CN110047961A - Back contacts solar module, conductive backings and its manufacturing method - Google Patents
Back contacts solar module, conductive backings and its manufacturing method Download PDFInfo
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- CN110047961A CN110047961A CN201910258622.7A CN201910258622A CN110047961A CN 110047961 A CN110047961 A CN 110047961A CN 201910258622 A CN201910258622 A CN 201910258622A CN 110047961 A CN110047961 A CN 110047961A
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- 239000010410 layer Substances 0.000 claims abstract description 477
- 239000002131 composite material Substances 0.000 claims abstract description 120
- 239000012790 adhesive layer Substances 0.000 claims abstract description 99
- 238000009413 insulation Methods 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 26
- 239000004925 Acrylic resin Substances 0.000 claims description 23
- 229920000178 Acrylic resin Polymers 0.000 claims description 23
- 239000011888 foil Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
This application discloses a kind of back contacts solar module, conductive backings and its manufacturing methods.Conductive backings include the first insulating layer, composite layer group and notacoria layer, composite layer group is between the first insulating layer and notacoria layer, composite layer group includes conductive layer and composite insulation layer, conductive layer is patterned layer, composite insulation layer is between conductive layer and notacoria layer, composite insulation layer includes the first adhesive layer, second insulating layer and the second adhesive layer, and second insulating layer is between the first adhesive layer and the second adhesive layer.Battery component includes muti-piece solar cell piece, and muti-piece solar cell piece is electrically connected by conductive backings, reduces influence of the conductive layer patternization processing to composite insulation layer, improves the dielectric strength and reliability of back contacts solar module.
Description
Technical field
The present invention relates generally to photovoltaic arts, and in particular to solar cell field more particularly to a kind of back contacts sun electricity
Pond component, conductive backings and its manufacturing method.
Background technique
Currently, back contact solar cell (such as IBC, MWT, EWT solar cell) is got the attention, due to its front
There is no main gate line, even without any electrode pattern, positive and cathode is all located at the back side of cell piece, reduces the screening of cell piece
Light makes the energy conversion efficiency of cell piece get a promotion to effectively increase the short circuit current of cell piece.Too due to back contacts
The short circuit current of positive energy battery is high compared with conventional batteries, therefore the establishment of component of back contact solar cell requires to the greatest extent
It may be decreased its series resistance, to reduce the ohmic loss of component, improve the incident photon-to-electron conversion efficiency of component.
Back contact solar cell component has begun one's study at present is realized between back contact battery piece using conductive backings
Conductive interconnections.Conductive metal foil layer (such as copper foil layer) that conductive backings are crossed by insulating medium layer, patterned process, EVA
(ethylene-vinyl acetate copolymer, ethylene-vinyl acetate copolymer) layer, backboard layer stackup are constituted.It leads
The patterned process process of electric metal layers of foil is cut by laser first by conductive metal foil layer first with back side EVA layer pre-bonded
The electric current derived type structure matched with back contact battery is formed, then tears unwanted copper foil off.Laser in laser processing procedure
Inevitably EVA layer is caused to damage, influences the intensity and insulation performance of EVA, the edge contour of laser ablation copper foil circuit
The rough band of out-of-flatness is jagged, and the copper scale that circuit edge is likely to result in when removing unwanted copper foil falls to the surface EVA,
There are the risks such as electric leakage after lamination, influences the dielectric strength and reliability of component.
Summary of the invention
In view of drawbacks described above in the prior art or deficiency, it is intended to provide a kind of back contacts solar panel of high reliablity
Part, conductive backings and its manufacturing method.
In a first aspect, conductive backings of the invention, including the first insulating layer, composite layer group and notacoria layer, composite layer group position
Between the first insulating layer and notacoria layer, composite layer group includes conductive layer and composite insulation layer, and conductive layer is patterned layer, compound
For insulating layer between conductive layer and notacoria layer, composite insulation layer includes the first adhesive layer, second insulating layer and the second adhesive layer,
Second insulating layer is between the first adhesive layer and the second adhesive layer.
Second aspect, back contacts solar module of the invention, including muti-piece solar cell piece, muti-piece solar cell piece
It is electrically connected by conductive backings.
The third aspect, the manufacturing method of conductive backings of the invention, comprising the following steps:
Patterned process is carried out by conductive layer and composite insulation layer roll-in, and to conductive layer, obtains composite layer group；
The first insulating layer successively arranged, composite layer group and notacoria layer are subjected to roll-in, obtain conductive backings.
According to technical solution provided by the embodiments of the present application, by by conductive layer and composite insulation layer roll-in, and to conduction
Layer carry out patterned process, obtain composite layer group, composite insulation layer include the first adhesive layer set gradually, second insulating layer and
Second adhesive layer, composite insulation layer are multilayered structure, reduce influence of the conductive layer patternization processing to second insulating layer, improve
Insulation performance；Due to having the first adhesive layer between second insulating layer and conductive layer, so be scattered on composite insulation layer
Conduction bits will not scratch second insulating layer, to reduce the possibility of back contacts solar module electric leakage, improve back contacts
The dielectric strength and reliability of solar module are able to solve the low problem of existing conductive component reliability.
Detailed description of the invention
By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other
Feature, objects and advantages will become more apparent upon:
Fig. 1 is the structural schematic diagram of the conductive backings of the embodiment of the present invention；
Fig. 2 is the first adhesive layer, second insulating layer, the second adhesive layer and the third of the conductive backings of the embodiment of the present invention
The structural schematic diagram of release layer cooperation；
Fig. 3 is the structural schematic diagram of the composite layer group of the conductive backings of the embodiment of the present invention；
Fig. 4 is the first adhesive layer, second insulating layer, the third adhesive layer, second of the conductive backings of the embodiment of the present invention
The structural schematic diagram of adhesive layer and the cooperation of third release layer；
Fig. 5 is the structural schematic diagram of the composite layer group of the conductive backings of the embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the first insulating layer of the conductive backings of the embodiment of the present invention；
Fig. 7 obtains the schematic diagram of the first insulating layer in the manufacturing method for the conductive backings of the embodiment of the present invention；
Fig. 8 is the schematic diagram that composite layer group is obtained in the manufacturing method of the conductive backings of the embodiment of the present invention；
Fig. 9 is the schematic diagram of the manufacturing method of the conductive backings of the embodiment of the present invention.
Specific embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, part relevant to invention is illustrated only in attached drawing.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
One of embodiment of the invention is to please refer to Fig. 1 to 5, a kind of conductive backings, including the first insulating layer 10,
Composite layer group 20 and notacoria layer 30, between the first insulating layer 10 and notacoria layer 30, composite layer group 20 includes composite layer group 20
Conductive layer 21 and composite insulation layer 22, conductive layer 21 are patterned layer, and composite insulation layer 22 is located at conductive layer 21 and notacoria layer 30
Between, composite insulation layer 22 includes that the first adhesive layer 23, second insulating layer 24 and the second adhesive layer 25, second insulating layer 24 are located at
Between first adhesive layer 23 and the second adhesive layer 25.
In an embodiment of the present invention, be adhesively fixed conductive layer and second insulating layer by the first adhesive layer, passes through
Two adhesive layers are come be adhesively fixed second insulating layer and notacoria layer, and can also be adhesively fixed conductive layer and the by the second adhesive layer
Two insulating layers, the second insulating layer that is adhesively fixed by the first adhesive layer and notacoria layer, the first adhesive layer and the second adhesive layer exist
There is viscosity under room temperature (25 DEG C).
With conductive layer and the second insulating layer of being adhesively fixed by the first adhesive layer, it is adhesively fixed by the second adhesive layer
It is described in detail for second insulating layer and notacoria layer, side and the conductive layer of the first adhesive layer are adhesively fixed, and the other side is used
It is adhesively fixed in second insulating layer, can be improved the binding force of conductive layer and second insulating layer, so that conductive layer and second is absolutely
Edge layer fixation is relatively reliable.The side of second adhesive layer is adhesively fixed with second insulating layer, and the other side is for Nian Jie with notacoria layer
It is fixed, it can be improved the binding force of second insulating layer Yu notacoria layer, so that second insulating layer and the fixation of notacoria layer are relatively reliable.
Composite insulation layer is the first adhesive layer, second insulating layer and the compound multilayered structure of the second adhesive layer, will be conductive
Layer and composite insulation layer roll-in, and patterned process is carried out to conductive layer, when obtaining composite layer group, the multilayer knot of composite insulation layer
Structure can reduce the loss of patterned process relative to existing EVA layer, guarantee the intensity and insulation performance of composite insulation layer,
When removing unwanted conductive layer, has a small amount of conductive bits and fall on composite insulation layer, the multilayered structure of composite insulation layer, energy
Enough influences for reducing conductive bits, reduce the possibility of back contacts solar module electric leakage, improve back contacts solar panel
The dielectric strength and reliability of part.
Conductive layer can be by carrying out patterned process acquisition to conductive metal foil, and the circuit pattern on conductive metal foil can
It is formed with but not only by mechanical punching, laser punching or chemical etching, the circuit pattern on conductive metal foil depends on back
The pattern of solar cell piece rear electrode is contacted, circuit pattern may include various shapes and/or size.Laser punching can
For forming circuit pattern from the conductive metal foil of continuous web-like.The material of conductive metal foil be copper, silver, aluminium, nickel, magnesium, iron,
Titanium, molybdenum, any one in tungsten or a variety of combinations, the material of conductive metal foil are copper, silver, aluminium, nickel, magnesium, iron, titanium, molybdenum, tungsten
In any one alloy or a variety of formation alloy.
The material of second insulating layer is polyimides (PI), polyethylene naphthalate (PEN), poly terephthalic acid second
Diol ester (PET) or polypropylene (PP), composite insulation layer can be single layer either multilayered structure, and composite insulation layer is not used
EPE material can reduce the manufacturing cost of composite insulation layer.
Notacoria layer includes polymer backboard, and the material of polymer backboard can be TPT, TPE, KPE, KPK, KPC or KPF.
Polymer backboard can be compound for the insulating layer, adhesive layer and/or fluoropolymer coating of insulating materials (PET or PP) composition
Made of polymeric multilayer structure.
Notacoria layer includes polymer backboard and encapsulated layer, is provided with encapsulated layer between polymer backboard and composite insulation layer,
The material of encapsulated layer can be EVA adhesive film, POE glue film or PVB film, the material of polymer backboard can for TPT, TPE, KPE,
KPK, KPC or KPF, polymer backboard can insulating layer, adhesive layers and/or fluorine-containing for insulating materials (PET or PP) composition
The polymeric multilayer structure that polymer coating is combined.
Further, conductive layer 21 is conductive metal foil, and the material of conductive metal foil is copper or aluminium, the thickness of conductive metal foil
Degree is 20-100 microns.
In an embodiment of the present invention, conductive metal foil with a thickness of 20-100 microns, guarantee conductive layer thickness foot
To provide under the premise of low-resistance current path, the thickness of conductive layer is controlled, the manufacturing cost of conductive backings is reduced.
Further, conductive metal foil with a thickness of 30-60 microns.
In an embodiment of the present invention, to the conductive metal foil being electrically connected with full wafer back contacts solar cell piece, conductive gold
Belong to foil material be copper or aluminium, at this point, conductive metal foil with a thickness of 30-60 micron, guarantee conductive layer thickness be enough to mention
Under the premise of with low-resistance current path, the thickness of conductive layer is controlled, reduces the manufacturing cost of conductive backings.
Further, conductive layer 21 with a thickness of 15-30 microns.
In an embodiment of the present invention, full wafer back contacts solar cell piece can also be cut into half back contacts solar cell
Piece is processed into half solar module, at this point, conductive layer with a thickness of 15-30 microns, guarantee conductive layer thickness be enough
It provides under the premise of there is low-resistance current path, controls the thickness of conductive layer, reduce the manufacturing cost of conductive backings.
Further, the material of the material of the first adhesive layer 23 and the second adhesive layer 25 is each independently selected from organic fluorine richness
Any one in acrylic resin, epoxy modified acrylic resin and nano-material modified acrylic resin.
In an embodiment of the present invention, acrylic resin is modified by ultraviolet light, the C-F key of introducing is knownization
Strongest one kind in key is learned, bond energy is up to 460kJ/mol, and fluoropolymer has stronger chemistry knot than other any polymer
Resultant force and structural stability, with excellent weather-proof, UV resistant and excellent dielectric properties and insulation performance；Nanoparticle
With small-size effect and interfacial effect, the absorption to ultraviolet light can be enhanced, improve the first adhesive layer and the second adhesive layer
UV resistant and weather resistance improve the reliability of conductive backings.
Further, second insulating layer 24 with a thickness of 20-200 microns, and/or,
The thickness of composite insulation layer 22 is less than 300 microns.
In an embodiment of the present invention, second insulating layer with a thickness of 20-100 microns, and/or, the thickness of composite insulation layer
Degree is less than 300 microns, the reasonable thickness that composite insulation layer and second insulating layer is arranged, before guaranteeing conductive backings reliability
It puts, reduces the manufacturing cost of conductive backings.
With reference to Fig. 1,4 and 5, further, notacoria layer 30 includes polymer backboard, and composite insulation layer 22 includes multilayer second
Insulating layer 24 is provided with third adhesive layer 26 between adjacent second insulating layer 24.
In an embodiment of the present invention, EVA layer is replaced by composite insulation layer, at this time, it may be necessary to increase composite insulation layer
Thickness, to meet the intensity requirement of conductive backings, composite insulation layer includes multilayer second insulating layer, further increases compound inslation
The insulation of layer and crystallized ability.It is adhesively fixed, is avoided adjacent by third adhesive layer between adjacent second insulating layer
Second insulating layer generates offset when roll-in, reduces the difficulty of processing of conductive backings, improves the non-defective unit of conductive backings
Rate.Composite insulation layer replaces EVA layer, can reduce the thickness of notacoria layer, and then reduce the thickness of conductive backings, reduces conductive back
The manufacturing cost of plate, third adhesive layer have viscosity under room temperature (25 DEG C).
Further, the material of third adhesive layer 26 is organic fluorin modified crylic acid resin, epoxy modified acrylic resin
With any one in nano-material modified acrylic resin.
In an embodiment of the present invention, acrylic resin is modified by ultraviolet light, the C-F key of introducing is knownization
Strongest one kind in key is learned, bond energy is up to 460kJ/mol, and fluoropolymer has stronger chemistry knot than other any polymer
Resultant force and structural stability, with excellent weather-proof, UV resistant and excellent dielectric properties and insulation performance；Nanoparticle
With small-size effect and interfacial effect, the absorption to ultraviolet light can be enhanced, improve the UV resistant of third adhesive layer and resistance to
Time ability improves the reliability of conductive backings.
Referring to figs. 1 to 3, further, notacoria layer 30 includes polymer backboard and encapsulated layer, and encapsulated layer is located at polymer back
Between plate and composite layer group 20, composite insulation layer 22 includes single layer second insulating layer 24.
In an embodiment of the present invention, notacoria layer includes polymer backboard and encapsulated layer, at this point, composite insulation layer includes single
Layer second insulating layer, the thickness of composite insulation layer do not need especially thick, it will be able to meet the intensity requirement of conductive backings, can drop
The manufacturing cost of low conductive backings.
Conductive layer and composite insulation layer are subjected to roll-in and patterned process is carried out to conductive layer, obtains composite layer group, then
Composite layer group and encapsulated layer and polymer backboard are subjected to roll-in, can be avoided conductive layer patternization processing damage encapsulated layer,
And composite insulation layer can merge completely with conductive layer, improve the reliability of conductive backings.
Further, encapsulated layer with a thickness of 100-800 microns.
In an embodiment of the present invention, encapsulated layer with a thickness of 100-800 microns, the thickness of encapsulated layer should not be too large or
Too small, under the premise of guaranteeing the intensity of conductive backings, the thickness for reducing encapsulated layer can reduce the production cost of conductive backings.
Further, composite insulation layer 22 expose 21 edge of conductive layer, positioned at the same side 22 edge of composite insulation layer with
The distance between 21 edge of conductive layer is 1-2 centimetres.
In an embodiment of the present invention, composite insulation layer exposes conductive layer, and composite insulation layer can more preferably protect conductive layer,
Meanwhile when also can be convenient for carrying out patterned process to conductive layer edge, conductive layer edge be fixed, conductive layer figure is reduced
The difficulty of caseization processing, improves the accuracy of conductive layer patternization processing.
With reference to Fig. 1 and 6, further, the first insulating layer 10 includes the 4th adhesive layer 12, insulating sublayer layer 13 and the 5th bonding
Layer 14, for insulating sublayer layer 13 between the 4th adhesive layer 12 and the 5th adhesive layer 14, the 5th adhesive layer 14 is located at insulating sublayer layer 13
Between composite layer group 20, the first insulating layer 10 be provided with it is several opening 15, opening 15 along the first insulating layer 10 thickness side
To through the first insulating layer 10.
In an embodiment of the present invention, the side of the 5th adhesive layer is adhesively fixed with insulating sublayer layer, and the other side is used for and answers
Layer group is closed to be adhesively fixed, the 5th adhesive layer for being connected and fixed the first insulating layer and composite layer group, improve the first insulating layer and
The binding force of composite layer group, so that the first insulating layer and composite layer group fixed relatively reliable, the 4th adhesive layer and the 5th adhesive layer
There is viscosity under room temperature (25 DEG C).
The side of 4th adhesive layer is adhesively fixed with insulating sublayer layer, and the other side is used to be adhesively fixed with solar cell piece, the
Four adhesive layers are used to be connected and fixed conductive backings and solar cell piece, improve the binding force of conductive backings and solar cell piece,
The reliability that conductive backings are connect with solar cell piece is improved, convenient for being assembled into component mistake in conductive backings and solar cell piece
Conductive backings and solar cell piece are positioned in journey.
First insulating layer is provided with several openings, and when conductive backings are connect with solar cell piece, electric connector is passed through
Opening, one end of electrical connection are electrically connected with solar cell piece, and the other end is electrically connected with composite layer group, so that the electricity of solar cell piece
Pole is electrically connected with composite layer group, to realize the series connection and parallel connection between muti-piece solar cell piece.It is realized by conductive backings more
The electrical connection of block solar cell piece, the first insulating layer can prevent from generating short circuit between electric connector, improve muti-piece sun electricity
The reliability of pond piece electrical connection.
The material of insulating sublayer layer is polyimides (PI), polyethylene naphthalate (PEN), poly terephthalic acid second two
Alcohol ester (PET) or polypropylene (PP), insulating sublayer layer can be single layer either multilayered structure, insulating sublayer layer and EPE material are not used,
It can reduce the manufacturing cost of insulating sublayer layer.
Further, the 4th adhesive layer 12 is provided with the first release layer 11 backwards to the side of insulating sublayer layer 13.
In an embodiment of the present invention, the first release layer is effectively protected the 4th adhesive layer, avoids the 4th adhesive layer not
It is contaminated before being adhesively fixed with solar cell piece, certainly, before conductive backings and solar cell piece are fixed, need to take out
First release layer.First release layer can be Nian Jie with the 4th adhesive layer, also, the first release layer not with the 4th adhesive layer
Reaction is learned, the 4th adhesive layer is avoided pollution.
Further, the material of the first release layer 11 is silicone oil paper, and the grammes per square metre of the first release layer 11 is 30-200 grams/square
Rice.
In an embodiment of the present invention, the material of the first release layer is silicone oil paper, the grammes per square metre of silicone oil paper is 30-200 grams/it is flat
Square rice, so that there is the first release layer suitable intensity to carry out roll-in and fitting processing.
Further, the grammes per square metre of the first release layer 11 is 30-45 grams/m.
In an embodiment of the present invention, the grammes per square metre of the first release layer is 30-45 grams/m, so that the first release layer has
There is suitable intensity to carry out roll-in and fitting processing.
Further, the material of the 4th adhesive layer 12 and the material of the 5th adhesive layer 14 are each independently selected from organic fluorine richness
Any one in acrylic resin, epoxy modified acrylic resin and nano-material modified acrylic resin.
In an embodiment of the present invention, acrylic resin is modified by ultraviolet light, the C-F key of introducing is knownization
Strongest one kind in key is learned, bond energy is up to 460kJ/mol, and fluoropolymer has stronger chemistry knot than other any polymer
Resultant force and structural stability, with excellent weather-proof, UV resistant and excellent dielectric properties and insulation performance；Nanoparticle
With small-size effect and interfacial effect, the absorption to ultraviolet light can be enhanced, improve the 4th adhesive layer and the 5th adhesive layer
UV resistant and weather resistance improve the reliability of conductive backings.
Further, insulating sublayer layer 13 with a thickness of 20-200 microns, and/or,
The thickness of first insulating layer 10 is less than 300 microns.
In an embodiment of the present invention, insulating sublayer layer with a thickness of 20-200 microns, and/or, the thickness of the first insulating layer
Less than 300 microns, the reasonable thickness that first insulating layer and insulating sublayer layer are set, in the premise for guaranteeing conductive backings reliability
Under, reduce the manufacturing cost of conductive backings.
Further, be open 15 shape be it is round or rectangular, 15 quantity of being open is 100-50000.
In an embodiment of the present invention, the shape of opening is round or rectangular, and the quantity of opening is 100-50000, is closed
The shape and open amount of the setting opening of reason, enable conductive backings according to different types of back contacts solar cell and
The quantity of shape and opening that electrode structure goes processing to be open, can reduce difficulty of processing, avoids overprocessing.
Further, the first insulating layer 10 includes multilayer insulating sublayer layer 13, and the is provided between adjacent insulating sublayer layer 13
Six adhesive layers.
In an embodiment of the present invention, the number of plies of insulating sublayer layer can be designed according to the actual situation, single layer can be used
Multilayer insulating sublayer layer also can be used in insulating layer, and when using multilayer insulating sublayer layer, the 6th bonding is arranged between insulating sublayer layer
Layer, to fix two layers adjacent of insulating sublayer layer.The number of plies of insulating sublayer layer is more, and the insulation performance of the first insulating layer is better, certainly,
Also to consider the manufacturing cost of conductive backings.
Further, the material of the 6th adhesive layer be organic fluorin modified crylic acid resin, epoxy modified acrylic resin and
Any one in nano-material modified acrylic resin.
In an embodiment of the present invention, acrylic resin is modified by ultraviolet light, the C-F key of introducing is knownization
Strongest one kind in key is learned, bond energy is up to 460kJ/mol, and fluoropolymer has stronger chemistry knot than other any polymer
Resultant force and structural stability, with excellent weather-proof, UV resistant and excellent dielectric properties and insulation performance；Nanoparticle
With small-size effect and interfacial effect, the absorption to ultraviolet light can be enhanced, improve the UV resistant of the 6th adhesive layer and resistance to
Time ability improves the reliability of conductive backings.
Another embodiment of the invention is a kind of back contacts solar module, including muti-piece solar cell piece, muti-piece
Solar cell piece is electrically connected by conductive backings.
In an embodiment of the present invention, when conductive backings are electrically connected with solar cell piece, electric connector is passed through first
One end of insulating layer, electrical connection is electrically connected with solar cell piece, and the other end is electrically connected with conductive layer, so that the electricity of solar cell piece
Pole is electrically connected with conductive layer, to realize the series connection and parallel connection between muti-piece solar cell piece.Muti-piece is realized by conductive backings
The electrical connection of solar cell piece, the first insulating layer can prevent from generating short circuit between electric connector, improve muti-piece solar cell
The reliability of piece electrical connection.
Another embodiment of the invention is, with reference to Fig. 1-9, a kind of manufacturing method of conductive backings, comprising the following steps:
Patterned process is carried out by conductive layer 21 and 22 roll-in of composite insulation layer, and to conductive layer 21, obtains composite layer group
20；
The first insulating layer 10 successively arranged, composite layer group 20 and notacoria layer 30 are subjected to roll-in, obtain conductive backings.
In an embodiment of the present invention, first by conductive layer and composite insulation layer roll-in, so that conductive layer and composite insulation layer
It is adhesively fixed, then patterned process is carried out to conductive layer, it, can not be to conductive layer during preventing to conductive layer patternization processing
It is positioned, reduces the difficulty of processing of conductive backings.
The first insulating layer successively arranged, composite layer group and notacoria layer are subjected to roll-in, obtain conductive backings, roll-in makes
First insulating layer, composite layer group and notacoria layer uniform force are avoided when pressing the first insulating layer, composite layer group and notacoria layer,
The first insulating layer, composite layer group and notacoria layer are damaged, meanwhile, improve the production efficiency of conductive backings.
With reference to Fig. 8, conductive layer and composite insulation layer is subjected to roll-in, and patterned process is carried out to conductive layer, is answered
Close layer group.
Further, composite layer group 20 includes third release layer 27,
Composite insulation layer 22 between third release layer 27 and conductive layer 21,
Before the first insulating layer 10, composite layer group 20 and the notacoria layer 30 that will successively arrange carry out roll-in, further include, shells
From third release layer 27.
In an embodiment of the present invention, third release layer can increase the integral strength of composite layer group, and certainly, third is release
Layer is initially to be adhesively fixed with composite insulation layer, composite insulation layer and conductive layer is being carried out roll-in, and carry out to conductive layer
When patterned process, the intensity of composite insulation layer can be improved, reduce the possibility that composite insulation layer generates deformation, meanwhile, third
Release layer also can be convenient for being wound packaging to composite insulation layer and composite layer group, further, it is possible to prevent the second adhesive layer from existing
It is contaminated in composite layer group manufacturing process.
Before the first insulating layer, composite layer group and the notacoria layer that will successively arrange carry out roll-in, further include, removes third
Release layer improves the reliability of conductive backings to improve the intensity that is adhesively fixed of composite layer group Yu notacoria layer.
With reference to Fig. 9, the first insulating layer, composite layer group and notacoria layer are drawn, to the first insulating layer, composite layer group and notacoria
Layer carries out roll-in, obtains conductive backings.Before composite layer group is towed to two pressure rollers, need first to remove third release layer,
To improve the binding force between composite layer group and notacoria layer.
Further, the material of third release layer 27 is silicone oil paper, and the grammes per square metre of third release layer 27 is 30-200 grams/square
Rice.
In an embodiment of the present invention, the material of third release layer is silicone oil paper, the grammes per square metre of silicone oil paper is 30-200 grams/it is flat
Square rice, so that there is third release layer suitable intensity to carry out roll-in and fitting processing.
Further, the grammes per square metre of third release layer 27 is 45-90 grams/m.
In an embodiment of the present invention, the grammes per square metre of silicone oil paper is 45-90 grams/m, is fitted so that third release layer has
Suitable intensity carries out roll-in and fitting processing.
Further, the pressure of roll-in is 0.1~1.5MPa.
In an embodiment of the present invention, the pressure of roll-in is 0.1~1.5Mpa, can be guaranteed between each layer of conductive backings
Under the premise of bonding strength, the possibility of damage conductive backings is reduced, the yields of conductive backings is improved.
Further, further includes:
Several openings 15 are formed on polymer glue film, obtain the first insulating layer 10, wherein polymer glue film includes the 4th
Adhesive layer 12, insulating sublayer layer 13 and the 5th adhesive layer 14, insulating sublayer layer 13 be located at the 4th adhesive layer 12 and the 5th adhesive layer 14 it
Between.
In an embodiment of the present invention, the side of the 5th adhesive layer is adhesively fixed with insulating sublayer layer, and the other side is used for and answers
Layer group is closed to be adhesively fixed, the 5th adhesive layer for being connected and fixed the first insulating layer and composite layer group, improve the first insulating layer and
The binding force of composite layer group, so that the first insulating layer and the fixation of composite layer group are relatively reliable.
The side of 4th adhesive layer is adhesively fixed with insulating sublayer layer, and the other side is used to be adhesively fixed with solar cell piece, the
Four adhesive layers are used to be connected and fixed conductive backings and solar cell piece, improve the binding force of conductive backings and solar cell piece,
The reliability that conductive backings are connect with solar cell piece is improved, convenient for being assembled into component mistake in conductive backings and solar cell piece
Conductive backings and solar cell piece are positioned in journey.
First insulating layer is provided with several openings, and when conductive backings are connect with solar cell piece, electric connector is passed through
Opening, one end of electrical connection are electrically connected with solar cell piece, and the other end is electrically connected with composite layer group, so that the electricity of solar cell piece
Pole is electrically connected with composite layer group, to realize the series connection and parallel connection between muti-piece solar cell piece.It is realized by conductive backings more
The electrical connection of block solar cell piece, the first insulating layer can prevent from generating short circuit between electric connector, improve muti-piece sun electricity
The reliability of pond piece electrical connection.
The material of insulating sublayer layer is polyimides (PI), polyethylene naphthalate (PEN), poly terephthalic acid second two
Alcohol ester (PET) or polypropylene (PP), insulating sublayer layer can be single layer either multilayered structure, insulating sublayer layer and EPE material are not used,
It can reduce the manufacturing cost of insulating sublayer layer.
Several openings are formed on polymer glue film, it can be with but not only by etching or be laser-ablated in polymer glue film
It is upper to form several openings.
With reference to Fig. 7, spreading out and winding for polymer film is completed by three pressure rollers, after polymer film is spread out, poly-
It closes and forms several openings on object glue film, it can be with but not just for process opening by laser, the first insulating layer of acquisition, then
Again by the first insulating layer on pressure roller, the processing of the first insulating layer is completed.
Further, polymer film further includes the second release layer 16, and the 5th adhesive layer 14 is located at the second release layer 16 and son
Between insulating layer 13,
Roll-in is carried out in the first insulating layer 10, composite layer group 20 and the notacoria layer 30 that will successively arrange, obtains conductive backings
It before, further include removing the second release layer 16.
In an embodiment of the present invention, polymer film further includes the second release layer, convenient for forming opening on polymer film,
When obtaining the first insulating layer, fixed polymer film can prevent the 5th adhesive layer to be contaminated in polymer film opening process, have
Polymer film is protected to effect, meanwhile, the second release layer is also convenient for being wound polymer film packaging.Certainly, by first
It before insulating layer, composite layer group and notacoria layer carry out roll-in, needs to remove the second release layer, improves the first insulating layer, composite layer
The reliability that group and notacoria layer are fixed.
Further, the material of the second release layer 16 is silicone oil paper, and the grammes per square metre of the second release layer 16 is 30-200 grams/square
Rice.
In an embodiment of the present invention, the material of the second release layer is silicone oil paper, and the grammes per square metre of the second release layer is 30-200
Gram/m, so that there is the second release layer suitable intensity to process opening.
Further, the grammes per square metre of the second release layer 16 is 30-45 grams/m.
In an embodiment of the present invention, the grammes per square metre of the second release layer is 30-45 grams/m, so that the second release layer has
There is suitable intensity processing opening.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art
Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (26)
1. a kind of conductive backings, which is characterized in that including the first insulating layer, composite layer group and notacoria layer, composite layer group position
Between first insulating layer and the notacoria layer, the composite layer group includes conductive layer and composite insulation layer, the conduction
Layer is patterned layer, and between the conductive layer and the notacoria layer, the composite insulation layer includes the composite insulation layer
First adhesive layer, second insulating layer and the second adhesive layer, the second insulating layer are located at first adhesive layer and described second
Between adhesive layer.
2. conductive backings according to claim 1, which is characterized in that the conductive layer is conductive metal foil, the conduction
The material of metal foil be copper or aluminium, the conductive metal foil with a thickness of 20-100 microns.
3. conductive backings according to claim 1, which is characterized in that the conductive layer with a thickness of 15-30 microns.
4. conductive backings according to claim 1, which is characterized in that the material of first adhesive layer is viscous with described second
The material for connecing layer is each independently selected from organic fluorin modified crylic acid resin, epoxy modified acrylic resin and nano-material modified third
Any one in olefin(e) acid resin.
5. conductive backings according to claim 1, which is characterized in that the second insulating layer it is micro- with a thickness of 20-200
Rice, and/or,
The thickness of the composite insulation layer is less than 300 microns.
6. conductive backings according to claim 1, which is characterized in that the notacoria layer includes polymer backboard, described multiple
Closing insulating layer includes second insulating layer described in multilayer, is provided with third adhesive layer between the adjacent second insulating layer.
7. conductive backings according to claim 6, which is characterized in that the material of the third adhesive layer is organic fluorine richness
Any one in acrylic resin, epoxy modified acrylic resin and nano-material modified acrylic resin.
8. conductive backings according to claim 1, which is characterized in that the notacoria layer includes polymer backboard and encapsulation
Layer, the encapsulated layer is between the polymer backboard and the composite layer group, second described in the composite insulation layer
The number of plies of insulating layer is one layer.
9. conductive backings according to claim 8, which is characterized in that the encapsulated layer with a thickness of 100-800 microns.
10. conductive backings according to claim 1, which is characterized in that the composite insulation layer exposes the conductive layer side
Edge is 1-2 centimetres positioned at the distance between the composite insulation layer edge of the same side and the conductive layer edge.
11. conductive backings according to claim 1, which is characterized in that first insulating layer includes the 4th adhesive layer, son
Insulating layer and the 5th adhesive layer, the insulating sublayer layer is between the 4th adhesive layer and the 5th adhesive layer, and described
For five adhesive layers between the insulating sublayer layer and the composite layer group, first insulating layer is provided with several openings, described
Opening runs through first insulating layer along the thickness direction of first insulating layer.
12. conductive backings according to claim 11, which is characterized in that the 4th adhesive layer is backwards to the insulating sublayer layer
Side be provided with the first release layer.
13. conductive backings according to claim 12, which is characterized in that the material of first release layer is silicone oil paper,
The grammes per square metre of first release layer is 30-200 grams/m.
14. conductive backings according to claim 11, which is characterized in that the material and the described 5th of the 4th adhesive layer
The material of adhesive layer is each independently selected from organic fluorin modified crylic acid resin, epoxy modified acrylic resin and nano-material modified
Any one in acrylic resin.
15. conductive backings according to claim 11, which is characterized in that the shape of the opening is round or rectangular, institute
The quantity for stating opening is 100-50000.
16. conductive backings according to claim 11, which is characterized in that first insulating layer includes that son described in multilayer is exhausted
Edge layer is provided with the 6th adhesive layer between the adjacent insulating sublayer layer.
17. conductive backings according to claim 16, which is characterized in that the material of the 6th adhesive layer changes for Organic fluoride
Any one in property acrylic resin, epoxy modified acrylic resin and nano-material modified acrylic resin.
18. conductive backings according to claim 11, which is characterized in that the insulating sublayer layer it is micro- with a thickness of 20-200
Rice, and/or,
The thickness of first insulating layer is less than 300 microns.
19. a kind of back contacts solar module, which is characterized in that including muti-piece solar cell piece, solar cell described in muti-piece
Piece is electrically connected by the described in any item conductive backings of claim 1-18.
20. a kind of manufacturing method of conductive backings, which comprises the following steps:
Patterned process is carried out by conductive layer and composite insulation layer roll-in, and to the conductive layer, obtains composite layer group；
The first insulating layer stacked gradually, the composite layer group and notacoria layer are subjected to roll-in, obtain conductive backings.
21. the manufacturing method of conductive backings according to claim 20, which is characterized in that the composite layer group includes third
Release layer,
The composite insulation layer between the third release layer and the conductive layer,
Before the first insulating layer, the composite layer group and the notacoria layer that will be stacked gradually carry out roll-in, further include, described in removing
Third release layer.
22. the manufacturing method of conductive backings according to claim 21, which is characterized in that the material of the third release layer
For silicone oil paper, the grammes per square metre of the third release layer is 30-200 grams/m.
23. the manufacturing method of conductive backings according to claim 20, which is characterized in that the pressure of the roll-in is 0.1
~1.5MPa.
24. the manufacturing method of conductive backings according to claim 20, which is characterized in that further include:
Several openings are formed on polymer glue film, obtain first insulating layer, wherein the polymer glue film includes the 4th
Adhesive layer, insulating sublayer layer and the 5th adhesive layer, the insulating sublayer layer be located at the 4th adhesive layer and the 5th adhesive layer it
Between.
25. the manufacturing method of conductive backings according to claim 24, which is characterized in that the polymer film further includes
Two release layers, the 5th adhesive layer between second release layer and the insulating sublayer layer,
First insulating layer stacked gradually, composite layer group and notacoria layer are being subjected to roll-in, before obtaining conductive backings, also
Including removing second release layer.
26. the manufacturing method of conductive backings according to claim 25, which is characterized in that the material of second release layer
For silicone oil paper, the grammes per square metre of second release layer is 30-200 grams/m.
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