CN209693315U - A kind of graphene high-efficiency radiator - Google Patents
A kind of graphene high-efficiency radiator Download PDFInfo
- Publication number
- CN209693315U CN209693315U CN201821830287.0U CN201821830287U CN209693315U CN 209693315 U CN209693315 U CN 209693315U CN 201821830287 U CN201821830287 U CN 201821830287U CN 209693315 U CN209693315 U CN 209693315U
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- Prior art keywords
- heat
- graphene
- heat dissipation
- substrate
- thin slice
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Abstract
The utility model discloses a kind of graphene high-efficiency radiators, graphene cooling fin, substrate, heat-conducting metal block, heat dissipation thin slice group including successively contacting superposition；The graphene cooling fin is flexible material, and upper surface is contacted with heat source, and lower surface is contacted with substrate；The substrate is using metal as substrate, outer lining graphene thin layer；The heat-conducting metal block is alloy heat-conducting block；The heat dissipation thin slice group includes several heat dissipation thin slices for being distributed in single metal block lower surface.The utility model is designed reasonably, perfect heat-dissipating can satisfy the requirement of device efficient heat dissipation, practical and popularizing value with higher.
Description
Technical field
The utility model belongs to cooling electronic component technical field more particularly to a kind of graphene high-efficiency radiator.
Background technique
With the miniaturization of electronic device and highly integrated, the density of wiring board over-assemble increasingly increases, so that electronics produces
Product surface temperature also accordingly increases, and has seriously affected the stability and service life of electronic product, therefore heat dissipation performance is in electronics
Paid much attention to during component design and use.
Traditional heat-dissipating piece is all to do heat sink material with copper, but the pyroconductivity of copper only has 400W/ (mK) mostly, heat dissipation
Ability is limited.And grapheme material with heating conduction outstanding and extraordinary specific surface area becomes research in recent years because of it
Focus is ideal high power electronic device heat sink material.
Chinese patent CN103107147 discloses the radiator that a kind of surface is covered with graphene film, mainly will be independent
Graphene film obtained or carrier containing graphene film, are fixed on radiator table with gum or other physical fixing methods
Face, and gum, carrier layer or other physical fixing methods between graphene film and radiator, so that thermal energy caused by heat source
Transmission be limited by limited thermally-conductive interface, heat radiation function is fairly limited.
Utility model content
Purpose of utility model: the technical problems to be solved in the utility model is to overcome the deficiencies of the prior art and provide one kind
The collection capacity of heat transmission is strong, radiate efficient graphene radiator.
Utility model content: a kind of graphene high-efficiency radiator, graphene cooling fin, base including successively contacting superposition
Material, heat-conducting metal block, heat dissipation thin slice group；
The graphene cooling fin is flexible material, and upper surface is contacted with heat source, and lower surface is contacted with substrate；It is described
Substrate is using metal as substrate, outer lining graphene thin layer；
The heat-conducting metal block is alloy heat-conducting block；The heat dissipation thin slice group includes several being distributed in single metal block following table
The heat dissipation thin slice in face.
Preferably, the thickness of the graphene cooling fin is at 50-100 microns.
Preferably, the substrate material of the substrate is aluminium, silver or copper, and thickness is at 50-100 microns.
Polygonal prism body or cylindrical body preferably, the heat-conducting metal block is positive.
Preferably, the heat-conducting metal block thickness is at 20-50 microns.
Preferably, heat dissipation thin slice of the heat dissipation thin slice group by 10-100 thickness degree at 10-20 microns is formed by stacking.
Preferably, the heat dissipation thin slice is alloy, and material surface spraying graphite alkene heat dissipating layer, graphene radiates thickness
Degree is at 5-10 microns.
Preferably, the heat dissipation thin slice is composed of triangle, triangle is centrosymmetric in metal block lower surface
Distribution.
Preferably, the angle of plane is 15-45 ° where the heat dissipation thin slice group and heat-conducting metal block.
Compared to the prior art, the utility model has the beneficial effects that: structure is simple, the capacity of heat transmission is strong, heat dissipation is efficient.
Graphene cooling fin can future self-heat power heat be quickly sent to substrate, and heat-conducting metal is sent to heat transfer by substrate
Block, then by metal block lower surface heat dissipation thin slice group in a manner of heat transfer or heat radiation loss and then reach reinforcement to outside
Thermally conductive, high efficiency and heat radiation effect.The arrangement increases heat transference efficiencies, can effectively improve applied to cooling electronic component efficiency
16%, it enhances the stability of electronic product and extends service life.The utility model is designed reasonably, perfect heat-dissipating, energy
Enough meet the requirement of device efficient heat dissipation, practical and popularizing value with higher.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment.
In figure: 1- graphene cooling fin, 2- substrate, 3- heat-conducting metal block, 4- heat dissipation thin slice group.
Fig. 2 is the structural schematic diagram of substrate.
In figure: 21- substrate；22- graphene thin layer.
Fig. 3 is the heat dissipation thin slice group of heat-conducting metal block lower surface.
In figure: 41- heat dissipation thin slice；42- graphene heat dissipating layer.
Specific embodiment
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, letter will be made to embodiment below
Single introduction.
Such as Fig. 1-3, a kind of graphene high-efficiency radiator, including including graphene cooling fin 1, the base for successively contacting superposition
Material 2, heat-conducting metal block 3, heat dissipation thin slice group 4；
The graphene cooling fin 1 is flexible material, and upper surface is contacted with heat source, and lower surface is contacted with substrate 2；Institute
Substrate 2 is stated using metal as substrate 21, outer lining graphene thin layer 22；The heat-conducting metal block 3 is alloy heat-conducting block；The heat dissipation is thin
Piece group 4 includes several heat dissipation thin slices 41 for being distributed in single metal block lower surface, graphene heat dissipating layer 42.
The thickness of the graphene cooling fin 1 is at 50-100 microns.
21 material of substrate of the substrate 2 is silver or copper or aluminium, and thickness is at 50-100 microns.
The heat-conducting metal block 3 is positive polygonal prism body or cylindrical body.
The heat-conducting metal block 3 is silver, copper, at least two metal alloys in aluminium, and thickness is at 20-50 microns.
It is described heat dissipation thin slice group 4 by 10-100 thickness degree 10-20 micron heat dissipation thin slice 41 be sprayed on heat dissipation thin slice
The graphene heat dissipating layer 42 on surface is formed by stacking.
The thin slice 41 that radiates is at least two metal alloy in silver, copper, aluminium, and material surface spraying graphite alkene radiates
Layer 42,42 thickness of graphene heat dissipating layer is at 5-10 microns.
The heat dissipation thin slice 41 is composed of triangle, and triangle is centrosymmetric distribution in metal block lower surface.
The angle of the heat dissipation thin slice group 4 and 3 place plane of heat-conducting metal block is 15-45 °.
Above embodiments are only to illustrate the optimal technical scheme of the utility model, it is noted that for the art
Those of ordinary skill for, without departing from the principle of this utility model, several improvement made or equivalent replacement,
It is accordingly to be regarded as the protection scope of the utility model, should be covered in the scope of the claims of the utility model.
Claims (9)
1. a kind of graphene high-efficiency radiator, which is characterized in that graphene cooling fin (1), base including successively contacting superposition
Material (2), heat-conducting metal block (3), heat dissipation thin slice group (4)；
The graphene cooling fin (1) is flexible material, and upper surface is contacted with heat source, and lower surface is contacted with substrate (2)；Institute
Substrate (2) is stated using metal as substrate, outer lining graphene thin layer；The heat-conducting metal block (3) is alloy heat-conducting block；The heat dissipation is thin
Piece group (4) includes several heat dissipation thin slices for being distributed in single metal block lower surface.
2. graphene high-efficiency radiator according to claim 1, which is characterized in that the graphene cooling fin (1)
Thickness is at 50-100 microns.
3. graphene high-efficiency radiator according to claim 1, which is characterized in that the substrate material of the substrate (2)
For aluminium, silver or copper, and thickness is at 50-100 microns.
4. graphene high-efficiency radiator according to claim 1, which is characterized in that the heat-conducting metal block (3) is positive
Polygonal prism body or cylindrical body.
5. graphene high-efficiency radiator according to claim 1, which is characterized in that heat-conducting metal block (3) thickness
At 20-50 microns.
6. graphene high-efficiency radiator according to claim 1, which is characterized in that the heat dissipation thin slice group (4) is by 10-
100 thickness degree are formed by stacking in 10-20 microns of heat dissipation thin slice.
7. graphene high-efficiency radiator according to claim 1, which is characterized in that the heat dissipation thin slice is alloy, and
Material surface spraying graphite alkene heat dissipating layer, graphene heat dissipating layer thickness is at 5-10 microns.
8. graphene high-efficiency radiator according to claim 1, which is characterized in that the heat dissipation thin slice is by triangle sets
It closes, triangle is centrosymmetric distribution in metal block lower surface.
9. graphene high-efficiency radiator according to claim 1, which is characterized in that the heat dissipation thin slice group and thermally conductive gold
The angle of plane is 15-45 ° where belonging to block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821830287.0U CN209693315U (en) | 2018-11-07 | 2018-11-07 | A kind of graphene high-efficiency radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821830287.0U CN209693315U (en) | 2018-11-07 | 2018-11-07 | A kind of graphene high-efficiency radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209693315U true CN209693315U (en) | 2019-11-26 |
Family
ID=68594655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821830287.0U Expired - Fee Related CN209693315U (en) | 2018-11-07 | 2018-11-07 | A kind of graphene high-efficiency radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209693315U (en) |
-
2018
- 2018-11-07 CN CN201821830287.0U patent/CN209693315U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191126 Termination date: 20201107 |
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| CF01 | Termination of patent right due to non-payment of annual fee |