CN210092124U

CN210092124U - Ceramic packaging support, lamp bead unit and Mini LED

Info

Publication number: CN210092124U
Application number: CN201921293017.5U
Authority: CN
Inventors: 温小斌; 纪扬; 陈文佳
Original assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Current assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Priority date: 2019-08-12
Filing date: 2019-08-12
Publication date: 2020-02-18
Anticipated expiration: 2029-08-12

Abstract

The utility model provides a ceramic packaging support, have this packaging support's lamp pearl unit and have this lamp pearl Mini LED of unit, ceramic packaging support sets up "Z" shape structure, arrange into Mini LED light-emitting module through the lamp pearl unit that packaging support of "Z" shape structure made, the "Z" shape structure is assembled easily, namely the first pin portion and the second pin portion of adjacent lamp pearl unit overlap the cooperation from top to bottom, and form the electricity and connect, the structural connection is compact, zero clearance, the intensity is good, it is accurate to arrange the size, difficult deviation; and electrodes do not need to be arranged on the substrate for surface mount packaging, the limitation of the substrate electrodes is cancelled, and the electrodes can be randomly arranged.

Description

Ceramic packaging support, lamp bead unit and Mini LED

Technical Field

The utility model relates to a semiconductor illumination shows the field, concretely relates to pottery encapsulation support, have this encapsulation support's lamp pearl unit and have the Mini LED of this lamp pearl unit.

Background

The Mini LED is a display screen which adopts a more precise device and a new packaging mode to realize pixel particles of 0.2-0.9 mm. With the reduction of the cost of the LED chip and the progress of the technology, and the recent increase and weakness of the LED lighting industry, new market growth points are searched for at large time at home and abroad with LED chips and packaging huge times, Mini & Micro LEDs are particularly concerned in two years as a new technology with wide market prospects, Micro LEDs are difficult to be commercialized on a large scale in a short time due to uncertain technical routes and high cost at present, and Mini LEDs are used as the extension of small-distance LED products and the introduction of Micro LEDs, and are already delivered in LCD backlight and RGB display products.

The conventional Mini led generally uses a cob (chip On board) package, that is, a bare chip is directly packaged On a substrate, although the advantages of compactness and rapidness can be realized, the chip is not screened by a photoelectric test, and the yield of the packaging method is poor due to the abnormality during packaging. The other mode is to package through the mode of paster, encapsulates the chip earlier and forms single small-size lamp pearl on the support promptly, then pastes the lamp pearl on the base plate, and this kind of mode can carry out normal photoelectric test in advance because of the encapsulation of chip earlier, and the encapsulation yield promotes by a wide margin. However, each bead is independently and electrically connected to the substrate, which requires a corresponding connection electrode on the substrate, and the structure formed by the beads is limited to the layout of the connection electrodes on the substrate, so that the beads cannot be randomly arranged.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model provides a pottery encapsulation support, have this encapsulation support's lamp pearl unit and have the Mini LED of this lamp pearl unit, have the characteristics that the encapsulation yield is high, can arrange the figure at will, can effectively solve the problem that exists among the background art.

In order to achieve the above purpose, the utility model provides a technical scheme as follows:

the utility model provides a ceramic package support, is "Z" shape structure, includes encapsulation portion, connects in the first pin portion of the upper portion position of encapsulation portion side and connects in the second pin portion of the lower part position of encapsulation portion another side, the upper surface of encapsulation portion and the upper surface parallel and level of first pin portion are formed with the encapsulation face, the encapsulation face is equipped with opposite polarity's first electrode and second electrode, the lower surface of first pin portion is equipped with the first contact of connecting first electrode, the upper surface of second pin portion is equipped with the second contact of connecting the second electrode.

Furthermore, the upper surfaces of the packaging part and the first pin part are recessed downwards to form a bowl-cup structure, and the bottom surface of the bowl-cup structure forms the packaging surface.

Furthermore, the packaging part, the first pin part and the second pin part are all of square structures with equal width.

Further, the sum of the heights of the first lead part and the second lead part is slightly smaller than the height of the packaging part.

A lamp bead unit comprises a packaging support and an LED chip packaged on the packaging support, wherein the packaging support is the ceramic packaging support.

A Mini LED comprises a substrate and a Mini LED light-emitting module arranged on the substrate, wherein the Mini LED light-emitting module is formed by arranging a plurality of lamp bead units in an array mode, and the lamp bead units are the lamp bead units; the first pin part and the second pin part of the adjacent lamp bead units are in up-and-down overlapped fit, and the first contact of the first pin part is electrically connected with the second contact of the second pin part.

Furthermore, a conductive adhesive layer is arranged between the first pin part and the second pin part which are matched with each other in an overlapping mode of the adjacent lamp bead units.

Further, the surface coating of base plate has a bonding glue film, and lamp pearl unit is fixed in on the base plate through the bonding of bonding glue film.

Furthermore, a plurality of lamp bead units are connected end to form an electrically connected row unit, the plurality of row units are arranged in parallel to form the Mini LED light-emitting module, and the lamp bead units at the edges of adjacent rows are electrically connected through metal welding wires.

Through the utility model provides a technical scheme has following beneficial effect:

the lamp bead units made of the packaging support with the Z-shaped structure are arranged to form a Mini LED light-emitting module, the Z-shaped structure is easy to assemble, namely, the first pin part and the second pin part of the adjacent lamp bead units are vertically overlapped and matched and form electric connection, the structure is compact in connection, no gap exists, the density is good, the arrangement size is accurate, and deviation is not easy to occur; and electrodes do not need to be arranged on the substrate for surface mount packaging, the limitation of the substrate electrodes is cancelled, and the electrodes can be randomly arranged. Meanwhile, the lamp bead units can be subjected to photoelectric detection firstly, and then the patterned Mini LED light-emitting modules are arranged in an array mode, so that the yield is improved.

Drawings

FIG. 1 is a schematic perspective view of an exemplary embodiment of a ceramic package support;

FIG. 2 is a cross-sectional view of an exemplary ceramic package support;

fig. 3 is a cross-sectional view of a bead unit encapsulated and molded by a ceramic encapsulation bracket in the embodiment;

FIG. 4 is a schematic diagram illustrating connection between adjacent bead units in an embodiment;

fig. 5 is a schematic structural diagram of a Mini LED in the embodiment.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

Referring to fig. 1 and 2, the present embodiment further provides a ceramic package support 1, that is, a package support made of ceramic material, which is a "Z" shaped structure and includes a package portion 13, a first lead portion 11 connected to an upper portion of one side surface of the package portion 13, and a second lead portion 12 connected to a lower portion of the other side surface of the package portion 13, an upper surface of the package portion 13 is flush with an upper surface of the first lead portion 11 and forms a package surface, the package surface is provided with a first electrode 101 and a second electrode 102 (i.e., a positive electrode and a negative electrode) with opposite polarities, a lower surface of the first lead portion 11 is provided with a first contact 111 connected to the first electrode 101, and an upper surface of the second lead portion 12 is provided with a second contact 112 connected to the second electrode 102.

Further, in the present embodiment, the upper surfaces of the sealing portion 13 and the first lead portion 11 are recessed downward to form a bowl structure 14, and the bottom surface of the bowl structure 14 forms the sealing surface. By adopting the bowl structure 14, on one hand, the inner wall of the bowl structure 14 has a reflection function, so that the light output amount can be increased, and the concentration of the emergent light is good; on the other hand, bowl cup structure 14 has the effect of holding, when encapsulating, can make LED chip and encapsulation glue all hold wherein, and the encapsulation glue can not be excessive, assurance lamp pearl unit 2's that can be fine quality. Of course, in other embodiments, a bowl structure may not be required.

Further, in this embodiment, the packaging portion 13, the first lead portion 11, and the second lead portion 12 are all square structures with equal widths, which can achieve good matching, and the overall appearance is neat and well connected. Of course, in other embodiments, the shapes of the package portion 13, the first lead portion 11, and the second lead portion 12 are not limited thereto.

Further, in this embodiment, the sum of the heights of the first lead part 11 and the second lead part 12 is slightly smaller than the height of the package part, so that when the adjacent lamp bead units 2 are matched, a yield space can be provided for the matching size of the first lead part 11 and the second lead part 12 which are overlapped and matched, and the abnormal situation of warping caused by large error of size during matching is prevented; meanwhile, the first contact 111 of the first lead part 11 and the second contact 112 of the second lead part 12 preferably protrude from the surface of the lead parts, so that electrical contact can be well ensured.

With reference to fig. 3, the embodiment further provides a lamp bead unit 2, which includes a packaging support and an LED chip packaged on the packaging support, where the packaging support is the ceramic packaging support 1.

Specifically, the LED chip 21 is packaged on the packaging surface of the packaging support, that is, the LED chip 21 is die-bonded on the packaging surface of the ceramic packaging support 1, the P electrode and the N electrode of the LED chip 21 are respectively connected to the first electrode 101 and the second electrode 102 of the packaging support 1, and then the packaging adhesive 22 is covered to realize the die-bonding, where the packaging manner of the LED chip 21 is the prior art.

With reference to fig. 5, the present embodiment further provides a Mini LED, including a substrate 40 and a Mini LED light-emitting module 3 disposed on the substrate 40, where the Mini LED light-emitting module 3 is formed by arranging a plurality of bead units in an array, and the bead units are the bead units 2; as shown in fig. 4, the first lead part 11 and the second lead part 12 of the adjacent lamp bead units 2 are in up-and-down overlapped fit, and the first contact 111 of the first lead part 11 and the second contact 112 of the second lead part 12 form an electrical connection, as shown in fig. 4.

The lamp bead units 2 made of the packaging support with the Z-shaped structure are arranged to form the Mini LED light-emitting module 3, the Z-shaped structure is easy to assemble, namely, the first pin part 11 and the second pin part 12 of the adjacent lamp bead units 2 are overlapped and matched up and down and form electric connection, the structure is compact in connection, free of gap, good in concentration, accurate in arrangement size and not prone to deviation; and electrodes do not need to be arranged on the substrate for surface mount packaging, the limitation of the substrate electrodes is cancelled, and the electrodes can be randomly arranged. Meanwhile, the lamp bead units 2 can be subjected to photoelectric detection, and then the patterned Mini LED light-emitting modules 3 are arranged in an array mode, so that the yield is improved.

Specifically, the LED chip 21 is packaged on the packaging surface of the packaging support, that is, the LED chip 21 is die-bonded on the packaging surface of the packaging support, the P electrode and the N electrode of the LED chip 21 are respectively connected to the first electrode 101 and the second electrode 102 of the packaging support 1, and then the packaging adhesive 22 is covered to realize the die-bonding, where the packaging manner of the LED chip 21 is the prior art.

Still further, in this embodiment, a conductive adhesive layer 30 is disposed between the first pin portion 11 and the second pin portion 12 of the adjacent lamp bead units 2 in overlapped fit, the conductive adhesive layer 30 is coated on the upper surface of the second pin portion 12 of the previous lamp bead unit 2, the first pin portion 11 of the next lamp bead unit 2 is in overlapped fit with the second pin portion 12 of the previous lamp bead unit 2, the conductive adhesive layer can well perform bonding and conductive functions, and the bonding firmness and the electrical connection between the lamp bead units 2 are ensured. Specifically, the conductive adhesive layer 30 is solder paste or silver paste in the prior art. Of course, in other embodiments, the structure of coating the conductive adhesive layer 30 may not be required.

Further, in this embodiment, a bonding adhesive layer (not shown) is coated on the surface of the substrate 40, the lamp bead units 2 are fixed on the substrate 40 by bonding of the bonding adhesive layer, a bonding adhesive layer is coated on the surface of the substrate 40, and then the lamp bead units 2 are arranged in an array and are fixedly bonded on the substrate 40. The bonding glue layer can be fine with lamp pearl unit rigid coupling on base plate 40, and simple structure, the realization of being convenient for. Of course, in other embodiments, other methods of fastening may be used.

Further, in this embodiment, a plurality of the bead units 2 are connected end to form electrically connected row units, the plurality of the row units are arranged in parallel to form the Mini LED lighting module 3, and the bead units 2 at the edges of adjacent rows are electrically connected by the metal welding rod 51 to form the electrical connection of the whole Mini LED lighting module 3; this kind of mode of arrangement is simple. Specifically, arrange the second contact 112 of the marginal lamp pearl unit 2 of unit and set up upwards, directly connect through metal welding rod 51, arrange the first contact 111 of the marginal lamp pearl unit 2 of unit promptly, the accessible increases a protruding muscle 52 at base plate 40, inlays metal welding rod 51 on protruding muscle 52, when arranging lamp pearl unit 2, aligns metal welding rod 51 on the protruding muscle 52 with the first contact 111 of marginal lamp pearl unit 2, carries out the electricity and connects. Of course, in other embodiments, the Mini LED lighting modules 3 may be arranged in other array manners.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A ceramic package support, characterized in that: be "Z" shape structure, including encapsulation portion, connect in the first pin portion of the upper portion position of encapsulation portion side and connect in the second pin portion of the lower part position of encapsulation portion another side, the upper surface of encapsulation portion and the upper surface parallel and level of first pin portion are formed with the encapsulation face, the encapsulation face is equipped with opposite polarity's first electrode and second electrode, the lower surface of first pin portion is equipped with the first contact of connecting the first electrode, the upper surface of second pin portion is equipped with the second contact of connecting the second electrode.

2. The ceramic package support of claim 1, wherein: the upper surfaces of the packaging part and the first pin part are recessed downwards to form a bowl-cup structure, and the bottom surface of the bowl-cup structure forms the packaging surface.

3. The ceramic package support of claim 1, wherein: the packaging part, the first pin part and the second pin part are all of square structures with equal width.

4. The ceramic package support of claim 1, wherein: the sum of the heights of the first lead part and the second lead part is slightly smaller than the height of the packaging part.

5. The utility model provides a lamp pearl unit, includes encapsulation support and the LED chip of encapsulation on this encapsulation support, its characterized in that: the package support is the ceramic package support of any one of claims 1 to 4.

6. A Mini LED, characterized by: the Mini LED lamp comprises a substrate and a Mini LED light-emitting module arranged on the substrate, wherein the Mini LED light-emitting module is formed by arranging a plurality of lamp bead unit arrays, the lamp bead units are the lamp bead units in claim 5, a first pin part and a second pin part of each adjacent lamp bead unit are in up-and-down overlapped fit, and a first contact of the first pin part is electrically connected with a second contact of the second pin part.

7. The Mini LED of claim 6, wherein: and a conductive adhesive layer is arranged between the first pin part and the second pin part which are matched with each other in an overlapping way by adjacent lamp bead units.

8. The Mini LED of claim 6, wherein: the surface coating of base plate has a bonding glue film, and lamp pearl unit is fixed in on the base plate through the bonding of bonding glue film.

9. The Mini LED of claim 6, wherein: the lamp bead units are connected end to form a row unit which is electrically connected, the row units are arranged in parallel to form the Mini LED light-emitting module, and the lamp bead units at the edges of adjacent rows are electrically connected through metal welding wires.