CN210516715U

CN210516715U - Smart card module

Info

Publication number: CN210516715U
Application number: CN201921937253.6U
Authority: CN
Inventors: 冯学裕
Original assignee: Chengtian Weiye Ningbo Chip Technology Co Ltd
Current assignee: Chengtian Weiye Ningbo Chip Technology Co Ltd
Priority date: 2019-11-11
Filing date: 2019-11-11
Publication date: 2020-05-12
Anticipated expiration: 2029-11-11

Abstract

The utility model discloses a smart card module, wherein, the utility model discloses a smart card module is through adopting the substrate layer, and first metal level lays in the surface of substrate layer, and the second metal level is glued and is connect in the surface that first metal level deviates from substrate layer one side, and the second metal level passes through metallization hole electric connection in first metal level, and the second metal level deviates from the protruding connection arch of establishing two relative settings that form in the surface of first metal level one side, and two connection are protruding to extend in the surface of second metal level and set up to form solid crystalline region, the solid crystalline region is located to the chip. The utility model discloses a first metal level and second metal level pass through the metallization hole electricity and connect, so can omit the technology of beating the gold thread to the great degree saved production time and manufacturing cost, the chip is fixed in two through solid brilliant technology simultaneously and connects the arch, realizes the electric connection of chip and second metal level, compares in the gold thread connection, and the electric connection of this application is more stable, consequently can improve the stability of smart card module performance.

Description

Smart card module

Technical Field

The utility model relates to a microelectronics semiconductor package technical field, in particular to smart card module.

Background

Smart Card (Smart Card): a generic term for a plastic card (usually the size of a credit card) with a microchip embedded therein. Some smart cards contain a microelectronic chip and require data interaction via a reader/writer. The smart card is equipped with CPU, RAM and I/O, and can process a large amount of data without interfering the operation of the CPU of the host computer. The smart card may also filter out erroneous data to relieve the host CPU of the burden. The method is suitable for occasions with more ports and higher communication speed requirements. The integrated circuit in the card comprises a central processing unit CPU, a programmable read-only memory EEPROM, a random access memory RAM and a card Operating system COS (chip Operating system) solidified in the read-only memory ROM. The data in the card is divided into an external reading part and an internal processing part.

At present, the conventional intelligent module packaging generally adopts a substrate layer of a carrier tape, a single-sided or double-sided copper-clad circuit is arranged, then an intelligent card chip is connected by bonding and routing, and after the intelligent card chip is finished, the intelligent card module is directly molded or UV packaged to realize high reliability of the intelligent card module. The packaging method requires that a corresponding carrier tape can be directly provided with gold wires, the carrier tape is produced by foreign manufacturers exclusively at present, the cost of the die is high, and the unit price is expensive. This makes the cost of intelligent module encapsulation high, very big reduction corresponding intelligent module's market competition.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a smart card module aims at shortening production, and reduction in production cost improves the stability of smart card module performance.

In order to achieve the above object, the utility model provides a smart card module, include:

a substrate layer;

the first metal layer is laid on the surface of the base material layer;

the second metal layer is glued to the surface of one side, away from the base material layer, of the first metal layer, and is electrically connected to the first metal layer through a metallization hole, two oppositely arranged connecting bulges are formed on the surface of one side, away from the first metal layer, of the second metal layer in a protruding mode, and the two connecting bulges extend from the surface of the second metal layer and form a die bonding area;

and the chip is arranged in the die bonding area.

Optionally, the cross section of the connecting projection is semi-elliptical.

Optionally, the surface of the second metal layer facing the first metal layer is recessed to form two opposite connecting recesses, and the two connecting recesses correspond to the two connecting protrusions respectively.

Optionally, the first metal layer and the second metal layer are made of copper foils with surfaces subjected to electroplating process and oxidation prevention treatment.

Optionally, the first metal layer and the second metal layer are bonded by resin.

Optionally, the material of the base material layer is composed of any one of polydimethylsilane, polyimide, polyethylene, polyvinylidene fluoride and natural rubber.

The utility model discloses technical scheme is through adopting the substrate layer, and first metal level lays in the surface of substrate layer, and the second metal level is glued and is connect in the surface that first metal level deviates from substrate layer one side, and the second metal level passes through metallization hole electric connection in first metal level, and the surface that the second metal level deviates from first metal level one side is protruding to be established and is formed the connection arch of two relative settings, and two connection are protruding to extend the setting in the surface of second metal level to form solid crystalline region, solid crystalline region is located to the chip. The utility model discloses a first metal level and second metal level pass through the metallization hole electricity and connect, so can omit the technology of beating the gold thread to the great degree saved production time and manufacturing cost, the chip is fixed in two through solid brilliant technology simultaneously and connects the arch, realizes the electric connection of chip and second metal level, compares in the gold thread connection, and the electric connection of this application is more stable, consequently can improve the stability of smart card module performance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a cross-sectional view of an embodiment of the smart card module of the present invention;

fig. 2 is a flow chart of the packaging process of the smart card module of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Smart card module	30b	Connection recess
1a	Metallized hole	20	Resin composition
				10	A first metal layer	40	Chip and method for manufacturing the same
30	Second metal layer	50	Smart card substrate
				31	Connecting projection	50a	Clamping groove
30a	Die bonding region	60	Ultraviolet curing adhesive

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, the utility model provides a smart card module 1.

In the embodiment of the present invention, the smart card module 1 includes:

a substrate layer;

the first metal layer 10 is laid on the surface of the base material layer, and the first metal layer 10 is laid on the surface of the base material layer;

the second metal layer 30 is bonded to the surface of the first metal layer 10 on the side away from the substrate layer, the second metal layer 30 is electrically connected to the first metal layer 10 through the metalized hole 1a, two oppositely arranged connecting protrusions 31 are formed on the surface of the second metal layer 30 on the side away from the first metal layer 10 in a protruding manner, and the two connecting protrusions 31 extend from the surface of the second metal layer 30 to form a die bonding area 30 a;

and the chip 40 is arranged in the die bonding area 30 a.

The utility model discloses an embodiment, the substrate layer is made by FR4 or G10 material, first metal level 10 and second metal level 30 are made by the copper foil material, the surface of copper foil is through electroplating process and anti-oxidation treatment, first metal level 10 and second metal level 30 bond as an organic wholely through resin 20, and through pressfitting technology pressfitting in the surface of substrate layer, second metal level 30 passes through metallization hole 1a electric connection in first metal level 10, and second metal level 30 deviates from the protruding connection arch 31 that forms two relative settings of establishing in surface of first metal level 10 one side, this connection arch 31's transversal half oval setting of personally submitting, the protruding 31 of connection of oval setting has higher intensity, this connection arch 31 is used for forming solid crystalline region 30a, chip 40 connects in two connection archs 31 through some glue processes.

The utility model discloses technical scheme is through adopting the substrate layer, first metal level 10 lays in the surface of substrate layer, second metal level 30 is glued and is connect in the surface that first metal level 10 deviates from substrate layer one side, second metal level 30 passes through metallization hole 1a electric connection in first metal level 10, second metal level 30 deviates from the protruding connection arch 31 that forms two relative settings of establishing in the surface of first metal level 10 one side, two connect protruding 31 in the surface extension setting of second metal level 30 to form solid brilliant regional 30a, chip 40 locates solid brilliant regional 30 a. The utility model discloses a first metal level 10 and second metal level 30 are connected through metallization hole 1a electricity, so can omit the technology of beating the gold thread to the great degree saved production time and manufacturing cost, chip 40 is fixed in two through solid brilliant technology simultaneously and connects arch 31, realizes the electric connection of chip 40 and second metal level 30, compares in the gold thread connection, and the electric connection of this application is more stable, consequently can improve the stability of 1 performance of smart card module.

In order to make the bonding between the second metal layer 30 and the first metal layer 10 more firm, in an embodiment of the present application, the surface of the second metal layer 30 facing the first metal layer 10 is recessed to form two connecting recesses 30b disposed oppositely, the cross section of the connecting recess 30b is also semi-elliptical, and the two connecting recesses 30b correspond to the two connecting protrusions 31, respectively. By providing the two connecting recesses 30b, when the first metal layer 10 and the second metal layer 30 are bonded together by the resin 20, the resin 20 can penetrate into the two connecting recesses 30b to enlarge the connecting area, so that the overall structure of the smart card module 1 is more reliable, and the performance stability of the smart card module 1 is greatly improved.

In an embodiment of the present application, the smart card module 1 includes a smart card substrate 50, the smart card substrate 50 is formed with a whole rectangular-shaped slot 50a, when the chip 40 is fixed to the two connection protrusions 31 of the second metal layer 30 through the ultraviolet curing adhesive 60, after the smart card strip is obtained, the smart card strip is bonded to the smart card substrate 50, the chip 40 is accommodated in the slot 50a, so not only the smart card module 1 can be manufactured through a card manufacturing process, but also the chip 40 is accommodated in the slot 50a, which can protect the smart card module 1, thereby prolonging the service life of the smart card module 1.

Referring to fig. 2, the present invention further provides a packaging process for producing the smart card module 1 in the above embodiment, wherein the packaging process comprises the following steps:

providing a substrate layer, a first metal layer 10, a second metal layer 30 and a chip 40, wherein the surface of one side of the second metal layer 10 is convexly provided with two oppositely arranged connecting bulges 31, and the two connecting bulges 31 form a die bonding area 30 a;

and (3) laminating: sequentially pressing the first metal layer 10 and the second metal layer 30 on the surface of the substrate layer along the direction departing from the connecting projection 31;

drilling and metallizing: drilling holes at corresponding positions of the first metal layer 10 and the second metal layer 30, and carrying out metallization treatment on the drilled holes to form metallized holes 1 a;

etching the circuit: etching lines on the surfaces of the first metal layer 10 and the second metal layer 30;

and (3) crystal solidification: fixing the chip 40 to the die bonding area 30a by dispensing;

packaging: coating ultraviolet curing glue 60 on the chip 40 fixed on the die bonding area 30a, and curing the chip in a UV (ultraviolet) furnace to obtain a strip;

card making: and performing a final card manufacturing process on the manufactured strip to manufacture the intelligent card module 1.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A smart card module, comprising:

a substrate layer;

the first metal layer is laid on the surface of the base material layer;

and the chip is arranged in the die bonding area.

2. The smart card module of claim 1, wherein the connecting protrusion has a semi-elliptical shape in cross section.

3. The smart card module as claimed in claim 1, wherein the surface of the second metal layer facing the first metal layer is recessed to form two opposing connection recesses, and the two connection recesses correspond to the two connection protrusions, respectively.

4. The smart card module of claim 1, wherein the first metal layer and the second metal layer are made of copper foil with surfaces subjected to an electroplating process and an oxidation prevention treatment.

5. The smart card module of claim 1, wherein the first metal layer and the second metal layer are glued by a resin.

6. The smart card module of claim 1 wherein the substrate layer is made of material FR4 or G10.