CN210349792U

CN210349792U - Device applied to LED wafer expansion

Info

Publication number: CN210349792U
Application number: CN201921824262.4U
Authority: CN
Inventors: 马景鹏
Original assignee: Lianyungang Para Light Electronics Co ltd
Current assignee: Lianyungang Para Light Electronics Co ltd
Priority date: 2019-10-28
Filing date: 2019-10-28
Publication date: 2020-04-17
Anticipated expiration: 2029-10-28

Abstract

The utility model discloses a be applied to LED wafer and expand brilliant device, which comprises a frame, be equipped with in the frame and expand brilliant structure and set up the pressure membrane structure of expanding brilliant structure top, it is equipped with first ionic fan to expand brilliant structure one side, expand brilliant structure and include top board, holding down plate and set up the thing chamber of putting in the holding down plate below, top board and holding down plate one side are articulated, and top board and holding down plate opposite side pass through locking device swing joint, be equipped with the recess that the pressure head that is used for locking device placed on the top board, be equipped with the magnet piece on the top board of recess one side. The crystal expansion device is reasonable in structural design in the use process, utilizes the existing structural resources, maximizes the functions, can eliminate static electricity in the operation process and ensures the crystal expansion effect.

Description

Device applied to LED wafer expansion

Technical Field

The utility model relates to a expand brilliant machine, in particular to be applied to LED wafer and expand brilliant device.

Background

In the production process of the LED lamp, the detection and sorting of the LED wafer is a very important process. In order to easily detect and sort the LED chips, the distance between the original LED chips on the chip film must be enlarged, that is, the chip film is subjected to a chip enlarging operation by a chip enlarging machine.

The wafer expander is used for uniformly separating closely arranged LED wafers to better implant the LED wafers into welding workpieces, the LED wafers are uniformly diffused to the periphery by utilizing the heating plasticity of an LED film and adopting the up-and-down control of an air cylinder, the LED wafers are automatically formed after a satisfactory wafer gap is achieved, and the film is tight and does not deform, so that the wafer expander is one of LED packaging equipment.

At present, the common crystal expanding machine on the market has the following problems: firstly, the upper pressing plate and the lower pressing plate are frequently separated in the crystal expansion process, the upper pressing plate and the lower pressing plate are generally hinged, the upper pressing plate is separated for multiple times without support, and all force is concentrated on the hinged parts, so that the hinged parts between the upper pressing plate and the lower pressing plate are easy to damage; secondly, the traditional heating mode adopts a film pressing structure to heat, so that the crystal expansion film is heated unevenly, and the crystal expansion effect is poor; thirdly, the locking device directly contacts with the upper surface of the stainless steel upper pressure plate, the surface of the upper pressure plate can be damaged after multiple times of pressing, the pressing is not tight, and the crystal expansion effect is influenced; fourthly, static electricity is inevitably generated in the crystal expansion operation process, and the static electricity can cause uneven crystal expansion, thereby finally influencing the crystal expansion effect. Therefore, the device applied to LED wafer crystal expansion is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a be applied to LED wafer and expand brilliant device can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the device for LED wafer expansion comprises a rack, wherein a wafer expansion structure and a film pressing structure arranged above the wafer expansion structure are arranged on the rack, a first ion fan is arranged on one side of the wafer expansion structure, the wafer expansion structure comprises an upper pressing plate, a lower pressing plate and an object placing cavity arranged below the lower pressing plate, the upper pressing plate is hinged to one side of the lower pressing plate, the other side of the upper pressing plate is movably connected with the other side of the lower pressing plate through a locking device, a groove used for placing a pressing head of the locking device is formed in the upper pressing plate, and a magnet sheet is arranged on the upper pressing plate on one side of the groove;

the upper pressing plate and the lower pressing plate are provided with accommodating cavities with the same size, the bottom of the lower pressing plate is connected with the accommodating cavity through a first upright post, a first air cylinder is arranged in the accommodating cavity, the end part of a piston rod of the first air cylinder penetrates through the accommodating cavity to be connected with a wafer expanding disc arranged in the accommodating cavity, a heating pipeline is arranged in the wafer expanding disc, and the wafer expanding disc can move up and down under the action of the first air cylinder to penetrate through the accommodating cavities;

the film pressing structure comprises a second upright post, a third upright post and a supporting plate, wherein the second upright post and the third upright post are arranged at the upper end of the object placing cavity, the supporting plate is fixed between the second upright post and the third upright post, the second upright post is arranged at one side where the upper pressing plate is hinged with the lower pressing plate, the magnet sheet is aligned to the second upright post when rotating along with the upper pressing plate, the third upright post is arranged at one side of the locking device, the third upright post is provided with a scale, the supporting plate is provided with a second air cylinder, the end part of a piston rod of the second air cylinder penetrates through the supporting plate;

the rack is also provided with a vertical plate, and the vertical plate is provided with a second ion fan.

Further, the locking device is a vertical clamp.

Furthermore, a rubber pad is arranged in the groove.

Furthermore, a pull rod is fixedly arranged on the side wall of the upper pressure plate.

Furthermore, the pull rod, the wafer expanding disc, the upper pressing plate and the lower pressing plate are all made of stainless steel.

Furthermore, the upper pressing plate and the lower pressing plate are arranged in a square shape, and the first upright columns are four and are fixedly connected with four opposite corners of the lower surface of the lower pressing plate respectively.

Further, the wafer expanding device further comprises a lantern ring, wherein the inner diameter of the lantern ring is equal to the outer diameter of the wafer expanding disc.

Compared with the prior art, the utility model discloses following beneficial effect has:

firstly, a groove used for placing a pressure head of a locking device is arranged on an upper pressure plate, a magnet piece is arranged on the upper pressure plate on one side of the groove, the magnet piece is aligned to a second upright post when the magnet piece rotates along with the upper pressure plate, the structure is designed to prevent the relative sliding between the pressure head and the upper pressure plate, the pressure head is placed in the groove, a rubber pad is placed in the groove, the pressure head and the upper pressure plate are protected, meanwhile, when the upper pressure plate rotates upwards along with an articulated piece, the position with the magnet piece is just sucked on the second upright post, the influence on the service life of the articulated piece caused by the random rotation of the upper pressure plate along with the articulated piece is avoided, and when the upper pressure plate is put down, an operator only needs to overcome the defect that;

a scale is arranged on the upright post III, the scale plays a role in supervision, the films of the same type needing crystal expansion can reach a preset height every time in the rising process along with the crystal expansion disc, and the quality of the wafer is not influenced in the height range;

thirdly, breaking through the traditional heating mode of the film pressing structure, and adopting the mode of directly heating the wafer expanding disc, so that the blue film is uniformly heated and the expanded film is uniform, and the wafer expanding effect is finally ensured;

and fourthly, the first ion fan and the second ion fan are arranged, all links which possibly generate static electricity in the film expanding process are eliminated, and the influence of the static electricity on the quality of the wafer is avoided.

Drawings

FIG. 1 is a side view of the device for expanding LED chips according to the present invention;

FIG. 2 is a perspective view of the device for expanding LED chips of the present invention;

fig. 3 is a schematic structural view of the locking device applied to the LED chip die expanding device of the present invention;

fig. 4 is a schematic view of the fitting structure of the lantern ring and the wafer expanding disk of the device for expanding the LED wafer according to the present invention;

FIG. 5 is a schematic view of the surface structure of the upper pressing plate of the device for expanding the LED wafer according to the present invention;

in the figure: 1. a frame; 2. a first ion fan; 3. an upper pressure plate; 4. a lower pressing plate; 5. a storage cavity; 6. a locking device; 601. a pressure head; 602. a groove; 604. Mounting a plate; 605. a supporting seat; 606. a connecting rod; 607. a driven lever; 608. a driving lever; 609. a cantilever; 610. a handle; 7. a magnet piece; 8. an accommodating cavity; 9. a first upright post; 10. a first cylinder; 11. expanding a wafer disc; 12. a heating line; 13. a second upright post; 14. a third upright post; 15. a support plate; 16. a scale; 17. a second air cylinder; 18. pressing a plate; 19. a vertical plate; 20. a second ion fan; 21. a pull rod; 22. a collar.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-5, a device for LED chip die-expanding comprises a frame 1, the frame 1 is provided with a die-expanding structure and a die pressing structure disposed above the die-expanding structure, one side of the die-expanding structure is provided with a first ion fan 2, the die-expanding structure comprises an upper pressing plate 3, a lower pressing plate 4 and a storage cavity 5 disposed below the lower pressing plate 4, one side of the upper pressing plate 3 is hinged to one side of the lower pressing plate 4, the other side of the upper pressing plate 3 is movably connected to the other side of the lower pressing plate 4 through a locking device 6, the locking device 6 is a vertical clamp, the locking device 6 comprises a supporting seat 605 fixedly disposed on a mounting plate 604, a connecting rod 606 and a driven rod 607 hinged to the supporting seat 605, and a driving rod 608 hinged to the connecting rod 606 and the driven rod 607, the driven rod 607 is connected to a cantilever 609, the cantilever 609 is provided with a pressing head 601, the driving rod 608 is provided with, a groove 602 for placing a pressure head 601 of the locking device 6 is formed in the upper pressure plate 3, a rubber pad is arranged in the groove 602, a magnet sheet 7 is arranged on the upper pressure plate 3 on one side of the groove 602, and a pull rod 21 is fixedly arranged on the side wall of the upper pressure plate 3;

the upper pressing plate 3 and the lower pressing plate 4 are provided with accommodating cavities 8 with the same size, the bottom of the lower pressing plate 4 is connected with an object accommodating cavity 5 through a first upright post 9, the upper pressing plate 3 and the lower pressing plate 4 are arranged in a square shape, four first upright posts 9 are arranged and are fixedly connected with four diagonal corners of the lower surface of the lower pressing plate 4 respectively, a first air cylinder 10 is arranged in the object accommodating cavity 5, the end part of a piston rod of the first air cylinder 10 penetrates through the object accommodating cavity 5 to be connected with a crystal expansion disc 11 arranged in the accommodating cavity 8, a heating pipeline 12 is arranged in the crystal expansion disc 11, and the crystal expansion disc 11 can move up and down under the action of the first air cylinder 10 to penetrate;

the film pressing structure comprises a second upright post 13, a third upright post 14 and a supporting plate 15, wherein the second upright post 13 is arranged at the upper end of the object placing cavity 5, the supporting plate 15 is fixed between the second upright post 13 and the third upright post 14, the second upright post 13 is arranged at one side of the upper pressing plate 3 hinged with the lower pressing plate 4, the magnet piece 7 is aligned with the second upright post 13 when the magnet piece 7 rotates along with the upper pressing plate 3, the third upright post 14 is arranged at one side of the locking device 6, a scale 16 is arranged on the third upright post 14, a second air cylinder 17 is arranged on the supporting plate 15, the end part of a piston rod of the second air cylinder 17 penetrates through the supporting plate; the pull rod 21, the wafer expanding disc 11, the upper pressing plate 3 and the lower pressing plate 4 are made of stainless steel, so that corrosion can be avoided, the service life of the wafer expanding disc is prolonged, and the heat conduction efficiency can be improved by the aid of the wafer expanding disc 11 made of stainless steel.

Wherein, the frame 1 is further provided with a vertical plate 19, and the vertical plate 19 is provided with a second ion fan 20.

The wafer expanding device further comprises a lantern ring 22, wherein the inner diameter of the lantern ring 22 is equal to the outer diameter of the wafer expanding disc 11, and the lantern ring 22 is guaranteed to be just sleeved on the wafer expanding disc 11 when being under pressure.

It should be noted that, the utility model relates to a be applied to LED wafer and expand brilliant device, during operation, will follow the blue membrane that has the wafer of purchase on the market, the blue membrane generally covers a layer of white paper, need tear this layer of paper in the process of expanding the brilliant, the process of tearing puts the blue membrane in the work interval of first ion fan 2, gets rid of the static on the blue membrane;

the temperature of a temperature control box (the model is 220Vkw produced by a permanent electric heating device, the structure of the temperature control box is not a protection object of the patent, but a temperature controller is provided to realize the temperature control of the heating pipeline 12) of a heating pipeline 12 is adjusted to 40 ℃, the temperature of a belt reaches a set temperature, the heating in the step is to soften a plastic blue film to ensure that the plastic blue film is uniformly expanded, then the blue film is placed on a lower pressing plate 4, the upper pressing plate 3 is separated from a stand column II 13 by overcoming the magnetism of a magnet 7 on the upper pressing plate 3 through a pull rod 21, then the upper pressing plate is rotated along a hinge to be attached to the lower pressing plate 4, after the blue film is attached, a locking device 6 drives a driving rod 608 to rotate through a handle 610 to drive a driven rod 609 to rotate, so that a pressing head 601 arranged on the driven rod 609 moves towards a groove 602 of the upper pressing plate 3, so that the upper pressing plate 3 and the lower pressing plate 4 are locked, starting a first cylinder 10 (model number is CNSUPAISC40 × 25) to enable a piston rod to drive a wafer expansion disc 11 to move upwards to a preset height, judging whether the movement stroke of the first cylinder 10 is accurate through a scale 16 at the moment, adjusting in time if deviation occurs, monitoring whether the wafer expansion height can be accurately achieved each time, placing a lantern ring 22 along the edge of the wafer expansion disc 11 when the wafer expansion disc 11 reaches the preset height, then starting a second cylinder 17 (model number is CNSUPAI SC40 × 200) to enable a piston rod of the second cylinder 17 to drive a pressing plate 18 to downwards press the wafer expansion disc 11, enabling the lantern ring 22 to be sleeved on a blue film and then enabling the piston rod of the second cylinder 17 to drive the pressing plate 18 to return, wherein in the film pressing process, the working range of a second ion fan 20 is aligned to the vicinity of the wafer expansion disc 11 to avoid the influence of static electricity on the wafer on the blue film in the film pressing process, and finally taking down the blue film with the lantern ring, and marking for later use.

The structure of the first cylinder 10 and the second cylinder 17 is not improved, and based on the working principle of the prior art cylinder,

the basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a be applied to LED wafer and expand brilliant device which characterized in that: the crystal expanding machine comprises a rack (1), wherein a crystal expanding structure and a film pressing structure arranged above the crystal expanding structure are arranged on the rack (1), a first ion fan (2) is arranged on one side of the crystal expanding structure, the crystal expanding structure comprises an upper pressing plate (3), a lower pressing plate (4) and an object placing cavity (5) arranged below the lower pressing plate (4), the upper pressing plate (3) is hinged to one side of the lower pressing plate (4), the other side of the upper pressing plate (3) is movably connected with the other side of the lower pressing plate (4) through a locking device (6), a groove (602) for placing a pressing head (601) of the locking device (6) is formed in the upper pressing plate (3) on one side of the groove (602), and a magnet piece (7) is arranged on the upper pressing plate (3);

the upper pressing plate (3) and the lower pressing plate (4) are provided with accommodating cavities (8) with the same size, the bottom of the lower pressing plate (4) is connected with the object accommodating cavity (5) through a first upright post (9), a first air cylinder (10) is arranged in the object accommodating cavity (5), the end part of a piston rod of the first air cylinder (10) penetrates through the object accommodating cavity (5) to be connected with a crystal expansion disc (11) arranged in the accommodating cavity (8), a heating pipeline (12) is arranged in the crystal expansion disc (11), and the crystal expansion disc (11) can move up and down under the action of the first air cylinder (10) to penetrate through the accommodating cavities (8);

the film pressing structure comprises a second upright post (13) and a third upright post (14) which are arranged at the upper end of the storage cavity (5) and a supporting plate (15) fixed between the second upright post (13) and the third upright post (14), the second upright post (13) is arranged on one side of the upper pressing plate (3) hinged to the lower pressing plate (4), the magnet piece (7) aligns to the second upright post (13) when the magnet piece (7) rotates along with the upper pressing plate (3), the third upright post (14) is arranged on one side of the locking device (6), a scale (16) is arranged on the third upright post (14), a second air cylinder (17) is arranged on the supporting plate (15), the end part of a piston rod of the second air cylinder (17) penetrates through the supporting plate (15) to be fixedly connected with the pressing plate (18), and the size of the pressing plate (18);

the rack (1) is also provided with a vertical plate (19), and the vertical plate (19) is provided with a second ion fan (20).

2. The device for LED wafer expansion according to claim 1, wherein: the locking device (6) is a vertical clamp.

3. The device for LED wafer expansion according to claim 1, wherein: a rubber pad is arranged in the groove (602).

4. The device for LED wafer expansion according to claim 1, wherein: and a pull rod (21) is fixedly arranged on the side wall of the upper pressure plate (3).

5. The device for LED wafer expansion according to claim 4, wherein: the pull rod (21), the wafer expanding disc (11), the upper pressing plate (3) and the lower pressing plate (4) are all made of stainless steel.

6. The device for LED wafer expansion according to claim 1, wherein: the upper pressing plate (3) and the lower pressing plate (4) are arranged in a square mode, and four upright posts (9) are fixedly connected with four opposite corners of the lower surface of the lower pressing plate (4) respectively.

7. The device for LED wafer expansion according to claim 1, wherein: the wafer expanding device further comprises a collar (22), and the inner diameter of the collar (22) is equal to the outer diameter of the wafer expanding disk (11).