CN210519001U - Ultra-long flexible circuit board for LED lamp strip - Google Patents
Ultra-long flexible circuit board for LED lamp strip Download PDFInfo
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- CN210519001U CN210519001U CN201921305730.7U CN201921305730U CN210519001U CN 210519001 U CN210519001 U CN 210519001U CN 201921305730 U CN201921305730 U CN 201921305730U CN 210519001 U CN210519001 U CN 210519001U
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Abstract
The utility model discloses a LED lamp is overlength flexible circuit board for area. This LED lamp is overlength flexible circuit board for area includes from last first insulation layer, component circuit layer, second insulation layer, main line layer, the third insulation layer that sets gradually down, be provided with gluing agent layer and bond through gluing agent layer in first insulation layer, component circuit layer, second insulation layer, main line layer, the third insulation layer between adjacent two-layerly, be provided with the blind hole between component circuit layer and the second insulation layer in order to realize switching on of component circuit layer and main line layer. The utility model discloses a set up the blind hole between component circuit layer and second insulating layer in order to realize switching on of component circuit layer and main line layer, the bigger reliability of solder joint area of contact is higher, the utility model discloses bond together through gluing agent layer between the adjacent two-layer structure, gluing agent layer comprises epoxy thermosetting glue, and epoxy thermosetting glue is high temperature resistant, and viscidity is better, does not produce the bubble during production, and the practicality is strong.
Description
Technical Field
The utility model relates to a LED lamp technical field, concretely relates to LED lamp is overlength flexible circuit board for area.
Background
The LED lamp strip is formed by welding a special processing technology for the LED lamp on a flexible circuit board and then connecting a power supply to emit light, and has the characteristics of long service life, energy conservation, environmental protection and the like. With the continuous improvement of living standard of people, the LED lamp strip is widely applied to decorative lighting places, such as neon lamps, large-scale antenna circuit boards, caption advertisements, signboards, ceiling lighting and the like.
Traditional flexible circuit board length is no longer than 1m, and the flexible circuit board that exceeds 1m usually needs to adopt many flexible circuit board concatenations to form, and in process of production, needs to carry out certain copper facing to flexible circuit board and handles, and the concatenation can increase production processes, material and production defective products in addition, has increaseed manufacturing cost input and has quality hidden danger such as butt joint rosin joint to, flexible circuit board is multilayer structure, produces the bubble easily between layer when production.
SUMMERY OF THE UTILITY MODEL
For the problem of solving above-mentioned flexible circuit board easy gassing between layer when production, the utility model provides a LED lamp is overlength flexible circuit board for area.
In order to achieve the above object, the utility model adopts the following technical scheme: LED lamp is overlength flexible circuit board for area, include from last first insulation layer, component circuit layer, second insulation layer, main line layer, the third insulation layer that sets gradually extremely down, be provided with gluing agent layer and bond through gluing agent layer in first insulation layer, component circuit layer, second insulation layer, main line layer, the third insulation layer between adjacent two-layerly, be provided with the blind hole between component circuit layer and the second insulation layer in order to realize switching on of component circuit layer and main line layer.
Furthermore, the adhesive layer is made of epoxy thermosetting adhesive.
Furthermore, a plurality of wiring pads are arranged on the first insulating layer, and the wiring pads are respectively connected and conducted with the element circuit layer and the main circuit layer.
Further, the connection pad is disposed at one end of the first insulating layer.
Further, the blind hole is arranged below the wiring pad.
Furthermore, a plurality of LED lamp bonding pads and a plurality of solder resisting pads are arranged on the first insulating layer, and the LED lamp bonding pads and the solder resisting pads are alternately arranged in two rows.
Furthermore, the LED lamp bonding pad is respectively connected and conducted with the element circuit layer and the main circuit layer.
Further, the solder mask is respectively connected and conducted with the element circuit layer and the main circuit layer.
Further, the first insulating layer, the second insulating layer and the third insulating layer are all PI insulating films.
Further, the first insulating layer, the second insulating layer and the third insulating layer are all PET insulating films.
From the above description of the present invention, compared with the prior art, the present invention has the following advantages:
1. the utility model discloses a set up the blind hole between component circuit layer and second insulating layer in order to realize the switching on of component circuit layer and main line layer, compared with traditional through-hole design, the utility model discloses a blind hole design, solder joint area of contact is bigger the reliability is higher;
2. the utility model can design the length of the flexible circuit board according to the requirement of a client, adopts the novel whole roll material and roll-to-roll combined process, directly meets the requirement of the length and the width of a product, does not need splicing in the using process, can save splicing equipment, labor and material cost, and avoids bad butt joint and rosin joint;
3. the utility model discloses bond together through gluing agent layer between the adjacent two-layer structure, gluing agent layer comprises the epoxy thermosetting glue, and the epoxy thermosetting glue is high temperature resistant, and viscidity is better, does not produce the bubble during production, and the practicality is strong, prevents to appear the phenomenon of coming unstuck in the production.
Drawings
Fig. 1 is a schematic cross-sectional view of an ultra-long flexible circuit board for an LED light strip according to a first embodiment of the present invention;
fig. 2 is the utility model discloses in the embodiment one, overlook the sketch map of overlength flexible circuit board for LED lamp area.
Reference numerals: 1. a first insulating layer; 11. a wiring pad; 12. LED lamp bonding pads; 13. a solder pad; 2. a device wiring layer; 3. a second insulating layer; 4. a main line layer; 5. a third insulating layer; 6. an adhesive layer; 7. and (4) blind holes.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows:
referring to fig. 1-2, the ultra-long flexible circuit board for the LED lamp strip comprises a first insulation layer 1, an element circuit layer 2, a second insulation layer 3, a main circuit layer 4 and a third insulation layer 5 which are sequentially arranged from top to bottom, wherein an adhesive layer 6 is arranged between two adjacent layers in the first insulation layer 1, the element circuit layer 2, the second insulation layer 3, the main circuit layer 4 and the third insulation layer 5 and is bonded through the adhesive layer 6, a blind hole 7 is arranged between the element circuit layer 2 and the second insulation layer 3 to realize the conduction of the element circuit layer 2 and the main circuit layer 4, and the adhesive layer 6 is formed by epoxy thermosetting adhesive.
The first insulating layer 1 is provided with a plurality of wiring pads 11, the wiring pads 11 are respectively connected and conducted with the element circuit layer 2 and the main circuit layer 4, the wiring pads 11 are arranged at one end of the first insulating layer 1, the blind holes 7 are arranged below the wiring pads 11, the wiring pads 11 are connected with a power line for conducting, the wiring pads 11 adopt a trepan design, and the conduction with the element circuit layer 2 and the main circuit layer 4 is realized through tin conductor welding; the LED lamp packaging structure is characterized in that a plurality of LED lamp bonding pads 12 and a plurality of solder resisting pads 13 are arranged on the first insulating layer 1, the LED lamp bonding pads 12 and the solder resisting pads 13 are alternately arranged in two rows, the LED lamp bonding pads 12 are respectively connected and conducted with the element circuit layer 2 and the main circuit layer 4, the solder resisting pads 13 are respectively connected and conducted with the element circuit layer 2 and the main circuit layer 4, and LED lamp components are welded on the LED lamp bonding pads 12 and the solder resisting pads 13 through solder paste; the first insulating layer 1, the second insulating layer 3 and the third insulating layer 5 are PI insulating films, the PI insulating films are polyimide films, the PI insulating films are film type insulating materials with good performance, and heat resistance and tensile strength of the flexible circuit board are improved.
The utility model discloses a set up blind hole 7 between component circuit layer 2 and second insulating layer 3 in order to realize the switching on of component circuit layer 2 and main line layer 4, compared with the traditional through-hole design, the utility model discloses a blind hole 7 design, the bigger reliability of solder joint area of contact is higher; the utility model can design the length of the flexible circuit board according to the requirement of a client, adopts the novel whole roll material and roll-to-roll combined process, directly meets the requirement of the length and the width of a product, does not need splicing in the using process, can save splicing equipment, labor and material cost, and avoids bad butt joint and rosin joint; the utility model discloses bond together through gluing agent layer 6 between the adjacent two-layer structure, gluing agent layer 6 comprises the epoxy thermosetting glue, and the epoxy thermosetting glue is high temperature resistant, and viscidity is better, does not produce the bubble during production, and the practicality is strong, prevents to appear the phenomenon of coming unstuck in the production.
The second embodiment is as follows:
the present embodiment is different from the first embodiment in that: the first insulating layer 1, the second insulating layer 3 and the third insulating layer 5 are all PET films. The PET film is a high-temperature-resistant polyester film, so that the flexible circuit board has better weather resistance and ageing resistance, and the service life of the flexible circuit board is longer.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.
Claims (10)
- LED lamp is overlength flexible circuit board for area, its characterized in that: including from last first insulation layer, component circuit layer, second insulating layer, main line layer, the third insulating layer that sets gradually extremely down, be provided with gluing agent layer and bond through gluing agent layer in first insulation layer, component circuit layer, second insulating layer, main line layer, the third insulating layer between adjacent two-layerly, be provided with the blind hole between component circuit layer and the second insulating layer in order to realize switching on of component circuit layer and main line layer.
- 2. The ultra-long flexible circuit board for the LED strip according to claim 1, wherein: the adhesive layer is composed of epoxy thermosetting adhesive.
- 3. The ultra-long flexible circuit board for the LED strip according to claim 1, wherein: and the first insulating layer is provided with a plurality of wiring pads which are respectively connected and conducted with the element circuit layer and the main circuit layer.
- 4. The ultra-long flexible circuit board for the LED strip according to claim 3, wherein: the wiring pad is arranged at one end of the first insulating layer.
- 5. The ultra-long flexible circuit board for the LED strip according to claim 3, wherein: the blind hole is arranged below the wiring welding plate.
- 6. The ultra-long flexible circuit board for the LED strip according to claim 1, wherein: the LED lamp comprises a first insulating layer and is characterized in that a plurality of LED lamp bonding pads and a plurality of solder resisting pads are arranged on the first insulating layer, and the LED lamp bonding pads and the solder resisting pads are alternately arranged in two rows.
- 7. The ultra-long flexible circuit board for the LED strip according to claim 6, wherein: and the LED lamp bonding pad is respectively connected and conducted with the element circuit layer and the main circuit layer.
- 8. The ultra-long flexible circuit board for the LED strip according to claim 6, wherein: and the solder resisting disc is respectively connected and communicated with the element circuit layer and the main circuit layer.
- 9. The ultra-long flexible circuit board for the LED light strip according to any one of claims 1 to 8, wherein: the first insulating layer, the second insulating layer and the third insulating layer are all PI insulating films.
- 10. The ultra-long flexible circuit board for the LED light strip according to any one of claims 1 to 8, wherein: the first insulating layer, the second insulating layer and the third insulating layer are all PET insulating films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921305730.7U CN210519001U (en) | 2019-08-13 | 2019-08-13 | Ultra-long flexible circuit board for LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921305730.7U CN210519001U (en) | 2019-08-13 | 2019-08-13 | Ultra-long flexible circuit board for LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210519001U true CN210519001U (en) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921305730.7U Active CN210519001U (en) | 2019-08-13 | 2019-08-13 | Ultra-long flexible circuit board for LED lamp strip |
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| Country | Link |
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| CN (1) | CN210519001U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838378A (en) * | 2021-09-15 | 2021-12-24 | 昆山国显光电有限公司 | Display module and display device |
-
2019
- 2019-08-13 CN CN201921305730.7U patent/CN210519001U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838378A (en) * | 2021-09-15 | 2021-12-24 | 昆山国显光电有限公司 | Display module and display device |
| CN113838378B (en) * | 2021-09-15 | 2023-07-25 | 昆山国显光电有限公司 | Display module and display device |
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