CN100585848C - Module and electronic device - Google Patents
Module and electronic device Download PDFInfo
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- CN100585848C CN100585848C CN 200710107162 CN200710107162A CN100585848C CN 100585848 C CN100585848 C CN 100585848C CN 200710107162 CN200710107162 CN 200710107162 CN 200710107162 A CN200710107162 A CN 200710107162A CN 100585848 C CN100585848 C CN 100585848C
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- pin
- reference column
- pin configuration
- substrate
- location hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
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- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a module including a base plate and two pin structure, wherein the pin structure comprises a pin and a pin carrier; each pin is independently sticked on the pin carrier; at least two pin structures are provided respectively arranged at the two sides of the base plate for connecting the base plate and the motherboard; at least two reference columns are arranged on the pin carrier. A positioning hole corresponding to the reference column arranged on the pin structure is arranged on the base plate, wherein the positioning hole on the base plate is on the same line; the reference column on the pin carrier is assembled with the base plate. The invention also discloses an electronic equipment including a module and a motherboard. The pins at the two sides of the base plate is independant each other for connecting different I/O ports, which advances the layout density, thereby reducing the layout space of the motherboard, increasing the whole layout density, meanwhile the positioning hole on the module base plate is on the same level, which effectively ensures the coplane degree of the vertical module pin.
Description
Technical field
The present invention relates to electronic technology field, refer to a kind of vertical type module and electronic installation especially.
Background technology
Highly dense miniaturization is the trend of electronic product development, also is the challenge that the electronics packaging technology faces always, and the layout density that improves veneer has become electronic product and realized one of necessary condition of highly dense miniaturization.
With the partial common circuit on the circuit board, especially repeated circuit unit is integrated on the module on a motherboard, and then it is assembled on the motherboard as a conventional device.By this method, not only make full use of three dimensions, reduced floor space, and when improving layout density, promoted packaging efficiency and quality, reduced production cost.
Module (Module) is neither certain special semiconductor device, neither certain passive component, and module is the integrated circuit package of designing according to the principle of optimized circuit and system configuration that has comprised multiple device.Broadly, the separate unit body that building block technique can be understood as different components and parts encapsulation integrated, module itself needs once assembling, and the secondary that attaches it on the motherboard is assembled.Form according to module secondary assembling on motherboard can be divided into module two kinds of vertical type module and horizontal modules.
Wherein, vertical type module can effectively utilize the three dimensions of veneer, and like this, the I/O mouth number of deriving on limited space is less naturally based on single pin configuration but existing vertical type module is many, becomes the bottleneck that restriction modular circuit integrated level promotes.
Along with the development of electronic product microminiaturization, the circuit level on the module is more and more higher, and the number of pins that requires to be used for to derive the I/O mouth is also just more and more, and pin configuration has become the key factor that high I/O mouth vertical type module is effectively realized.At present, mainly contain following several vertical type module.
Fig. 1 is the profile and the pin schematic diagram of existing vertical single straight cutting module, as shown in Figure 1, plays before the assembling once that I/O connects and a plurality of pins (being also referred to as contact pin) of supporting role are injection-moulded in together, then as an overall package to module substrate.The technology of secondary assembling general employing wave-soldering or through hole Reflow Soldering realizes being connected of module and motherboard.Pin is single, is positioned at a side of module, the connection of an I/O mouth of a pin realization after assembling is finished.
Referring to Fig. 1, in realizing process of the present invention, the inventor finds that there are the following problems at least in the prior art, and single pin makes that the number of pins that can be used for deriving the I/O mouth is less, has limited the development of modular circuit high integration.When module was carried out the secondary assembling on motherboard, the design of plug-in mounting pin had reduced the surface mount rate of whole plate.The assembling of plug-in mounting module need be on motherboard perforate and via hole bigger, be unfavorable for the lifting of wiring density on the plate.
Fig. 2 is the profile and the pin schematic diagram of existing vertical single surface-mount module, as shown in Figure 2, once many before the assembling intercell connector of pin by two ends connected, then as an overall package to module substrate.The technology of the general employing of secondary assembling Reflow Soldering realizes being connected of module and motherboard.I/O connects and the pin of supporting role has left and right sides both wings to lay respectively at the both sides of module though rise, and the both wings of pair of pins are connected as a single entity, and pair of pins still can only realize the connection of an I/O mouth after assembling was finished.
Referring to Fig. 2, in realizing process of the present invention, the inventor finds that there are the following problems at least in the prior art, the Surface Mount pin of the module left and right sides is actual to be one, the number of pins that can be used for deriving the I/O mouth is still less, and the pin that links to each other with module substrate is to be stamped to form from bottom legs, requires the bottom legs width bigger, limit pin density and further promoted, thereby limited the number of pins that derives the I/O mouth.Then must increase the size of module board if will increase the I/O mouth number of circuit, thereby increase floor space, limit the development of modular circuit high integration.
Except that above-mentioned two kinds of vertical type modules, also have a kind of vertical type module, split type different Surface Mount pin configuration is adopted in the substrate both sides.By at the module substrate two ends each up and down and arrange two location holes, the reference column on the pin plastic-sealed body is realized the location in the location hole of relevant position on the insert module substrate respectively.In realizing process of the present invention, the inventor finds that there are the following problems at least in the prior art, in this implementation, because different pin configuration is used in the module substrate both sides, and position by two pairs of location holes that are parallel to each other on the substrate, have the dimension chain cumulative limit, pin coplanarity is difficult to shortcomings such as assurance.
Summary of the invention
In view of this, the purpose of the embodiment of the invention is to provide a kind of module and electronic installation, can improve the integrated level of modular circuit, improves the coplane degree of pin simultaneously.
For achieving the above object, the technical scheme of the embodiment of the invention specifically is achieved in that
A kind of module comprises substrate and pin configuration;
Wherein, described pin configuration comprises pin and pin carrier.Be mounted on the pin carrier between each pin independently of each other; Described pin configuration is at least two, is separately positioned on the substrate both sides, is used to connect substrate and motherboard.
Described pin carrier is provided with at least two reference columns, offer on the described substrate with pin configuration on the corresponding location hole of reference column that is provided with, the location hole on the described substrate is located on the same line; Reference column on the described pin carrier is by location hole and substrate assembling.
A kind of electronic installation is characterized in that, comprises module and motherboard;
Described module comprises substrate and pin configuration;
Wherein, described pin configuration comprises pin and pin carrier; Be mounted on the pin carrier between each pin independently of each other; Described pin configuration is at least two, is separately positioned on the substrate both sides, is used to connect substrate and motherboard;
Described pin carrier is provided with at least two reference columns, offer on the described substrate with pin configuration on the corresponding location hole of reference column that is provided with, the location hole on the described substrate is located on the same line; Reference column on the described pin carrier is by location hole and substrate assembling.
As seen from the above technical solution, the embodiment of the invention makes the pin of substrate both sides separate by improving pin configuration, can connect different I/O mouths, has improved layout density, thereby has reduced the arrangement space of motherboard, has improved integral layout density; Because pin configuration has adopted same the locate mode on the straight line, has eliminated the size cumulative errors, has improved the coplane degree of Surface Mount pin.
Description of drawings
Fig. 1 is the profile and the pin schematic diagram of existing vertical single straight cutting module;
Fig. 2 is the profile and the pin schematic diagram of existing vertical single surface-mount module;
Fig. 3 is the schematic diagram of the embodiment of the profile of the vertical double surface-mount module of the present invention and pin;
Fig. 4 is the schematic diagram that the vertical double surface-mount module of the present invention is assembled into the embodiment on the motherboard;
Fig. 5 is the front view after module of the present invention is once assembled;
Fig. 6 a is the schematic diagram of the reference column at A section place among Fig. 5;
Fig. 6 b is the schematic diagram of the reference column at B section place among Fig. 5;
Fig. 7 is the schematic diagram of pin example of shape of the present invention;
Fig. 8 is the schematic diagram of the reference column structure embodiment on the pin configuration in the vertical type module of the present invention;
Fig. 9 is when adopting reference column structure shown in Figure 8, the schematic diagram of the reference column at B section place among Fig. 5;
Figure 10 is the schematic diagram of the location hole structure embodiment on the pin configuration in the vertical type module of the present invention;
Figure 11 is the schematic diagram of double contact pin pin vertical type module.
Embodiment
For making purpose of the present invention, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
Module of the present invention mainly comprises substrate, pin configuration.
Wherein, pin configuration comprises pin and pin carrier; Be mounted on the pin carrier between each pin independently of each other; Described pin configuration is at least two, is separately positioned on the substrate both sides, is used to connect substrate and motherboard;
When substrate is long, can two or more pin configuration be set respectively in the same side of substrate, to improve the connection stability between substrate and the motherboard.
Described pin carrier is provided with at least two reference columns, offer on the described substrate with pin configuration on the corresponding location hole of reference column that is provided with, the location hole on the described substrate is located on the same line;
Reference column on the described pin carrier is by location hole and substrate assembling.
The boss that paster is used in the time of can also further being provided on the pin configuration supplying once to assemble, described reference column can be arranged on the boss.
Fig. 3 is the profile of the vertical double surface-mount module of the present invention and the embodiment schematic diagram of pin, and as shown in Figure 3, vertical type module embodiment of the present invention mainly comprises: substrate 1, two pin configuration 3; Can also comprise card cap 9.
Wherein, each pin configuration 3 comprises: pin 4, pin carrier 0, and pin carrier 0 is provided with boss 5 in the present embodiment, and reference column 6 is arranged on the boss 5;
In the present embodiment, substrate 1 comprises: the location hole 7 of opposite ends reference column, and the location hole 8 of corresponding interfix post; Can also comprise the components and parts 2 on the substrate.
As shown in Figure 3, pin 4 is Surface Mount contact pins, and the Surface Mount contact pin adopts the design of Surface Mount pin.All being provided with in each pin configuration 3, is separate between each pin, makes that the pin configuration of substrate 1 both sides is separate, can connect different I/O mouths, has improved layout density, thereby has reduced the arrangement space of motherboard, has improved integral layout density.
Two reference columns 6 are respectively arranged on each pin configuration 3, one of them reference column 6 is located on the boss 5 at one of two ends of pin configuration 3, if the reference column that is positioned at two ends of one of them pin configuration 3 is located at left end, correspondingly, the reference column that is positioned at two ends of another pin configuration 3 is located at right-hand member;
Another reference column 6 is located on the boss 5 in centre position of pin configuration 3.The reference column that is positioned on the boss 5 in pin configuration 3 centre positions departs from point midway a little, staggers in the reference column position on the boss 5 in this position and another pin configuration 3 centre positions, so that two reference columns stagger and can not interfere mutually when mounting the pin of another side.
The size and shape of reference column 6 is decided on the practical structures demand, and such as cylindrical, the length of cylinder is not more than substrate thickness.Need to prove that the shape of reference column just illustrates here, and be not used in the shape that limits reference column, such as the shape, abnormal shape etc. that can also be cube rod.
On the position of the reference column 6 on the substrate 1 on the corresponding pin structure 3, be respectively equipped with three and be positioned at same the location hole on the horizontal line, wherein, the perforate of the position of the corresponding reference column in substrate two ends is the location hole 7 of opposite ends reference column, and the perforate of the position of middle corresponding reference column is the location hole 8 of corresponding interfix post.
The shape of the location hole 7 of opposite ends reference column is consistent with the cross section of its corresponding reference column promptly same or similar, also can be mounting hole etc.; The location hole 8 of corresponding interfix post is a mounting hole, cooperate with two reference columns in the middle of the bilateral pin configuration 3, waist-shaped hole is and the parallel horizontal direction in substrate 1 bottom, eliminated the mismatch error on location hole line direction between pin and the location hole, like this, also eliminate the dimension chain accumulated error that adopts two pairs of positioned parallel holes, guaranteed pin coplanarity.Need to prove that the shape of location hole just illustrates here, and be not used in the shape that limits location hole, such as being quadrangle such as rectangle, square, special-shaped cross sectional shape etc.
Need to prove, the position of reference column and location hole is not limited to position shown in Figure 3, as long as guaranteeing location hole is positioned on the same horizontal line, stable assembling gets final product between substrate and the motherboard, as for what reference columns and location hole are set, how the position is set just can make to stablize between substrate and the motherboard to assemble belongs to another technical problem of this area, and irrelevant with the present invention, therefore no longer describes in detail here.
Fig. 4 is the schematic diagram of embodiment of the assembling of the vertical double surface-mount module of the present invention, based on vertical surface-mount module structure shown in Figure 3, as shown in Figure 4, the Surface Mount contact pin adopts the design of Surface Mount pin, a plurality of pins by plastic packaging together, the injection moulding die sinking manufactures the pin plastic-sealed body and does as a whole being assembled on the module substrate, and the pin capsulation material is insulation, high temperature resistant, antistatic material.All pin 4 bottoms are positioned at same plane, have guaranteed the quality of electric and mechanical connection when secondary is assembled on the motherboard substrate.If the Surface Mount pin configuration of substrate both sides is identical, only need a die sinking.Paster usefulness when the boss 5 of pin plastic-sealed body mid portion can supply once to assemble, the size of absorption face 10 satisfies the demand of picking up of chip mounter.The top of substrate is equipped with the card cap 9 that secondary assembling paster is used.
The assembling of vertical double surface-mount module comprises once assembling and secondary assembling.
Once assembling is equivalent to the assembling process of general circuit assembly, i.e. all components and parts on the Knockdown block, Surface Mount pin and card cap, and Fig. 5 is the front view after module of the present invention is once assembled.Once Zu Zhuan method is: mount pin configuration when mounting device on the module substrate one side, on the reference column insert module substrate on the pin plastic-sealed body in the location hole of relevant position, reference column length is not more than substrate thickness, to guarantee the seal process of tin of another side; Equally, when the module substrate another side carried out mounting of device, the reference column on the pin plastic-sealed body inserted in remaining two location holes of substrate and finishes the location, carried out reflow soldering subsequently to finish once assembling.
Secondary assembling promptly is assembled into module on the motherboard substrate by the Surface Mount pin on the module, and the secondary assembling can adopt machine to mount technology with Reflow Soldering.
Fig. 6 a is the schematic diagram of the reference column at A section place among Fig. 5, and Fig. 6 a has clearly illustrated that the assembling between the location hole 8 of reference column and corresponding interfix post in the middle of pin configuration 3 illustrates; Fig. 6 b is the schematic diagram of the reference column at B section place among Fig. 5, and Fig. 6 b has clearly illustrated the assembling signal between the location hole 7 of the reference column at pin configuration 3 two ends and opposite ends reference column.
The pin shape of module and motherboard coupling part can be wing, I font, J-shaped etc., but is not limited to this three kinds of shapes.Fig. 7 is the schematic diagram of pin example of shape of the present invention, and Fig. 7 (a) is wing pin stereogram, and Fig. 7 (b) is wing pin schematic diagram, and Fig. 7 (c) is an I font pin schematic diagram, and Fig. 7 (d) is a J font pin schematic diagram.Fig. 7 only illustrates, and the shape and size of the single pin of module of the present invention are not concrete to be limited, and size, spacing etc. are mainly relevant with components and parts layout and I/O mouth number on module substrate size, the module substrate.
Between each pin of module of the present invention is separate, makes that the pin configuration of substrate 1 both sides is separate, can connect different I/O mouths, has increased the integrated level and the I/O number of module itself effectively.In addition, double Surface Mount pin vertical type module has improved the components and parts surface mount rate and the integral layout density of motherboard; Location hole is positioned on same the horizontal plane on the module substrate, has guaranteed the coplane degree of vertical type module pin effectively, has finally realized the electric and mechanical connection good with motherboard; And, if module substrate both sides pin configuration is identical, only need a die sinking, reduced cost of goods manufactured, shortened the production cycle.
Need to prove that if the components and parts layout of module substrate bilateral and I/O mouth number have specific (special) requirements or influenced by other factors, the pin configuration of module substrate both sides can be different, and structure of the present invention is still adopted in other design of module.
For the module substrate pin configuration that mounts of one side wherein, the reference column structure on it as shown in Figure 3, promptly reference column length is not more than substrate thickness, to guarantee the seal process of tin of another side.The pin configuration that mounts for the module substrate another side, as shown in Figure 8, Fig. 8 is the schematic diagram of the reference column structure embodiment on the pin configuration in the vertical type module of the present invention, and the reference column 91 on it (two or wherein any one) can pass in the location hole 92 that module substrate inserts opposite pin plastic-sealed body again.The location hole of all positions is positioned on the same horizontal line on the module substrate, to eliminate the dimension chain cumulative limit.Fig. 9 is when adopting reference column structure shown in Figure 8, and the schematic diagram of the reference column at B section place among Fig. 5, Fig. 9 have clearly illustrated that the reference column that is arranged in pin configuration 3 two ends passes the assembling signal that module substrate inserts the location hole of opposite pin plastic-sealed body again.
Further, also can adopt plural reference column promptly to cross the mode of location, adopt the mode of locating further to reduce the linearity distortion and the error of pin contact pin itself.
For the structure of location hole, can adopt another form.As shown in Figure 9, Fig. 9 is the schematic diagram of the location hole structure embodiment on the pin configuration in the vertical type module of the present invention, can change a mounting hole of centre shown in Figure 3 into two circular holes 108, the spacing of two circular holes 108 does not have specific (special) requirements, as long as guarantee that these two circular holes are positioned on the same horizontal line and about the center line symmetry of substrate; Also can all adopt the mode in other shape localization holes such as waist shape.
Further, when contact pin adopts more than two as during three reference columns, can correspondence on the substrate drive three location holes and position.
Outside, the structure of all modules of the present invention is equally applicable to double contact pin pin vertical type module shown in Figure 10.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention, all any modifications of being made within the spirit and principles in the present invention, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (15)
1. a module is characterized in that, comprises substrate and pin configuration;
Wherein, described pin configuration comprises pin and pin carrier; Be mounted on the pin carrier between each pin independently of each other; Described pin configuration is at least two, is separately positioned on the substrate both sides, is used to connect substrate and motherboard;
Described pin carrier is provided with at least two reference columns, offer on the described substrate with pin configuration on the corresponding location hole of reference column that is provided with, the location hole on the described substrate is located on the same line; Reference column on the described pin carrier is by location hole and substrate assembling.
2. module according to claim 1 is characterized in that, the boss that paster is used when further being provided on the described pin configuration supplying once to assemble.
3. module according to claim 2 is characterized in that described reference column is arranged on the boss.
4. module according to claim 3 is characterized in that;
Described reference column on described each pin configuration is two, and one of them reference column is located on the boss at one of two ends of pin configuration, and another reference column is located on the boss in centre position of pin configuration;
The reference column in described centre position departs from the point midway of pin configuration.
5. module according to claim 4 is characterized in that, the length of the reference column of described pin configuration is not more than the thickness of substrate.
6. module according to claim 4 is characterized in that, the location hole on the described substrate is three, and wherein, two location holes are separately positioned on the position of the corresponding reference column in substrate two ends, the position of corresponding reference column in the middle of the 3rd location hole is arranged on.
7. module according to claim 6 is characterized in that, the shape of the described location hole that is positioned at the substrate two ends is same or similar with the cross sectional shape of corresponding reference column;
Location hole in the middle of described being positioned at is a mounting hole, and described mounting hole is with substrate base and holds capable horizontal direction level with both hands.
8. module according to claim 1 is characterized in that, described pin is Surface Mount type or pin type.
9. module according to claim 1 is characterized in that described pin configuration is identical or inequality.
10. module according to claim 3 is characterized in that, described pin configuration is first pin configuration and second pin configuration;
Described reference column on described wherein first pin configuration is two, one of them reference column is located on the boss of an end of first pin configuration, and another reference column is located on the boss in centre position of first pin configuration and the point midway of lateral deviation first pin configuration;
Second pin configuration and described first pin configuration are identical;
Perhaps, the reference column length of second pin configuration is than the length of first pin configuration, and reference column passes described substrate, inserts in the corresponding location hole of first pin configuration again.
11. module according to claim 10, it is characterized in that the location hole on the described substrate is more than three or three, wherein, two location holes are separately positioned on the position of the corresponding reference column in substrate two ends, the position of corresponding reference column in the middle of remaining location hole is arranged on;
The shape of the described location hole that is positioned at the substrate two ends is same or similar with the cross sectional shape of corresponding reference column; Described remaining location hole is circular hole or mounting hole.
12. an electronic installation is characterized in that, comprises module and motherboard;
Described module comprises substrate and pin configuration;
Wherein, described pin configuration comprises pin and pin carrier; Be mounted on the pin carrier between each pin independently of each other; Described pin configuration is at least two, is separately positioned on the substrate both sides, is used to connect substrate and motherboard;
Described pin carrier is provided with at least two reference columns, offer on the described substrate with pin configuration on the corresponding location hole of reference column that is provided with, the location hole on the described substrate is located on the same line; Reference column on the described pin carrier is by location hole and substrate assembling.
13. electronic installation according to claim 12 is characterized in that, the location hole on the described substrate is three, and wherein, two location holes are separately positioned on the position of the corresponding reference column in substrate two ends, the position of corresponding reference column in the middle of the 3rd location hole is arranged on.
14. electronic installation according to claim 13 is characterized in that, the shape of the described location hole that is positioned at the substrate two ends is same or similar with the cross sectional shape of corresponding reference column;
Location hole in the middle of described being positioned at is a mounting hole, and described mounting hole is with substrate base and holds capable horizontal direction level with both hands.
15. electronic installation according to claim 12 is characterized in that, described pin configuration is first pin configuration and second pin configuration;
Described reference column on described wherein first pin configuration is two, one of them reference column is located on the boss of an end of first pin configuration, and another reference column is located on the boss in centre position of first pin configuration and the point midway of lateral deviation first pin configuration;
Second pin configuration and described first pin configuration are identical;
Perhaps, the reference column length of second pin configuration is than the length of first pin configuration, and reference column passes described substrate, inserts in the corresponding location hole of first pin configuration again.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710107162 CN100585848C (en) | 2007-04-30 | 2007-04-30 | Module and electronic device |
| PCT/CN2008/070801 WO2008134965A1 (en) | 2007-04-30 | 2008-04-25 | Module and electric assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710107162 CN100585848C (en) | 2007-04-30 | 2007-04-30 | Module and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101299426A CN101299426A (en) | 2008-11-05 |
| CN100585848C true CN100585848C (en) | 2010-01-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710107162 Active CN100585848C (en) | 2007-04-30 | 2007-04-30 | Module and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100585848C (en) |
| WO (1) | WO2008134965A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867286B (en) * | 2010-06-29 | 2015-05-13 | 中兴通讯股份有限公司 | DC/ DC module power supply |
| CN102340559A (en) * | 2010-07-20 | 2012-02-01 | 上海闻泰电子科技有限公司 | Combined circuit board of mobile terminal and assembly method |
| TWI403252B (en) * | 2010-12-03 | 2013-07-21 | Asustek Comp Inc | Electronic module and electronic device using the same |
| CN102290698A (en) * | 2011-07-20 | 2011-12-21 | 聚信科技有限公司 | Vertical soldering system and method for mounting vertical surface-mounted module |
| CN103280424B (en) * | 2012-12-12 | 2015-10-28 | 贵州振华风光半导体有限公司 | A kind of integrated approach of high integration power thick film hybrid integrated circuit |
| CN103151276B (en) * | 2012-12-12 | 2015-08-19 | 贵州振华风光半导体有限公司 | A kind of integrated approach of high integration power thin film hybrid integrated circuit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW572442U (en) * | 2003-06-03 | 2004-01-11 | Hon Hai Prec Ind Co Ltd | Card edge connector |
| US6815614B1 (en) * | 2003-09-05 | 2004-11-09 | Power-One Limited | Arrangement for co-planar vertical surface mounting of subassemblies on a mother board |
| JP4889989B2 (en) * | 2005-09-20 | 2012-03-07 | 第一電子工業株式会社 | Electrical connector |
-
2007
- 2007-04-30 CN CN 200710107162 patent/CN100585848C/en active Active
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2008
- 2008-04-25 WO PCT/CN2008/070801 patent/WO2008134965A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN101299426A (en) | 2008-11-05 |
| WO2008134965A1 (en) | 2008-11-13 |
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