CN209878145U - Sensing device and infrared sensing mechanism - Google Patents
Sensing device and infrared sensing mechanism Download PDFInfo
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- CN209878145U CN209878145U CN201920294386.XU CN201920294386U CN209878145U CN 209878145 U CN209878145 U CN 209878145U CN 201920294386 U CN201920294386 U CN 201920294386U CN 209878145 U CN209878145 U CN 209878145U
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- infrared sensing
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Abstract
The utility model discloses a sensing device and infrared sensing mechanism, infrared sensing mechanism includes: sensing component, pin base and pad dress spare. When the infrared sensing mechanism is used, the pins of the pin base are firstly inserted into the pin holes, and the pins are flush or approximately flush with the mounting surface. At this time, the electrical connection between the pins and the circuit board can be realized only by mutually attaching the mounting surface of the gasket piece and the preset part of the circuit board. The electric connection between the infrared sensing mechanism and the circuit board is realized. Therefore, in the above embodiment, an assembly manner of a manual plug-in (conventionally, the infrared sensor needs to electrically connect the pin base and the circuit board in a plug-in manner) is not required, and the electrical connection between the infrared sensing mechanism and the circuit board can be realized, so that the assembly efficiency of the infrared sensing mechanism can be improved.
Description
Technical Field
The utility model relates to a technical field of sensor especially relates to a sensing device and infrared sensing mechanism.
Background
Traditionally, infrared sensors have achieved the perception of movement of the emitter body by receiving a source of infrared radiation. Traditional infrared sensor passes through TO-5 pin base cartridge on corresponding circuit board, and above-mentioned package assembly often can only assemble through artifical plug-in components, can't realize infrared sensor's automatic assembly promptly TO make infrared sensor's assembly efficiency reduce.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a sensor device and an infrared sensing mechanism that can improve assembly efficiency.
The technical scheme is as follows:
an infrared sensing mechanism comprises a sensing assembly, a pin base and a pad assembly, wherein the pin base is electrically connected with the sensing assembly, a pin is arranged on the pin base, a pin hole corresponding to the pin is formed in the pad assembly, an installation surface of the pad assembly is used for being attached to a circuit board, the pin penetrates through the pin hole and is used for being in electrical contact with the circuit board, and the pin is bent and flattened and then is flushed with the installation surface.
The assembly method of the infrared sensing mechanism comprises the steps of firstly inserting the pins of the pin base into the pin holes, bending the pins along the pin grooves, flattening the pins, and then leveling the pins with the mounting surface. At this time, the electrical connection between the pins and the circuit board can be realized only by mutually attaching the mounting surface of the gasket piece and the preset part of the circuit board. The electric connection between the infrared sensing mechanism and the circuit board is realized. Therefore, in the above embodiment, an assembly mode of manual insertion is not required (the conventional infrared sensor needs to electrically connect the pin base and the circuit board in an insertion mode), and the electrical connection between the infrared sensing mechanism and the circuit board can be realized, so that the assembly efficiency of the infrared sensing mechanism can be improved.
A sensing device comprises an infrared sensing mechanism and a circuit board, wherein the infrared sensing mechanism is arranged on the circuit board and is electrically connected with the circuit board.
When the sensing device is processed, the infrared sensing mechanism is attached to the circuit board, so that automatic assembly of the infrared sensing mechanism and the circuit board can be realized by means of auxiliary equipment, and the assembly efficiency of the sensing device is improved.
The present invention is further explained below by combining the above scheme:
the pin base is provided with a pin groove corresponding to the pin, the pad part is attached to the pin base, and the pin is bent along the pin groove and is flush with the mounting surface.
The pin base is provided with a positioning bulge, and the pad part is provided with a positioning notch corresponding to the positioning bulge.
The pins are flat, bent and flattened and attached to the bottoms of the pin grooves.
The pins are provided with bending joints, and the bending joints correspond to the pin holes.
The infrared sensing mechanism further comprises a shell, the sensing assembly is arranged on the pin base, the shell is sleeved on the pin base, and the sensing assembly is located inside the shell.
The sensing assembly comprises a pyroelectric detecting element and a preamplification circuit, the pyroelectric detecting element is electrically connected with the preamplification circuit, the optical filter is arranged on the shell, and the optical filter is opposite to the pyroelectric detecting element.
The optical filter is an optical lens, such as a silicon wafer coated with an optical film.
The sensing assembly further comprises a pre-amplification circuit, and the pre-amplification circuit comprises a cushion block, a field effect tube and a PCB.
Drawings
Fig. 1 is a schematic structural diagram of an infrared sensing mechanism according to an embodiment of the present invention;
fig. 2 is a schematic partial structural view of an infrared sensing mechanism according to an embodiment of the present invention (in an unadded state);
fig. 3 is a schematic structural diagram of a cushion member according to an embodiment of the present invention;
fig. 4 is a top view of an infrared sensing mechanism according to an embodiment of the present invention;
fig. 5 is a front view of an infrared sensing mechanism according to an embodiment of the present invention;
fig. 6 is a bottom view of an infrared sensing mechanism according to an embodiment of the present invention.
Description of reference numerals:
100. the pyroelectric infrared sensing device comprises a sensing assembly, a 110, a shell, a 120, a filter, a 130, a pyroelectric detecting element, a 140, a cushion block, a 150, a field effect transistor, a 160, a PCB (printed circuit board), a 200, a pin base, a 210, pins, a 211, a bending joint, a 300, a gasket part, a 310, pin holes, a 320, a mounting surface, a 330, a pin groove, a 340, an alignment notch, a 350 and a pin surface.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the present invention, the terms "first" and "second" do not denote any particular quantity or order, but are merely used to distinguish names.
As shown in fig. 1 and 2, in one embodiment, an infrared sensing mechanism includes: sensing component 100, lead base 200, and pad assembly 300. The lead base 200 is electrically connected to the sensing assembly 100, the lead base 200 is provided with a lead 210, the pad 300 is provided with a lead hole 310 corresponding to the lead 210, an installation surface 320 of the pad 300 is used for being attached to a circuit board, the lead 210 penetrates through the lead hole 310 and is electrically connected to the circuit board, and the lead 210 is flush with the installation surface 320.
When the infrared sensing mechanism is produced, the leads 210 of the lead base 200 are first flattened and inserted into the lead holes 310, and then the flattened leads 210 are bent and flattened in the lead slots 330 of the gasket 300, and the leads 210 are flush with the mounting surface 320. As shown in fig. 6, at this time, the mounting surface 320 of the pad 300 and the predetermined portion of the circuit board are only required to be attached to each other, so that the electrical connection between the pins 210 and the circuit board can be realized. The electric connection between the infrared sensing mechanism and the circuit board is realized. Therefore, in the above embodiment, an assembly manner of a manual plug-in (conventionally, the infrared sensor needs to electrically connect the pin base 200 to the circuit board by a plug-in manner) is not required, and the electrical connection between the infrared sensing mechanism and the circuit board can be realized, so that the assembly efficiency of the infrared sensing mechanism can be improved.
Specifically, in the present embodiment, the pad 300 is a gasket or a pad plate. The thickness of the gasket 300 may be processed according to actual conditions. The pins 210 are flush with the mounting surface 320 after being inserted into the pin holes 310, so that on one hand, the pins 210 can be ensured to penetrate through the pin holes 310 to be electrically connected with a circuit board, and on the other hand, the bonding effect of the pad assembly 300 and the circuit board is also ensured. The installation of the infrared sensing mechanism on the circuit board is realized through the attaching mode in the above embodiment, so that the infrared sensing mechanism can be more easily assembled with the circuit board by means of the auxiliary equipment. That is, the above-mentioned embodiment uses the TO-5 pin base TO cooperate with the pad 300 TO realize the SMD (Surface Mounted Devices). This is only one of the embodiments, for example: according to practical situations, the first lead groove 330 and the second lead groove 330 may be formed on two corresponding surfaces of the pad assembly 300, respectively, that is, the bonding mounting of the lead 210 on the two surfaces of the pad assembly 300 may be achieved.
As shown in fig. 2 and fig. 3, in an embodiment, the pad assembly 300 further has a pin slot 330 corresponding to the pin 210, the pad assembly 300 and the pin base 200 are attached to each other, and the pin 210 is disposed in the pin slot 330. Specifically, in the present embodiment, the groove depth of the lead groove 330 is determined according to the size and shape of the lead 210. Further, the lead groove 330 is opened on the surface of the pad 300, and the lead groove 330 is opened on the surface of the pad 300 from the outer side of the pad 300 to the middle of the surface. The above-mentioned slotting method enables the installation condition (whether the pin 210 is completely fitted) of the pin 210 in the pin slot 330 to be observed through the side part after the pad 300 and the pin base 200 are fitted to each other. Further, when the pad assembly 300 is attached to the lead base 200, the length of the lead 210 on the lead base 200 is greater than the thickness of the pad assembly 300, so that when the lead 210 is inserted into the lead hole 310 and flush with the mounting surface 320, the lead 210 between the lead base 200 and the pad assembly 300 can be bent and mounted in the lead groove 330.
In one embodiment, the surface of the pad assembly 300 for contacting a circuit board is a mounting surface 320, and the surface of the pad assembly 300 contacting the lead base 200 is a lead surface 350. According to actual assembly conditions, the mounting surface 320 and the lead surface 350 may be provided with lead grooves 330, and then the leads 210 are bent, so that the leads 210 and the pad 300 are attached to each other.
In one embodiment, the lead base 200 is provided with an alignment protrusion, and the pad 300 is provided with an alignment notch 340 corresponding to the alignment protrusion. Specifically, in the present embodiment, after the pins 210 are mounted in the pin slots 330 of the pad 300 or the pins 210 are inserted into the pin holes 310, the alignment notches 340 are aligned and matched with the alignment protrusions. That is, the above embodiment plays a role in alignment prompt in the process of attaching the pins 210, so that the infrared sensing mechanism is more convenient to install.
In one embodiment, the leads 210 are flat, and the side portions of the leads 210 and the bottom portions of the lead slots 330 are attached to each other. Specifically, in the present embodiment, the pins 210 and the bottoms of the pin slots 330 are more tightly attached, so as to ensure the attaching and mounting effect of the pad 300 and the pin base 200. More specifically, the flat leads 210 have a thinner overall thickness than the conventional leads 210, so as to facilitate the bending operation.
In one embodiment, the lead 210 is provided with a bending joint 211, and the bending joint 211 corresponds to the lead hole 310. Specifically, according to the actual operation, after the pin 210 is inserted into the pin hole 310 of the pad 140, the bending joint 211 on the pin 210 is inserted into the pin hole 310 correspondingly following the pin 210. At this time, the pin 210 is directly bent, so that the pin 210 can be bent under the action of the bending joint 211 and attached to the surface of the cushion member 300. The above embodiment makes the bending of the lead 210 more convenient.
As shown in fig. 1 and 2, in one embodiment, the infrared sensing mechanism further comprises a housing 110. The sensing component 100 is mounted on the pin base, the housing 110 is sleeved on the pin base, and the sensing component 100 is located inside the housing 110. Specifically, in this embodiment, the housing 110 can effectively prevent external dust or pollution particles from falling into the infrared sensing mechanism, thereby ensuring normal use of the infrared sensing mechanism.
As shown in fig. 1 and 5, in one embodiment, the sensing assembly 100 includes a housing 110, a thermal filter 120, a voltage release detector 130, a spacer 140, a fet 150, and a PCB 160. As shown in fig. 1 and 4, the optical filter 120 is disposed on the housing 110, and the optical filter 120 faces the pyroelectric detecting element 130. The pyroelectric detecting element 130 is electrically connected to the PCB 160 through the pad 140, and the fet 150 is electrically connected to the PCB 160. The PCB 160 is electrically connected to the pin base 200. After receiving the variable infrared radiation signal, the pyroelectric detecting element 130 converts the variable information of the infrared signal into a corresponding voltage signal and transmits the voltage signal to the preamplifier circuit for processing.
In one embodiment, a sensing device includes the infrared sensing mechanism according to any one of the above embodiments, and further includes a circuit board. The infrared sensing mechanism is arranged on the circuit board and is electrically connected with the circuit board. Specifically, in this embodiment, when the sensing device is processed, the infrared sensing mechanism is attached to the circuit board, so that the infrared sensing mechanism and the circuit board can be automatically assembled by using auxiliary equipment, and the assembly efficiency of the sensing device is improved.
In one embodiment, the number of the infrared sensing mechanisms is more than one, and the more than one infrared sensing mechanisms are reflow-welded on the circuit board. The infrared sensing mechanism is made of a high Curie point material and can effectively withstand reflow soldering at 260 ℃.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An infrared sensing mechanism, comprising:
the pin base is electrically connected with the sensing assembly, pins are arranged on the pin base, pin holes corresponding to the pins are formed in the pad assembly, the mounting surface of the pad assembly is used for being mutually attached to a circuit board, and the pins penetrate through the pin holes and are electrically connected with the circuit board when in use.
2. The infrared sensing mechanism as recited in claim 1, wherein the pad member further defines a pin slot corresponding to the pin, the pad member and the pin base are attached to each other, and the pin is bent along the pin slot and flush with the mounting surface.
3. The infrared sensing mechanism as recited in claim 2, wherein the pin base is provided with an alignment protrusion, and the pad member is provided with an alignment notch corresponding to the alignment protrusion.
4. The infrared sensing mechanism as set forth in claim 2, wherein said leads are flat, and said leads are bent and flattened and fit against the bottoms of said lead grooves.
5. The infrared sensing mechanism as recited in claim 2, wherein said pins are provided with bending joints, said bending joints corresponding to said pin holes.
6. The infrared sensing mechanism of claim 1, further comprising a housing, wherein the housing further comprises a filter, the sensing component is mounted on the pin base, the housing is mounted on the pin base, and the sensing component is located inside the housing.
7. The infrared sensing mechanism as recited in claim 6, wherein the sensing element comprises a pyroelectric detecting element and a pre-amplifying circuit, the pyroelectric detecting element is electrically connected to the pre-amplifying circuit, the pre-amplifying circuit is electrically connected to the pin base, the filter is mounted on the housing, and the filter faces the pyroelectric detecting element.
8. The infrared sensing mechanism as set forth in claim 6, wherein said optical filter is an optical lens.
9. The infrared sensing mechanism of claim 6, wherein the sensing assembly further comprises a preamplifier circuit, the preamplifier circuit comprising a spacer, a field effect transistor, and a PCB.
10. A sensing device, comprising the infrared sensing mechanism of any one of claims 1 to 9, and further comprising a circuit board, wherein the infrared sensing mechanism is mounted on the circuit board and electrically connected to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920294386.XU CN209878145U (en) | 2019-03-08 | 2019-03-08 | Sensing device and infrared sensing mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920294386.XU CN209878145U (en) | 2019-03-08 | 2019-03-08 | Sensing device and infrared sensing mechanism |
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| CN209878145U true CN209878145U (en) | 2019-12-31 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117219522A (en) * | 2023-10-17 | 2023-12-12 | 深圳市同和光电科技有限公司 | Production method of multiple detection type high-qualification rate infrared receiving chip |
| CN117219522B (en) * | 2023-10-17 | 2024-08-02 | 深圳市同和光电科技有限公司 | Production method of multiple detection type high-qualification rate infrared receiving chip |
-
2019
- 2019-03-08 CN CN201920294386.XU patent/CN209878145U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117219522A (en) * | 2023-10-17 | 2023-12-12 | 深圳市同和光电科技有限公司 | Production method of multiple detection type high-qualification rate infrared receiving chip |
| CN117219522B (en) * | 2023-10-17 | 2024-08-02 | 深圳市同和光电科技有限公司 | Production method of multiple detection type high-qualification rate infrared receiving chip |
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