CN209998517U - Combined wire bonding hot pressing plate with improved structure for semiconductor packaging - Google Patents
Combined wire bonding hot pressing plate with improved structure for semiconductor packaging Download PDFInfo
- Publication number
- CN209998517U CN209998517U CN201920486170.3U CN201920486170U CN209998517U CN 209998517 U CN209998517 U CN 209998517U CN 201920486170 U CN201920486170 U CN 201920486170U CN 209998517 U CN209998517 U CN 209998517U
- Authority
- CN
- China
- Prior art keywords
- plate
- chip
- bottom plate
- wire
- storage tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Wire Bonding (AREA)
Abstract
The utility model discloses a combination formula routing hot pressboard that is used for semiconductor package with improvement structure, contain clamp plate and hot plate, be equipped with the bonding wire groove on this clamp plate, and this bonding wire groove is equipped with a plurality of cavity blocks on corresponding both sides, this bonding wire inslot is equipped with the location strip of dividing into a plurality of chip holding mouths with it, the width of this location strip is between 0.2 to 0.3mm, this hot plate contains bottom plate and roof, be equipped with the storage tank on this bottom plate and be located fixed orifices and chip on the storage tank and bear the seat, this roof sets up on the storage tank, and be equipped with on this roof and bear the mouth with chip bears the corresponding, therefore, the utility model discloses when can remove the bonding pin production error at the platform, the block of providing bonding pin buffering avoids the bonding pin directly to hit the bonding wire groove and cause the dropping or the fracture of bonding pin to the design of assembled hot plate, the subassembly of convenience of user's change loss, and effectively reduce production facility cost.
Description
Technical Field
The present invention relates to kinds of wire bonding hot press plates, and more particularly, to kinds of combined wire bonding hot press plates with improved structures for semiconductor packaging.
Background
when wire bonding, a die is first placed on a hot plate, then the die is fixed on the hot plate by a pressing plate, and finally the wire bonding is performed by starting the wire bonding machine.
wire bonding machine for semiconductor package is usually in high speed state when wire bonding operation is performed, so when the machine generates jumping or row error in the process of moving the lead frame, the welding needle is easy to hit the side surface of the wire bonding groove or the thicker positioning strip, and the welding needle is easy to fall off or break, which causes the machine to be abnormal and stop, and when the machine is abnormal and stops, the machine can only be checked by a maintenance technician to remove the fault, however, when the machine is stopped , the production efficiency of the whole factory will be reduced when the machine is stopped.
However, since the design of the body molding makes it impossible to replace only worn blocks, so that the cost of production equipment cannot be reduced in a factory, it is necessary to improve the conventional hot plate and platen to avoid the reduction of production efficiency and production equipment cost.
In view of this, the inventor has conducted extensive research and development experience in the related fields for many years, has made extensive studies on the above-mentioned deficiencies, and has actively sought a solution to the above-mentioned needs, and finally completed the present invention through long-term research and many tests.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at reduces the collision between welding needle and the clamp plate.
The utility model discloses a secondary aim at provides kinds of hot plates that can make things convenient for dismouting and change.
In order to achieve the above object, the present invention provides a combined wire bonding hot pressing plate for semiconductor packaging with an improved structure, which has two different patterns according to the different number of hot plate assemblies, pattern , and comprises a pressing plate and a hot plate;
the pressure plate is provided with th positioning holes, a wire welding groove and a plurality of through holes adjacent to the wire welding groove, two corresponding sides of the wire welding groove are inclined outward slopes, a plurality of hollow blocks are arranged on the inclined outward slopes, a positioning strip for dividing the wire welding groove into a plurality of chip accommodating openings is arranged in the wire welding groove, the chip accommodating openings are adjacent to the hollow blocks, and the width of the positioning strip is between 0.2 and 0.3 millimeter (mm);
the hot plate includes bottom plate and roof, wherein, this bottom plate is equipped with the storage tank on its top surface to be equipped with the through hole that runs through the bottom plate on the side of this bottom plate, be equipped with draw-in groove and vacuum suction port in addition on the bottom surface of this bottom plate, and be equipped with fixed orifices on this storage tank and have the chip of chip suction port and bear the seat, and this chip bears the seat and holds the mouth with the chip and correspond each other, this through hole and vacuum suction port and chip suction port intercommunication, this roof sets up in the storage tank of bottom plate, be equipped with on this roof and bear the mouth that bears that the seat corresponds with.
In addition, the second aspect of the present invention relates to a combined wire bonding hot pressing plate with an improved structure for semiconductor packaging, comprising a pressing plate and a hot plate;
the pressure plate is provided with th positioning holes, a wire welding groove and a plurality of through holes adjacent to the wire welding groove, two corresponding sides of the wire welding groove are inclined outward slopes, a plurality of hollow blocks are arranged on the inclined outward slopes, a positioning strip for dividing the wire welding groove into a plurality of chip accommodating openings is arranged in the wire welding groove, the chip accommodating openings are adjacent to the hollow blocks, and the width of the positioning strip is between 0.2 and 0.3 millimeter (mm);
the hot plate includes the bottom plate, medium plate and roof, wherein, this bottom plate is equipped with the storage tank on its top surface, be equipped with the draw-in groove on the bottom surface of bottom plate in addition, and be equipped with th fixed orifices and the vacuum suction mouth that runs through the storage tank on this storage tank, this medium plate sets up in the storage tank, be equipped with on this medium plate and run through the medium plate and with the corresponding third fixed orifices of fixed orifices, be equipped with the chip that has the chip suction mouth on this medium plate top surface and bear the seat, and this chip bears the seat and corresponds each other with chip holding mouth, be equipped with the through hole on the side of this medium plate, be equipped with the through hole corresponding with the vacuum suction mouth on the bottom surface of this medium plate in addition, this through hole and chip suction mouth intercommunication, this roof sets up.
In summary, the utility model discloses a combination formula routing hot pressboard for semiconductor package with improve structure is characterized in that:
1. the positioning strip with the width between 0.2 and 0.3 millimeter (mm) can fix the chip in place and prevent the chip from displacing, and meanwhile, the welding needle can be difficult to collide with the positioning strip when crossing the chip accommodating port, so that the condition that the welding needle falls off or is broken due to collision can be effectively avoided, and the production efficiency of products is further improved.
2. The hollow blocks arranged on the two corresponding sides of the welding wire groove can provide buffer blocks for the welding pins when the welding pins are moved by the machine table to generate errors, thereby avoiding the falling or the fracture of the welding pins caused by the direct collision of the welding pins with the welding wire groove.
3. Due to the design of the assembled hot plate, a user can replace lost components conveniently, and the cost of production equipment is effectively reduced.
Drawings
Fig. 1 is a schematic view of a pressing plate according to embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of a platen according to version of the present invention;
fig. 3 is a partial perspective view of a pressing plate according to the embodiment of the present invention;
FIG. 4 is a schematic illustration of a hot plate according to version of the present invention;
FIG. 5 is a schematic cross-sectional view taken along section A-A of FIG. 4 at ;
fig. 6 is a schematic bottom plate view of an version of the present invention;
FIG. 7 is a schematic cross-sectional view taken along section line B-B of FIG. 6 at version ;
fig. 8 is a schematic view of a top plate according to an embodiment of the present invention at ;
FIG. 9 is a schematic view of a hot plate according to a second aspect of the present invention;
FIG. 10 is a schematic view of a second aspect of the present invention in a hot plate exploded view;
fig. 11 is a schematic top plate view of a second aspect of the present invention;
FIG. 12 is a schematic cross-sectional view taken along section line C-C in the second version of FIG. 11;
fig. 13 is a schematic view of an embodiment of the present invention ;
fig. 14 is a schematic diagram of another implementation of the present invention.
Symbolic illustration in the drawings:
1 press plate, 11 th th positioning holes, 12 through holes, 13 welding wire grooves, 131 hollow blocks, 14 positioning strips, 15 chip accommodating ports, 2 hot plates, 21 bottom plates, 211 accommodating grooves, 212 extraction ports, 213 clamping grooves, 214 vacuum suction ports, 215 st fixing holes, 216 positioning columns, 22 middle plates, 221 through holes, 222 third fixing holes, 23 top plates, 231 bearing ports, 232 second positioning holes, 233 second fixing holes, 24 through holes, 25 chip bearing seats, 251 chip suction ports, 3 welding pins and 4 chips.
Detailed Description
In order to provide a more thorough understanding of the objects, functions, features and structure of the invention, preferred embodiments will now be described with reference to the accompanying drawings.
First, please refer to fig. 1 to fig. 3, in which fig. 1 is a schematic diagram of a pressing plate in an th mode of the present invention, fig. 2 is a partial enlarged view of the pressing plate in a th mode of the present invention, and fig. 3 is a partial three-dimensional schematic diagram of the pressing plate in a th mode of the present invention.
The utility model discloses a combination formula routing hot pressboard for semiconductor package with improved structure includes clamp plate 1 and hot plate 2 (as shown in figure 4).
The pressure plate 1 is provided with th positioning holes 11, a wire bonding groove 13 and a plurality of through holes 12 adjacent to the wire bonding groove 13, the pressure plate 1 is fixed on a wire bonding machine table for semiconductor packaging through th positioning holes 11, two sides corresponding to the wire bonding groove 13 are inclined outward, a plurality of hollow blocks 131 are arranged on the inclined outward inclined surfaces, the hollow blocks 131 provide buffer space, thereby avoiding that a welding needle 3 (shown in fig. 13) directly hits the groove wall of the wire bonding groove 13 when the wire bonding machine table for semiconductor packaging operates to generate lattice jumping or row error, a positioning bar 14 for dividing the wire bonding groove 13 into a plurality of chip accommodating openings 15 is arranged in the wire bonding groove 13, the chip accommodating openings 15 are adjacent to the hollow blocks 131, the positioning bar 14 is mainly used for fixing a chip 4 (shown in fig. 13) in place and avoiding that the chip 4 (shown in fig. 13) suddenly tilts up to cause damage in the wire bonding process, and the width of the positioning bar 14 is between 0.2 and 0.3 centimeters (mm).
Please refer to fig. 4 to 8, fig. 4 is a schematic diagram of a hot plate of the th form of the present invention, fig. 5 is a schematic diagram of a cross-sectional view of the th form of fig. 4 along a-a line, fig. 6 is a schematic diagram of a bottom plate of the th form of the present invention, fig. 7 is a schematic diagram of a cross-sectional view of the th form of fig. 6 along a B-B line, and fig. 8 is a schematic diagram of a top plate of the th form of the present invention.
The heat plate 2 includes a bottom plate 21 and a top plate 23, the bottom plate 21 has a receiving cavity 211 and a pick-up opening 212 adjacent to the receiving cavity 211 on the top surface thereof, and a through hole 24 penetrating the bottom plate 21 is formed on the side surface of the bottom plate 21, and a card slot 213 and a vacuum suction port 214 fastened to a bonding wire machine are formed on the bottom surface of the bottom plate 21, the receiving cavity 211 is provided with an -th fixing hole 215, a positioning post 216 and a chip bearing seat 25 having a chip suction port 251, the chip bearing seat 25 corresponds to the chip receiving opening 15 (as shown in fig. 3), the through hole 24 communicates with the vacuum suction port 214 and the chip suction port 251, the top plate 23 is located in the receiving cavity 211 of the bottom plate 21, and the top plate 23 is provided with a bearing opening 231 corresponding to the chip bearing seat 25 and a second positioning hole 232 corresponding to.
The connection method of the bottom plate 21 and the top plate 23 can be divided into locking and vacuum adsorption, if the locking method is adopted for connection, a second fixing hole 233 corresponding to the -th fixing hole 215 is required to be arranged on the top plate 23, and then the bottom plate 21 and the top plate 23 are fixed by a fixing component through the -th fixing hole 215 and the second fixing hole 233 at the same time, and if the vacuum adsorption method is adopted for connection, the second fixing hole 233 is not required to be arranged on the top plate 23, and only the -th fixing hole 215 is required to be pumped by vacuum equipment, so that a gap formed by the joint surface of the bottom plate 21 and the top plate 23 is in a vacuum state, and the bottom plate 21 and the top plate 23 can be stably connected without loosening.
Please refer back to fig. 1 to 3.
In addition, the second aspect of the present invention provides a combined wire bonding hot pressing plate with an improved structure for semiconductor packaging, which comprises a pressing plate 1 and a hot plate 2 (as shown in fig. 9).
The pressure plate 1 is provided with th positioning holes 11, a wire bonding groove 13 and a plurality of through holes 12 adjacent to the wire bonding groove 13, the pressure plate 1 is fixed on a wire bonding machine table for semiconductor packaging through th positioning holes 11, two sides corresponding to the wire bonding groove 13 are inclined outward, a plurality of hollow blocks 131 are arranged on the inclined outward inclined surfaces, the hollow blocks 131 provide buffer space, thereby avoiding that a welding needle 3 (shown in fig. 13) directly hits the groove wall of the wire bonding groove 13 when the wire bonding machine table for semiconductor packaging operates to generate lattice jumping or row error, a positioning bar 14 for dividing the wire bonding groove 13 into a plurality of chip accommodating openings 15 is arranged in the wire bonding groove 13, the chip accommodating openings 15 are adjacent to the hollow blocks 131, the positioning bar 14 is mainly used for fixing a chip 4 (shown in fig. 13) in place and avoiding that the chip 4 (shown in fig. 13) suddenly tilts up to cause damage in the wire bonding process, and the width of the positioning bar 14 is between 0.2 and 0.3 centimeters (mm).
Fig. 9 to 12 show still another drawings, fig. 9 is a schematic diagram of a hot plate according to a second aspect of the present invention, fig. 10 is an exploded schematic diagram of a hot plate according to the second aspect of the present invention, fig. 11 is a schematic diagram of a top plate according to the second aspect of the present invention, and fig. 12 is a schematic sectional diagram of the second aspect shown in fig. 11, taken along the C-C line of sight.
The heat plate 2 includes a bottom plate 21, a middle plate 22 and a top plate 23, wherein the bottom plate 21 has a receiving groove 211 on a top surface thereof, a clamping groove 213 fastened to a wire bonding machine is disposed on a bottom surface of the bottom plate 21, the receiving groove 211 has a vacuum suction port 214 and an -th fixing hole 215 penetrating through the receiving groove 211, the middle plate 22 is disposed in the receiving groove 211, the middle plate 22 has a third fixing hole 222 penetrating through the middle plate 22 and corresponding to the -th fixing hole 215, the top surface of the middle plate 22 has a chip carrying seat 25 having a chip suction port 251, the chip carrying seat 25 corresponds to the chip receiving port 15 (as shown in fig. 3), a through hole 24 is disposed on a side surface of the middle plate 22, a through hole 221 corresponding to the vacuum suction port 214 is disposed on the bottom surface of the middle plate 22, the through hole 24 is communicated with the through hole 221 and the chip suction port 251, the top plate 23 is disposed in the receiving groove 211 and above the middle plate 22, and a carrying.
The connection method between the bottom plate 21, the middle plate 22 and the top plate 23 can be divided into locking and vacuum suction, if the locking method is adopted for connection, a second fixing hole 233 corresponding to the -th fixing hole 215 and the third fixing hole 222 is required to be arranged on the top plate 23, and then the bottom plate 21, the middle plate 22 and the top plate 23 are fixed by a fixing component through the -th fixing hole 215, the second fixing hole 233 and the third fixing hole 222, and if the vacuum suction method is adopted for connection, the second fixing hole 233 is not required to be arranged on the top plate 23, and only the -th fixing hole 215 and the third fixing hole 222 are required to be arranged by vacuum equipment, so that a gap formed by the joint surfaces of the bottom plate 21, the middle plate 22 and the top plate 23 is in a vacuum state, and the bottom plate 21, the middle plate 22 and the top plate 23 can be stably connected without loosening.
The following detailed description of embodiments of the present invention and related references can be made to the drawings in which:
referring to fig. 13 and 14 in conjunction with fig. 3, fig. 13 is a schematic diagram of an embodiment of the present invention , and fig. 14 is a schematic diagram of another embodiment of .
The utility model discloses on using respectively with clamp plate 1 and hot plate 2 be fixed in the bonding wire board that semiconductor package used, place chip 4 after that on chip bears seat 25 and cover clamp plate 1 again to the chip 4 that makes the bonding wire operation will be carried out is located chip holding mouth 15 department, can begin to carry out the bonding wire operation.
In the process of carrying out the bonding wire operation, when bonding pin 3 will span chip holding mouth 15 and carry out the bonding wire operation of chips 4 down, the risk that hits locating bar 14 at the in-process bonding pin 3 that removes exists, nevertheless the utility model discloses a locating bar 14 width only is between 0.2 to 0.3 centimetre (mm), even if consequently the condition of jump check or row error also is difficult to collide locating bar 14 appears in bonding pin 3, and then reduces bonding pin 3 by a wide margin and strikes locating bar 14 and make bonding pin 3 drop or cracked condition take place, can also effectively reduce the number of times that stops of bonding wire operation simultaneously to improve the production efficiency of the bonding wire board of semiconductor package usefulness.
In addition, the hollow blocks 131 disposed on the two sides of the wire groove 13 and inclined outward are mainly used to prevent the needle 3 from directly impacting the wall of the wire groove 13 during the moving process, and provide a buffer space for the needle 3 to move toward the wire groove 13, thereby preventing the needle 3 from falling off or breaking due to the direct impact of the needle 3 on the wall of the wire groove 13.
In summary, the utility model discloses a combination formula routing hot pressboard for semiconductor package with improvement structure is characterized in that:
1. the positioning strip with the width between 0.2 and 0.3 millimeter (mm) can fix the chip in place and prevent the chip from displacing, and meanwhile, the welding needle can be difficult to collide with the positioning strip when crossing the chip accommodating port, so that the condition that the welding needle falls off or is broken due to collision can be effectively avoided, and the production efficiency of products is further improved.
2. The hollow blocks arranged on the two corresponding sides of the welding wire groove can provide buffer blocks for the welding pins when the welding pins are moved by the machine table to generate errors, thereby avoiding the falling or the fracture of the welding pins caused by the direct collision of the welding pins with the welding wire groove.
3. Due to the design of the assembled hot plate, a user can replace lost components conveniently, and the cost of production equipment is effectively reduced.
The above description is only for the preferred embodiment of the present invention, and other equivalent structural changes made by the present invention in the specification and claims should be construed as being included in the claims of the present invention.
Claims (6)
1, combined wire bonding hot pressing plate with improved structure for semiconductor package, which is characterized by comprising a pressing plate and a hot plate;
the pressure plate is provided with th positioning holes, a wire welding groove and a plurality of through holes adjacent to the wire welding groove, two corresponding sides of the wire welding groove are inclined outward slopes, a plurality of hollow blocks are arranged on the inclined outward slopes, a positioning strip for dividing the wire welding groove into a plurality of chip accommodating openings is arranged in the wire welding groove, the chip accommodating openings are adjacent to the hollow blocks, and the width of the positioning strip is between 0.2 and 0.3 mm;
this hot plate contains bottom plate and roof, wherein, this bottom plate is equipped with the storage tank on its top surface to be equipped with the through hole that runs through the bottom plate on the side of this bottom plate, be equipped with draw-in groove and vacuum suction port in addition on the bottom surface of this bottom plate, and be equipped with fixed orifices on this storage tank and have the chip of chip suction port and bear the seat, and this chip bears the seat and holds the mouth with the chip and correspond each other, this through hole and vacuum suction port and chip suction port intercommunication, this roof is located the storage tank of bottom plate, be equipped with on this roof and bear the mouth that bears that the seat corresponds with the.
2. The assembled wire-bonding hot-pressing board with improved structure for semiconductor package as claimed in claim 1, wherein the top surface of the bottom plate is provided with a pick-up opening adjacent to the receiving groove.
3. The assembled wire-bonding hot-pressing board with improved structure for semiconductor package as claimed in claim 1, wherein the receiving cavity is provided with a positioning post and a second positioning hole located on the top plate and corresponding to the positioning post.
4. The improved structure of the combined wire-bonding hot-pressing board for semiconductor package as claimed in claim 1, wherein the top board has a second fixing hole.
5, A combined wire bonding hot pressing plate with improved structure for semiconductor package, which is characterized in that it comprises a pressing plate and a hot plate;
the pressure plate is provided with th positioning holes, a wire welding groove and a plurality of through holes adjacent to the wire welding groove, two corresponding sides of the wire welding groove are inclined outward slopes, a plurality of hollow blocks are arranged on the inclined outward slopes, a positioning strip for dividing the wire welding groove into a plurality of chip accommodating openings is arranged in the wire welding groove, the chip accommodating openings are adjacent to the hollow blocks, and the width of the positioning strip is between 0.2 and 0.3 mm;
this hot plate contains the bottom plate, medium plate and roof, wherein, this bottom plate is equipped with the storage tank on its top surface, be equipped with the draw-in groove on the bottom surface of bottom plate, be equipped with fixed orifices and the vacuum suction inlet that runs through the storage tank on this storage tank, this medium plate sets up in the storage tank, be equipped with on this medium plate and run through the medium plate and the third fixed orifices that corresponds with the fixed orifices, it bears the seat to be equipped with the chip that has the chip suction inlet on this medium plate top surface, and this chip bears the seat and corresponds each other with chip holding mouth, be equipped with the through hole on the side of this medium plate, be equipped with the opening corresponding with the vacuum suction inlet on the bottom surface of this medium plate, this through hole and opening and chip suction inlet intercommunication, this roof sets up in the storage.
6. The assembled wire-bonding hot-pressing board with improved structure for semiconductor package as claimed in claim 5, wherein the top board is provided with second fixing holes corresponding to the third fixing holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920486170.3U CN209998517U (en) | 2019-04-11 | 2019-04-11 | Combined wire bonding hot pressing plate with improved structure for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920486170.3U CN209998517U (en) | 2019-04-11 | 2019-04-11 | Combined wire bonding hot pressing plate with improved structure for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209998517U true CN209998517U (en) | 2020-01-31 |
Family
ID=69303464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920486170.3U Expired - Fee Related CN209998517U (en) | 2019-04-11 | 2019-04-11 | Combined wire bonding hot pressing plate with improved structure for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209998517U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI820828B (en) * | 2022-07-27 | 2023-11-01 | 南茂科技股份有限公司 | Hot pressing device |
-
2019
- 2019-04-11 CN CN201920486170.3U patent/CN209998517U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI820828B (en) * | 2022-07-27 | 2023-11-01 | 南茂科技股份有限公司 | Hot pressing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5083327B2 (en) | Socket for semiconductor device | |
| CN209998517U (en) | Combined wire bonding hot pressing plate with improved structure for semiconductor packaging | |
| CN100585848C (en) | Module and electronic device | |
| US10388329B2 (en) | SSD storage module, SSD component, and SSD | |
| CN201656204U (en) | Universal adaptor for BGA packaging testing socket | |
| CN218426182U (en) | Semiconductor pressure welding process pressing plate | |
| JP7395874B2 (en) | Gate breaking method and gate breaking device | |
| CN210182376U (en) | Combined lead frame for chip packaging | |
| CN112171455A (en) | Groove grinding tool for groove needle of warp knitting machine | |
| CN206464792U (en) | Provision for disengagement | |
| CN214081135U (en) | Special tray assembly for vertical core cladding | |
| CN212097227U (en) | Insert pin mould fast | |
| CN113625016B (en) | Miniature blade needle module with heat dissipation function | |
| CN220922600U (en) | Bearing plate separating device | |
| CN210202237U (en) | Assembled electronic assembly box | |
| KR102627485B1 (en) | Selective soldering method using titanium blocks | |
| CN214601319U (en) | Broken rib punch of broken rib die | |
| CN219211566U (en) | Insert assembly, insert assembly mechanism, mold structure and cooling fin ejection device | |
| CN216793624U (en) | Clamp for copper ring mounting | |
| CN215879504U (en) | Washing machine motor end frame unloading hole flanging mould | |
| CN213470657U (en) | Groove grinding tool for groove needle of warp knitting machine | |
| CN219642800U (en) | Semiconductor packaging material box | |
| CN218144469U (en) | A material collecting device for wafer recovery | |
| CN220062755U (en) | Rubber plug positioning mechanism of electronic detonator | |
| CN212419313U (en) | Quick replacement static mould insert |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200131 |