CN206210791U - A kind of LED component and LED display - Google Patents
A kind of LED component and LED display Download PDFInfo
- Publication number
- CN206210791U CN206210791U CN201621179720.XU CN201621179720U CN206210791U CN 206210791 U CN206210791 U CN 206210791U CN 201621179720 U CN201621179720 U CN 201621179720U CN 206210791 U CN206210791 U CN 206210791U
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- Prior art keywords
- led
- substrate
- led component
- led chip
- chip
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED component and LED display, the LED component includes substrate, at least three LED chips and the encapsulation glue-line in upper surface of base plate encapsulated moulding；The LED chip is arranged on the substrate and is electrically connected with the substrate, the encapsulation glue-line cladding LED chip；It is characterized in that：At least three LED chip is single electrode chip.The substrate includes a public wire welding area and at least three crystal bonding areas, is mutually insulated between the public wire welding area and crystal bonding area；The LED chip is individually fixed on the crystal bonding area.LED component described in the utility model, by the reasonable setting of crystal bonding area and public wire welding area, reduces the size of LED component, can effectively improve the resolution ratio of LED display.
Description
Technical field
The utility model is related to field of luminescent technology, more particularly to a kind of LED component and LED display.
Background technology
At present, LED component is mainly used in LED display, when LED component is used on LED display, LED component
Size it is bigger, cause the volume of LED encapsulation structure bigger, so as to reduce the resolution ratio of LED display.
In traditional all-colour LED device, red LED chip uses vertical stratification, green LED chip and blue-light LED chip
Using horizontal structure, the gold thread quantity needed for welding LED chip is more, and reserved certain pitch of weld is needed when gold thread is welded
From, and welding disking area on LED support is larger.Therefore, the overall dimensions of traditional LED component are difficult to very little.Together
When, it is necessary to the increase of gold thread quantity of welding can bring production cost to uprise, production efficiency step-down, and the device that bonding wire is caused
The problems such as reliability is reduced.Therefore, it is necessary to provide a kind of encapsulating structure of LED component, reduced size wire welding area is made it have
And less size.
Utility model content
The purpose of this utility model is to overcome shortcoming and defect of the prior art, there is provided a kind of LED component and LED are aobvious
Display screen, the LED component needs the gold thread quantity of welding few, and the size of device is small.
The utility model is achieved through the following technical solutions：A kind of LED component, including substrate, at least three LED cores
Piece and the encapsulation glue-line in upper surface of base plate encapsulated moulding；The LED chip be arranged on the substrate and with the substrate
Electrical connection, the encapsulation glue-line cladding LED chip；It is characterized in that：At least three LED chip is single electrode chip.
Relative to prior art, LED component of the present utility model, by using single electrode chip, reduces making for bonding wire
With, cost has been saved, the reliability of LED component is improved, and the size of LED component is reduced, LED display can be effectively improved
Resolution ratio.
Further, the substrate includes a public wire welding area and at least three crystal bonding areas, the public wire welding area and solid
Mutually insulated between crystalline region；The LED chip is individually fixed on the crystal bonding area.By crystal bonding area and public wire welding area
Rationally set, reduce the size of LED component, the resolution ratio of LED display can be effectively improved.
Further, the substrate includes a public wire welding area and three crystal bonding areas, and the public wire welding area and three consolidate
Crystalline region is arranged in array 2 × 2.
Further, the LED component includes three single-electrode LED chips, respectively red LED chip, blue-light LED chip
And green LED chip.
Further, the length and width of the substrate is equal, and the length and width of the substrate is 0.39mm~1.1mm.
Further, the length and width of the substrate is 0.5mm*0.5mm.
Further, the size of described red LED chip be 3.5*3.5mil-5.5*5.5mil between, the blue-ray LED
The size of chip is 5*5mil, and the size of the green LED chip is 5*5mil.
Further, the substrate is black BT substrates.
Further, the encapsulation glue-line is black.
The utility model additionally provides a kind of LED display, including multiple LED components, PCB and mask；Institute
State LED component to install and be electrically connected at the PCB, the mask is fastened on the PCB top.It is described
LED component is any one foregoing LED component.
Relative to prior art, LED display of the present utility model, using the LED component that size is small, reliability is high, energy
Effectively improve the resolution ratio and service life of LED display.
In order to more fully understand and implement, the utility model is described in detail below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is the structural representation of the LED component in embodiment 1.
Specific embodiment
Embodiment 1
Fig. 1 is referred to, it is the structural representation of the LED component of the present embodiment.The LED component includes substrate 10, LED
Chip 20, encapsulation glue-line (not shown).The LED chip 20 is arranged on substrate 10 and is electrically connected with substrate 10, the encapsulation
Glue-line is arranged on substrate 10, and encapsulates the glue-line cladding LED chip 20.
.Include a crystal bonding area 12 for the mutually insulated of public wire welding area 11 and at least three on the substrate 10.The public affairs
Also mutually insulated is total between wire welding area 11 and crystal bonding area 12.Described each crystal bonding area 12 is used to lay a LED chip 20, described
The number of LED chip 20 is consistent with the number of the crystal bonding area 12.In the present embodiment, it is public including one on the substrate
Wire welding area 11 and three crystal bonding areas of mutually insulated 12.The public wire welding area 11 and three crystal bonding areas 12 are in the row of array 2 × 2
Row.The shape of the crystal bonding area 12 can be square or circular, and be not limited to this.
In the present embodiment, the substrate is black BT substrates.The substrate is alternatively common pcb board or TOP-LED branch
Frame.When the substrate is black BT substrates, be greatly improved the LED component goes out optical contrast ratio.The shape of the substrate
Can be rectangle, square, parallelogram, trapezoidal, irregular figure or circle etc., in the present embodiment, the substrate
Be shaped as square, and be not limited to the shape of the present embodiment.Three crystal bonding areas and a public wire welding area are divided successively
It is distributed in four angles of substrate.
The LED chip includes red LED chip, a blue-light LED chip and a green LED chip.It is described
Red LED chip, blue-light LED chip and green LED chip are single electrode chip.The red LED chip, blue-ray LED core
Piece and green LED chip are individually fixed on three crystal bonding areas, and by bonding wire are welded in public wire welding area respectively.At this
In embodiment, the size of the red LED chip of the single electrode is 3.5*3.5mil-5.5*5.5mil, the indigo plant of the single electrode
The size of light LED chip is 5*5mil, and the size of the green LED chip of the single electrode is 5*5mil.Specifically, single electricity
The top of pole piece piece is P poles, and bottom is N poles.The N poles of three single electrode chips are respectively fixedly connected with three by conducting resinl
Individual crystal bonding area.The P poles of three single electrode chips are welded to connect in public wire welding area.
The preparation of the LED component is comprised the following steps：
S1：Prepared substrate：At the top of BT substrates or other substrates by way of plating or the heavy plating of chemistry, in the base
At least three crystal bonding areas and a public wire welding area are formed on plate top, between the multiple crystal bonding area and public wire welding area mutually absolutely
Edge.
S2：The single-electrode LED chip consistent with crystal bonding area quantity is fixedly mounted on each die bond by conducting resinl respectively
Qu Shang.
S3：The top electrodes of each single-electrode LED chip are welded to connect in the public wire welding area of the substrate.
S4：In substrate top encapsulation colloid, encapsulation glue-line is formed, encapsulation glue-line is coated LED chip, obtain the LED
Device.
Relative to prior art, LED component of the present utility model, by using single electrode chip, reduces making for bonding wire
With, cost has been saved, the reliability of LED component is improved, and by the reasonable setting of crystal bonding area and public wire welding area, reduce
The size of LED component, can effectively improve the resolution ratio of LED display.
Embodiment 2
The present embodiment provides a kind of LED display, and the display screen includes multiple LED components, PCB and face
Cover.The LED component is the LED component described in above-described embodiment one, and its arrangement is installed and is electrically connected at the PCB circuits
Plate, the mask is placed in the top of the PCB and is fastened in PCB.The small size LED component is used to make
During standby LED display, the resolution ratio of LED display can be effectively improved.
Relative to prior art, LED display of the present utility model, LED component is passed through by using single electrode chip
The reasonable setting of crystal bonding area and public wire welding area effectively reduces the size of LED component, so as to effectively increase LED display
Resolution ratio.
The utility model is not limited to above-mentioned implementation method, if do not taken off to various changes of the present utility model or deformation
From spirit and scope of the present utility model, if these are changed and deformation belongs to claim of the present utility model and equivalent technologies
Within the scope of, then the utility model is also intended to comprising these changes and deforms.
Claims (10)
1. a kind of LED component, including substrate, at least three LED chips and the packaging plastic in upper surface of base plate encapsulated moulding
Layer；The LED chip is arranged on the substrate and is electrically connected with the substrate, the encapsulation glue-line cladding LED chip；It is special
Levy and be：At least three LED chip is single electrode chip.
2. LED component according to claim 1, it is characterised in that：The substrate is including a public wire welding area and at least
Three crystal bonding areas, mutually insulate between the public wire welding area and crystal bonding area；The LED chip is individually fixed in the die bond
Qu Shang.
3. LED component according to claim 2, it is characterised in that：The substrate includes a public wire welding area and three
Crystal bonding area, the public wire welding area and three crystal bonding areas arrange in array 2 × 2.
4. LED component according to claim 1, it is characterised in that：The LED component includes three single-electrode LED chips,
Respectively red LED chip, blue-light LED chip and green LED chip.
5. LED component according to claim 1, it is characterised in that：The length and width of the substrate is equal, the substrate
Length and width be 0.39mm~1.1mm.
6. LED component according to claim 1, it is characterised in that：The length and width of the substrate is 0.5mm*
0.5mm。
7. LED component according to claim 4, it is characterised in that：The size of described red LED chip is 3.5*
Between 3.5mil-5.5*5.5mil, the size of the blue-light LED chip is 5*5mil, and the size of the green LED chip is 5*
5mil。
8. LED component according to claim 1, it is characterised in that：The substrate is black BT substrates.
9. LED component according to claim 1, it is characterised in that：The encapsulation glue-line is black.
10. a kind of LED display, including multiple LED components, PCB and mask；The LED component is installed and electrical
The PCB is connected to, the mask is fastened on the PCB top, it is characterised in that：The LED component is
LED component in claim 1-9 described in any claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621179720.XU CN206210791U (en) | 2016-10-27 | 2016-10-27 | A kind of LED component and LED display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621179720.XU CN206210791U (en) | 2016-10-27 | 2016-10-27 | A kind of LED component and LED display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206210791U true CN206210791U (en) | 2017-05-31 |
Family
ID=58757770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621179720.XU Active CN206210791U (en) | 2016-10-27 | 2016-10-27 | A kind of LED component and LED display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206210791U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360884A (en) * | 2018-11-05 | 2019-02-19 | 苏州晶世达光电科技有限公司 | A kind of preparation method of LED display module |
| CN110854254A (en) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | Intensive LED packaging mode |
-
2016
- 2016-10-27 CN CN201621179720.XU patent/CN206210791U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360884A (en) * | 2018-11-05 | 2019-02-19 | 苏州晶世达光电科技有限公司 | A kind of preparation method of LED display module |
| CN110854254A (en) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | Intensive LED packaging mode |
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