CN209772785U - Semiconductor element packaging defect inspection machine - Google Patents
Semiconductor element packaging defect inspection machine Download PDFInfo
- Publication number
- CN209772785U CN209772785U CN201920283958.4U CN201920283958U CN209772785U CN 209772785 U CN209772785 U CN 209772785U CN 201920283958 U CN201920283958 U CN 201920283958U CN 209772785 U CN209772785 U CN 209772785U
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- cylinder
- defect inspection
- inspection machine
- display
- conveying belt
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Abstract
The utility model discloses a semiconductor element encapsulates defect inspection machine, it includes charging tray etc, the top at the box is fixed to the roof, the charging tray is located the conveyer belt, the conveyer belt is connected with the gyro wheel, push away the material cylinder, the cartridge clip all is located the side of conveyer belt, the one end and the detection camera of manipulator are connected, the frame, the other end of manipulator, the cylinder, the one end of support all is located the roof, the other end and the display of support are fixed, the conveyer belt, the gyro wheel, it all is located the frame to block the cylinder, driving motor is connected with the gyro wheel, it is located the side of gyro wheel to block the cylinder. The utility model discloses automatic feeding and shooting improve detection efficiency, reduce the cost of labor.
Description
Technical Field
The utility model relates to a package defect inspection machine especially relates to a semiconductor component package defect inspection machine.
Background
At present, with the rapid development of the semiconductor industry, chips applied to the market are smaller and smaller, the processing performance is higher and higher, and accordingly, more and more chip gold wire welding pins are required to be arranged and are more and more compact, so that the defect detection of the industry is required to be many times higher than before, but the detection level at the present stage cannot meet the detection requirement, the detection efficiency can only be shot and observed by a human microscope, the detection efficiency is very low, the false detection is artificially missed, and the influence of false detection factors is great.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a semiconductor component encapsulation defect inspection machine is provided, its automatic feeding carries out the shooting, improves detection efficiency.
The utility model discloses a solve above-mentioned technical problem through following technical scheme: a semiconductor element packaging defect inspection machine is characterized by comprising a material tray, a box body, a top plate, a frame, a conveying belt, a roller, a material pushing cylinder, a cartridge clip, a mechanical arm, a detection camera, a cylinder, a display, a guide rail, a support, a horizontal transfer sliding block, a driving motor, a blocking cylinder and a material box lifting motor, wherein the top plate is fixed at the top end of the box body, the material tray is positioned on the conveying belt, the conveying belt is connected with the roller, the material pushing cylinder and the cartridge clip are positioned on the side surface of the conveying belt, one end of the mechanical arm is connected with the detection camera, the frame, the other end of the mechanical arm, the cylinder and one end of the support are positioned on the top plate, the other end of the support is fixed with the display, the conveying belt, the roller and the blocking cylinder are positioned on the frame, the driving motor is connected with the roller, the guide rail is located one side of the cartridge clip and located below the display, and the material box lifting motor is located below one cartridge clip.
Preferably, a box door is arranged on the box body.
Preferably, the bottom end of the box body is provided with a foot pad.
Preferably, the display is a touch screen.
Preferably, a plurality of grooves are formed in the tray.
The utility model discloses an actively advance the effect and lie in: the utility model discloses automatic feeding and shooting improve detection efficiency, reduce the cost of labor.
Drawings
Fig. 1 is a schematic perspective view of the semiconductor device package defect inspection machine of the present invention.
Fig. 2 is a front view of the semiconductor device package defect inspection machine of the present invention.
Detailed Description
The following provides a preferred embodiment of the present invention with reference to the accompanying drawings to explain the technical solutions of the present invention in detail.
As shown in fig. 1 and fig. 2, the semiconductor device package defect inspection machine of the present invention comprises a tray 1, a box 2, a top plate 3, a frame 4, a conveyor belt 5, a roller 6, a material pushing cylinder 7, a cartridge clip 8, a manipulator 9, a detection camera 10, a cylinder 11, a display 12, a guide rail 13, a support 14, a horizontal transfer slider 15, a driving motor 16, a blocking cylinder 17, and a cartridge lifting motor 18, wherein the top plate 3 is fixed on the top end of the box 2, the tray 1 is located on the conveyor belt 5, the conveyor belt 5 is connected with the roller 6, the material pushing cylinder 7 and the cartridge clip 8 are located on the side of the conveyor belt 5, one end of the manipulator 9 is connected with the detection camera 10, the frame 4, the other end of the manipulator 9, the cylinder 11, and one end of the support 14 are located on the top plate 3, the other end of the support 14 is fixed with the display, the driving motor 16 is connected with the roller 6, the blocking cylinder 17 is located on the side face of the roller 6, the horizontal transfer sliding block is connected with the guide rail in a sliding mode, the horizontal transfer sliding block is located on the material disc, the guide rail is located on one side of the cartridge clip 8 and located below the display 12, and the material box lifting motor is located below one cartridge clip 8.
Wait to examine the product and put on the charging tray, the charging tray is put into the material loading region through the cartridge clip, thereby magazine elevator motor with the charging tray lift transfer the slider with the level and link together with the charging tray, push away the material cylinder, the horizontal transfer slider pushes away a charging tray to the conveyer belt at every turn, driving motor passes through gyro wheel drive conveyer belt and rotates, wait to examine the product and transport the detection station by the conveyer belt on with the charging tray, carry out secondary positioning by blockking the cylinder afterwards, it improves the accuracy that detects the position to block the cylinder, it takes a picture to each position of pin respectively to drive the detection camera by the manipulator, will shoot picture and standard sample and carry out contrast difference at the display, thereby detect out. The detected material tray is conveyed to OK (qualified) and NG (unqualified) areas through a conveying belt, the blanking area also adopts a cartridge clip type blanking mode, the blanking modes of the two areas are the same, two cartridge clips are controlled to be interchanged by a cylinder, the OK area is located in a detection production line right opposite area under normal conditions, when a defective material box comes, an NG module is conveyed to the position, and the material tray is stacked in the NG module. The frame positions the charging tray and prevents the charging tray from moving outside.
The box body 2 is provided with a box door 22, so that the box body is convenient to open and close and is convenient for storing things.
The bottom end of the box body 2 is provided with a foot pad 23, so that the stability can be improved.
The display is a touch screen, so that the control and the operation are convenient.
Be equipped with a plurality of recesses on the charging tray, conveniently lay a plurality of products of waiting to examine like this.
To sum up, the utility model discloses automatic feeding carries out the shooting, improves detection efficiency, reduces the cost of labor.
The above-mentioned embodiments further explain the technical problems, technical solutions and advantages of the present invention in detail, it should be understood that the above-mentioned embodiments are only examples of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. A semiconductor element packaging defect inspection machine is characterized by comprising a material tray, a box body, a top plate, a frame, a conveying belt, a roller, a material pushing cylinder, a cartridge clip, a mechanical arm, a detection camera, a cylinder, a display, a guide rail, a support, a horizontal transfer sliding block, a driving motor, a blocking cylinder and a material box lifting motor, wherein the top plate is fixed at the top end of the box body, the material tray is positioned on the conveying belt, the conveying belt is connected with the roller, the material pushing cylinder and the cartridge clip are positioned on the side surface of the conveying belt, one end of the mechanical arm is connected with the detection camera, the frame, the other end of the mechanical arm, the cylinder and one end of the support are positioned on the top plate, the other end of the support is fixed with the display, the conveying belt, the roller and the blocking cylinder are positioned on the frame, the driving motor is connected with the roller, the guide rail is located one side of the cartridge clip and located below the display, and the material box lifting motor is located below one cartridge clip.
2. The semiconductor device package defect inspection machine of claim 1, wherein a door is provided on the box body.
3. The semiconductor device package defect inspection machine of claim 1, wherein a foot pad is provided at a bottom end of the box body.
4. The semiconductor device package defect inspection machine of claim 1, wherein the display is a touch screen.
5. The semiconductor device package defect inspection machine of claim 1, wherein a plurality of grooves are provided on the tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920283958.4U CN209772785U (en) | 2019-03-07 | 2019-03-07 | Semiconductor element packaging defect inspection machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920283958.4U CN209772785U (en) | 2019-03-07 | 2019-03-07 | Semiconductor element packaging defect inspection machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209772785U true CN209772785U (en) | 2019-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920283958.4U Active CN209772785U (en) | 2019-03-07 | 2019-03-07 | Semiconductor element packaging defect inspection machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN209772785U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109821767A (en) * | 2019-03-07 | 2019-05-31 | 苏州振畅智能科技有限公司 | Semiconductor component packing defect inspection machine |
| CN116395384A (en) * | 2023-04-27 | 2023-07-07 | 先之科半导体科技(东莞)有限公司 | A full-automatic feeding equipment of self-checking formula for diode processing |
-
2019
- 2019-03-07 CN CN201920283958.4U patent/CN209772785U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109821767A (en) * | 2019-03-07 | 2019-05-31 | 苏州振畅智能科技有限公司 | Semiconductor component packing defect inspection machine |
| CN116395384A (en) * | 2023-04-27 | 2023-07-07 | 先之科半导体科技(东莞)有限公司 | A full-automatic feeding equipment of self-checking formula for diode processing |
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