CN209843727U - Conductive back plate and back contact solar cell module - Google Patents
Conductive back plate and back contact solar cell module Download PDFInfo
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- CN209843727U CN209843727U CN201920430444.7U CN201920430444U CN209843727U CN 209843727 U CN209843727 U CN 209843727U CN 201920430444 U CN201920430444 U CN 201920430444U CN 209843727 U CN209843727 U CN 209843727U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses conductive backboard and back contact solar cell module. The conductive back plate comprises a composite insulating layer, a conductive layer and a back membrane layer, the conductive layer is positioned between the composite insulating layer and the back membrane layer, the conductive layer is a patterned conductive layer, the composite insulating layer comprises a first bonding layer, a sub-insulating layer and a second bonding layer, the sub-insulating layer is positioned between the first bonding layer and the second bonding layer, the second bonding layer is positioned between the sub-insulating layer and the conductive layer, the composite insulating layer is provided with a plurality of openings, and the openings penetrate through the composite insulating layer along the thickness direction of the composite insulating layer; the battery pack comprises a plurality of solar battery pieces, the solar battery pieces are electrically connected through the conductive back plate, the binding force between the conductive back plate and the solar battery pieces can be improved, the conductive back plate and the solar battery pieces are conveniently positioned in the assembly process of assembling the conductive back plate and the solar battery pieces, and the connection reliability of the conductive back plate and the solar battery pieces is improved.
Description
Technical Field
The utility model relates to a photovoltaic field, concretely relates to solar cell field especially relates to a conductive backing plate and back contact solar module.
Background
At present, back contact solar cells (such as IBC, MWT and EWT solar cells) are widely concerned, and because the front side of the back contact solar cell is not provided with main grid lines or even any electrode patterns, the positive electrode and the negative electrode are arranged on the back side of the cell, so that the shading of the cell is reduced, the short-circuit current of the cell is effectively increased, and the energy conversion efficiency of the cell is improved. Since the short-circuit current of the back contact solar cell is much higher than that of the conventional cell, the series resistance of the back contact solar cell is required to be reduced as much as possible in order to reduce the ohmic loss of the back contact solar cell and improve the photoelectric conversion efficiency of the back contact solar cell.
Currently, back contact solar cell modules have been studied to achieve conductive interconnection between back contact cells by using a conductive back sheet. The conductive back sheet is formed by laminating an insulating medium layer, a patterned conductive metal foil layer (such as a copper foil layer), an EVA (ethylene-vinyl acetate copolymer) layer, and a back sheet layer. The insulating dielectric layer is usually made of materials such as EPE (ethylene vinyl acetate) and the like, and the polyester film with EVA adhered to two sides of the insulating dielectric layer is easy to generate poor products and has the risk of reliability in the subsequent assembly processing process.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a conductive backsheet and a back-contact solar cell module with high reliability.
In a first aspect, the utility model discloses a conductive backboard, including composite insulation layer, conducting layer and notacoria layer, the conducting layer is located between composite insulation layer and the notacoria layer, and the conducting layer is the patterning conducting layer, and composite insulation layer includes first adhesive linkage, sub-insulating layer and second adhesive linkage, and the sub-insulating layer is located between first adhesive linkage and the second adhesive linkage, and the second adhesive linkage is located between sub-insulating layer and the conducting layer, and composite insulation layer is provided with a plurality of openings, and the opening runs through composite insulation layer along composite insulation layer's thickness direction.
In a second aspect, the utility model discloses a back contact solar module, including polylith solar wafer, polylith solar wafer carries out the electricity through electrically conductive backplate and connects.
According to the technical scheme provided by the embodiment of the application, the composite insulating layer comprises a first bonding layer, a sub insulating layer and a second bonding layer which are sequentially arranged, the second bonding layer is used for connecting the sub insulating layer and a conducting layer, the bonding force between the sub insulating layer and the conducting layer can be improved, the first bonding layer is used for connecting the sub insulating layer and a solar cell, the bonding force between a conductive back plate and the solar cell can be improved, the conductive back plate and the solar cell can be conveniently positioned in the assembly process of assembling the conductive back plate and the solar cell, the connection reliability of the conductive back plate and the solar cell is improved, the problem that the processing and positioning exist in the assembly process of assembling the conventional conductive back plate into an assembly can be solved, the bonding force between the laminated back plate and the cell is small, and the problem of reliability risk exists.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a conductive backplane according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a composite insulating layer of the conductive backplane according to an embodiment of the present invention;
fig. 3 is a schematic view of a composite insulating layer obtained in the manufacturing method of the conductive backplane according to the embodiment of the present invention;
fig. 4 is a schematic view of a manufacturing method of a conductive backplane according to an embodiment of the present invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
The utility model discloses a one of them embodiment does, please refer to fig. 1 and 2, the utility model discloses a conductive backboard, including composite insulation layer 10, conducting layer 20 and notacoria layer 30, conducting layer 20 is located between composite insulation layer 10 and notacoria layer 30, and conducting layer 20 is the patterning conducting layer, and composite insulation layer 10 includes first adhesive linkage 12, sub-insulating layer 13 and second adhesive linkage 14, and sub-insulating layer 13 is located between first adhesive linkage 12 and the second adhesive linkage 14, and second adhesive linkage 14 is located between sub-insulating layer 13 and the conducting layer 30, and composite insulation layer 10 is provided with a plurality of openings 15, and opening 15 runs through composite insulation layer 10 along composite insulation layer 10's thickness direction.
The utility model discloses an in the embodiment, one side and the sub-insulating layer bonding of second adhesive linkage are fixed, and the opposite side is used for bonding fixedly with the conducting layer, and the second adhesive linkage is used for connecting fixed composite insulation layer and conducting layer, has improved the cohesion of composite insulation layer with the conducting layer for composite insulation layer is fixed more reliably with the conducting layer, and first adhesive linkage and second adhesive linkage have viscidity under normal atmospheric temperature (25 degrees centigrade).
One side of the first bonding layer is fixedly bonded with the sub-insulating layer, the other side of the first bonding layer is fixedly bonded with the solar cell piece, the first bonding layer is used for connecting and fixing the conductive back plate and the solar cell piece, and when the solar cell piece and the conductive back plate are laminated, the position of the conductive layer and the solar cell piece is fixed due to the fact that the first bonding layer has viscosity at normal temperature, and the risk that the conductive layer and the solar cell piece are dislocated or even short-circuited in the subsequent process is avoided; the first bonding layer improves the bonding force between the conductive back plate and the solar cell piece, improves the connection reliability between the conductive back plate and the solar cell piece, and facilitates the positioning of the conductive back plate and the solar cell piece in the assembly process of the conductive back plate and the solar cell piece.
The conductive layer may be obtained by patterning a conductive metal foil on which a circuit pattern may be formed, but not exclusively, by mechanical die cutting, laser die cutting or chemical etching, the circuit pattern on the conductive metal foil depending on the pattern of the back electrode of the back contact solar cell sheet, and the circuit pattern may include various shapes and/or sizes. Laser die cutting may be used to form circuit patterns from a continuous roll of conductive metal foil. The material of the conductive metal foil is any one or combination of more of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum and tungsten, and the material of the conductive metal foil is any one or combination of more of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum and tungsten.
The composite insulating layer is provided with a plurality of openings, when the conductive back plate is connected with the solar cell pieces, the electric connector penetrates through the openings, one end of the electric connector is electrically connected with the solar cell pieces, and the other end of the electric connector is electrically connected with the conductive layer, so that the electrodes of the solar cell pieces are electrically connected with the conductive layer, and series connection and parallel connection among a plurality of solar cell pieces are achieved. The electric connection of the plurality of solar battery pieces is realized through the conductive back plate, the composite insulating layer can prevent short circuit between electric connectors, and the reliability of the electric connection of the plurality of solar battery pieces is improved.
The material of the sub-insulating layer is Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET) or polypropylene (PP), the sub-insulating layer can be of a single-layer or multi-layer structure, and the sub-insulating layer does not use an EPE material, so that the manufacturing cost of the sub-insulating layer can be reduced.
The back film layer comprises a polymer back plate, and the material of the polymer back plate can be TPT, TPE, KPE, KPK, KPC or KPF. The polymer back plate can be a polymer multilayer structure formed by compounding an insulating layer consisting of an insulating material (PET or PP), a binder layer and/or a fluorine-containing polymer coating.
The back membrane layer includes polymer backplate and encapsulated layer, is provided with the encapsulated layer between polymer backplate and the conducting layer, and the material of encapsulated layer can be EVA glued membrane, POE glued membrane or PVB membrane, and the material of polymer backplate can be TPT, TPE, KPE, KPK, KPC or KPF, and the polymer backplate can be the insulating layer that insulating material (PET or PP) constitute, the polymer multilayer structure that binder layer and/or fluoropolymer coating are compound to form.
Further, a first release layer 11 is disposed on a side of the first adhesive layer 12 facing away from the sub-insulating layer 13.
The embodiment of the utility model provides an in, first from the first adhesive linkage of type layer protection effectively, avoid first adhesive linkage to be contaminated before fixed with the bonding of solar wafer, of course, before will electrically conduct backplate and solar wafer fixed, need take out first from the type layer. The first type layer can bond with first adhesive linkage from to, the first type layer does not take place chemical reaction with first adhesive linkage from, avoids polluting first adhesive linkage.
Further, the first release layer 11 is made of silicone oil paper, and the gram weight of the silicone oil paper is 30-200 g/m.
In the embodiment of the present invention, the first release layer is made of silicone oil paper, and the grammage of the silicone oil paper is 30-200 g/sq.m, so that the first release layer has suitable strength for rolling and laminating.
Further, the gram weight of the first release layer is 30-45 grams per square meter.
In the embodiment of the present invention, the gram weight of the first release layer is 30-45 g/sq m, so that the first release layer has suitable strength for rolling and laminating.
Further, the conductive layer 20 includes a conductive metal foil 21, the material of the conductive metal foil 21 is copper or aluminum, and the thickness of the conductive metal foil 21 is 20 to 100 micrometers.
The embodiment of the utility model provides an in, the conducting layer can be through carrying out patterning to conductive metal foil and handling and obtain, and conductive metal foil's thickness is 20-100 microns, is guaranteeing that the thickness of conducting layer is enough to provide the prerequisite that has the current path of low resistance, and the manufacturing cost of conductive backplate is reduced to the thickness of control conducting layer.
Further, the thickness of the conductive metal foil 21 is 30 to 60 μm.
The embodiment of the utility model provides an in, to the conductive metal foil who is connected with whole piece back contact solar wafer electricity, conductive metal foil's material is copper or aluminium, and at this moment, conductive metal foil's thickness is 30-60 microns, is guaranteeing that the thickness of conducting layer is enough to provide the prerequisite that has the low resistance current path under, the thickness of control conducting layer, reduces the manufacturing cost of conductive backplate.
Further, the thickness of the conductive layer 20 is 15 to 30 μm.
The embodiment of the utility model provides an in, whole piece back contact solar wafer also can cut into half piece back contact solar wafer, processes into half piece solar module, and at this moment, the thickness of conducting layer is 15-30 microns, is guaranteeing that the thickness of conducting layer is enough to provide the prerequisite that has the current path of low resistance under, the thickness of control conducting layer, reduces the manufacturing cost of conductive backplate.
Further, the material of the first adhesive layer 12 and the material of the second adhesive layer 14 are each independently selected from any one of organic fluorine modified acrylic resin, epoxy modified acrylic resin and nanomaterial modified acrylic resin.
In the embodiment of the utility model, the acrylic resin is modified by ultraviolet rays, the introduced C-F bond is the strongest one of the known chemical bonds, the bond energy is as high as 460kJ/mol, and the fluorine-containing polymer has stronger chemical bonding force and structural stability than any other polymer, and has excellent weather resistance, ultraviolet resistance, dielectric property and insulating property; the nano particles have small size effect and interface effect, can enhance the absorption of ultraviolet rays, improve the ultraviolet ray resistance and weather resistance of the first bonding layer and the second bonding layer, and improve the reliability of the conductive back plate.
Further, the thickness of the sub-insulating layer 13 is 20 to 200 μm, and/or,
the thickness of the composite insulating layer 10 is less than 300 microns.
The utility model discloses an in the embodiment, the thickness of sub-insulating layer is 20-200 microns, and/or, the thickness of composite insulation layer is less than 300 microns, and the reasonable thickness that sets up composite insulation layer and sub-insulating layer reduces the manufacturing cost of electrically conductive backplate under the prerequisite of guaranteeing electrically conductive backplate reliability.
Further, the shape of the opening 15 is circular or square, and the number of the openings 15 is 100 and 50000.
The utility model discloses an in the embodiment, open-ended shape is circular or square, and open-ended quantity is 50000, and the reasonable open-ended shape and the opening quantity that sets up for electrically conductive backplate can remove processing open-ended shape and open-ended quantity according to the back contact solar cell of different grade type and electrode structure, can reduce the processing degree of difficulty, avoids the overprocessing.
Further, the composite insulation layer 10 includes a plurality of sub-insulation layers 13, and a third adhesion layer is disposed between adjacent sub-insulation layers 13.
The utility model discloses an in the embodiment, can design the number of piles of sub-insulating layer according to actual conditions, can use single-layer sub-insulating layer, also can use multilayer sub-insulating layer, when using multilayer sub-insulating layer, set up the third adhesive linkage between the sub-insulating layer, fix adjacent two-layer sub-insulating layer. The more the number of the sub-insulating layers is, the better the insulating property of the composite insulating layer is, and of course, the manufacturing cost of the conductive backboard is also considered.
Furthermore, the material of the third adhesive layer is any one of organic fluorine modified acrylic resin, epoxy modified acrylic resin and nano material modified acrylic resin.
In the embodiment of the utility model, the acrylic resin is modified by ultraviolet rays, the introduced C-F bond is the strongest one of the known chemical bonds, the bond energy is as high as 460kJ/mol, and the fluorine-containing polymer has stronger chemical bonding force and structural stability than any other polymer, and has excellent weather resistance, ultraviolet resistance, dielectric property and insulating property; the nano particles have small size effect and interface effect, can enhance the absorption of ultraviolet rays, improve the ultraviolet ray resistance and weather resistance of the third bonding layer, and improve the reliability of the conductive back plate.
Another embodiment of the present invention is a back contact solar cell module, which comprises a plurality of solar cells, wherein the plurality of solar cells are electrically connected to each other through a conductive back plate.
The embodiment of the utility model provides an in, realize establishing ties or parallelly connected between the polylith solar wafer through electrically conductive backplate.
Referring to fig. 1-4, a method of manufacturing a conductive backsheet includes the steps of:
forming a plurality of openings on a polymer adhesive film to obtain a composite insulating layer 10, wherein the polymer adhesive film comprises a first bonding layer 12, a sub-insulating layer 13 and a second bonding layer 14 which are sequentially arranged;
the composite insulating layer 10, the conductive layer 20 and the back film layer 30, which are sequentially stacked, are rolled to obtain a conductive backsheet.
The composite insulating layer, the conducting layer and the back membrane layer which are sequentially stacked are rolled to obtain the conductive backboard, the composite insulating layer, the conducting layer and the back membrane layer are uniformly stressed by rolling, the composite insulating layer, the conducting layer and the back membrane layer are prevented from being damaged when the composite insulating layer, the conducting layer and the back membrane layer are pressed, and meanwhile, the production efficiency of the conductive backboard is improved.
Referring to fig. 3, the spreading and winding of the polymer film are completed by three press rolls, after the polymer film is spread, a plurality of openings are formed on the polymer adhesive film, and the composite insulating layer can be obtained by, but not limited to, processing the openings by a laser, and then the composite insulating layer is wound on the press rolls to complete the processing of the composite insulating layer.
Referring to fig. 4, the composite insulating layer, the conductive layer and the back film layer are drawn and rolled to obtain the conductive back plate. Before the composite insulating layer is drawn to the two pressing rollers, the second release layer needs to be peeled off first so as to improve the bonding force between the composite insulating layer and the conducting layer.
The polymer film also comprises a second release layer 16, a second adhesive layer 14 is arranged between the second release layer 16 and the sub-insulating layer 13,
before the composite insulating layer 10, the conductive layer 20 and the back film layer 30 which are sequentially laminated are rolled to obtain the conductive back plate, stripping the second release layer 16 is further included.
The polymer film also comprises a second release layer, so that an opening is formed on the polymer film conveniently, when the composite insulating layer is obtained, the polymer film is fixed, the second adhesive layer can be prevented from being polluted in the opening process of the polymer film, the polymer film is effectively protected, and meanwhile, the second release layer is also convenient for winding and packaging the polymer film. Certainly, before the composite insulating layer, the conductive layer and the back film layer are rolled, the second release layer needs to be peeled off, so that the fixing reliability of the composite insulating layer, the conductive layer and the back film layer is improved.
The second release layer 16 is made of silicone oil paper, and the gram weight of the second release layer 16 is 30-200 g/square meter, so that the second release layer has a proper strength processing opening.
The gram weight of the second release layer is 30-45 grams per square meter, so that the second release layer has proper strength processing openings.
The pressure of roll-in is 0.1 ~ 1.5Mpa, can guarantee the prerequisite of the joint strength between each layer of electrically conductive backplate under, reduces the possibility of damaging electrically conductive backplate, has improved the yields of electrically conductive backplate.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (11)
1. The utility model provides a conductive backboard, its characterized in that, includes composite insulation layer, conducting layer and notacoria layer, the conducting layer is located composite insulation layer with between the notacoria layer, the conducting layer is the patterning layer, composite insulation layer includes first adhesive linkage, sub-insulating layer and second adhesive linkage, sub-insulating layer is located first adhesive linkage with between the second adhesive linkage, the second adhesive linkage is located sub-insulating layer with between the conducting layer, composite insulation layer is provided with a plurality of openings, the opening along composite insulation layer's thickness direction runs through composite insulation layer.
2. The conductive backsheet according to claim 1, wherein a first release layer is disposed on a side of the first adhesive layer facing away from the sub-insulating layer.
3. The conductive backsheet of claim 2, wherein the first release layer is a silicone oil paper and the grammage of the first release layer is 30-200 grams per square meter.
4. The conductive backsheet of claim 1, wherein the conductive layer comprises a conductive metal foil, wherein the conductive metal foil is a copper foil or an aluminum foil, and wherein the conductive metal foil has a thickness of 20-100 microns.
5. The conductive backsheet of claim 1, wherein the conductive layer has a thickness of 15-30 microns.
6. The conductive backsheet of claim 1, wherein the first adhesive layer and the second adhesive layer are independently selected from any one of an organic fluorine modified acrylic resin layer, an epoxy modified acrylic resin layer, and a nanomaterial modified acrylic resin layer.
7. The conductive backsheet according to claim 1, wherein the sub-insulating layer has a thickness of 20-200 μm, and/or,
the thickness of the composite insulating layer is less than 300 microns.
8. The conductive backplate of claim 1, wherein the openings are circular or square, and the number of the openings is 100-50000.
9. The conductive backsheet of claim 1, wherein the composite insulating layer comprises a plurality of the sub-insulating layers, and a third adhesive layer is disposed between adjacent sub-insulating layers.
10. The conductive backsheet according to claim 9, wherein the third adhesive layer is any one of an organic fluorine modified acrylic resin layer, an epoxy modified acrylic resin layer and a nanomaterial modified acrylic resin layer.
11. A back contact solar cell module comprising a plurality of solar cells electrically connected by the conductive backsheet according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201920430444.7U CN209843727U (en) | 2019-04-01 | 2019-04-01 | Conductive back plate and back contact solar cell module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920430444.7U CN209843727U (en) | 2019-04-01 | 2019-04-01 | Conductive back plate and back contact solar cell module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061080A (en) * | 2019-04-01 | 2019-07-26 | 泰州隆基乐叶光伏科技有限公司 | Back contacts solar module, conductive backings and its manufacturing method |
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- 2019-04-01 CN CN201920430444.7U patent/CN209843727U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061080A (en) * | 2019-04-01 | 2019-07-26 | 泰州隆基乐叶光伏科技有限公司 | Back contacts solar module, conductive backings and its manufacturing method |
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