CN109890144A - A method of circuit board is made using flat-panel printer - Google Patents
A method of circuit board is made using flat-panel printer Download PDFInfo
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- CN109890144A CN109890144A CN201910254811.7A CN201910254811A CN109890144A CN 109890144 A CN109890144 A CN 109890144A CN 201910254811 A CN201910254811 A CN 201910254811A CN 109890144 A CN109890144 A CN 109890144A
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- circuit board
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- panel printer
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Abstract
A method of circuit board is made using flat-panel printer, the following steps are included: clipper circuit plate shape, copper face is sprayed into anti-etching printing ink, the output of printed circuit picture is formed into UV ink layer on the ink layer of circuit board, circuit board is placed in ink removal liquid and removes the ink for the copper face that need to corrode, then circuit board is put into etching solution and is corroded, then removes UV ink layer, remove remaining ink, prints solder mask and character；Using the solution of the present invention, input cost is high when overcoming unstable existing thermal transfer production circuit board effect, photoresist process production circuit board and technology difficulty is held, silk-screen production circuit board is not suitable for frequently drawing a design circuit board, directly with there is the incomplete disadvantage of circuit after plate printing printing and making circuit board etching, be particularly suitable for medium-sized and small enterprises circuit board frequently draw a design, batch making circuit board.
Description
Technical field
The present invention relates to a kind of method for making circuit board, especially a kind of, low cost system quick using flat-panel printer
Make the method for printed circuit board.
Background technique
The title of circuit board has ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board, PCB
Plate, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, ultra-thin wiring board, ultrathin circuit board, a variety of calls such as printed circuit board.Electricity
Road plate makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance layout for fixed circuit play an important role.Production
It is there are many ways to circuit board, most common to have thermal transfer, photoresist process production circuit board, stencil etc..
Thermal transfer is that production PCB circuit board is a kind of common method, first designs printed circuit with PCB Software for producing
Figure, so that it may printed circuit diagram is printed upon on heat-transferring printing paper using laser printer, second step is processing copper-clad plate, according to
PCB figure size carries out cleaning treatment after having cut copper-clad plate, can be cleaned with suds, and the copper-clad plate cleaned down is dried, and
By pcb board and the alignment pattern being printed upon on heat-transferring printing paper, then it is stained with securely with transparent rubberized fabric；Third step be exactly be thermal transfer,
Electric iron is generally used, conditional that plastic packaging machine can be used, effect is more preferable, and temperature will be adjusted when transfer with flatiron
High a little a solid pedestal to be looked for start ironing, ironing when, keeps same direction mobile, while firmly to press down, one
As there is a small amount of smog to emerge.Transfer is good, opens how one jiao of transfer paper looked at the effect transferred while hot, if very complete
Whole transfer paper of just directly tearing covers if good and uses flatiron ironing a little while again.It tears after transfer paper, needs to check transfer
Circuit, look at either with or without short-term or what bitten, if there is just fill can with being applied with permanent pen.
It next is exactly chemical attack.The corrosive agent of corrosion PCB copper-clad plate has very much, but more environmentally friendly and safe still tri-chlorination
Iron and environmentally friendly etchant pour into appropriate ferric trichloride particle in plastic casing and with boiled water modulation until particle all dissolves, so
PCB copper-clad plate is put into afterwards and constantly shakes plastic casing, the etching situation of wiring board is checked, is fully etched to unwanted part
Until falling, even if so far the primary work of circuit board making completes.The work of the above production PCB circuit board seems that comparison is light
Pine, actually this is not so, and all fans for doing PCB circuit board are that it had a headache, and the ink powder on heat-transferring printing paper often has part
The case where transfer is not got off, and causes thermal transfer effect very unstable, and it is easy to appear scarce black breakpoints due to printer, needs craft
It is mended with oil pen black, it is often necessary to which a large amount of work for repairing route needs to take a substantial amount of time and energy, a small amount of production are gone back
Can be with, if but this defect be transplanted to industrial production, production efficiency will can be greatly reduced in that.
Photoresist process makes circuit board, is exactly that circuit board is pasted to light-sensitive surface or applies photosensitive paint, film is then close to electricity
Road plate using ultraviolet exposure machine to circuit board exposure, then the wiring board after exposure is put and is developed in a developer, removed and be not required to
The part wanted exposes the part for needing to etch, then circuit board is placed in etching solution and erodes unwanted copper, must after cleaning
The circuit board needed is arrived, it is main stream approach that photoresist process, which makes circuit board, some circuit board factories use the method, but need valuableness
The circuit board that can just produce of equipment, the people for doing oversampling circuit plate both knows about, this is not suitable for small lot and sparetime circuit board,
First is the film difficulty production for being exactly high-quality, and second is exactly that light exposure is not easy to grasp, and third is dry film difficulty patch, secondly
It is just right to be that developing process difficulty grasps, these processes take great energy, is time-consuming, is laborious, feel to suffer untold misery sometimes.
Also have and production circuit board is sent out using silk-screen, circuit diagram is exactly fabricated to silk screen, is printed ink using silk screen
On circuit boards, the disadvantages of the method are as follows it is at high cost, speed is slow, precision is inadequate, circuit slightly changes, and must all remake one piece
Silk screen, this method are not suitable for the frequent circuit board of medium-sized and small enterprises and draw a design (a small amount of production circuit board is for testing) and produce in batches.
Also have using flat-panel printer (being also UV printer) directly by UV ink printed on circuit boards, but due to UV
Ink adhesive force does not cause by force the circuit of the circuit board after corrosion incomplete, and the people generally done just feels very troublesome.
For the medium-sized and small enterprises of small lot production, how it is hoped that there will be a kind of simple, being easily mastered, inexpensive, fast
The method of the production circuit board of speed.
Summary of the invention
When in order to overcome unstable and complicated for operation existing thermal transfer production circuit board effect, photoresist process production circuit board
Input cost is high and technology difficulty is held, silk-screen production circuit board is not suitable for frequently drawing a design circuit board and precision is lower, direct with flat
There is the incomplete disadvantage of circuit after plate printing printing and making circuit board etching, is printed the invention proposes a kind of using plate
Mechanism makees the method for circuit board to solve the problems, such as this, and good effect is: making circuit board using flat-panel printer using a kind of
Method, directly printed circuit diagram can be printed on circuit boards using flat-panel printer, very simply just produce ideal
Circuit board, substantially increase medium-sized and small enterprises production circuit board efficiency, reduce the making step of circuit board, reduce circuit
The cost of manufacture of plate, and it is easy to operate, be easily mastered, manufacturing speed it is fast, be particularly suitable for circuit board frequently drawing a design and batch is raw
It produces.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of method using flat-panel printer production circuit board of the invention, using following steps: well cutting circuit board shape
(may include punching etc.), makes the size of circuit board in the printable range of flat-panel printer, by the circuit board of well cutting
Copper face sprays anti-etching printing ink (can be acid and alkali-resistance anti-etching printing ink or alkaline-resisting anti-etching printing ink), after ink dries, utilizes plate
The photo print of printed circuit is formed UV ink layer by printer on the ink layer of circuit board, and printed circuit board is placed on
Ink removal liquid in (if be acidproof anti-etching printing ink if use 1% -5% sodium hydroxide solution, if be alkaline-resisting
Anti-etching printing ink is needed with dilute hydrochloric acid) ink on the copper face that need to corrode of removal, the circuit board after removal ink is put into etching solution
The circuit board etched is placed in clear water and impregnates removal UV ink layer, will remove the circuit board of UV ink layer again by middle corrosion
It is put into ink removal liquid, removes remaining ink, clear water dries up after rinsing or natural air drying, then prints solder mask and text
Character number, one piece of complete circuit board making are completed.
Specific embodiment
We by implement it is a kind of using flat-panel printer production circuit board method for the present invention is further described:
A kind of method using flat-panel printer production circuit board of the invention, can be easily accomplished using the following steps:
Step 1: it is cut together with engraving machine or other tool clipper circuit plate shapes, the hole location etc. that also may include circuit board,
Make the size of circuit board in the printable range of printer, if it is cutting aluminum substrate, need plus cut metal tiltedly to consider liquid to be worth doing earnestly,
To guarantee that cutter can normally be cut, if circuit board is less than printer and can print size, it can directly print, can also will cut
Final step is placed on the process of punching to handle.
Step 2: being to need to improve to put down by the copper face inking of the circuit board of well cutting or oil spout ink, the purpose of oil spout ink
The adhesive force of plate printer (being called UV printer) UV ink, at the same ink play the role of it is anti-etching.It is conditional to use high pressure
Gas oil spout ink or electronic oil spout ink, just can guarantee that the ink of the copper face of circuit board is uniform in this way, this is production high-precision circuit
The basis of plate, if it is of less demanding, and unprofessional paint spraying outfit, writing brush type brush ink can be used, as far as possible uniformly, so
Ink natural air drying is waited afterwards；The ink that the present embodiment is selected can be acidproof anti-etching printing ink, and ink removal liquid can use 1%-
The removal of the alkaline matters such as 5% sodium hydroxide (being commonly called as caustic soda, caustic soda, caustic soda) aqueous solution, can also use alkaline-resisting anti-etching oil
Ink removes liquid as ink using acid solutions such as dilute hydrochloric acid, and anti-etching printing ink and ink go New Year's Eve in Taobao or entity
Shop is on sale.
Step 3: using the software development circuit diagram of the profession production circuit board such as DXP, then exporting picture, or directly use
CAD software makes the picture of printed circuit diagram, and printing electricity can also be directly drawn with the included drawing software of the operating system of Microsoft
Then Lu Tu is exported printed circuit picture on the ink layer of circuit board using flat-panel printer (being also UV printer), if
It should be noted that when counting picture and just cover UV ink on copper face that needs retain, the ink layer on copper face for needing to corrode is not beaten
Print UV ink.
Step 4: printed circuit board is placed on the ink for the copper face that ink removal liquid removal need to corrode (due to UV plate
The UV ink layer of printer printing can completely cut off acid solution or alkaline solution, the ink and UV ink layer on copper face for needing to retain
Will not be removed), if it is the acidproof anti-etching printing ink used, can be gone using 1% -5% sodium hydroxide solution as ink
Except liquid removes ink, super go beyond the scope of concentration can also remove ink in fact, only influence removal speed and completeness, if it is
The alkaline-resisting anti-etching printing ink used needs the acid solutions such as dilute hydrochloric acid as ink and removes liquid to remove ink.Remove ink
Process general tens seconds, related with the thickness of ink layer, the circuit board after removal ink was rinsed with clear water.
Step 5: the circuit board after removal ink being put into etching solution and is corroded, if it is aluminum substrate, utilizes environmentally friendly etching solution
(sodium peroxydisulfate) effect is best, and for example renewable etchant of other etchants and ferric trichloride all have strong corrosion to aluminium sheet
Effect is not suitable for etching aluminum substrate, if etching the copper face of aluminum substrate with renewable etchant and ferric trichloride, needs pair
Other parts japanning operates more troublesome, unsuitable quickly production.
Step 6: the circuit board etched is placed in clear water and is impregnated, or so room temperature lower 10 hours, the UV ink of printing
Layer will soften, and with brush, gently a brush will remove, if urgently needed, directly brush away UV ink layer with steel wire lump.
Step 7: the circuit board for removing UV ink layer being placed again into ink removal liquid, remaining ink (route is removed
Partial ink), drying or natural air drying, one piece of circuit board with route appear at the moment after being rinsed with clear water.
Step 8: printing solder mask and letter symbol, this step are generally to do the step of circuit board will use, draw a design
Circuit board does not need welding resistance and character printing sometimes, terminates to this circuit board making.
Using flat-panel printer production circuit board method, can quickly, low-cost production's circuit board, be particularly suitable for medium and small
Enterprise's circuit board fast proofing, batch production, the precision of circuit are determined by the printing precision of printer.
Claims (3)
1. a kind of method using flat-panel printer production circuit board, which comprises the following steps:
Step (1): clipper circuit plate shape makes the size of circuit board in the printable range of flat-panel printer；
Step (2): the copper face of the circuit board of well cutting is sprayed into anti-etching printing ink；
Step (3): after ink dries, printed circuit picture is exported using flat-panel printer and is formed on the ink layer of circuit board
UV ink layer；
Step (4): printed circuit board is placed on to the ink that the copper face that need to corrode is removed in ink removal liquid；
Step (5): the circuit board after the copper face ink that need to corrode of removal is put into etching solution and is etched；
Step (6): the circuit board etched is placed in clear water and impregnates removal UV ink layer；
Step (7): the circuit board for removing UV ink layer is drained the oil again in ink removal liquid, removes remaining ink, clear water rinses
Drying or natural air drying afterwards.
2. a kind of method using flat-panel printer production circuit board according to claim 1, which is characterized in that step
(2) anti-etching printing ink is acidproof anti-etching printing ink, and the ink removal liquid in corresponding step (4) and step (7) is 1% -5%
Sodium hydroxide solution.
3. a kind of method using flat-panel printer production circuit board according to claim 1, which is characterized in that step
(2) anti-etching printing ink is alkaline-resisting anti-etching printing ink, and the ink removal liquid in corresponding step (4) and step (7) is dilute hydrochloric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910254811.7A CN109890144A (en) | 2019-04-01 | 2019-04-01 | A method of circuit board is made using flat-panel printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910254811.7A CN109890144A (en) | 2019-04-01 | 2019-04-01 | A method of circuit board is made using flat-panel printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109890144A true CN109890144A (en) | 2019-06-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910254811.7A Pending CN109890144A (en) | 2019-04-01 | 2019-04-01 | A method of circuit board is made using flat-panel printer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015341A (en) * | 2021-04-22 | 2021-06-22 | 江西新华盛电子电路科技有限公司 | Preparation process of double-sided board for household appliances |
| CN113498270A (en) * | 2021-07-08 | 2021-10-12 | 江西晶弘新材料科技有限责任公司 | Method for removing and washing solidified ink in aluminum nitride ceramic substrate |
| CN116732518A (en) * | 2023-06-06 | 2023-09-12 | 上海奢藏科技有限公司 | Etching treatment process for surface patterns of special-shaped multi-surface aluminum material |
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| US20040056939A1 (en) * | 2002-09-25 | 2004-03-25 | Manickam Thavarajah | Direct positive image photo-resist transfer of substrate design |
| KR20100040068A (en) * | 2008-10-09 | 2010-04-19 | 주식회사 동현써키트 | The improvement method of bending and heat emission effect by the two-sided structure of single-size board |
| CN104710869A (en) * | 2013-12-11 | 2015-06-17 | 方圆环球光电技术盐城有限公司 | UV-curing ink and method for preparing masking plate by using ink |
| CN108207081A (en) * | 2016-12-20 | 2018-06-26 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacturing method of printed circuit board circuitry |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040056939A1 (en) * | 2002-09-25 | 2004-03-25 | Manickam Thavarajah | Direct positive image photo-resist transfer of substrate design |
| KR20100040068A (en) * | 2008-10-09 | 2010-04-19 | 주식회사 동현써키트 | The improvement method of bending and heat emission effect by the two-sided structure of single-size board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015341A (en) * | 2021-04-22 | 2021-06-22 | 江西新华盛电子电路科技有限公司 | Preparation process of double-sided board for household appliances |
| CN113498270A (en) * | 2021-07-08 | 2021-10-12 | 江西晶弘新材料科技有限责任公司 | Method for removing and washing solidified ink in aluminum nitride ceramic substrate |
| CN113498270B (en) * | 2021-07-08 | 2023-06-02 | 江西晶弘新材料科技有限责任公司 | Method for stripping solidified ink in aluminum nitride ceramic substrate |
| CN116732518A (en) * | 2023-06-06 | 2023-09-12 | 上海奢藏科技有限公司 | Etching treatment process for surface patterns of special-shaped multi-surface aluminum material |
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Application publication date: 20190614 |
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