum net is fixed with the electroplating bath through the fixing component, the anode platinum net group and the independent secondary anode platinum net are arranged, so that the current and voltage on the secondary anode platinum net can be conveniently adjusted, when the thicknesses of the plating layers of the PCB are different, the corresponding thickness of the plating layer of the PCB is correspondingly formed by adjusting the current and the voltage on the corresponding secondary anode platinum net, the electroplating effect is good, meanwhile, the fixing component is arranged to facilitate the fixation of the secondary anode platinum nets, and the separation component is arranged to prevent the adjacent secondary anode platinum nets from being in series leakage;
2. arranging 6 secondary anode platinum nets, and weaving 2 secondary anode platinum nets into a group which is connected in series on a single rectifier, so that the current and voltage of the 2 secondary anode platinum nets can be conveniently adjusted, and the thickness of different PCB plate gold fingers can be conveniently adjusted;
3. through setting up 4 positive pole platinum net groups, separate the plating bath into 2 independent electroplating districts, increase the quantity of the PCB board of disposable electroplating, increase production efficiency.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a partially enlarged schematic view of a portion a in fig. 1.
In the figure: 1. an electroplating bath; 2. an anode platinum mesh group; 3. a partition assembly; 4. a secondary anode platinum mesh; 5. a fixing assembly; 6. an electroplating area; 7. hanging and connecting a rail; 8. a hanging plate; 9. lifting hasps; 10. positioning the bolt; 11. a plastic clamping frame; 12. a rectifier; 13. a plastic spacer block.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, for the advantages of the anode assembly of the gold plating bath for PCB of the present invention, the electroplating effect is good, and the plating thickness is convenient to control, including an electroplating bath 1, the electroplating bath 1 contains electroplating solution, an anode platinum net set 2 is provided in the electroplating bath 1, a separation component 3 is provided on the anode platinum net set 2, the separation component 3 divides the anode platinum net set 2 into a plurality of secondary anode platinum nets 4, a fixing component 5 is provided in the electroplating bath 1, the secondary anode platinum nets 4 are fixed with the electroplating bath 1 through the fixing component 5, a hanging rail 7 on the electroplating bath 1 and the corresponding anode platinum net set 2 are provided with 4, 2 of them are located in the middle of the electroplating bath 1 and divide the electroplating bath 1 into 2 independent electroplating zones 6, the electroplating bath 1 is divided into 2 independent electroplating zones 6 by providing 4 anode platinum net sets 2, the number of the PCB plates for one-time electroplating is increased, increase production efficiency, it is through setting up positive pole platinum net group 2, set up solitary secondary positive pole platinum net 4, be convenient for adjust the current-voltage on the secondary positive pole platinum net 4, it is different at PCB board cladding material thickness, current-voltage on the secondary positive pole platinum net 4 that corresponds through the adjustment corresponds and forms corresponding PCB cladding material thickness, it is effectual to electroplate, it is convenient for fixed secondary positive pole platinum net 4 to set up fixed subassembly 5 simultaneously, it avoids adjacent secondary positive pole platinum net 4 to take place the electric leakage and establishes ties to set up partition subassembly 3.
Referring to fig. 1 and 2, a fixing component 5 is arranged to facilitate fixing of a secondary anode platinum mesh 4 and formation of an anode platinum mesh group 2, the fixing component 5 comprises a hanging rail 7 erected on an electroplating bath 1, a plurality of inverted U-shaped hanging plates 8 are arranged on the hanging rail 7, the secondary anode platinum mesh 4 is fixed with the lower ends of the hanging plates 8, and an inverted U-shaped lifting hasp 9 is arranged at the top ends of the hanging plates 8, so that the hanging rail 7 is arranged to be conveniently fixed on the electroplating bath 1, meanwhile, the U-shaped hanging plates 8 facilitate fixing of the secondary anode platinum mesh 4 at the lower ends, the inverted U-shaped lifting hasp 9 is arranged to facilitate lifting up the hanging plates 8 together with the secondary anode platinum mesh 4 and facilitate replacement of the secondary anode platinum mesh 4, meanwhile, a plurality of plastic clamping frames 11 are arranged on the side wall of the electroplating bath 1, the hanging rails 7 are in lap joint with the plastic clamping frames 11, and positioning bolts 10 horizontally arranged at the two end parts of the hanging rails 7, the positioning bolt 10 is abutted against the plastic clamping frame 11, and the plastic clamping frame 11 is arranged, so that the hanging rail 7 is fixed firmly. The slipping of the hanging rail 7 is reduced, the positioning bolt 10 is convenient to be clamped with the plastic clamping frame 11 through the positioning bolt 10, the plastic clamping frame 11 is convenient to fix, and the shaking of the plastic clamping frame 11 is reduced.
Referring to fig. 1 and 2, each hanging rail 7 is provided with 6 secondary anode platinum nets 4, 3 rectifiers 12 are correspondingly arranged in the side wall of the electroplating bath 1, 42 secondary anode platinum nets are connected in series on the corresponding rectifiers 12 in a group, 6 secondary anode platinum nets 4 are arranged, and 2 secondary anode platinum nets 4 are grouped into a group and connected in series on a single rectifier 12, so that the current and voltage of the 2 secondary anode platinum nets 4 can be conveniently adjusted, the thickness of different PCB panel gold fingers can be conveniently adjusted, the electroplating consumption of gold can be saved, correspondingly, the partition component 3 comprises 2 plastic partition blocks 13 arranged on the hanging rail 7, the plastic partition blocks 13 are distributed among the gaps of the secondary anode platinum nets 4 connected by different ballasts, the 6 secondary anode platinum nets 4 are partitioned into three areas by the 2 plastic partition blocks 13, the electroplating can be conveniently carried out, the electric leakage between the secondary anode platinum nets 4 is avoided.
Working process (principle): the utility model discloses a PCB gold plating groove anode component, which comprises a plating groove 1, wherein an anode platinum net group 2 is arranged in the plating groove 1, a separation component 3 is arranged on the anode platinum net group 2, the separation component 3 divides the anode platinum net group 2 into a plurality of secondary anode platinum nets 4, a fixing component 5 is arranged in the plating groove 1, the secondary anode platinum nets 4 are fixed with the plating groove 1 through the fixing component 5, the anode platinum net group 2 and the independent secondary anode platinum net 4 are arranged, so that the current and voltage on the secondary anode platinum net 4 can be conveniently adjusted, when the thicknesses of the plating layers of the PCB boards are different, the corresponding thickness of the PCB plating layer is correspondingly formed by adjusting the current and the voltage on the corresponding secondary anode platinum net 4, the electroplating effect is good, meanwhile, the fixing component 5 is arranged to facilitate fixing of the secondary anode platinum mesh 4, and the separation component 3 is arranged to prevent the adjacent secondary anode platinum meshes 4 from being in series leakage.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (8)
1. A PCB gold plating groove anode assembly comprises a plating groove (1) and is characterized in that: the electroplating bath is characterized in that an anode platinum net group (2) is arranged in the electroplating bath (1), a separation component (3) is arranged on the anode platinum net group (2), the anode platinum net group (2) is separated into a plurality of secondary anode platinum nets (4) by the separation component (3), a fixing component (5) is arranged in the electroplating bath (1), and the secondary anode platinum nets (4) are fixed with the electroplating bath (1) through the fixing component (5).
2. A PCB gold plated slot anode assembly according to claim 1, wherein: the fixing assembly (5) comprises a hanging rail (7) erected on the electroplating bath (1), a plurality of inverted U-shaped hanging plates (8) are arranged on the hanging rail (7), and the secondary anode platinum mesh (4) is fixed with the lower ends of the hanging plates (8).
3. A PCB gold plated slot anode assembly according to claim 2, wherein: the top end of the hanging plate (8) is provided with an inverted U-shaped lifting hasp (9).
4. A PCB gold plated slot anode assembly according to claim 3, wherein: each hanging rail (7) is provided with 6 secondary anode platinum nets (4), the side wall of the electroplating bath (1) is internally and correspondingly provided with 3 rectifiers (12), and 2 secondary anode platinum nets (4) are connected in series on the corresponding rectifiers (12).
5. A PCB gold plated slot anode assembly according to claim 4, wherein: the separation component (3) comprises 2 plastic isolation blocks (13) arranged on the hanging rail (7), and the plastic isolation blocks (13) are distributed among gaps of the secondary anode platinum nets (4) connected with the rectifiers (12).
6. A PCB gold plated slot anode assembly according to claim 5, wherein: the side wall of the electroplating bath (1) is provided with a plurality of plastic clamping frames (11), and the hanging connection rail (7) is in lap joint with the plastic clamping frames (11).
7. A PCB gold plated slot anode assembly as claimed in claim 6, wherein: hang joint rail (7) both ends tip and be equipped with positioning bolt (10) that the level set up, positioning bolt (10) with plastics joint frame (11) butt.
8. A PCB gold plated slot anode assembly according to claim 7, wherein: the hanging rail (7) on the electroplating bath (1) and the corresponding anode platinum net group (2) are provided with 4, wherein 2 are positioned in the middle of the electroplating bath (1) and divide the electroplating bath (1) into 2 independent electroplating areas (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921169809.1U CN210596303U (en) | 2019-07-23 | 2019-07-23 | PCB gold plating groove anode assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921169809.1U CN210596303U (en) | 2019-07-23 | 2019-07-23 | PCB gold plating groove anode assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210596303U true CN210596303U (en) | 2020-05-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921169809.1U Active CN210596303U (en) | 2019-07-23 | 2019-07-23 | PCB gold plating groove anode assembly |
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| Country | Link |
|---|---|
| CN (1) | CN210596303U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114016115A (en) * | 2021-12-16 | 2022-02-08 | 昆山硕凯自动化科技有限公司 | Miniature precious metal continuous selective plating tank |
-
2019
- 2019-07-23 CN CN201921169809.1U patent/CN210596303U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114016115A (en) * | 2021-12-16 | 2022-02-08 | 昆山硕凯自动化科技有限公司 | Miniature precious metal continuous selective plating tank |
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