CN209561113U - A kind of patch type hot melt breaks compound varistor device assembly - Google Patents

Abstract

The utility model discloses a kind of patch type to heat compound varistor device assembly of breaking, including a pair of of chip unit, chip unit includes electrode and porcelain body, the burning infiltration of porcelain body both ends has electrode, insulating layer is equipped between a pair of of chip unit, it is connected between the both ends of the surface of a pair of electrodes of identical side by fuse-link on a pair of chip unit, the utility model reduces the halfway risk of fuse-link fusing by changing the connection type of fuse-link between two electrodes, and use patch form, small volume, two electrodes are generally aligned in the same plane simultaneously, really realize single side attachment.

Description

A kind of patch type hot melt breaks compound varistor device assembly

Technical field

The utility model relates to piezoresistor technical fields more particularly to a kind of patch type to heat the compound pressure-sensitive electricity that breaks Hinder device assembly.

Background technique

Piezoresistor is the overvoltage protection element being most widely used at present, with nonlinear resistance characteristic, When its both end voltage is higher than certain value, the resistance value of varistor is reduced rapidly, when piezoresistor both end voltage is lower than certain When value, the resistance value of varistor is very big, where circuit almost open a way, furthermore varistor has good energy absorption and resistance to By high current feature, these characteristics allow to it is in parallel in circuit, when occur causing by factors such as lightning stroke, electrostatic in circuit When high voltage transient, varistor is connected rapidly, flows through the electric current overwhelming majority caused by high pressure via itself, thus protect with Its electrical equipment and chip in parallel.

It is current it is pressure-sensitive be difficult to be resistant to long-time conducting electric current, after there is pressure-sensitive failure, easily there is risk on fire, in the industry one As make pressure responsive resistor failure in such a way that hot melt is disconnected or mechanical trip after cut off the power, heating disconnected representative is TMOV, is passed through The disconnected lead of pressure sensitive surface attachment hot melt realizes metapyretic power-off of failing, but TMOV has the ineffective risk of power-off, such as Fruit fuse-link be molten into it is spherical after be still kept in contact with electrode surface, circuit arcing, power off it is not clean, still have risk on fire；Furthermore when It is preceding it is pressure-sensitive it is general be not appropriate for mounting there are lead-in inductance influence using lead type, be unfavorable for reducing small product size；And it pastes The varistor of dress is usually the right and left attachment, or draws plane attachment after lead, is directly mounted to electrode in plane.

Utility model content

The purpose of this utility model is to provide a kind of patch type to heat compound varistor device assembly of breaking, and passes through change The connection type of fuse-link reduces the halfway risk of fusing between two electrodes, uses patch form, small volume, simultaneously At least two electrodes are generally aligned in the same plane, real single side attachment.

In order to achieve the above objectives, the technical solution adopted in the utility model is: a kind of patch type hot melt breaks compound pressure-sensitive Resistor component, including a pair of of chip unit, the chip unit include electrode and porcelain body, and porcelain body both ends burning infiltration has electricity Pole is equipped with insulating layer between a pair of chip unit, on a pair of chip unit between the both ends of the surface of a pair of electrodes of side It is connected by fuse-link.

As further optimization, the both ends of the surface of at least a pair of electrodes of side are located at same on a pair of chip unit In plane.

As further optimization, the width of the fuse-link is less than electrode end surface width.

As further optimization, area of section is less than or equal to its both ends area of section in the middle part of the fuse-link.

As further optimization, the fuse-link is connect with electrode by soldering-tin layer.

Compared with prior art, the utility model have it is below the utility model has the advantages that

1. reducing the halfway wind that fuses by the connection type for changing fuse-link between two chip unit top electrodes Danger,

2. not using external lead wire, volume can reduce；

3. two electrode surfaces are generally aligned in the same plane, it is suitble to directly mount, welds fuse-link again after can also first mounting.

Detailed description of the invention

Fig. 1 is the main view of conventional varistor device assembly.

Fig. 2 is the top view of conventional varistor device assembly.

Fig. 3 is the main view of the utility model.

Fig. 4 is the top view of the utility model.

In figure, 1. chip units；2. electrode；3. porcelain body；4. insulating layer；5. fuse-link；6. conducting wire.

Specific embodiment

It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further Description, but the utility model is not limited to these examples.

As shown in Fig. 1 to 2, two chip units of conventional varistor device assembly are electrically connected by conducting wire 6, two fuse-links (Thermal Cutoffs) is respectively arranged at the end face on wherein each electrode far from conducting wire one end.

As shown in Figs. 3-4, a kind of patch type heats break compound varistor device assembly, including a pair of of chip unit 1, Chip unit 1 includes electrode 2 and porcelain body 3, and 3 two sides burning infiltration of porcelain body has electrode 2, is equipped with insulating layer 4 between a pair of of chip unit 1, It is connected between the both ends of the surface of a pair of electrodes 2 of side by fuse-link 5 on a pair of chip unit 1.

Using two concatenated structures of chip of pressure sensitive resistor unit, chip includes porcelain body and electrode, two chip units In at least a pair of electrodes where plane it is parallel, insulating layer is equipped with therebetween, on an ipsilateral electrode of two chip units It is welded with fuse-link to connect two electrodes, fuse-link can also be used using having pin or the Thermal Cutoffs without pin Between the thick constant fuse-link of fuse-link or sectional area in thinner both sides.

For fuse-link between two chip units, striking point is located at middle section, continues without fuse-link close to electrode after fusing Risk, reduction fuse-link continue the risk being powered after fusing, chip unit is two series connection, when one of them fails, pressure-sensitive electricity Crimping closely halves, it may appear that fuse-link fusing occurs at this time in follow current, and two sides generates heat simultaneously, and fuse-link incudes both sides simultaneously Heat, it is easier to fuse.

The both ends of the surface of at least a pair of electrodes 2 of side are in the same plane on a pair of chip unit 1, can also two sides The both ends of the surface of a pair of electrodes be respectively positioned in same plane.

The width of fuse-link 5 is less than 2 end face width of electrode.

5 middle part area of section of fuse-link is less than or equal to its both ends area of section, fusing can be generated in medium position, after fusing Two electrodes are isolated.

Fuse-link 5 is connect with electrode 2 by soldering-tin layer.

The utility model reduces the halfway risk that fuses by changing the connection type of fuse-link between two electrodes, Using patch form, small volume, while two electrodes are generally aligned in the same plane, and really realize single side attachment.

The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.

Claims (5)

1. The compound varistor device assembly 1. a kind of patch type hot melt breaks, which is characterized in that including a pair of of chip unit (1), institute Stating chip unit (1) includes electrode (2) and porcelain body (3), and porcelain body (3) the both ends burning infiltration has electrode (2), a pair of chip list Insulating layer (4) are equipped between first (1), by molten between the both ends of the surface of a pair of electrodes (2) of side on a pair of chip unit (1) Disconnected body (5) are connected.
2. The compound varistor device assembly 2. patch type hot melt according to claim 1 breaks, which is characterized in that described in a pair The both ends of the surface of at least a pair of electrodes (2) of side are in the same plane on chip unit (1).
3. The compound varistor device assembly 3. patch type hot melt according to claim 1 breaks, which is characterized in that the fusing The width of body (5) is less than electrode (2) end face width.
4. The compound varistor device assembly 4. patch type hot melt according to claim 3 breaks, which is characterized in that the fusing Area of section is less than or equal to its both ends area of section in the middle part of body (5).
5. The compound varistor device assembly 5. patch type hot melt according to any one of claims 1 to 4 breaks, feature exist In the fuse-link (5) is connect with electrode (2) by soldering-tin layer.