CN210183794U - Electronic device - Google Patents
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- CN210183794U CN210183794U CN201921006541.XU CN201921006541U CN210183794U CN 210183794 U CN210183794 U CN 210183794U CN 201921006541 U CN201921006541 U CN 201921006541U CN 210183794 U CN210183794 U CN 210183794U
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Abstract
The application provides an electronic device, which comprises a chip, a shielding case and a regulating piece; the shielding cover covers the chip and is used for realizing electromagnetic shielding of the chip and conducting heat generated by the chip; the adjusting piece is used for adjusting the height of the shielding case, so that the shielding case is attached to the chip. In the electronic equipment that this application provided, the regulating part can be used for adjusting the mounted position of shield cover, can adjust the mounting height of shield cover, offsets the dimensional error between the various parts of equipment, makes the direct laminating chip's of shield cover surface, avoids producing the clearance between the two. Because there is no gap between the shielding case and the chip, the heat generated by the operation of the integrated circuit in the chip can be quickly transferred to the shielding case through the surface material of the chip, so as to realize the quick dissipation of the heat.
Description
Technical Field
The application relates to the technical field of electromagnetic radiation, in particular to an electronic device.
Background
In order to avoid interference of external electromagnetic signals to components such as chips in electronic equipment in a complex electromagnetic environment or leakage of confidential signals through electromagnetic radiation, shielding cases may be arranged in the electronic equipment such as a confidential mobile phone; the shield case is fixed on a main board of the electronic device, and is matched with the main board to cover electronic components such as chips and the like which can generate electromagnetic radiation.
Because the shield cover and the mainboard form a sealed cover space and an air layer is formed between the shield cover and the chip, the heat dissipation performance of the chip is reduced; in order to prevent the chip from overheating, a heat conducting member needs to be disposed in the air layer, and the heat conducting member needs to be disposed in consideration of the mounting reliability problem of the heat conducting member, the heat conducting effect problem, and the weight increase problem of the electronic device caused by the increase of the heat conducting member.
SUMMERY OF THE UTILITY MODEL
The present application provides an electronic device to solve the technical problems mentioned in the background.
The application provides an electronic device, which comprises a chip, a shielding case and a regulating piece;
the shielding cover covers the chip and is used for realizing electromagnetic shielding of the chip and conducting heat generated by the chip;
the adjusting piece is used for adjusting the height of the shielding case, so that the shielding case is attached to the chip.
Optionally, the electronic device includes a main board;
the chip is fixed on the mainboard;
the adjusting piece enables the edge of the shielding cover to be connected with the mainboard, and the shielding cover covers the chip.
Optionally, in the electronic device:
the adjusting piece is an elastic deformation piece;
the elastic deformation piece is connected with the edge of the shielding cover, and the height of the shielding cover is adjusted through the elastic deformation of the elastic deformation piece.
Optionally, in the electronic device:
the adjusting piece comprises an annular flanging part and a clamping part; the annular flanging part is fixedly connected with the main board;
the edge of the shielding cover is provided with a clamping matching part; the clamping matching part is matched with the clamping part in an elastic clamping manner;
the joint cooperation portion with joint portion cooperation degree is different and makes the high difference of shield cover.
Optionally, in the electronic device:
the annular flanging part is connected with the main board in a welding mode or is connected with the main board through a screw.
Optionally, in the electronic device:
the shielding cover comprises an annular flanging positioned at the edge; a through hole is formed in the annular flanging;
the adjusting piece comprises a screw and an elastic cushion piece;
the screw penetrates through the through hole to be fixedly connected with the main board, and the elastic padding piece between the annular flanging and the main board is compressed to change the height of the shielding cover.
Optionally, in the electronic device:
the shield cover is detachably connected with the adjusting piece.
Optionally, in the electronic device:
a heat-conducting adhesive layer is arranged between the shielding cover and the chip; the heat conducting adhesive layer is used for conducting heat generated by the chip to the shielding case.
Optionally, in the electronic device:
the binding surface of the shielding cover is bound with the surface of the chip;
the surface of at least one of the binding surface of the shielding cover and the chip is a frosted surface or a concave-convex surface.
Optionally, in the electronic device: the shield is grounded.
In the electronic equipment that this application provided, the regulating part can be used for adjusting the mounted position of shield cover, can be in order to adjust the mounting height of shield cover, offsets various size match errors among the part installation, makes the surface of the direct laminating chip of shield cover, avoids producing the clearance between the two. Because there is no gap between the shielding case and the chip, the heat generated by the operation of the integrated circuit in the chip can be quickly transferred to the shielding case through the surface material of the chip, so as to realize the quick dissipation of the heat.
Drawings
FIG. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment;
FIG. 2 is a schematic cross-sectional view of an electronic apparatus according to a second embodiment;
FIG. 3 is a schematic cross-sectional view of an electronic apparatus according to a third embodiment;
in fig. 1: 11-main board, 12-chip, 13-shielding case, 131-clamping matching part, 14-adjusting part, 141-annular flanging part, 142-clamping part, 143-screw, 144-elastic cushion part and 15-heat conducting adhesive layer.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
Example one
Fig. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment. As shown in fig. 1, an electronic device provided in the embodiment of the present application includes a main board 11, a chip 12, a shield case 13, and a regulator 14.
The chip 12 is an integrated circuit device that implements data processing and various spectral changes during operation of the electronic device, which generates a large amount of heat during operation; the operating temperature of the chip 12 needs to be maintained below a certain temperature in order to ensure that the chip 12 operates properly and avoid overheating which can cause the semiconductor components such as transistors in the chip 12 to fail. The chip 12 is fixed to the motherboard 11 by soldering, and is connected to a printed circuit or other interface contact on the motherboard 11.
The shielding cover 13 covers the surface of the chip 12; the shielding cover 13 is made of a metal material or other materials and structures (for example, a metamaterial layer) which may have an electromagnetic shielding effect, and can play a role in electromagnetic shielding, so that abnormal deformation of an electrical signal of an integrated circuit inside the chip 12 due to external strong electromagnetic interference is avoided, and information leakage caused by outward conduction of various electromagnetic radiations generated by parasitic effects and the like during the operation of the chip 12 is avoided.
In the embodiment of the present application, since the shielding can 13 may have good thermal conductivity, the heat generated by the chip 12 can be dissipated as quickly as possible by using the good thermal conductivity. If there is a gap between the shielding case 13 and the chip 12, the air with high thermal resistance filled in the gap will block the heat transfer and reduce the heat conduction efficiency; therefore, to improve the heat dissipation efficiency, the shield case 13 should be directly attached to the surface of the chip 12.
In practical applications, the chip 12 and the shield can 13 may not be well attached because of the difference in the thickness of the chip 12, the manufacturing error of the shield can 13, and the thickness error of the solder layer during the solder connection between the chip 12 and the carrier.
To solve the foregoing problem, in the embodiment of the present application, the electronic apparatus further includes an adjusting member 14. The adjusting part 14 can be used for adjusting the mounting position of the shielding case 13, that is, the mounting height of the shielding case 13 can be adjusted, various size errors mentioned in the previous section can be offset, and then the shielding case 13 is directly attached to the surface of the chip 12, so that a gap is avoided between the two. Because there is no gap between the shielding can 13 and the chip 12, there is no air with strong thermal resistance between the two, and the heat generated by the operation of the integrated circuit in the chip 12 can be quickly transferred to the shielding can 13 through the surface material of the chip 12, i.e. the quick dissipation of heat is realized.
Referring to fig. 1, in the embodiment of the present application, a chip 12 is soldered and fixed on a motherboard 11. The adjusting member 14 is fixedly connected with the edge of the shielding case 13, and the edge of the shielding case 13 is connected with the main board 11, so that the shielding case 13 covers the chip 12.
Referring to fig. 1, the adjusting member 14 includes an annular flange portion 141 and a catching portion 142. The annular flanging portion 141 is directly used for being attached to the surface of the main plate 11, so that the adjusting member 14 is fixedly connected with the main plate 11. In a specific application, the annular flanging part 141 can be fixed to the main board 11 by screws 143, or can be fixed to the main board 11 by welding.
In order to realize the connection between the shielding cover 13 and the adjusting part 14, the edge of the shielding cover 13 is provided with a clamping matching part, and the clamping matching part is elastically clamped and matched with the clamping part 142 in the adjusting part 14 to realize the fixation of the shielding cover 13 and the adjusting part 14. In the embodiment of the present application, the edge of the shielding cover 13 is provided with a plurality of clamping matching portions, and the adjusting member 14 is provided with a plurality of clamping portions 142; when the clamping part 142 is matched with different clamping matching parts, the heights of the shielding cover 13 relative to the main board 11 are different; that is, the height of the shield case 13 can be adjusted by adjusting the fitting relationship between the clip portion 142 and the clip fitting portion, and then the shield case 13 is fitted to the surface of the chip 12 adaptively.
In this embodiment, the connection between the clamping portion 142 and the clamping matching portion is detachable, and the clamping matching portion can be separated from the clamping portion 142 to detach the shielding cover 13 from the adjusting member 14 under the action of a large external force.
Of course, in some embodiments, particularly in the case where the main board 11 is scrapped directly after being damaged, the mating relationship of the shield case 13 and the adjuster 14 may also be configured to be non-detachable.
Please refer to fig. 1 further. The electronic device provided by the embodiment of the application further comprises a heat-conducting adhesive layer 15; a layer of thermally conductive adhesive 15 is disposed between the shield can 13 and the chip 12 for conducting heat generated by the chip 12 to the shield can 13. Because the heat conducting adhesive layer 15 also has the buffering and vibration damping effect of the adhesive, it can also avoid the excessive impact stress generated when the shielding cover 13 is directly pressed against the surface of the chip 12 during the installation of the shielding cover 13, and then reduce the probability that the chip 12 is crushed or the probability that the welding contact between the chip 12 and the mainboard 11 is damaged.
In a specific application, the heat-conducting adhesive of the heat-conducting adhesive layer 15 may be heat-conducting silica gel widely used in the computer field, such as silver powder silica gel, copper powder silica gel, and the like.
In practical applications, in order to achieve heat dissipation as much as possible, or to achieve adhesion of the thermal conductive adhesive layer 15 to the surface of the chip 12 or the adhesion surface of the shielding case 13, the adhesion surface of the shielding case 13 and the surface of the chip 12 may be a frosted surface or a concave-convex surface.
In addition, in the electronic device provided in the embodiment of the present application, the shielding case 13 is preferably grounded, so that energy generated by the electromagnetic signal induced by the shielding case is rapidly consumed.
Example two
Fig. 2 is a schematic cross-sectional view of an electronic device according to a second embodiment. As shown in fig. 2, the electronic device provided in the embodiment of the present application also includes a main board 11, a chip 12, a shield case 13, and a regulator 14.
The chip 12 is fixed to the motherboard 11 by soldering, and is connected to a printed circuit or other interface contact on the motherboard 11. The shielding cover 13 covers the surface of the chip 12; the adjusting piece 14 is fixedly connected with the main board 11, and the shielding cover 13 can be attached to the chip 12 by adjusting the height of the shielding cover 13, so that a gap between the shielding cover 13 and the chip 12 is avoided.
Because there is no gap between the shielding can 13 and the chip 12, there is no air layer or vacuum layer with strong thermal resistance between the two, and the heat generated by the operation of the integrated circuit in the chip 12 can be quickly transferred to the shielding can 13 through the surface material of the chip 12, i.e. the heat can be quickly dissipated.
As shown in fig. 2, in the embodiment of the present application, the shielding case 13 includes an annular flange located at an edge, and a through hole is formed in the annular flange.
The aforementioned adjusting member 14 includes a screw 143 and an elastic elevating member 144. Wherein the screw 143 can pass through the through hole on the annular flange of the shielding case 13 to fix the shielding case 13 on the main board 11. In addition, the heightening elastic member is arranged between the annular flange and the main plate 11; during tightening of the screw 143, the annular bead approaches the main plate 11, causing a certain elastic deformation of the padding elastic element. Because the elastic elevating member 144 itself has a certain compression characteristic, the space of its elastic deformation can make the shielding case 13 have a certain degree of adjustability relative to the main board 11, so that the chip 12 and the shielding case 13 can be attached.
In the embodiment of the present application, the elastic elevating member 144 may be an annular elastic member with a size slightly larger than the diameter of the screw 143, and the annular elastic member may be sleeved on the screw 143 to achieve self-positioning. In other embodiments, the padding elastic member may also be a ring member having a size substantially the same as that of the annular edge of the shielding case 13, and the padding elastic member is also provided with a through hole at a position corresponding to the annular flange through hole.
As with the first embodiment, in the present application, the thermal conductive adhesive layer 15 may also be disposed between the shielding can 13 and the chip 12, so as to utilize the thermal conductive adhesive layer 15 to perform a buffering function and a thermal conduction function, thereby avoiding a fine gap between the shielding can 13 and the chip 12.
In addition, the bonding surface of the shielding case 13 and the surface of the chip 12 may be a frosted surface or a concave-convex surface, so as to achieve better fixation of the heat conductive adhesive layer 15 and increase the heat dissipation surface area.
EXAMPLE III
Fig. 3 is a schematic cross-sectional view of an electronic device according to a third embodiment. As shown in fig. 3, the electronic device provided in the embodiment of the present application also includes a main board 11, a chip 12, a shield case 13, and a regulator 14.
The chip 12 is fixed to the motherboard 11 by soldering, and is connected to a printed circuit or other interface contact on the motherboard 11. The shielding cover 13 covers the surface of the chip 12; the adjusting piece 14 is fixedly connected with the main board 11, and the shielding cover 13 can be attached to the chip 12 by adjusting the height of the shielding cover 13, so that a gap between the shielding cover 13 and the chip 12 is avoided.
In the embodiment of the present application, the adjusting member 14 is an elastic deformation member. The elastic deformation member is mounted on the main board 11, and the edges of the shield case 13 are connected; the elastic deformation member adjusts the height of the shielding case 13 through its own elastic deformation, so that the shielding case 13 is adaptively attached to the surface of the chip 12, and a gap is prevented from being generated between the shielding case 13 and the chip 12.
Because there is no gap between the shielding can 13 and the chip 12, there is no air layer or vacuum layer with strong thermal resistance between the two, and the heat generated by the operation of the integrated circuit in the chip 12 can be quickly transferred to the shielding can 13 through the surface material of the chip 12, i.e. the heat can be quickly dissipated.
In the embodiment of the present application, the adjusting member 14 may be fixed on the main board 11 by a screw 143, or may be fixed on the main board 11 by a welding connection method.
In the electronic device provided in the embodiment of the present application, a thermal conductive adhesive layer 15 may be further disposed between the shielding can 13 and the chip 12. The heat conducting adhesive layer 15 has certain elastic deformation capacity, can buffer impact on the chip 12 in the installation process of the shielding case 13, and can reduce a fine gap between the shielding case 13 and the chip 12.
In this application embodiment, the binding face of shield cover 13 and the surface of chip 12 can set up to frosting or concave-convex surface to increase the area of contact of heat-conducting adhesive layer 15 with shield cover 13 and chip 12, realize better heat dissipation.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the spirit of the invention. For example, the above features may be interchanged with other features disclosed in this application, but not limited to those having similar functions.
Claims (10)
1. An electronic device includes a chip, a shield case, and a regulating member;
the shielding cover covers the chip and is used for realizing electromagnetic shielding of the chip and conducting heat generated by the chip;
the adjusting piece is used for adjusting the height of the shielding case, so that the shielding case is attached to the chip.
2. The electronic device of claim 1, comprising a motherboard;
the chip is fixed on the mainboard;
the adjusting piece enables the edge of the shielding cover to be connected with the mainboard, and the shielding cover covers the chip.
3. The electronic device of claim 2, wherein:
the adjusting piece is an elastic deformation piece;
the elastic deformation piece is connected with the edge of the shielding cover, and the height of the shielding cover is adjusted through the elastic deformation of the elastic deformation piece.
4. The electronic device of claim 2, wherein:
the adjusting piece comprises an annular flanging part and a clamping part; the annular flanging part is fixedly connected with the main board;
the edge of the shielding cover is provided with a clamping matching part; the clamping matching part is matched with the clamping part in an elastic clamping manner;
the joint cooperation portion with joint portion cooperation degree is different and makes the high difference of shield cover.
5. The electronic device of claim 4, wherein:
the annular flanging part is connected with the main board in a welding mode or is connected with the main board through a screw.
6. The electronic device of claim 2, wherein:
the shielding cover comprises an annular flanging positioned at the edge; a through hole is formed in the annular flanging;
the adjusting piece comprises a screw and an elastic cushion piece;
the screw penetrates through the through hole to be fixedly connected with the main board, and the elastic padding piece between the annular flanging and the main board is compressed to change the height of the shielding cover.
7. The electronic device of any of claims 2-6, wherein:
the shield cover is detachably connected with the adjusting piece.
8. The electronic device of any of claims 2-6, wherein:
a heat-conducting adhesive layer is arranged between the shielding cover and the chip; the heat conducting adhesive layer is used for conducting heat generated by the chip to the shielding case.
9. The electronic device of claim 8, wherein:
the binding surface of the shielding cover is bound with the surface of the chip;
the surface of at least one of the binding surface of the shielding cover and the chip is a frosted surface or a concave-convex surface.
10. The electronic device of any of claims 1-6, wherein:
the shield is grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921006541.XU CN210183794U (en) | 2019-06-30 | 2019-06-30 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921006541.XU CN210183794U (en) | 2019-06-30 | 2019-06-30 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210183794U true CN210183794U (en) | 2020-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921006541.XU Active CN210183794U (en) | 2019-06-30 | 2019-06-30 | Electronic device |
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| Country | Link |
|---|---|
| CN (1) | CN210183794U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113079685A (en) * | 2021-03-25 | 2021-07-06 | Oppo广东移动通信有限公司 | Shielding cover, shielding assembly and electronic equipment |
-
2019
- 2019-06-30 CN CN201921006541.XU patent/CN210183794U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113079685A (en) * | 2021-03-25 | 2021-07-06 | Oppo广东移动通信有限公司 | Shielding cover, shielding assembly and electronic equipment |
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