CN210351981U - Anisotropic heat transfer material - Google Patents
Anisotropic heat transfer material Download PDFInfo
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- CN210351981U CN210351981U CN201921092932.8U CN201921092932U CN210351981U CN 210351981 U CN210351981 U CN 210351981U CN 201921092932 U CN201921092932 U CN 201921092932U CN 210351981 U CN210351981 U CN 210351981U
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- heat transfer
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Abstract
The utility model discloses an anisotropic heat transfer material, include: the heat-conducting piece is provided with a heating body at one end and a radiating shell at the other end, and the heat-conducting piece is respectively attached to the heating body and the radiating shell; the heat conducting piece is a thin-skin-shaped heat conducting piece and consists of a heat conducting soft material and a super heat conducting material, the upper end and the lower end of the super heat conducting material are attached and wrapped with the heat conducting soft material, heat on a heating body can be effectively transferred to the heat dissipation shell through the heat conducting piece, the heat conducting piece is made of the soft material, the shape can be changed randomly, therefore, the arrangement of a bending circuit can be carried out in the electronic component, the parallel requirements of the heating element device, the heat dissipation module and the heat dissipation shell do not need to be met, and the space for designing and developing the electronic component is enlarged.
Description
Technical Field
The utility model belongs to the technical field of hot material and specifically relates to an anisotropic heat transfer material is related to.
Background
The heat dissipation of the heating component among the electronic components among the prior art generally carries out the setting of laminating formula through heat dissipation module, heat dissipation casing and carries out the conduction and the transmission of heat, and such design can be fixed the position of heating component, must laminate with heat dissipation module, otherwise the heat dissipation problem of heating component just becomes the problem that can't solve to because of the parallel requirement of three between the component ware that generates heat and heat dissipation module, the heat dissipation casing, restricted electronic components's design and development.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.
An anisotropic heat transfer material comprising: the heat-conducting piece is provided with a heating body at one end and a radiating shell at the other end, and the heat-conducting piece is respectively attached to the heating body and the radiating shell;
the heat conducting part is a thin-skin-shaped heat conducting part, the heat conducting part is composed of a heat conducting soft material and a super heat conducting material, and the upper end and the lower end of the super heat conducting material are coated with the heat conducting soft material in a laminating mode.
As a further aspect of the present invention: the super heat conducting material can be graphite sheets, graphene, carbon nanotubes, copper foils, aluminum foils and other materials with ultrahigh heat conductivity coefficient.
As a further aspect of the present invention: the super heat conductive material can be a composite material of graphite sheets, graphene, carbon nanotubes, copper foil and aluminum foil materials, such as graphite sheet adhesive tapes, graphite sheet copper foils, copper foil adhesive tapes and the like.
As a further aspect of the present invention: the heat-conducting soft material can be soft materials such as heat-conducting silica gel, heat-conducting silica gel sheets, heat-conducting adhesive tapes and the like.
As a further aspect of the present invention: the super heat conducting material and the heat conducting soft material are formed and combined through a spraying process or a laminating process, a coating process and a roll forming process.
Compared with the prior art, the beneficial effects of the utility model are that: can effectually pass through on heat conduction spare transmits the heat dissipation casing on with the heat-generating body, and the heat conduction spare is soft material, change shape that can be arbitrary to can carry out the setting of crooked circuit in electronic components's inside, need not to guarantee the parallel requirement of three between heating element ware and heat radiation module, the heat dissipation casing, thereby enlarge the space of electronic components's design development.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic view of the heat conducting member of the present invention.
Fig. 2 is a schematic structural view of the heat conducting member of the present invention.
In the figure: 1. heat conducting piece, 2, heating body, 3, heat dissipation casing, 11, heat conducting soft material, 12, super heat conducting material.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, in an embodiment of the present invention, an anisotropic heat transfer material includes: the heat dissipation device comprises a heat conduction piece 1, wherein a heating body 2 is arranged at one end of the heat conduction piece 1, a heat dissipation shell 3 is arranged at the other end of the heat conduction piece 1, and the heat conduction piece 1 is respectively attached to the heating body 2 and the heat dissipation shell 3, so that the heat of the heating body 2 is transmitted to the heat dissipation shell 3 through the heat conduction piece 1 and is dissipated through the heat dissipation shell 3;
the heat conducting member 1 is a thin-skin-shaped heat conducting member 1, has a bendable characteristic, can be randomly changed in shape and can be rolled, the heat conducting member 1 is composed of a heat conducting soft material 11 and a super heat conducting material 12, and the upper end and the lower end of the super heat conducting material 12 are attached and wrapped with the heat conducting soft material 11.
The super heat conducting material 12 can be graphite sheet, graphene, carbon nanotube, copper foil, aluminum foil and other materials with super high heat conductivity coefficient.
The super thermal conductive material 12 can be a composite material of graphite sheet, graphene, carbon nanotube, copper foil and aluminum foil, such as graphite sheet tape, graphite sheet copper foil, copper foil tape, etc.
The heat-conducting soft material 11 can be a soft material such as heat-conducting silica gel, heat-conducting silica gel sheet, heat-conducting adhesive tape, etc.
The super heat conducting material 12 and the heat conducting soft material 11 are formed and combined through a spraying process or a bonding process, a coating process and roll forming.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. An anisotropic heat transfer material, comprising: the heat-conducting piece is provided with a heating body at one end and a radiating shell at the other end, and the heat-conducting piece is respectively attached to the heating body and the radiating shell;
the heat conducting part is a thin-skin-shaped heat conducting part, the heat conducting part is composed of a heat conducting soft material and a super heat conducting material, and the upper end and the lower end of the super heat conducting material are coated with the heat conducting soft material in a laminating mode.
2. An anisotropic heat transfer material according to claim 1, wherein the super thermal conductive material is selected from the group consisting of graphite sheet, graphene, carbon nanotube, copper foil, aluminum foil, and other ultra-high thermal conductivity materials.
3. An anisotropic heat transfer material according to claim 2, wherein the superconductive material is a composite of graphite sheet, graphene, carbon nanotubes, copper foil, aluminum foil material, such as graphite sheet tape, graphite sheet copper foil, copper foil tape, etc.
4. An anisotropic heat transfer material according to claim 1, wherein the soft heat conductive material is a soft material such as a heat conductive silicone rubber, a heat conductive silicone sheet, or a heat conductive adhesive tape.
5. An anisotropic heat transfer material according to claim 1, wherein the super thermal conductive material and the soft thermal conductive material are formed and bonded by a spraying process or a bonding process, a coating process, or a roll forming process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921092932.8U CN210351981U (en) | 2019-07-12 | 2019-07-12 | Anisotropic heat transfer material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921092932.8U CN210351981U (en) | 2019-07-12 | 2019-07-12 | Anisotropic heat transfer material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351981U true CN210351981U (en) | 2020-04-17 |
Family
ID=70195218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921092932.8U Active CN210351981U (en) | 2019-07-12 | 2019-07-12 | Anisotropic heat transfer material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210351981U (en) |
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2019
- 2019-07-12 CN CN201921092932.8U patent/CN210351981U/en active Active
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