CN209545979U - Conductive traces, the device and component load-bearing part formed by conductive traces - Google Patents
Conductive traces, the device and component load-bearing part formed by conductive traces Download PDFInfo
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- CN209545979U CN209545979U CN201821595870.8U CN201821595870U CN209545979U CN 209545979 U CN209545979 U CN 209545979U CN 201821595870 U CN201821595870 U CN 201821595870U CN 209545979 U CN209545979 U CN 209545979U
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Abstract
Provide a kind of conductive traces, a kind of device and a kind of component load-bearing part that the second conductive traces by the first conductive traces and horizontally abutted directly against are formed.Ratio between the area of section (A1) of the top one third of the conductive traces and the area of section (A2) of middle part one third is between 0.8 to 1.2, and the ratio between the area of section (A2) of the middle part one third and the area of section (A3) of lower part one third is between 0.8 to 1.2.
Description
It is on January 29th, 2018 that the application, which is the applying date, entitled " to carry to component application No. is 201820149318X
The conductive coating structure of part is etched the equipment to form conductive traces " Chinese utility model patent application divisional application.
Technical field
The utility model relates to a kind of conductive traces, a kind of device formed by least two conductive traces and a kind of portions
Part load-bearing part.
Background technique
Increase the miniaturization journey with this component in the product function of the component load-bearing part equipped with one or more components
It is more next in the increased situation of quantity of degree raising and the component being mounted on component load-bearing part such as printed circuit board (PCB)
If more using the array-like component become stronger day by day or packaging part with dry part, these components or packaging part with multiple
Contact or connector, the space between these contacts even increasingly reduce.
PCB industry, which is particularly faced with, adapts to the size of printed circuit board produced to meet appointing for small form factor requirements
Business.Due to the distance between the new size of circuit paths, drilling and drilling, it is therefore desirable to implement new etching technique,
Especially new copper etching process.Although copper etching process is one of most important step in manufacture printed circuit board, making
The task that processing is still a challenge is carried out to copper during work.In conventional isotropic copper etching process as shown in Figure 1,
To being formed on substrate and part is etched by the copper film to be etched of mask (as patterned negative template) covering
When, due to isotropic etching, undercutting may be formed below mask, causes poor adhesion.In addition, isotropic etching may
Very delicate etch structures can not be formed, but isotropic etching may be stopped by corresponding fine mask arrangement.
It is that 30 microns and fine structure below may need to carry out anisotropic etch process that generating, which has circuit paths,.
In the case where printed circuit board, it may be desirable to etch (especially removal copper) and more occur in a vertical direction without in cross
To on direction.Therefore, the structure of available rule, and can be to avoid chopped mouth.Ideal anisotropy is shown in FIG. 2
Etching process, wherein etching only occurs in the vertical direction of PCB without in a lateral direction, so that not forming undercutting.
Utility model content
The purpose of the utility model is to provide a kind of etching machines, allow to carry out anisotropic etching to conductive coating structure
And/or allow to be formed conductive traces with substantially regular shape, particularly with essentially vertical side wall, to mention
The total quality of high component load-bearing part such as printed circuit board.
To achieve the goals above, a kind of equipment for being etched to conductive coating structure, a kind of conductor mark are provided
Line, a kind of device formed by least two conductive traces and a kind of component load-bearing part.In addition, disclosing a kind of pair of conductive layer
The method that structure is etched.
Exemplary implementation scheme according to the present utility model is etched to be formed the conductive coating structure of component load-bearing part
The method of conductive traces includes the following steps: to carry out vacuum etch to conductive coating structure；Then (matched in addition etching additive
The vertical etching of promotion is set to etch and inhibit lateral etches) while two-fluid erosion is carried out to (pre-etched) conductive coating structure
It carves.
Another exemplary embodiment according to the present utility model, loses for the conductive coating structure to component load-bearing part
Carving with the equipment for forming conductive traces includes: the vacuum etch unit for being configured to carry out conductive coating structure vacuum etch, quilt
The two-fluid for being configured to carry out two-fluid etching to (pre-etched) conductive coating structure immediately etches unit, and is configured to
The etching additive addition of addition etching additive (for promoting vertically to etch and inhibiting lateral etches) during two-fluid etches
Unit.
Another exemplary implementation scheme according to the present utility model provides a kind of conductor with substantial rectangular section
Trace, wherein ratio between the area of section of top one third and the area of section of middle part one third 0.8 to 1.2 it
Between in the range of, and the ratio between the area of section of middle part one third and the area of section of lower part one third 0.8 to
Between 1.2.It in one embodiment, can be by etching process described herein and/or by described herein
Etching machines form conductive traces.
Another exemplary implementation scheme according to the present utility model provides a kind of by all having substantial rectangular section
The device that first conductive traces and the second conductive traces horizontally abutted directly against are formed, wherein the upper flat of conductive traces
Model of the ratio between 0.7 to 1.3 between the distance between the distance between platform (plateaus, level ground) lower end of conductive traces
In enclosing.In one embodiment, it can be formed by etching process described herein and/or by etching machines described herein
First conductive traces of the device and/or the second conductive traces (especially the two conductive traces).
Another exemplary implementation scheme according to the present utility model provides a kind of component load-bearing part, the component load-bearing part
Including the stacked body formed by least one electric insulation layer structure and at least one conductive coating structure, wherein at least one is conductive
At least part of layer structure includes conductive traces described herein and/or device described herein.
In the context of this application, term " etch combination " can be referred to particularly such as golden to conductive material
Belong to --- being particularly, but without limitation, to copper, aluminium, nickel or silver --- and at least partly etched the fluid of (thawing), such as solution or
Liquid.For this purpose, etching composition can particularly include indicating to be used at least partly lose conductive material in composition
Carve the etchant (etching reagent) of the reactive component of (fusing).
Exemplary implementation scheme according to the present utility model provides a kind of etching process, wherein in conjunction with two different
Etching technique, thus realize the anisotropic etching of conductive coating structure is allowed to be formed with substantially regular shape,
Particularly with the conductive traces of essentially vertical side wall.It, can be with more specifically, by combining vacuum etch and two-fluid to etch
Etching process is controlled, so that compared with the etching in the transverse direction in conductive coating structure (that is, etched structure),
Promote the etching in the vertical direction of the recess portion (recess) formed in etched structure during etching.It is not intended to be bound by any reason
By, it is believed that being formed by spraying before by vacuum etch for the etching particle generated by two-fluid etching is very narrow recessed
Between permeate.Further, it is believed that the etching additive added during two-fluid etching can generate on the side wall of narrow recess
Protective film, so that etching substantially carries out in a vertical direction, rather than transverse direction.It is thus possible to improve component load-bearing part
The total quality of such as printed circuit board, the especially etch profile in reduction ratio of defects, improvement plate produced (improve equal
Even property) and in terms of improving the etching factor of etched structure.Furthermore it is possible to realize the line width (line-space less than 50 μm
(line-to-space), L/S), such as 30 μm or hereinafter, particularly 25 μm or less.
It will be explained below the method being etched to conductive coating structure, set for what is be etched to conductive coating structure
Other exemplary implementation schemes of standby, conductive traces, the device of at least two conductive traces and component load-bearing part.However, this
Utility model is not limited to the specific descriptions of following exemplary implementation schemes, the mesh that these exemplary implementation schemes are merely to illustrate
's.
It should be noted that can be with any other about the feature that an exemplary implementation scheme or illustrative aspect describe
Exemplary implementation scheme or illustrative aspect combine, particularly, described with any exemplary implementation scheme of etching process
Feature can be with any other exemplary implementation scheme and etching machines, conductive traces, at least two conductors of etching process
The device of trace and any exemplary implementation scheme of component load-bearing part combine, and vice versa, unless otherwise expressly specified.
Indefinite article or definite article such as " a (one) ", " an (one) " or " the (being somebody's turn to do) " are used when referring to single term
In the case of, it also include the plural form of the term, vice versa, unless otherwise expressly specified, and word used herein " one
It is a " or digital " 1 " be often referred to " only one " or " just what a ".
It should be noted that term " including (comprising) " is not excluded for other elements or step, as it is used herein,
Not only include the meaning of " including (comprising) ", " including (including) " or " containing (containing) ", also includes
" substantially by ... constitute " and " by ... constitute " meaning.
Unless otherwise expressly specified, otherwise statement " at least partly " used herein, " at least partially ", " extremely
Few ... part " or " a part at least ... " can refer to its at least 1%, particularly its at least 5%, particularly it is at least
10%, particularly its at least 15%, particularly its at least 20%, particularly its at least 25%, particularly its at least 30%, especially
Ground its at least 35%, particularly its at least 40%, particularly its at least 45%, particularly its at least 50%, particularly it is at least
55%, particularly its at least 60%, particularly its at least 65%, particularly its at least 70%, particularly its at least 75%, especially
Ground its at least 80%, particularly its at least 85%, particularly its at least 90%, particularly its at least 95%, particularly it is at least
98%, and can also include its 100%.
In one embodiment, the conductive coating structure of component load-bearing part is etched to form the method packet of conductive traces
It includes: vacuum etch being carried out to conductive coating structure, immediately to conductive coating structure (particularly in its same position or place, the position
Or therefore place is referred to as " pre-etched " or " etching " before) carry out two-fluid etching.
In one embodiment, conductive coating structure is made to be subjected to abatement (subtractive is deleted) etching program, to be formed
Conductive traces.Therefore, etching process can be abatement etching process.
In one embodiment, vacuum etch includes that will apply including the etch combination of etchant and (especially spray) extremely
Conductive coating structure.
In one embodiment, etch combination is liquid, such as solution.It can be by the way that each component part be such as etched
Agent is dissolved in solvent appropriate such as water and/or organic solvent and prepares etch combination.Therefore, etch combination can wrap
Include solvent such as water and/or organic solvent.
In one embodiment, etchant includes copper chloride (CuCl2) and iron chloride (FeCl3At least one of).It can replace
Dai Di can also use alkaline etching.Advantageously etchant includes copper chloride (CuCl2), especially it is in etching process
In the case where being etched conductive coating structure with the etching process of the conductive traces of forming member load-bearing part.
In one embodiment, vacuum etch further includes extra by low pressure (such as low-pressure, vacuum) removal (removal)
Etchant (or extra etch combination).Therefore, available very narrow etching space or recess portion, such as with 30 μm
Or below, particularly 25 μm or width below.
In one embodiment, two-fluid etching includes at least one fluid for applying liquid and gaseous at least one
Fluid.
In one embodiment, two-fluid etching include apply include etchant at least one fluid and including air
At least one fluid.
In one embodiment, at least one fluid of the liquid and/or at least one fluid including etchant can
To include etching additive.However, can also will etch additive during two-fluid etching and at least one of the liquid flows
Body and/or at least one fluid including etchant separate (individually) addition.
In one embodiment, etchant used in two-fluid etching can be and etchant used in vacuum etch
Identical etchant, or can be different etchant.It can be beneficial that etchant used in two-fluid etching and true
Etchant used in cavitation corrosion quarter is identical.
In one embodiment, etching additive is configured to promote vertically to etch and inhibit lateral etches.
In one embodiment, etching additive includes rheologic additive.In the context of this application, term " rheology
Additive " can particularly refer to change the compound of the rheological behaviour of fluid such as liquid.Rheologic additive may include
Organic compound and/or inorganic compound.
In one embodiment, rheologic additive is selected from by following groups constituted: silica, hydroxyethyl cellulose, page
Silicate and urea.Silica can hydrophilic in particular and/or igneous and/or amorphous silica, such as HDK N20
(can be bought from Munich, Germany Wacker Chemie AG company).Hydroxyethyl cellulose particularly can be water soluble ethoxyl
Cellulose, such as 250 HHBR or Natrosol 250HHX of Natrosol (can be from card Winton Ashland Inc. companies, the U.S.
It buys).Phyllosilicate particularly can be aqueous phyllosilicate, and such as Optigel WX (can be from German Wei Saier Byk-
Chemie GmbH company buys).Urea particularly can be Modified Urea, and such as Byk-7420 ES (can be from German Wei Saier
Byk-Chemie GmbH company buys).
Be not intended to be bound by any theory, it is assumed that following the description: the theory based on injection etching, the flowing of etching liquid is recessed
The centre or center in portion are more surging, so that liquid is fiercer than the side-walls in recess portion here.In this case, to etching
Liquid addition rheologic additive may cause the etching liquid among compared to recess portion, the density of the etching liquid of adjacent sidewalls
And/or viscosity increases.Under normal circumstances, the density and/or viscosity of etching liquid are lower, and etching liquid and surface are (such as
Be made of copper) between ingredient exchange it is easier.Therefore, addition rheologic additive may cause higher in vertical direction
Etching speed, and the lower etching speed on horizontal (transverse direction) direction, to further increase etching process and gained
The anisotropy of etch structures.
In one embodiment, after making conductive coating structure be subjected to two-fluid etching, (etched) conductive layer can be made
Structure is subjected to flushing liquid.
In one embodiment, flushing liquid includes being configured to adjust the porosity on etched surface and/or preventing
The compound (hereinafter referred to as " flushing liquid additive ") on (copper) surface and air interaction.
In one embodiment, flushing liquid additive can be selected from by following groups constituted: ethyoxyl amide, (ethoxy
Base) amine, fatty acid, phosphonate ester, alkanolamine phosphonate ester and dispersing agent.
In one embodiment, process can be etched by etching machines described herein.
In one embodiment, etching machines include the vacuum etch for being configured to carry out conductive coating structure vacuum etch
Unit, the two-fluid etching unit for being configured to immediately carry out (pre-etched) conductive coating structure two-fluid etching, and by
The etching additive adding unit for being configured to the addition etching additive during two-fluid etches (vertically etches and presses down for promoting
Lateral etches processed).
In one embodiment, it is described herein etched to may be configured to (or can be adapted for) execution for etching machines
Journey.
In one embodiment, vacuum etch unit includes that injection unit such as jet rod and pump unit are such as true
Empty bar.Injection unit may be configured to spray the etch combination including etchant to conductive coating structure.Pump unit can
To be configured to remove (removal) extra etchant by low pressure (such as low-pressure, vacuum), (or extra etching is combined
Object).Injection unit and pump unit can be arranged at the opposite side of vacuum etch unit.For example, injection unit can be arranged
In the upper part of vacuum etch unit, pump unit can be arranged in the lower part of vacuum etch unit.Particularly, it sprays
Unit can be arranged in the top of the object to be etched such as conductive coating structure of component load-bearing part, and pump unit can be arranged
In the lower section of object to be etched.It is thereby achieved that particularly efficient vacuum etch and/or can particularly obtain narrow etching
Structure.
In one embodiment, two-fluid etching unit include be configured to be formed by least two fluids it is spraying (mist,
Plume) injection nozzle.
In one embodiment, two-fluid etching unit includes at least two pipes for being configured to supply at least two fluids
Road.It (can just exist) before injection nozzle, mix at least two fluid in injection nozzle and/or behind (just existing) injection nozzle
It closes.
In one embodiment, etching additive can be added at least one of fluid in advance, particularly added
To fluid liquid and/or including the fluid of etchant.Therefore, etching additive adding unit and two-fluid can be etched into unit
Separate the setting (particularly in upstream).
Alternatively or additionally, addition etching additive in unit can be etched in two-fluid.In one embodiment,
Etching additive adding unit is integrated in two-fluid etching unit.In this case, it is single to be integrated with etching additive addition
The two-fluid etching unit of member may include the additional pipeline for being configured to supply etching additive.
In one embodiment, etching machines include conveyer, can be by component load-bearing part from one by the conveyer
Shipped is etched to another etching unit, unit is such as etched from vacuum etch shipped to two-fluid.
In one embodiment, the characteristic of the conductive traces with substantial rectangular section is cutting for top one third
Ratio between face area and the area of section of middle part one third between 0.8 to 1.2, particularly between 0.85 to 1.15,
Particularly exist between 0.9 to 1.1, particularly between 0.93 to 1.07, particularly between 0.94 to 1.06, particularly
Between 0.95 to 1.05, and between the area of section of middle part one third and the area of section of lower part one third
Ratio 0.8 to 1.2, particularly between 0.85 to 1.15, particularly between 0.9 to 1.1, particularly 0.93 to
Between 1.07, particularly between 0.94 to 1.06, particularly between 0.95 to 1.05.
In one embodiment, the characteristic of conductive traces can also be, the area of section of top one third and lower part
Ratio between the area of section of one third between 0.7 to 1.3, particularly between 0.8 to 1.2, particularly 0.9 to
Between 1.1, particularly between 0.92 to 1.08, particularly between 0.94 to 1.06.
In one embodiment, by etching process described herein and/or etching machines described herein can be passed through
Form conductive traces.
In the context of this application, term top one third, middle part one third and lower part one third " section face
Product " can particularly refer to respectively when along vertical direction cutting and it is laterally subdivided for three contour one thirds when conductive traces
Area of section, according to the explanation of Fig. 6 and hereafter corresponding explanation will be apparent from.
In the context of this application, term " substantial rectangular section " can particularly refer to above-mentioned area of section than in
At least one especially at least two are located in each above range.Alternatively or additionally, term " substantial rectangular section "
Distance as described below can be referred to than being located in range described below.
In one embodiment, by all having first conductive traces in substantial rectangular section and horizontally abutting directly against
The characteristic of device that is formed of the second conductive traces be, the distance between upper brace of conductive traces under conductive traces
End the distance between ratio between 0.7 to 1.3, particularly between 0.8 to 1.2, particularly 0.85 to 1.15 it
Between, particularly between 0.9 to 1.1, particularly between 0.92 to 1.08, the particularly range between 0.95 to 1.05
It is interior.
In one embodiment, between the distance between upper brace of conductive traces and/or the lower end of conductive traces
Distance can be less than 50 μm, and such as 30 μm or hereinafter, particularly 25 μm or less.
In one embodiment, by etching process described herein and/or etching machines described herein can be passed through
Form the first conductive traces and/or the second conductive traces (especially the two conductive traces) of device.
In one embodiment, component load-bearing part includes by least one electric insulation layer structure and at least one conductive layer knot
The stacked body being configured to, wherein at least part of at least one conductive coating structure include conductive traces described herein and/or
Device described herein.
In one embodiment, can at least partly expose at least one conductive coating structure includes conductive traces
The part of device and/or.
In one embodiment, at least one conductive coating structure includes that the part of conductive traces and/or device can be with
It is at least partially sandwiched between two electric insulation layers and/or is at least partially embedded in an electric insulation layer structure.
In the context of this application, term " component load-bearing part " can particularly refer to hold thereon and or therein
One or more components are received to provide any support construction of mechanical support and/or electrical connection.In other words, component load-bearing part can
To be disposed for the machinery and/or electronics load-bearing part of component.Particularly, component load-bearing part can be printed circuit board, organic
One of insertion piece and IC (integrated circuit) substrate.Component load-bearing part can also be the component load-bearing part for combining the above-mentioned type
In different component load-bearing parts mixed plate.
In the context of this application, term " electronic component " can particularly refer to appointing for the inside of built in items load-bearing part
What large volume and non-laminar active parts (such as semiconductor chip) or passive component (such as copper billet).
In one embodiment, component can be selected from by following groups constituted: non-conductive inlay, conductive inlay are (such as golden
Belong to inlay, it preferably includes copper or aluminium), heat transfer unit (such as heat pipe), light-guide device (such as optical waveguide or photoconductive tube connection
Part), electronic component or their combination.For example, component can be active electronic component, passive electrical components, electronic chip, deposit
Storage device (such as DRAM or another data storage), filter, integrated circuit, Signal Processing Element, power management components,
Optoelectronic interface element, electric pressure converter (such as DC/DC converter or AC/DC converter), encryption unit, transmitter and/or
Receiver, electromechanical transducer, sensor, actuator, MEMS (MEMS), microprocessor, capacitor, resistor, electricity
Sense, battery, switch, video camera, antenna, logic chip and energy collection unit.However, it is possible to be embedded in it in component load-bearing part
His component.For example, magnetic element can be used as component.It is (such as ferromagnetic element, anti-that this magnetic element can be permanent magnet component
Ferromagnetic element, or ferrous magnetic cell such as ferrite core) or can be paramagnetic elements.However, in addition component can also be
Component load-bearing part, configured for instance in plate in plate.Component can be to be surface mounted on component load-bearing part and/or can be embedding
Enter inside it.In addition, other component especially generates and issues electromagnetic radiation and/or quick for the electromagnetic radiation from environmental dissemination
Those of sense component is also used as component.
In one embodiment, component load-bearing part includes by least one electric insulation layer structure and at least one conductive layer knot
The stacked body being configured to.For example, component load-bearing part can be the laminated body of above-mentioned electric insulation layer structure and conductive structure, especially
It is formed by applying mechanical pressure, the forming process is supported by thermal energy if necessary.Above-mentioned stacked body can provide
The plate portion part load-bearing part of big mounting surface but still very thin compact can be provided for other component.Term " layer structure "
It can specifically indicate pantostrat, patterned layer or the multiple discontinuous islands in common plane.
In one embodiment, component load-bearing part is configured to plate.This facilitates compact design, but wherein component load-bearing part
Big substrate for installing component on it is provided.Further, since the thickness of bare chip is small, can be convenient will be especially as
The exemplary bare chip of embedded-type electric subassembly is embedded into thin plate such as printed circuit board.
In one embodiment, component load-bearing part is configured to by printed circuit board and substrate (especially IC substrate) structure
At one of group.
In the context of this application, term " printed circuit board " (PCB) can be indicated specifically by by several conductions
The component load-bearing part that layer structure and several electric insulation layer structures are laminated to be formed is (its (i.e. plane) for can be plate, three-dimensional
(such as when being manufactured using 3D printing) of curved surface or its can have any other shape), above-mentioned forming process is for example logical
Application pressure initiation is crossed, is accompanied by the supply of thermal energy if necessary.As the preferred material for PCB technology, conductive layer
Structure is made of copper, and electric insulation layer structure may include resin and/or glass fibre, so-called prepreg or FR4 material.
By formation across the through-hole (such as passing through laser drill or machine drilling) of laminated body and by utilizing conductive material (especially
Copper) fill these through-holes to formed as through-hole connection via hole, various conductive coating structures can in the desired manner that
This connection.Other than it can be embedded in one or more components in printed circuit board, printed circuit board is usually also configured
For accommodating one or more components in one or two opposed surface of plate shape printed circuit board.These components can pass through
It is solder-connected to corresponding main surface.The dielectric part of PCB can be by the resin structure with reinforcing fiber (such as glass fibre)
At.
In the context of this application, term " substrate " specifically can indicate and want component mounted thereto (especially
It is electronic component) have basically the same the widget load-bearing part of size.More specifically, substrate is construed as electricity
The load-bearing part of gas connection or electrical network and with the comparable component load-bearing part of printed circuit board (PCB), however have it is significant more
Highdensity transverse direction and/or the connector being vertically arranged.Transverse connection is, for example, conducting path, and vertical connector can be
Such as it drills.These are laterally and/or vertical connector is disposed in substrate, and may be used to provide especially IC chip
The component accommodated or the component not accommodated (such as bare chip) and printed circuit board or intermediate printed circuit board electrically connect
It connects and/or is mechanically connected.Thus, term " substrate " further includes " IC substrate ".The dielectric part of substrate can be by having enhancing ball
The resin of (such as glass marble) is constituted.
In one embodiment, component load-bearing part is laminated type component load-bearing part.In such embodiments, component
Load-bearing part is by applying pressure --- if necessary with heat --- multilayered structure for stacking and linking together
Compound.
In one embodiment, at least one electric insulation layer structure includes by following at least one of groups constituted:
Resin (such as enhancing or non-reinforcing resin, such as epoxy resin or bismaleimide-cyanate resin, more specifically FR-4 or
FR-5), cyanate, polyphenylene derivatives (polyphenylene derivate), glass (especially glass fibre, multilayer
Glass, glassy material), prepreg material, polyimides, polyamide, liquid crystal polymer (LCP), epoxy group laminated film
(epoxy-based Build-Up Film), polytetrafluoroethylene (PTFE) (teflon), ceramics and metal oxide.It can also use
Reinforcing material, such as net, fiber or sphere made of glass (compound glass).Although prepreg or FR4 are usually excellent
Choosing, but other materials also can be used.For frequency applications, high frequency material such as polytetrafluoroethylene (PTFE), liquid crystal polymer and/or
Cyanate ester resin can be embodied as electric insulation layer structure in component load-bearing part.
In one embodiment, at least one described conductive coating structure includes by copper, aluminium, nickel, silver, gold, palladium and tungsten
At least one of group of composition.Although copper is usually preferred, other materials or their coated form are also that have can
Can, especially it is coated with the above-mentioned material of superconductor such as graphene.
In one embodiment, at least one conductive coating structure, especially at least including conductive traces and/or device
One conductive coating structure includes at least one of the group being made of copper, aluminium, nickel and silver.
Detailed description of the invention
According to exemplary implementation scheme described below, the above-mentioned aspect of the utility model and other aspects become obvious,
And these aspects are illustrated with reference to these exemplary implementation schemes.
Fig. 1 shows conventional isotropic copper etching process according to prior art.
Fig. 2 shows the ideal anisotropy copper etching processes of exemplary implementation scheme according to the present utility model.
The etching process that is related to cutting down that Fig. 3 shows exemplary implementation scheme according to the present utility model passes through photoresist
The conductive coating structure of component load-bearing part is carried out photolithographic structuring.
Fig. 4 shows the etching machines of exemplary implementation scheme according to the present utility model.
Fig. 5 A and Fig. 5 B illustrate the etching process shown in fig. 3 of exemplary implementation scheme according to the present utility model
A part enlarged view.
Fig. 6 shows the sectional view of the conductive traces of exemplary implementation scheme according to the present utility model.
Fig. 7 shows the section for the device of exemplary implementation scheme according to the present utility model formed by conductive traces
Figure.
Diagram in attached drawing is schematical.In different drawings, element similar or identical is provided with identical attached
Icon note.
Specific embodiment
Before exemplary implementation scheme is described in greater detail with reference to the attached drawings, the exemplary of expansion the utility model will be summarized
Some basic considerations that embodiment is based on.
Exemplary implementation scheme according to the present utility model combines vacuum etch and including erosion in abatement etching process
The two-fluid etching of additive is carved, this can permit the line-space (L/S) for realizing 25 μm.
Abatement etching process can not usually realize 25 μm of line-space (L/S) on thick copper (15 μm or more).On the contrary,
In order to realize so low S/R, it usually needs carry out half addition process (SAP), however, half addition process material, ability and
It is all more expensive compared with cutting down etching in terms of facility.(it is referred to as " super erosion for the combination of vacuum etch and two-fluid etching
Carve ") 35 μm to 40 μm of L/S can be realized on the Cu of 20 μ m-thicks, and 30 μm can also be realized on the Cu of 15 μ m-thicks
L/S.In addition, may be implemented on 15 μm or more thick Cu and half addition process one by further using etching additive
The etching performance down to 25 μm of L/S of sample.
As illustrative process, make thickness (more than the 12 μm) copper foil with standard roughness profile (at least 4.2 μm of Rz)
Laminated body (it is worth noting that, half addition process needs relatively thin and low roughness profile Cu foil, being related to higher cost) electricity
It is plating to the copper thickness (such as 20 μm) of requirement.Then, photo-patterning is carried out (it is worth noting that, half addition process with standard dry film
Need higher (more expensive) dry film type of thicker and resolution ratio).Then carry out vacuum etch, on the etching surface of plate with
And improved Cu etch profile and/or uniformity are provided between the top side and bottom side of plate.Preferable etch uniformity helps real
Now fine line etching.Then two-fluid etching is carried out, permeates etch compounds preferably between narrow space.It can lead to
It is very small that there is the generation of overspray nozzle the permission of preferable penetrating power suitably to be etched between very narrow space
Etchant particle (" mist ").Addition etching additive can protect trace side wall during two-fluid etching, allow higher erosion
The factor is carved, therefore the even higher etch capabilities down to 25 μm of L/S on permission thickness Cu are even.It is not intended to be bound by any reason
By, it is believed that protective film is formed on trace side wall with the etching additive of Cu ions binding, therefore slows down lateral etches.On the contrary,
Etching mainly vertically (downward) will carry out.By two-fluid etch injection nozzle generate fine particle can narrow space it
Between permeated, allow to etch fine lines.It is thereby achieved that 25 μm of L/S, while side wall is straight, Er Qieshi
It is high to carve the factor.Obtained trace can have trapezoidal shape, but have high etching factor, such as between 4 to 7.
The etching process that is related to cutting down that Fig. 3 shows exemplary implementation scheme according to the present utility model passes through photoresist
The conductive coating structure of component load-bearing part is carried out photolithographic structuring.In the first step, provide to be etched by electric insulation layer structure
The laminated body or stacked body that (being such as made of dielectric) and conductive coating structure (being such as made of copper) are formed.Then in conductive layer
Apply photoresist layer in structure.Then, (by mask, being not shown) makes photoresist be partially exposed to electromagnetic radiation (such as purple
(UV) light outside) and develop, to remove the part for being exposed to electromagnetic radiation of photoresist.In next step, carry out according to this
The abatement etching process (being highlighted with frame) of the exemplary implementation scheme of the engraving method of utility model.To conductive layer knot
Structure is anisotropically etched, so that the side wall of the recess portion formed in conductive coating structure is substantially vertical, although showing in Fig. 3
The slight undercut below photoresist is gone out.Finally, remove remaining photoresist (such as photoresist before be not exposed to electromagnetism
The part of radiation), such as in a manner of peeling, then obtain exemplary embodiment party according to the present utility model on the dielectric
The device of the conductive traces of case.
Fig. 4 shows the etching machines 100 of exemplary implementation scheme according to the present utility model.It is etched shown in Fig. 4
Equipment 100 includes being configured to carry out the vacuum etch unit 110 of vacuum etch to conductive coating structure, being configured to immediately to leading
The two-fluid that electric layer structure carries out two-fluid etching etches unit 120, and is configured to add erosion during two-fluid etches
Carve the etching additive adding unit 130 of additive.
Fig. 5 A and Fig. 5 B illustrate the highlighted by frame in Fig. 3 of exemplary implementation scheme according to the present utility model
The enlarged view of a part of etching process.More specifically, Fig. 5 A and Fig. 5 B show exemplary reality according to the present utility model
Apply the two-fluid etching of the etching process of scheme.
Referring to Fig. 5 A, the tiny etchant particle mixed with etching additive is injected into pre-etched part from injection nozzle
(part formed before by vacuum etch, be not shown).As shown in Figure 5 B, etching additive can be on the side wall of recess portion
Protective film is formed, its etch activity is substantially only used on the bottom of recess portion by etchant.Therefore, etching is basic
On carried out along the vertical direction of recess portion, rather than transverse direction.
Referring to Fig. 6, the leading with substantial rectangular section of exemplary implementation scheme according to the present utility model is shown
The sectional view of body trace.Particularly, sectional view shown in Fig. 6 is the vertical direction sectional view of conductive traces, that is, when along perpendicular
To the view of conductive traces when cutting.In addition, as depicted in figure 6, conductive traces are horizontally subdivided into contour three three
/ mono-.Therefore, the area of section (A1) of top one third, the area of section (A2) of middle part one third and lower part three are obtained
/ mono- area of section (A3).It is according to the characteristic of the conductive traces of exemplary implementation scheme, top one third is cut
Ratio between face area (A1) and the area of section (A2) of middle part one third between 0.8 to 1.2, and in
Ratio between the area of section (A2) of portion's one third and the area of section (A3) of lower part one third is between 0.8 to 1.2
In range.In one embodiment, the characteristic of conductive traces can also be, the area of section (A1) of top one third is under
Ratio between the area of section (A3) of portion's one third is between 0.7 to 1.3.
Referring to Fig. 7, the sectional view of the device of the conductive traces of exemplary implementation scheme according to the present utility model is shown.
Particularly, sectional view shown in fig. 7 is the device of conductive traces along the sectional view of vertical direction, that is, when along vertical side
To cutting conductive traces when view.Fig. 7 depicts the first conductive traces (such as the conductive traces on the left side) and the second conductor mark
Line (such as the conductive traces on the right).Fig. 7 further depicts the with the arrow of the distance between upper brace for indicating conductive traces
Line A, and indicate the line B with the arrow of the distance between the lower end of conductive traces.According to the conductor mark of exemplary implementation scheme
The characteristic of the device of line is, the distance between lower end of the distance between upper brace of conductive traces A and conductive traces B it
Between ratio between 0.7 to 1.3.Distance A and/or distance B can be, for example, less than 50 μm, such as 30 μm or hereinafter,
Particularly 25 μm or less.
It should be noted that the appended drawing reference in claim should not be understood as the limitation to the scope of the claims.
The implementation of the utility model is not limited to preferred embodiment shown in the drawings and above-mentioned.Even on the contrary,
In the case where the different embodiment in basis, also can be used shown in scheme and principle according to the present utility model carry out it is a variety of
Modification.
Claims (15)
1. a kind of conductive traces, which is characterized in that the area of section of the top one third of the conductive traces divides with middle part three
One of area of section between ratio between 0.8 to 1.2, and the area of section of the middle part one third with
Ratio between the area of section of lower part one third is between 0.8 to 1.2.
2. a kind of device that the second conductive traces by the first conductive traces and horizontally abutted directly against are formed, described first is led
Body trace and second conductive traces are according to conductive traces described in claim 1, which is characterized in that the conductive traces
The distance between the distance between the upper brace lower end of conductive traces model of the ratio 0.7 to 1.3 between the two
In enclosing.
3. a kind of component load-bearing part, including the stacking formed by least one electric insulation layer structure and at least one conductive coating structure
Body, which is characterized in that at least part of at least one conductive coating structure includes conductive traces according to claim 1
And/or the apparatus of claim 2.
4. component load-bearing part according to claim 3, which is characterized in that the component load-bearing part further include be mounted on it is described
At least one is electrically insulated at least one electric insulation layer structure and/or at least one described conductive coating structure and/or described in insertion
Component in layer structure and/or at least one described conductive coating structure.
5. component load-bearing part according to claim 4, which is characterized in that the component is electronic component.
6. component load-bearing part according to claim 4, which is characterized in that the component is selected from by following groups constituted: electricity
Subassembly, non-conductive and/or conductive inlay, heat transfer unit, energy collection unit, active electronic component, passive electrical sub-portion
Part, electronic chip, storage device, filter, integrated circuit, Signal Processing Element, power management components, optoelectronic interface member
Part, electric pressure converter, encryption unit, transmitter and/or receiver, electromechanical transducer, actuator, MEMS, micro process
Device, capacitor, resistor, inductance, accumulator, switch, camera, antenna, magnetic element, component load-bearing part in addition and logic core
Piece.
7. component load-bearing part according to claim 3, which is characterized in that at least one described conductive coating structure includes under
One of the group of composition: copper, aluminium, nickel, silver, gold, palladium and tungsten is stated, any one of mentioned material is coated with superconduction material
Material.
8. component load-bearing part according to claim 7, which is characterized in that the superconductor is graphene.
9. component load-bearing part according to claim 7, which is characterized in that at least one described conductive coating structure include by
One of the group that copper, aluminium, nickel and silver are constituted.
10. component load-bearing part according to claim 3, which is characterized in that at least one of described electric insulation layer structure
Including by following one of groups constituted: resin；Cyanate；Polyphenylene derivatives；Glass；Prepreg material；Polyamides is sub-
Amine；Polyamide；Liquid crystal polymer；Epoxy group laminated film；Polytetrafluoroethylene (PTFE)；Ceramics and metal oxide.
11. component load-bearing part according to claim 10, which is characterized in that the resin is enhancing or non-reinforcing resin.
12. component load-bearing part according to claim 11, which is characterized in that the resin is epoxy resin, span carrys out acyl
Imines-cyanate resin, FR-4 or FR-5.
13. component load-bearing part according to claim 3, which is characterized in that the component load-bearing part is shaped to plate.
14. component load-bearing part according to claim 3, which is characterized in that the component load-bearing part is configured to by printing
One in group that circuit board and substrate are constituted.
15. component load-bearing part according to claim 3, which is characterized in that the component load-bearing part is configured to stacked
Component load-bearing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821595870.8U CN209545979U (en) | 2018-01-29 | 2018-01-29 | Conductive traces, the device and component load-bearing part formed by conductive traces |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820149318.XU CN208273367U (en) | 2018-01-29 | 2018-01-29 | The equipment to form conductive traces is etched to the conductive coating structure of component load-bearing part |
| CN201821595870.8U CN209545979U (en) | 2018-01-29 | 2018-01-29 | Conductive traces, the device and component load-bearing part formed by conductive traces |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820149318.XU Division CN208273367U (en) | 2018-01-29 | 2018-01-29 | The equipment to form conductive traces is etched to the conductive coating structure of component load-bearing part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209545979U true CN209545979U (en) | 2019-10-25 |
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| CN201820149318.XU Active CN208273367U (en) | 2018-01-29 | 2018-01-29 | The equipment to form conductive traces is etched to the conductive coating structure of component load-bearing part |
| CN201821595870.8U Active CN209545979U (en) | 2018-01-29 | 2018-01-29 | Conductive traces, the device and component load-bearing part formed by conductive traces |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820149318.XU Active CN208273367U (en) | 2018-01-29 | 2018-01-29 | The equipment to form conductive traces is etched to the conductive coating structure of component load-bearing part |
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| EP3745832B1 (en) * | 2019-05-27 | 2023-05-03 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Anisotropic etching using photopolymerizable compound |
| CN110943271B (en) * | 2019-12-03 | 2021-06-11 | 哈尔滨工程大学 | Electric field regulation and control dual-channel terahertz filter and manufacturing method thereof |
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2018
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| CN208273367U (en) | 2018-12-21 |
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