CN209914173U

CN209914173U - Circuit board capable of directly printing printed circuit diagram

Info

Publication number: CN209914173U
Application number: CN201920433932.3U
Authority: CN
Inventors: 任永斌
Original assignee: Chongqing Lin Meng Electronic Science And Technology Co Ltd
Current assignee: Chongqing Lin Meng Electronic Science And Technology Co Ltd
Priority date: 2019-04-02
Filing date: 2019-04-02
Publication date: 2020-01-07
Anticipated expiration: 2029-04-02

Abstract

A circuit board capable of directly printing a printed circuit diagram consists of an insulating substrate, a copper conducting layer and an acid-resistant ink layer, wherein the acid-resistant ink layer for improving the adhesive force of the printing ink layer is manufactured on the copper conducting layer; adopted the utility model discloses a scheme has overcome that current thermal transfer method preparation circuit board effect is unstable and the operation is complicated, the sensitization method preparation circuit board time input cost is high and the technique is difficult to be held, silk screen printing preparation circuit board is unsuitable frequently to be taken a design circuit board and the precision is lower, directly prints the incomplete shortcoming of circuit that appears after the preparation circuit board etching with the flat board, is particularly suitable for the medium and small enterprise frequently to take a design circuit board, makes the circuit board in batches.

Description

Circuit board capable of directly printing printed circuit diagram

Technical Field

The present invention relates to a circuit board for manufacturing a printed circuit, and more particularly, to a circuit board capable of directly printing a printed circuit pattern by using a flat printer (also called a UV printer).

Background

The circuit board is also called ceramic circuit board, PCB board, aluminum base board, high frequency board, impedance board, printed circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the mass production of fixed circuits. There are various methods for manufacturing the circuit board, and the most commonly used methods for manufacturing the circuit board include a thermal transfer method, a photosensitive method, a screen printing method, and the like. The thermal transfer printing method for manufacturing the circuit board has unstable effect and complex operation, the photosensitive method for manufacturing the circuit board has high input cost and difficult technical control, and the screen printing method is directly used for printing the etching-resistant ink on the circuit board to be used for etching resistance, but the screen printing method for manufacturing the circuit board is not suitable for frequently-proofing the circuit board and has lower precision, and a very simple method is that the UV ink (ink for a flat-plate printer) is directly printed on the copper conducting layer of the copper-coated plate by using the flat-plate printer, and the UV ink can not be soaked by the etching agent generally, so that the manufactured circuit board has incomplete circuit. For small and medium-sized enterprises, a simple, low-cost circuit board capable of directly printing a printed circuit diagram is highly desirable.

SUMMERY OF THE UTILITY MODEL

In order to overcome that traditional circuit board preparation technology is complicated, with high costs, directly print the shortcoming that can't produce the ideal circuit board on the copper conducting layer of copper clad plate with the UV ink with flatbed printer, the utility model provides a can directly print circuit board of printed circuit diagram in order to solve this problem, its positive effect is: the circuit board capable of directly printing the printed circuit diagram is adopted, the printed circuit diagram can be directly printed on the circuit board by using the flat-panel printer, an ideal circuit board can be manufactured simply, the efficiency of manufacturing the circuit board by medium and small enterprises is greatly improved, the manufacturing steps of the circuit board are reduced, the manufacturing cost of the circuit board is reduced, the operation is simple, the technology is easy to master, the manufacturing speed is high, and the circuit board is particularly suitable for frequent proofing and batch production of the circuit board.

The utility model provides a technical scheme that its technical problem adopted is:

the utility model discloses a circuit board of ability direct printing printed circuit diagram comprises insulating substrate, copper conducting layer, acid-resistant printing ink layer, makes the acid-resistant printing ink layer that is used for improving the printing ink layer adhesive force on the copper conducting layer.

Drawings

The following is a brief description of the drawings.

Fig. 1 is a schematic diagram of a circuit board structure capable of directly printing a printed circuit diagram according to the present invention.

In the figure, 1, an insulating substrate, 2, a copper conducting layer, 3, an acid-resistant ink layer and 4, a printing ink layer are arranged.

Detailed Description

We will further explain the present invention by taking as an example the implementation of a circuit board capable of direct printing of printed circuit diagrams:

In the figure, an insulating substrate 1 is generally made of bakelite, fiber woven cloth and epoxy resin glue which are pressed into an insulating plate with the thickness of 0.5mm-2.5mm, one surface of the insulating substrate 1 is plated with a thin red copper foil as a conductive layer, the conductive layer is a copper conductive layer 2, the insulating substrate 1 and the copper conductive layer 2 are combined to form a common copper clad plate, if an aluminum substrate is adopted, a layer of aluminum heat dissipation plate is arranged below a very thin insulating layer (corresponding to the insulating substrate 1 of the copper clad plate), and the embodiment is implemented by using finished copper clad plates (the insulating substrate 1 and the copper conductive layer 2); the acid-proof ink layer 3 is one kind of ink, the ink is acid-proof and alkali-proof, can be purchased in a physical shop or on the internet, can be easily removed by using a sodium hydroxide solution (one kind of alkaline substance), can be sprayed by using a pneumatic paint sprayer or an electric paint sprayer, so that the acid-proof ink forms the acid-proof ink layer 3 on the copper-clad copper conducting layer 2, when the acid-proof ink is sprayed, a special ink diluent is needed to dilute the ink, in order to save the ink, according to the actual manufacturing experience, only a very thin layer of ink is needed to achieve the effect, the acid-proof ink layer 3 is not used for etching resistance, has the effect equivalent to a coating used when a flat-panel printer is used for printing, is used for improving the adhesive force of the printing ink layer 4 formed when the flat-panel printer is used for printing, and many methods can not enable the ink to directly print on the copper conducting layer 2 to have good adhesive, the use of specialized metal coatings is also not feasible, and it is difficult to remove the unwanted metal coating easily and at low cost prior to etching.

Printing ink layer 4 does not belong to the utility model discloses an implement scope, this is the customer according to own needs, utilize the flatbed printer to print the printed circuit picture and form printing ink layer 4 on acidproof ink layer 3, utilize printing ink layer 4 to come the etch resistance, put into 1% -4% sodium hydroxide solution the board that has printed, only need tens of seconds, acidproof ink layer 3 of the part that does not have been printed will be destroyed by sodium hydroxide solution, will drop with the brush gently one brush, then the clear water is washed, just can put into etching liquid with the board and etch, etching liquid can be environmental protection etchant, also can use ferric trichloride etc, wait that the copper conducting layer 2 of the part that needs to etch is totally etched away, then put into the clear water and soak and can soften printing ink layer 4, or directly can remove printing ink layer 4 with steel sheet or steel wire ball, then put into sodium hydroxide solution the board, the acid-proof ink layer 3 of the circuit part is removed, after cleaning, a complete circuit board is manufactured, and then the next step is to manufacture a solder mask layer and print characters, which is a common process for manufacturing the circuit board and is not described in detail.

The production process of the circuit board with the acid-proof ink layer is simple, the acid-proof ink layer 3 only needs to be sprayed on the copper conducting layer 2 of the finished copper-clad plate or the finished aluminum substrate, the circuit board with the acid-proof ink layer is suitable for mass production in factories, a user directly purchases the circuit board with the acid-proof ink layer, and then the circuit board is manufactured by using a flat-panel printer or other methods, so that the method is high in speed, few in steps and low in cost, and is particularly suitable for quick sample making and.

Claims

1. The utility model provides a can directly print circuit board of printed circuit diagram, comprises insulating substrate (1), copper conducting layer (2), acidproof printing ink layer (3), its characterized in that: an acid-resistant ink layer (3) for improving the adhesive force of the printing ink layer (4) is manufactured on the copper conducting layer (2).