CN209880639U - Chip laying device - Google Patents
Chip laying device Download PDFInfo
- Publication number
- CN209880639U CN209880639U CN201920452507.9U CN201920452507U CN209880639U CN 209880639 U CN209880639 U CN 209880639U CN 201920452507 U CN201920452507 U CN 201920452507U CN 209880639 U CN209880639 U CN 209880639U
- Authority
- CN
- China
- Prior art keywords
- laying
- connecting arm
- chip
- base
- screw rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Manipulator (AREA)
Abstract
The utility model provides a chip laying device relates to solar cell and makes technical field. The method comprises the following steps: the base, lay subassembly, track, drive arrangement and track all set up in on the base, lay the subassembly with track sliding connection. The track is two, and two tracks parallel arrangement. The driving device drives the laying assembly to move on the rail, and the laying assembly lays the chip. The utility model provides a chip laying device can enlarge the home range who lays the subassembly, avoids the displacement that the support plate that lays produced in the motion.
Description
Technical Field
The utility model relates to a solar cell makes the field, particularly, relates to a chip laying device.
Background
In the production process of the solar cell, the chip needs to be laid on the corresponding placement position on the carrier plate. In the existing production process, a carrier plate is conveyed to a designated position by using a conveyor belt, and a chip is laid on a corresponding placement position on the carrier plate by a manual or mechanical arm. Meanwhile, because the laying area of the support plate is often large, the movable range of the manipulator is limited, and all chips cannot be laid on one station, so that in the process of laying the chips, the conveyor belt can move the station at a small distance after the manipulator lays part of the positions of the support plate, and the manipulator can lay other positions of the support plate. In the process, the carrier plate is driven to move by the conveyor belt for many times. However, because the friction between the conveyor belt and the carrier plate is limited, when the conveyor belt drives the carrier plate to move, the conveyor belt and the carrier plate move relatively at the starting moment and the stopping moment, and a position error is generated. And the error is continuously increased in multiple movements, which affects the radiation precision of the chip.
Disclosure of Invention
The utility model provides a chip laying device aims at improving current chip and lays the in-process, and the mobile scope of manipulator is limited, and the conveyer belt can take place relative displacement with the support plate and produce position error's problem.
In order to solve the problems, the utility model discloses a chip laying device, which comprises a base, a laying assembly and a track, wherein the track is arranged on the base, the laying assembly is connected with the track in a sliding way, and the laying assembly is used for grabbing a chip;
optionally, the number of the rails is two, and the two rails are arranged on the base in parallel;
optionally, the chip laying movement device further comprises a driving device arranged on the base, the driving device comprises a screw rod, a servo motor and a coupler, and the servo motor is connected with the screw rod through the coupler;
optionally, the screw rod is arranged between the two rails, the screw rod is parallel to the rails, the two ends of the screw rod are provided with limiting blocks, and the servo motor can be arranged at any end of the screw rod;
optionally, the laying assembly comprises a sliding base, a lifting device, a connecting arm and a gripper assembly, the lifting device is arranged on the sliding base, the connecting arm is rotatably connected with the extending end of the lifting device, and the gripper assembly is connected with the connecting arm;
optionally, the bottom of the sliding base is correspondingly provided with two track grooves which can be slidably connected with the tracks, the bottom of the sliding base is provided with a screw rod sliding block, and the sliding base is rotatably connected with a screw rod through the screw rod sliding block.
Optionally, the connecting arm includes a first connecting arm and a second connecting arm, one end of the first connecting arm is rotatably connected with the extending end of the lifting device, the other end of the first connecting arm is rotatably connected with one end of the second connecting arm, and the gripper assembly is connected with the second connecting arm;
optionally, the grabbing component comprises a sucker and a connecting rod, one end of the connecting rod is connected with the sucker, and the other end of the connecting rod is connected with the second connecting arm;
after the technical scheme is adopted, external transportation equipment is used, if a conveyor belt conveys a carrier plate to be laid to a corresponding position, the laying device lays the carrier plate, after the laying of the part is finished, the driving device drives the laying assembly to move on the rail, and after the laying device moves to the next station, the laying device continues laying, so that the problem that the carrier plate slips in the transmission process to cause displacement difference is solved. And the movable range of the laying device is enlarged by additionally arranging the track.
Drawings
Reference numerals:
FIG. 1 is an overall structure of the present invention;
FIG. 2 is a structural diagram of the laying assembly of the present invention;
the main elements in the figures are numbered as follows:
1. a base; 2. a track; 3. a servo motor; 4. a coupling; 5. a limiting block; 6. a screw rod; 7. a sliding base; 8. a lifting device; 9. a suction cup; 10. a first connecting arm; 11. a second connecting arm; 12. a connecting rod;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The invention will be described in more detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2, in one embodiment, a chip laying device includes a base, a laying assembly, and two rails disposed in parallel on the base. The laying device further comprises a driving device, the driving device comprises a lead screw, a coupler and a servo motor, the lead screw is arranged on the base between the two rails and is parallel to the rails, and limiting blocks are arranged at two ends of the lead screw respectively. One end of the screw rod is provided with a servo motor, the servo motor is rotationally connected with the screw rod through a coupler, and the screw rod is driven to rotate through the rotation of the servo motor. The laying assembly comprises a sliding base, a lifting device, a connecting arm and a gripper assembly, two rail grooves corresponding to rails and a screw rod sliding block corresponding to a screw rod are arranged at the bottom of the sliding base, so that the sliding base can drive the screw rod to rotate through the rotation of a servo motor, and the sliding base can be driven to move along the rails. The lifting device is fixedly arranged on the sliding base, and the height of the laying assembly can be adjusted by extending or retracting the extending end of the lifting device. The connecting arm comprises a first connecting arm and a second connecting arm, one end of the first connecting arm is rotatably connected with the extending end of the lifting device, the other end of the first connecting arm is rotatably connected with one end of the second connecting arm, and the gripper assembly is connected with the second connecting arm. The grabbing component comprises a sucker and a connecting rod, one end of the connecting rod is connected with the sucker, and the other end of the connecting rod is connected with the second connecting arm. The grabbing component comprises a sucker and a connecting rod, one end of the connecting rod is connected with the sucker, and the other end of the connecting rod is connected with the second connecting arm.
In the chip laying process, the chip laying device can be fixed above the conveyor belt, and the track direction is vertical to the extending direction of the conveyor belt and can also be fixed at other suitable positions. After the laying support plate is conveyed to a corresponding position through the conveyor belt, the conveyor belt stops moving, a laying assembly of the laying device rotates through the matching of all parts, and after the prepared chip is adsorbed and lifted by the suction disc, the chip is laid on the support plate. When the width overlength of support plate has surpassed the longest scope of each linking arm of laying the subassembly, behind the sucking disc absorption chip, servo motor rotated, drives and lays the subassembly and move on the track, enlarges the working range who lays the subassembly, realizes in the width direction of support plate, can lay the chip in the optional position of support plate.
Through the utility model provides a chip laying device can realize enlarging and lay the scope. Therefore, the movement of the carrier plate is reduced, the displacement caused by the slipping of the carrier plate on the conveyor belt is avoided, and the chip laying precision is further improved.
Claims (8)
1. The chip laying device is characterized by comprising a base, a laying assembly and a rail, wherein the rail is arranged on the base, the laying assembly is connected with the rail in a sliding mode, and the laying assembly is used for grabbing a chip.
2. The die placement apparatus according to claim 1, wherein said rails are two, and wherein said two rails are disposed in parallel on said base.
3. The chip laying apparatus according to claim 2, wherein the chip laying movement apparatus further comprises a driving device disposed on the base, the driving device comprises a screw, a servo motor and a coupling, and the servo motor is connected with the screw through the coupling.
4. The chip laying device according to claim 3, wherein the screw rod is arranged between two rails, the screw rod is parallel to the rails, two ends of the screw rod are provided with limit blocks, and the servo motor can be arranged at any end of the screw rod.
5. The chip laying apparatus according to claim 4, wherein the laying assembly comprises a sliding base, a lifting device, a connecting arm and a gripper assembly, the lifting device is arranged on the sliding base, the connecting arm is rotatably connected with an extending end of the lifting device, and the gripper assembly is connected with the connecting arm.
6. The chip laying device according to claim 5, wherein the bottom of the sliding base is correspondingly provided with two track grooves which can be slidably connected with the tracks, the bottom of the sliding base is provided with a screw rod sliding block, and the sliding base is rotatably connected with a screw rod through the screw rod sliding block.
7. The chip laying apparatus according to claim 6, wherein the connecting arm includes a first connecting arm and a second connecting arm, one end of the first connecting arm is rotatably connected to the protruding end of the lifting device, the other end of the first connecting arm is rotatably connected to one end of the second connecting arm, and the gripper assembly is connected to the second connecting arm.
8. The die placement apparatus according to claim 7, wherein said grasping assembly comprises a suction cup and a connecting rod, one end of said connecting rod being connected to said suction cup and the other end of said connecting rod being connected to said second connecting arm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920452507.9U CN209880639U (en) | 2019-04-04 | 2019-04-04 | Chip laying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920452507.9U CN209880639U (en) | 2019-04-04 | 2019-04-04 | Chip laying device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209880639U true CN209880639U (en) | 2019-12-31 |
Family
ID=68958542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920452507.9U Expired - Fee Related CN209880639U (en) | 2019-04-04 | 2019-04-04 | Chip laying device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209880639U (en) |
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2019
- 2019-04-04 CN CN201920452507.9U patent/CN209880639U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PP01 | Preservation of patent right |
Effective date of registration: 20200817 Granted publication date: 20191231 |
|
PP01 | Preservation of patent right | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20230817 Granted publication date: 20191231 |
|
PD01 | Discharge of preservation of patent | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191231 |
|
CF01 | Termination of patent right due to non-payment of annual fee |