CN210524171U

CN210524171U - Substrate dividing device

Info

Publication number: CN210524171U
Application number: CN201921234275.6U
Authority: CN
Inventors: 白井明
Original assignee: Shirai Tech Ltd
Current assignee: Shirai Tech Ltd
Priority date: 2018-09-13
Filing date: 2019-07-31
Publication date: 2020-05-15
Anticipated expiration: 2029-07-31
Also published as: TWM584535U; JP3219034U

Abstract

The utility model provides a cutting device of base plate possesses: a first moving body that moves back and forth; a first step which ascends and descends on the lower surface side of the first moving body and rotatably holds the substrate on the lower surface; a second moving body that moves back and forth in the left-right direction below the moving path of the first step; a cutter which is arranged on the second moving body and can freely cut the lower glass plate of the substrate in a lifting way; a third moving body that moves back and forth in the front-rear direction in front of the forward stop position of the first step; a second stage rotatably receiving the substrate holding the first stage thereon on an upper surface side of the third moving body; a fourth moving body moving back and forth in the left and right directions on the upper side of the moving path of the second step; and a laser device for cutting the upper film of the substrate from the upper surface side while freely moving up and down on the fourth moving body.

Description

Substrate dividing device

Technical Field

The utility model relates to a cut apart into device of goods size with organic EL base plate.

Background

A conventional liquid crystal substrate (panel) is formed by bonding two glass substrates.

When the liquid crystal substrate is divided (cut) into product sizes, a cutting line is cut on the glass plate on the a-plane by the cutter, and a cutting line is cut on the glass plate on the B-plane by the cutter.

The cutting lines of the above-described cutting are sequentially subjected to a cutting process (see, for example, patent document 1).

[ background Art document ]

Patent document 1: japanese patent No. third 969992.

SUMMERY OF THE UTILITY MODEL

[ problems to be solved by the present invention ]

In addition to liquid crystal substrates, organic EL substrates (panels) composed of a glass substrate and a film provided on one surface of the glass substrate (multi-layer film formation) have also been used as display devices in recent years.

When the multilayer film constituting the organic EL is cut with a wheel-shaped cutter, the processing quality of the cut edge is poor. Further, when the cutting is performed with a cutter, the cutting quality of the cutter is deteriorated (due to wear of the edge) in a short time, the cutting is not smooth, the quality of the cut edge is deteriorated, and a defective product is generated in some cases.

Accordingly, the present invention provides a cutting device for a substrate such as an organic EL substrate, which solves the above problems.

[ means for solving the problems ]

In order to solve the above problem, the present invention provides a substrate dividing apparatus, comprising:

a first moving body that is guided by the front-rear direction guide device and moves back and forth by the first moving device;

a first stage which can be lifted by a lifting device on the lower surface side of the first moving body, can be rotated by 90 degrees by a rotating device, and has a suction holding function of receiving and holding a supply substrate on the lower surface;

a second moving body which is guided by the left-right direction guide device to move under the moving path of the first step and moves back and forth by the second moving device;

a cutter which is arranged in parallel to the left and right of the second moving body, is capable of adjusting position, is lifted and lowered by a lifting device, and is used for cutting the lower surface side of the lower glass plate forming the substrate;

a third moving body which is guided by another front-rear direction guide device between right below and forward of the forward stop position of the first step and which is movable back and forth by a third moving device;

a second step which can rotate 90 DEG on the upper surface side of the third moving body by a rotating device and has a sucking and holding function for receiving and holding the substrate on the upper surface;

a fourth moving body that is guided by the left-right guide device to move on the upper side of the moving path of the second step, and that moves back and forth by the fourth moving device; and

and a laser device which is arranged on the left and right sides of the fourth movable body and is capable of adjusting position, and which is respectively lifted and lowered by a lifting device, and which cuts the upper film constituting the substrate from the upper surface side.

[ efficacy of the utility model ]

As described above, according to the substrate dividing apparatus of the present invention, after the first moving body is retreated and stopped right above the supplied substrate, the first step is lowered by the elevating device, and after the substrate is received and sucked and held on the lower surface of the first step, the first step and the substrate are moved to the front side together.

At this time, the lower glass of the substrate is cut by the parallel cutters of the second moving body, and when the cutter moves back and forth on the first step, the first step is rotated by 90 ° by the rotating device, and at the same time, a rectangular cutting line (or a special-shaped cutting line) is cut on the lower glass.

When the cutting of the substrate is completed and the first table is kept to advance and stop, the first table is lowered on the second table which is stopped to retreat by virtue of the lifting device under the first table, and the substrate is received on the second table and is sucked and kept.

Then, the second step and the substrate are moved forward together, the upper film of the substrate is cut by the parallel laser device of the fourth moving body during the movement, and when the second step moves back and forth, the second step is rotated by 90 degrees by the rotating device, and the upper film is cut into a rectangular shape (or a special-shaped cutting line can be drawn).

Therefore, the glass cutting and the film cutting can be efficiently and smoothly performed on a single line, and the first step and the second step are arranged up and down, so that the glass cutting and the film cutting can be performed without turning the substrate.

Drawings

Fig. 1 is a side view showing an embodiment of the present invention.

Fig. 2 is a plan view showing the essential part as above.

Fig. 3 is a partially enlarged front view of the same.

Fig. 4 is an enlarged side view showing a cut portion of the cutter.

Fig. 5 is an enlarged side view showing a cut portion of the laser device.

Fig. 6 is a partially omitted plan view of the substrate divided into rectangles.

Fig. 7 is a partially omitted plan view of the substrate divided into the irregular shapes.

Description of reference numerals: A. a ', a "' … guide; b … a first mobile device; b' … second moving means; b "… third mobile device; b' "… fourth mobile device; c … first moving body; c' … second mobile body; c "… third mobile; c' "… fourth mobile; d … first step; an E … cutter; h … second step; a K … laser device; a P … camera; an X … substrate; a Y … glass plate; a Z … film; 1 … horizontal bar; 2 … orbit; 3 … slide; 4 … male screws; 5 … a motor; 6 … female screw; 7 … a rotating device; 8 … lifting device; 9 … suction holding function; 10 … hollow box; 11 … conveyor belt; 12 … seat material; 13 … orbit; 14 … a substrate; 15 … slide; 16 … male screws; 17 … female screws; an 18 … motor; 19 … orbit; 20 … a slide table; 21 … slide; 22 … longitudinally; 23 … lifting device; 24 … a substrate; 60 … cutting lines; 61 … special-shaped cutting lines; 63 … the lines are cut.

Detailed Description

Next, an embodiment of the present invention will be described with reference to the drawings.

As shown in fig. 1 to 5, the first mobile body C is moved and guided by the front-rear direction guide device a and moved back and forth by the first moving device B.

As shown in fig. 1, the guide device a and the first moving device B for moving the first moving body C back and forth are configured by a horizontal member 1 having both ends facing in the front-rear direction and rails 2 provided over the entire length of both side edges of the horizontal member 1, and the first moving body C is slid in the front-rear direction by slidably engaging the sliders 3 on both side edges of the upper edge of the first moving body C with the rails 2.

In the illustrated embodiment, the first moving device B for moving the first moving body C is composed of a motor 5 and a female screw 6, the motor 5 reversibly drives a male screw 4, the male screw 4 is supported at both ends of the horizontal member 1, the female screw 6 is attached to the first moving body C and is screwed with the male screw 4, and the first moving body C is moved back and forth by operating the motor 5.

Further, a first step D is provided on the lower surface side of the first moving body C, rotated by 90 ° by a rotating device 7 such as a motor, and lifted by a lifting device 8 such as a cylinder, and has a suction holding function 9 for holding the substrate X on the lower surface.

In the illustrated case, the first step D is a flat hollow box 10, and the substrate X is sucked and held under the bottom wall of the hollow box 10 by sucking the inside of the hollow box 10 and by using a plurality of small holes of the sucking and holding function 9 provided in the bottom wall of the hollow box 10.

As shown in fig. 6 and 7, the organic EL substrate X is configured by laminating a glass plate Y on the lower side and a multilayer film Z on the upper side of the glass plate Y.

As shown in fig. 1, when the substrate X carried in by the conveyor 11 stops, the first stage D is lowered by the lifter 8, and then the hollow box 10 (through the suction hose connected to the inside of the hollow box 10) is sucked, held, and received under the hollow box 10 of the first stage D.

A cutter E is provided below the moving path of the first step D to cut the lower surface of a glass plate Y constituting the substrate X sucked and held on the first step D.

As shown in fig. 1, 2, and 4, the cutter E is provided with rails 13 as guide means a 'on both sides (left and right directions) of a seat 12 extending in the advancing and retreating direction of a first step D, slides on the rails 13 from sliders 15 engaging both sides of the lower surface of a base 14, and screws female screws 17 to male screws 16, the male screws 16 serving as both ends of a second moving means B' are supported on the seat 12, the female screws 17 are provided on the lower surface of the base 14 serving as a second moving body C ', and a motor 18 connected to one end of the male screws 16 is operated to reversibly drive the male screws 16, thereby advancing and retreating the base 14 of the second moving body C' in the left and right directions.

Of course, the mode of advancing and retracting the base 14 is not limited to the above configuration, and may be performed by a linear motor, for example.

Next, a rail 19 is provided at the front side edge of the base 14 in parallel with the seat 12, a slider 21 of each slide table 20 arranged in a dot shape corresponding to the number of cuts is slidably engaged with the rail 19, a wheel-shaped cutter E is provided on the base 24 by a vertical guide 22 in each slide table 20, the vertical guide 22 includes a rail in the vertical direction and a slider slidably engaged with the rail, and the base 24 is moved up and down by a cylinder, for example, as a vertical movement device 23.

As the first step D moves forward, the cutting line 60 in one direction of the rectangle is cut on the lower surface of the glass plate Y of the substrate X by the cutter E.

Of course, the rotating device 7 may rotate the first step D by 90 °, and then the first step D is moved, so that the cutter E cuts the rectangular cutting line 60, which is cut in the other direction of the rectangle and intersects with the cutting line 60 (right angle) in the one direction of the rectangle, and the rectangular cutting line 60 is cut, which is divided into the product size shown in fig. 6.

Of course, the first step D and the cutter E can be moved by numerical control in the divided region of the cutting line 60, so that the special-shaped cutting line 61 shown in fig. 7 can be cut.

The parallel position of the substrate 24 having the cutters E is adjusted (changed) in accordance with the cut rectangular cutting line 60.

The adjustment can be performed by manually sliding each slide table 20 having the cutter E to assign the position, or by a method of sliding a linear motor to a specific position (for example, by providing a linear motor between the rail 19 and the slider 21 in fig. 4), or by a method described in, for example, paragraph [0028] of patent document 1 (japanese patent No. third 969992).

As shown in fig. 4, the mark provided on the substrate X is read by means of the camera P provided on the base 24, and the first step D is rotated and aligned by the rotating device 7 in accordance with the reading.

Further, a third moving body C ″ is provided, which is guided by another front-rear direction guide device a ″ and moved back and forth by a third moving device B ″ between just below and in front of the forward stop position of the first step D.

The guide device a "is the same as the guide device a of the first mobile body C, and the third mobile device B" of the third mobile body C "is the same as the first mobile device B of the first mobile body C, so detailed description of the configuration is omitted.

The second stage H is provided, and is rotated by 90 ° by the motor operation as the rotating means 7 on the upper surface side of the third moving body C ″ and has a suction holding function of sucking and holding the substrate X on the upper surface of the first stage D.

The second step H is formed by using the hollow box 10 for sucking the inside as the first step D, and the sucking and holding function 9 of the second step H is formed by arranging numerous small holes on the lower surface of the hollow box 10. Please refer to the description of the first moving body C for the track 2 and the slide 3 below the second step H, which are not described herein.

In this way, after the substrate X cut by the cutter E is carried out by the first step D, the substrate X is moved and received on the second step H standing by therebelow by the lowering action of the elevating device 8, and the substrate a is held on the second step H by the suction holding function.

Further, a fourth moving body C '"is provided, which is movably guided by the left-right direction guide device a" on the upper side of the moving path of the second step H, and which is moved back and forth by the fourth moving device B' ".

The moving manner of the guide device a ″ of the fourth moving body C ' ″, and the moving manner of the fourth moving device B ' ″ of the fourth moving body C ' ″ are the same as those of the cutter E side, and thus detailed description thereof is omitted.

Next, the laser device K is provided, and the fourth moving body C ″, the film Z (X direction, Y direction, and odd direction) is irradiated from above the substrate X, and is cut along with this.

The arrangement of the laser device K, that is, the arrangement of the laser device K attached to the parallel base 24, the arrangement of the parallel base 24 in which the position thereof can be changed, the manner of moving the laser device K up and down by the lift device 23, and the manner of sliding the base 24 in the left-right direction (shown in fig. 5) for adjusting the position of the laser device K are the same as those of the cutter E (see fig. 4), and thus the detailed description thereof is omitted.

In this way, the first step D is lowered by the lifting device 8, the substrate X cut by the cutter E is received on the second step H, and the substrate X is held on the second step H by the suction holding function 9, so that the second step H is moved forward.

At this time, the substrate 14 and the laser device K are moved together by the third moving device B ″, and the film Z is irradiated from above by the laser device K and cut.

Of course, the cutting of the laser device K, that is, the movement of the substrate and the cutter E in the left-right direction, the rotation of the second step H by 90 ° by the rotating device 7, and the cutting into a rectangular shape, may be performed in the same manner as the cutter E, and the film Z may be cut into a special shape while the laser device K is moved under numerical control in the same manner as described above.

Further, a camera P is mounted on the fourth moving body C' ″, an alignment mark of the substrate X is read by the camera P, and alignment is performed by rotating the second step H according to the reading.

When the cutter E cuts the special-shaped cutting line, the cutter E can be swung in the cutting direction of the special-shaped cutting line.

In the figure, 63 is a cutting line provided on the film Z by a laser device K.

In the embodiment of the present invention, the substrate having the glass plate processed on the lower side with the film on the upper side is used, but the substrate having the glass plate on the upper side and the film on the lower side may be processed (in this case, the upper cutter is disposed opposite to the lower laser device), and the glass plate may be cut by the laser device, so that the laser device may be used instead of the cutter.

Claims

1. An apparatus for dividing a substrate, comprising: