CN210183536U

CN210183536U - Loudspeaker half module with connecting circuit

Info

Publication number: CN210183536U
Application number: CN201921509404.8U
Authority: CN
Inventors: Hongjun Quan; 全洪军; Longhui Wang; 王隆辉; Chao Xu; 徐超; Jingjing Yuan; 袁晶晶; Shunting Chen; 陈顺挺; Jiaxiang Zheng; 郑佳祥
Original assignee: XIAMEN TUNESS ELECTRONIC CO Ltd
Current assignee: XIAMEN TUNESS ELECTRONIC CO Ltd
Priority date: 2019-09-11
Filing date: 2019-09-11
Publication date: 2020-03-24
Anticipated expiration: 2029-09-11

Abstract

The utility model provides a utensil connecting circuit's half module of speaker, include: the loudspeaker comprises a bracket upper cover, a loudspeaker single body accommodated in the bracket upper cover and a flexible circuit board electrically connected with the loudspeaker single body; an external interface is arranged on one side of the rear cavity of the bracket upper cover; an external connection area is arranged in the upper cover of the bracket and is positioned on one side, close to the external interface, of the outside of the retaining wall of the rear cavity; still including being fixed in two circuit pieces in the support upper cover, the circuit piece includes tin-plated section and gilding section, the tin-plated section is located inside the back chamber and with the flexible circuit board is connected, the gilding section is located the outer joining region department. The utility model discloses structural design is ingenious, moulds plastics circuit piece and support upper cover integratively, and the setting of circuit piece has saved the equipment back and has beaten gluey sealed process, has improved assembly precision and assembly efficiency.

Description

Loudspeaker half module with connecting circuit

Technical Field

The utility model relates to a speaker module, more specifically the theory that says so relates to a half module of utensil connecting circuit's speaker.

Background

The speaker module is an electroacoustic transducer, and is often used in electronic products.

At present, when traditional speaker module installation, need wear out the circuit piece from the sealed barricade bottom of back chamber, it is sealed still to beat it to glue after the equipment, and this kind of mode assembly error is big and assembly efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model provides a half module of utensil connecting circuit's speaker can effectively solve above-mentioned problem.

The utility model discloses a realize like this:

a speaker half module with connecting circuitry, comprising: the loudspeaker comprises a bracket upper cover, a loudspeaker single body accommodated in the bracket upper cover and a flexible circuit board electrically connected with the loudspeaker single body; an external interface is arranged on one side of the rear cavity of the bracket upper cover; an external connection area is arranged in the upper cover of the bracket and is positioned on one side, close to the external interface, of the outside of the retaining wall of the rear cavity;

still including being fixed in two circuit pieces in the support upper cover, the circuit piece includes tin-plated section and gilding section, the tin-plated section is located inside the back chamber and with the flexible circuit board is connected, the gilding section is located the outer joining region department.

As a further improvement, the circuit chip further comprises a fold line section which is connected between the tin plating section and the gold plating section, and the fold line section is wrapped in the bracket upper cover.

As a further improvement, the broken line segment is provided with a concave-convex structure.

As a further improvement, the height difference between the gold-plating section and the tin-plating section is 0.1 mm-0.8 mm.

As a further improvement, the upper surface of the circuit chip is flush with the surface of the bracket upper cover.

As a further improvement, the thickness of the circuit piece is 0.05 mm-0.3 mm.

The utility model has the advantages that: the circuit piece and the upper cover of the support are molded into a whole by injection, the circuit piece comprises a tinning section connected with the flexible circuit board and a gold-plating section arranged on an outer connection area, the flexible circuit board does not need to be assembled and connected independently, and the elastic pin on the mobile phone main board directly contacts with the gold-plating section. The circuit chip is arranged, so that the procedure of gluing and sealing after assembly is omitted, the accuracy of the PAD area position is improved, and the assembly precision and the assembly efficiency are improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic view of the overall structure provided by the embodiment of the present invention.

Fig. 2 is an exploded view of the overall structure provided by the embodiment of the present invention.

Fig. 3 is a schematic view of a part of the structure provided by the embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a removal positioning section according to an embodiment of the present invention.

Fig. 5 is a front view of a partial structure of a circuit board according to an embodiment of the present invention.

Fig. 6 is a perspective view of a partial structure of a circuit board according to an embodiment of the present invention.

In the figure: 1. bracket upper cover 11, rear cavity 111, retaining wall 12, external interface 13 and external connection area

2. Loudspeaker monomer 3, flexible circuit board 4, circuit board 41, tin-plated section

42. Gilding section 43, broken line section 44, positioning section 45 and taper hole structure

h: height difference between gold plating section and tin plating section

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to 6, a speaker half module with a connection circuit includes: the loudspeaker comprises a bracket upper cover 1, a loudspeaker single body 2 accommodated in the bracket upper cover 1 and a flexible circuit board 3 electrically connected with the loudspeaker single body 2; an external interface 12 is arranged on one side of the rear cavity 11 of the bracket upper cover 1, and when the utility model is applied to electronic products, the external interface 12 is used for placing a data transmission part; an external connection area 13 is arranged in the bracket upper cover 1, and the external connection area 13 is positioned on one side, close to the external interface 12, outside the retaining wall 111 of the rear cavity 11; the utility model discloses still including being fixed in two circuit chips 4 in support upper cover 1, circuit chip 4 includes tin-plated section 41 and gilding section 42, tin-plated section 41 is located inside rear chamber 11 and with flexible circuit board 3 is connected, gilding section 42 is located outer joining region 13 department, on the mainboard of electronic product bullet foot direct contact gilding section 42 can, relative ratio tradition structure, the utility model discloses need not assemble alone and connect flexible circuit board 3, saved the assembly process, improved assembly efficiency, and gilding section 42's setting has promoted the reliability and the oxidation resistance of contact point; be equipped with taper hole structure 45 on the tinning section 41, taper hole structure 45 makes tinning section 41 better with flexible circuit board 3's hot pressure welding effect.

Referring to fig. 5 to 6, the circuit chip 4 further includes a fold line section 43 disposed between the tin plating section 41 and the gold plating section 42, and the fold line section 43 is wrapped in the bracket upper cover 1. Preferably, the height difference h between the gold-plating section 42 and the tin-plating section 41 is 0.1mm to 0.8 mm. More preferably, the height difference h between the gold-plating section 42 and the tin-plating section 41 is 0.3mm to 0.5 mm. In this embodiment, the height difference h between the gold-plating section 42 and the tin-plating section 41 is 0.35 mm. The arrangement of the broken line segments 43 improves the binding force between the circuit chip 4 and the bracket upper cover 1, and compared with the traditional structure, the arrangement of the broken line segments 43 ensures the sealing property of the rear cavity 11.

The broken line section 43 is provided with a concave-convex structure (not shown in the figure), and the concave-convex structure enables the broken line section 43 and the upper bracket cover 1 to be better in combination force. Referring to fig. 6, in this embodiment, the concave-convex structure is a tapered hole structure 45, that is, a tapered hole structure 45 is disposed on the broken line segment 43, and the tapered hole structure 45 enables plastic to be solidified after passing through the tapered hole structure 45 when the process of injection molding the bracket upper cover 1 is performed, so that the bonding force between the broken line segment 43 and the bracket upper cover 1 is better.

Preferably, the thickness of the circuit chip 4 is 0.05mm to 0.3 mm. More preferably, the thickness of the circuit chip 4 is 0.15mm to 0.25 mm. In this embodiment, the thickness of the circuit chip 4 is 0.2mm, so that the cost performance of the product is the highest.

Referring to fig. 1 to 6, a manufacturing process of a speaker half module with a connecting circuit includes the following steps:

s1, injection-molding a circuit board 4 in the bracket upper cover 1, wherein the circuit board 4 comprises a positioning section 44, a tin-plated section 41 and a gold-plated section 42, the positioning section 44 is located on the outer side of the bracket upper cover 1, the tin-plated section 41 is located inside the rear cavity 11 of the bracket upper cover 1, and the gold-plated section 42 is located outside the rear cavity 11;

s2, removing the positioning section 44, and breaking the circuit board 4 into two relatively independent connecting sheets in the bracket upper cover 1;

s3, the horn unit 2 is accommodated and fixed in the bracket upper cover 1;

and S4, mounting a flexible circuit board 3 on the bracket upper cover 1, and performing hot-press welding connection on two ends of the flexible circuit board 3 with the horn unit 2 and the tinning section 41 respectively. At the moment, the two gold-plated sections are respectively used as access points of the positive electrode and the negative electrode of the circuit of the loudspeaker half module.

In step S1, the upper mold of the injection mold abuts on the circuit chip 4 so that the upper surface of the circuit chip 4 is flush with the surface of the carrier cover 1, keeping the working surface of the circuit chip 4 exposed in the inner surface of the carrier cover 1. This arrangement facilitates the voltage bonding of the tin plating section 41 to the flexible circuit board 3 and the contact of the gold plating section 42 provided in the outer land 13 with the spring pins of the electronic product.

In step S4, the thermocompression bonding of the two ends of the flexible circuit board 3 to the horn unit 2 and the tin plating section 41 is completed simultaneously. Compared with the traditional structure, the processing mode saves the assembly manufacturing process and improves the assembly efficiency.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A speaker half module with connecting circuitry, comprising: the loudspeaker comprises a bracket upper cover, a loudspeaker single body accommodated in the bracket upper cover and a flexible circuit board electrically connected with the loudspeaker single body; an external interface is arranged on one side of the rear cavity of the bracket upper cover; an external connection area is arranged in the upper cover of the bracket and is positioned on one side, close to the external interface, of the outside of the retaining wall of the rear cavity; it is characterized in that the preparation method is characterized in that,

2. The speaker half module as in claim 1, wherein the circuit piece further comprises a fold line segment connected between the tin plated segment and the gold plated segment, and wherein the fold line segment is encased in the bracket top cover.

3. The speaker half module of claim 2, wherein the break line segment is provided with a relief structure.

4. The speaker half module as claimed in claim 2, wherein the height difference between the gold plated section and the tin plated section is 0.1mm to 0.8 mm.

5. The speaker half module of claim 1, wherein the top surface of the die is flush with the surface of the bracket top cover.

6. The speaker half module of claim 1, wherein the die has a thickness of 0.05mm to 0.3 mm.