Silicon wafer basket capable of bearing silicon wafers
Technical Field
The utility model relates to a can bear silicon chip basket of flowers of silicon chip.
Background
The silicon wafer basket is used for bearing a silicon wafer, the inner space of the silicon wafer basket is used for inserting and placing a vertically-arranged silicon wafer and comprises a main frame body, the main frame body comprises a side wall and an underframe, the side wall is formed by a pair of side frames arranged left and right and a pair of end plates arranged front and back, the pair of end plates are vertically arranged and are parallel to each other, the pair of side frames are respectively provided with a vertical slot for inserting the side edge of the silicon wafer, and the pair of side frames are matched with each other.
The side frame of the existing silicon wafer flower basket mainly has two forms:
1) the side frame adopts a slot plate; the socket board includes: the device comprises a vertically arranged plate-shaped main body and a row of vertical slots arranged on one side surface of the plate-shaped main body; the row of slots are arranged along the transverse direction of the plate-shaped main body in sequence;
2) the side frame is composed of a plurality of toothed bars, and all the toothed bars in the same side frame are positioned on the same vertical surface; the rack bar includes: the rod-shaped body and at least one row of slots arranged on the rod-shaped body; the same row of slots are arranged in sequence along the axial direction of the rod-shaped main body; if two rows of slots are arranged on the rod-shaped main body, the two rows of slots are arranged oppositely.
With the development of solar cell technology, the efficiency of the solar module can be improved by dividing the whole silicon wafer into at least two sub-wafers. However, the existing silicon wafer flower basket is designed according to the shape of the whole silicon wafer, so that the silicon wafer flower basket needs to be additionally and independently designed for the slicing, and the production cost of an enterprise is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects in the prior art, the utility model provides a silicon wafer basket capable of bearing silicon wafers, the inner space of which is used for inserting and placing the vertical silicon wafers, comprising a main frame body, wherein the main frame body comprises a side frame and a bottom frame, the side frame is enclosed by a pair of side frames arranged left and right and a pair of end plates arranged front and back, the pair of end plates are vertically placed and are parallel to each other, the pair of side frames are respectively provided with a vertical slot for inserting and placing the side edge of the silicon wafer, and the pair of side frames are mutually matched;
and a separating rod is arranged between the pair of side frames and is vertical to the pair of end plates, the pair of end plates are respectively provided with a guide groove for guiding the end part of the separating rod to slide, the guide grooves on the pair of end plates are symmetrically arranged, and the two ends of the separating rod are respectively detachably connected with the guide grooves on the pair of end plates.
The utility model arranges a detachable separating rod for the prior silicon wafer flower basket; when the separating rod is detached, a row of vertically arranged silicon wafers (which can be a whole wafer) can be inserted into the silicon wafer basket; when the separating rod is arranged, the internal space of the silicon wafer basket can be separated, and then two rows of vertically arranged silicon wafers (can be separated) can be inserted and placed, and the two rows of silicon wafers can be arranged up and down or left and right.
In order to adjust the installation position of the separating rod in the internal space of the silicon wafer basket, guide grooves are formed in the pair of end plates, two ends of the separating rod can slide along the guide grooves, and the installation position of the separating rod can be adjusted in the left-right direction and/or the vertical direction to adapt to silicon wafers of different sizes; when the separation rod is installed, the installation position of the separation rod is adjusted to the right position, and then the separation rod is detachably fixed.
Preferably, the separating rod is a rack rod, and the rack rod is provided with a slot for inserting and placing the silicon wafer, so that the silicon wafer can be placed more stably.
Preferably, the guide groove is arranged along the left-right direction, two ends of the separating rod can slide left and right along the guide groove, and the mounting position of the separating rod can be adjusted along the left-right direction so as to adapt to silicon wafers of different sizes.
Preferably, the guide groove is vertically arranged, two ends of the separating rod can vertically slide along the guide groove, and the mounting position of the separating rod can be vertically adjusted to adapt to silicon wafers of different sizes.
Preferably, the top end of the guide groove is open to facilitate the insertion of the end of the separation rod into the guide groove.
Preferably, the guide groove is obliquely arranged, two ends of the separating rod can slide obliquely along the guide groove, and the mounting positions of the separating rod can be adjusted in the left-right direction and the vertical direction simultaneously so as to adapt to silicon wafers of different sizes.
Preferably, the guide groove is cross-shaped, two ends of the separating rod can slide left and right or vertically along the guide groove, and the mounting position of the separating rod can be adjusted in the left and right direction or vertical direction so as to adapt to silicon wafers of different sizes.
Preferably, the guide groove is X-shaped, two ends of the separating rod can slide along the guide groove in an inclined mode, and the mounting positions of the separating rod can be adjusted in the left-right direction and the vertical direction simultaneously to adapt to silicon wafers of different sizes.
Preferably, the guide groove is L-shaped, two ends of the separating rod can slide left and right or vertically along the guide groove, and the mounting position of the separating rod can be adjusted in the left and right direction or vertical direction so as to adapt to silicon wafers of different sizes.
Preferably, the top end of the guide groove is open, so that the end part of the separation rod can be conveniently inserted into the guide groove
Preferably, the pair of side frames are slot plates; is a side frame structure of the prior silicon wafer flower basket.
Preferably, the pair of side frames are respectively composed of a plurality of rack bars, and the rack bars in the same side frame are positioned on the same vertical surface; is a side frame structure of the prior silicon wafer flower basket.
Preferably, at least two separating bars are provided in a single guide groove, allowing more options for the storage layout of the silicon wafers.
Drawings
FIGS. 1 and 2 are schematic views of example 1;
FIG. 3 is a schematic view of example 2;
FIG. 4 is a schematic view of example 3;
FIG. 5 is a schematic view of example 4;
FIG. 6 is a schematic view of example 5;
FIG. 7 is a schematic view of example 6;
FIG. 8 is a schematic view of example 7;
FIG. 9 is a schematic view of example 8.
Detailed Description
The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example 1
As shown in fig. 1 and fig. 2, the utility model provides a silicon wafer basket capable of bearing silicon wafers, the inner space of which is used for inserting and placing vertically placed silicon wafers, comprising a main frame body, the main frame body comprises a side frame 10 and a bottom frame 20, the side frame 10 is enclosed by a pair of side frames 11 arranged left and right and a pair of end plates 12 arranged front and back, the pair of end plates 12 are vertically placed and parallel to each other, the pair of side frames 11 are respectively provided with vertical slots for inserting and placing the side edges of the silicon wafers, and the pair of side frames 11 are mutually matched;
a separating rod 30 is further arranged between the pair of side frames 11, the separating rod 30 is perpendicular to the pair of end plates 12, the pair of end plates 12 are respectively provided with a guide groove 40 for guiding the end of the separating rod 30 to slide, the guide grooves 40 on the pair of end plates 12 are symmetrically arranged, and two ends of the separating rod 30 are respectively detachably connected with the guide grooves 40 on the pair of end plates 12;
the guide groove 40 is provided in the left-right direction.
The separation rod 30 is detachable; when the separating rod 30 is detached, a row of vertically arranged silicon wafers (which can be a whole wafer) can be inserted into the silicon wafer basket; when the separating rod 30 is installed, the internal space of the silicon wafer basket can be separated, and then two rows of vertically-arranged silicon wafers 50 (which can be separated) can be inserted, and the two rows of silicon wafers 50 can be arranged up and down (as shown in fig. 1) or left and right (as shown in fig. 2).
In order to adjust the installation position of the separating rod 30 in the internal space of the silicon wafer basket, a pair of end plates 12 are provided with guide grooves 40, two ends of the separating rod 30 can slide left and right along the guide grooves 40, and the installation position of the separating rod 30 can be adjusted along the left and right direction to adapt to silicon wafers with different sizes; when the separation rod 30 is installed, the installation position of the separation rod 30 is adjusted to a proper position, and then the separation rod 30 is (detachably) fixed.
The separating rod 30 can be a rack rod, and the rack rod is provided with a slot for inserting and placing silicon wafers, so that the silicon wafers can be placed more stably.
The pair of side frames 11 may be of a conventional structure, and the pair of side frames 11 may be respectively formed of a plurality of rack bars, and the rack bars in the same side frame 11 are located on the same vertical plane. Alternatively, the pair of side frames 11 may be both slotted plates (the slotted plates are not shown).
Example 2
As shown in fig. 3, the difference is that, based on embodiment 1:
the guide groove 40 is vertically arranged, two ends of the separating rod 30 can vertically slide along the guide groove 40, and the mounting position of the separating rod 30 can be vertically adjusted to adapt to silicon wafers of different sizes.
Example 3
As shown in fig. 4, the difference is that, based on embodiment 2:
the top end of the guide groove 40 is open to facilitate the insertion of the end of the separation rod 30 into the guide groove 40.
Example 4
As shown in fig. 5, the difference is that, based on embodiment 1:
the guide groove 40 is obliquely arranged, two ends of the separating rod 30 can slide obliquely along the guide groove 40, and the mounting positions of the separating rod 30 can be adjusted in the left-right direction and the vertical direction simultaneously so as to adapt to silicon wafers with different sizes.
Example 5
As shown in fig. 6, the difference is that in example 1:
the guide groove 40 is cross-shaped, two ends of the separating rod 30 can slide left and right or vertically along the guide groove 40, and the mounting position of the separating rod 30 can be adjusted in the left and right direction or vertical direction to adapt to silicon wafers with different sizes.
Example 6
As shown in fig. 7, the difference is that in example 1:
the guide groove 40 is in an X shape, two ends of the separating rod 30 can slide along the guide groove 40 in an inclined mode, and the mounting positions of the separating rod 30 can be adjusted in the left-right direction and the vertical direction at the same time so as to adapt to silicon wafers of different sizes.
Example 7
As shown in fig. 8, the difference is that in example 1:
the guide groove 40 is L-shaped, two ends of the separating rod 30 can slide left and right or vertically along the guide groove 40, and the mounting position of the separating rod 30 can be adjusted in the left and right direction or vertical direction so as to adapt to silicon wafers with different sizes.
Example 8
As shown in fig. 9, the difference between example 7 is that:
the top end of the guide groove 40 is open to facilitate the insertion of the end of the separation rod 30 into the guide groove 40.
Preferably, in embodiments 1 to 8, at least two dividing bars are provided in a single guide groove 40, so that there are more options for the storage layout of the silicon wafers.
As in embodiment 1, at least two separation rods are fitted in a single guide groove 40; two rows of silicon chips can be inserted and arranged up and down; or a plurality of rows of silicon wafers are inserted and arranged in sequence along the left and right direction.
As in embodiment 2 and embodiment 3, at least two separation rods are fitted in a single guide groove 40; a plurality of rows of silicon wafers can be inserted and arranged in sequence along the vertical direction; or two rows of silicon chips are inserted and arranged left and right.
As in embodiment 4, at least two separation rods are fitted in a single guide groove 40; can insert put multirow silicon chip, this multirow silicon chip sets gradually along vertical, or this multirow silicon chip sets gradually along left and right sides.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.