CN203504881U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN203504881U CN203504881U CN201320577053.0U CN201320577053U CN203504881U CN 203504881 U CN203504881 U CN 203504881U CN 201320577053 U CN201320577053 U CN 201320577053U CN 203504881 U CN203504881 U CN 203504881U
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- Prior art keywords
- conduit
- circuit
- wall
- circuit board
- spacing
- Prior art date
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Abstract
A circuit board is provided. The circuit board comprises a circuit substrate, a conduit and a conduction pipe. The circuit substrate has a first surface and a second surface opposite to the first surface, and includes two outer-layer circuit layers, multiple circuit layers, and multiple insulating layers, wherein the insulating layers are alternatively disposed between the circuit layers; and the outer-layer circuit layers are positioned on outer sides of the insulating layers and the circuit layers respectively. The conduit is positioned in the circuit substrate and has a conducting layer. The conduit is electrically with at least one of the circuit layers through the conducting layer. The conduction pipe is positioned in the circuit substrate and includes a conduction portion and a pipe portion. The conduction pipe has a metal layer, and is electrically connected with at least one of the circuit layers through the metal layer, wherein the outer diameter of the pipe portion is larger than that of the conduction portion. According to the circuit board, the provided conduction pipe having different hole diameters can help to increase the wiring area between the conduction pipe and the conduit or between different conduction pipes.
Description
Technical field
The utility model relates to a kind of circuit board, and particularly relates to the structure of circuit board.
Background technology
Current electronic product, for example mobile phone and notebook computer, under the trend of microminiaturization and high performance, the whole stacking density of package module is more and more higher.Therefore, conventionally in circuit board, design different electrical connection paths.Generally speaking, circuit board is by conduction column, to be electrically connected the circuit layer of different layers.
Generally speaking, normally in through hole (through hole), blind hole (blind via hole) or buried via hole (buried hole) inside, plate metal material to form respectively plated-through-hole (plating through hole, PTH), plating blind hole or plating buried via hole.
Plated-through-hole is passed through every layer of circuit layer, thereby easily wastes internal circuit board space.In addition, though plating blind hole or plating buried via hole, only by the circuit layer of part, but, need to then bind in individual other circuit layer boring, thereby process costs are higher in production process again.
Utility model content
The utility model embodiment provides a kind of circuit board, and its formed conduction pipe can be divided at least two aperture portion separated from one another.
The utility model embodiment provides a kind of circuit board, and described circuit board comprises circuit substrate, the first conduit and conduction pipe.Circuit substrate has first surface and a second surface relative with first surface, circuit substrate comprises two outer circuit layers, multilayer circuit layer and multilayer dielectric layer, and these insulating barriers are alternately disposed between these circuit layers, and insulating barrier and circuit layer are between outer circuit layer.The first conduit is arranged in circuit substrate and has a conductive layer, and the first conduit is by wherein at least one electric connection of conductive layer and circuit layer.The pipe portion that conduction pipe is arranged in circuit substrate and comprises conducting portion and be connected with conducting portion.Conduction pipe has metal level, and conduction pipe is by wherein at least one electric connection of metal level and circuit layer, and wherein the external diameter of pipe portion is greater than the external diameter of this conducting portion.
Further, between the outer wall of conducting portion and the outer wall of the first conduit, there is one first spacing, between the outer wall of pipe portion and the outer wall of the first conduit, there is one second spacing, and the first spacing is greater than the second spacing.
Further, circuit board also comprises one second conduit, and the second conduit is connected in series to form another conduction pipe with the first conduit, and wherein the external diameter of the second conduit is not identical with the external diameter of the first conduit.
Further, the external diameter of the second conduit is less than the external diameter of the first conduit.
Further, between the outer wall of the second conduit and the outer wall of conducting portion, there is one the 3rd spacing, and the 3rd spacing is greater than the first spacing.
Further, between the outer wall of the second conduit and the outer wall of pipe portion, there is one the 4th spacing, and the 4th spacing is greater than the second spacing.
Further, circuit board comprises a plurality of conduction pipes, between the outer wall of the outer wall of one of them conducting portion and another pipe portion, there is one first spacing, between the outer wall of the outer wall of one of them pipe portion and another pipe portion, there is one second spacing, between the outer wall of one of them conducting portion and the outer wall of another conducting portion, there is one the 3rd spacing, and the 3rd spacing is greater than the first spacing, the first spacing is greater than the second spacing.
Further, circuit board also comprises an insulation filling body, and insulation filling body is disposed in conduction pipe, and insulation filling body contacts with metal level.
Further, the external diameter of conduction pipe is reduced toward conducting portion gradually from pipe portion.
Further, conduction pipe comprises a plurality of conducting portions, and conducting portion is connected with pipe portion.
In sum, the utility model embodiment provides a kind of circuit board.Circuit board comprises conduction pipe, and conduction pipe is arranged in circuit substrate and comprises conducting portion and pipe portion.Conduction pipe is electrically connected by least one circuit layer in metal level and circuit substrate, and the external diameter of pipe portion is greater than the external diameter of conducting portion.According to this, compared to the connected up area between known guide hole, the conduction pipe with different pore size provided by the utility model the connected up area between conduction pipe and conduit or different conduction pipe that is increased.That is to say, the conducting portion of the various outer diameter having by conduction pipe and pipe portion, no matter and arrangement between conduction pipe and conduit or conduction pipe can increase the connected up area of circuit layer between it.Accordingly, at the circuit layer between conduction pipe and conduit or different conduction pipe, be able to maintain under the prerequisite of circuit live width and reach circuit densification.
In order further to understand the utility model, be to reach technology, method and the effect that set object is taked, refer to following relevant detailed description of the present utility model, graphic, believe the purpose of this utility model, feature and feature, when being goed deep into thus and concrete understanding, yet appended graphic and annex only provide with reference to and explanation use, be not used for to the utility model limitr in addition.
Accompanying drawing explanation
Fig. 1 is the structural representation of the circuit board of the utility model the first embodiment.
Fig. 2 is the structural representation of the circuit board of the utility model the second embodiment.
Fig. 3 A is the structural representation of the circuit board of the utility model the 3rd embodiment.
Fig. 3 B is the structural representation of the circuit board of the utility model embodiment.
Fig. 4 is the structural representation of the circuit board of the utility model the 4th embodiment.
[symbol description]
100,200,300a, 300b, 400 circuit boards
110 circuit substrates
112 insulating barriers
114 circuit layers
116 outer circuit layers
120,220,320 conduits
130,230 conduction pipes
132,232 conducting portions
134,234 pipe portions
140 insulation filling bodies
150,250,250' the second conduit
C1, C2 conductive layer
D1 the first spacing
D2 the second spacing
D3 the 3rd spacing
D4 the 4th spacing
The external diameter of L1 conducting portion
The external diameter of L2 pipe portion
The external diameter of L3 conduit
The external diameter of L4 the second conduit
M1 metal level
S1 first surface
S2 second surface
Embodiment
Fig. 1 is the structural representation of the circuit board of the utility model the first embodiment.Refer to Fig. 1, circuit board 100 comprises a circuit substrate 110, conduit 120 and conduction pipe 130.Circuit substrate 110 comprises multilayer dielectric layer 112 and multilayer circuit layer 114, and these insulating barriers 112 are alternately disposed between these circuit layers 114, and conduit 120 and conduction pipe 130 are positioned at circuit substrate 110.
What deserves to be explained is, insulating barrier 112 normally forms with preimpregnation material (Preimpregnated Material), according to different reinforcing materials, divide, the prepreg bed of material can be the materials such as glass fibre prepreg (Glass fiber prepreg), carbon fibre initial rinse material (Carbon fiber prepreg), epoxy resin (Epoxy resin).In addition, circuit layer 114 and outer circuit layer 116 be copper metal material normally, and circuit layer 114 and outer circuit layer 116 can obtain Copper Foil metal layer pattern by lithography.Yet the utility model is not limited the material of insulating barrier 112 and circuit layer 114.
Particularly, in the process forming at conduction pipe 130, by machine drilling, with drill bit, from second surface S2 toward circuit substrate 110, be drilled to certain one deck circuit layer 114 to form the perforate of an aperture L2, then by laser drill (Laser drilling), at same position, continue to pierce to form the perforate of an aperture L1.
It should be noted that these two sidewalls that are positioned at the perforate of same position expose each layer insulating 112.In addition,, for different process requirements, these two perforates also can be pierced toward circuit substrate 110 from first surface S1 by machine drilling or laser drill, and it is not shown not run through circuit substrate 110().But, the utility model is not limited how forming perforate.
Then, to electroplate, form a metal level M1 in the hole wall of perforate.That is to say, by plating, make insulating barrier 114 sidewalls that the hole wall of perforate comes out metallized (metallization).What deserves to be explained is, in the process of electroplating, owing to being positioned at, the aperture of perforate of same position is different, therefore electroplates medicament and easily by the perforate of aperture L2, is flowed into the perforate of aperture L1, thereby make to be able to uniform metallization on the hole wall of perforate.
What deserves to be explained is to there is the first space D 1 between the outer wall of conducting portion 132 and the outer wall of guide hole 120, between the outer wall of pipe portion 134 and the outer wall of guide hole 120, there is the second space D 2, and the first space D 1 is greater than the second space D 2.According to this, at the connected up area of circuit layer 114 between the outer wall of conducting portion 132 and the outer wall of guide hole 120, be greater than the connected up area of circuit layer 114 between the outer wall of pipe portion 134 and the outer wall of guide hole 120.Accordingly, under being able to maintain the prerequisite of circuit live width, the circuit layer 114 between the outer wall of conducting portion 132 and the outer wall of guide hole 120 helps circuit densification.
Fig. 2 is the structural representation of the circuit board of the utility model the second embodiment.The circuit board 200 of the second embodiment and the circuit board of the first embodiment 100 the two structural similarity, effect is identical, and for example circuit board 200 and 100 equally all comprises multilayer dielectric layer 112.To only introduce circuit board 200 and 100 the two differences below, it is no longer repeated for identical feature.
Refer to Fig. 2, the circuit board 200 of the second embodiment comprises circuit substrate 110 and conduit 220 and conduction pipe 130.Similarly, circuit substrate 110 comprises multilayer dielectric layer 112 and multilayer circuit layer 114, and these insulating barriers 112 are alternately disposed between these circuit layers 114, and conduit 220 and conduction pipe 130 are positioned at circuit substrate 110.
In the present embodiment, the external diameter L4 of the second conduit 150 is less than the external diameter L3 of conduit 220.According to this, between the outer wall of conducting portion 132 and the outer wall of the second conduit 150, there is the 3rd space D 3, between the outer wall of conducting portion 132 and the outer wall of conduit 220, there is the first space D 1, between the outer wall of pipe portion 134 and the outer wall of conduit 220, there is the second space D 2.And being greater than the first space D 1, the first space D 1, the 3rd space D 3 is greater than the second space D 2.
Hold above-mentionedly, between the outer wall of conducting portion 132 and the outer wall of conduit 220 and the second conduit 150, the connected up area of circuit layer 114 is greater than the connected up area of circuit layer 114 between the outer wall of pipe portion 134 and the outer wall of conduit 220.Accordingly, the circuit layer 114 between the outer wall of conducting portion 132 and the outer wall of conduit 220 and the second conduit 150 is able to be issued to circuit densification in the prerequisite that maintains circuit live width.
Fig. 3 A is the structural representation of the circuit board of the utility model the 3rd embodiment.The circuit board 300 of the 3rd embodiment and the circuit board of the second embodiment 200 the two structural similarity, effect is identical, and for example circuit board 300 and 200 equally all comprises multilayer dielectric layer 112.To only introduce circuit board 300 and 200 the two differences below, it is no longer repeated for identical feature.
Refer to Fig. 3 A, the circuit board 300a of the 3rd embodiment comprises circuit substrate 110, conduit 320 and conduction pipe 130.Similarly, circuit substrate 110 comprises multilayer dielectric layer 112 and multilayer circuit layer 114, and these insulating barriers 112 are alternately disposed between these circuit layers 114, and conduit 320 and conduction pipe 130 are positioned at circuit substrate 110.
Similarly, the external diameter L4 of the second conduit 250 is less than the external diameter L3 of conduit 320, and the second conduit 250 is by conductive layer C2 and wherein at least one circuit layer 114 electric connections.In addition between the second conduit 250 and conduit 320, by conductive layer C1 and C2, be electrically connected.
But, different from the second embodiment, in the 3rd embodiment, the second conduit 250 and conduit 320 are different from the relative position between conduction pipe 130.Specifically, in practice, the second conduit 250 is a blind hole, from extending and do not run through circuit substrate 110 toward second surface S2 direction with conduit 320 connecting places.What deserves to be explained is, compared to the length of conduit 320, the length of the second conduit 250 is shorter.That is to say, insulating barrier 112 quantity that insulating barrier 112 quantity that conduit 320 runs through run through than the second conduit 250 are many.But, the utility model is not limited the length of the second conduit 250.
According to this, as shown in Figure 3A, between the outer wall of the outer wall of conducting portion 132 and conduit 320, there is the first space D 1, between the outer wall of the outer wall of pipe portion 134 and conduit 320, there is the second space D 2, between the outer wall of the outer wall of pipe portion 134 and the second conduit 250, there is the 4th space D 4, and the first space D 1 and the 4th space D 4 are all greater than the second space D 2.
Hold above-mentionedly, compared to the connected up area between known catheters, between the outer wall of conduction pipe 130 and the outer wall of conduit 320 and the second conduit 250, the connected up area of circuit layer 114 is larger.Accordingly, the circuit layer 114 between the outer wall of conduction pipe 130 and the outer wall of conduit 320 and the second conduit 250 is able to be issued to circuit densification in the prerequisite that maintains circuit live width.
But, in other embodiment, the length of the second conduit 250' also can be long compared with the length of conduit 320.That is to say, insulating barrier 112 quantity that insulating barrier 112 quantity that conduit 320 runs through run through than the second conduit 250 are few.
According to this, as shown in Figure 3 B, between the outer wall of the outer wall of conducting portion 132 and conduit 320, there is the first space D 1, between the outer wall of conducting portion 132 and the outer wall of the second conduit 250', there is the 3rd space D 3, between the outer wall of pipe portion 134 and the outer wall of the second conduit 250', there is the 4th space D 4.
Hold above-mentionedly, compared to the connected up area between known catheters, between the outer wall of conduction pipe 130 and the outer wall of conduit 320 and the second conduit 250', the connected up area of circuit layer 114 is larger.Accordingly, the circuit layer 114 between the outer wall of conduction pipe 130 and the outer wall of conduit 320 and the second conduit 250' is able to be issued to circuit densification in the prerequisite that maintains circuit live width.
Fig. 4 is the structural representation of the circuit board of the utility model the 4th embodiment.The circuit board 400 of the 4th embodiment and the circuit board of the first embodiment 100 the two structural similarity, effect is identical, and for example circuit board 400 and 100 equally all comprises multilayer dielectric layer 112.To only introduce circuit board 400 and 100 the two differences below, it is no longer repeated for identical feature.
Refer to Fig. 4, the circuit board 400 of the 4th embodiment comprises circuit substrate 110, conduit 120 and conduction pipe 230.Similarly, circuit substrate 110 comprises multilayer dielectric layer 112 and multilayer circuit layer 114, and these insulating barriers 112 are alternately disposed between these circuit layers 114, and conduit 120 and conduction pipe 230 are arranged in circuit substrate 110.
In the present embodiment, conduction pipe 230 comprises a plurality of conducting portions 232 and a pipe portion 234, and these conducting portions 232 are connected with pipe portion 234.These conducting portions 232 be arranged in parallel each other, and the external diameter L2 of pipe portion 234 is not only greater than the external diameter L1 of these conducting portions 232, and are greater than the scope being distributed by these conducting portions 232.What deserves to be explained is, conduction pipe 230 there is metal level M1 and be only disposed on conducting portion 232, and be not disposed in pipe portion 234.According to this, wherein, between the outer wall of at least one conducting portion 232 and the outer wall of conduit 120, there is one first space D 1, and there are one second space D 2, the first space D 1 between the outer wall of pipe portion 232 and the outer wall of conduit 120, be greater than the second space D 2.
Conducting portion pipe portion particularly, in the process forming at conduction pipe 230, by machine drilling, with drill bit, from second surface S2 toward circuit substrate 110, be drilled to certain one deck circuit layer 114 to form the perforate of an aperture L2, then by laser drill, by described perforate, continued to pierce to form the perforate of a plurality of aperture L1.Then, electroplate that above-mentioned a plurality of perforates are all plated to metal.Because aperture L2 is greater than aperture L1, so electroplate medicament, easily by the perforate of aperture L2, flowed into the perforate of aperture L1, thereby be positioned at the coat of metal distribution uniform of hole wall of the perforate of aperture L1.Then, exclude the coat of metal of the hole wall of the perforate that is positioned at aperture L2, to form a plurality of conducting portions 232 and a pipe portion 234.
Compared to the connected up area between known catheters, because conducting portion 232 is to form with laser, therefore, between the outer wall of pipe portion conducting portion between the outer wall of two conducting portions 232 wherein, the connected up area of circuit layer 114 is compared with bassoon portion conducting portion.In addition, between the outer wall of conducting portion 232 and the outer wall of guide hole 120, there is the first space D 1, between the outer wall of conducting portion 234 and the outer wall of guide hole 120, there is the second space D 2, and the first space D 1 is greater than the second space D 2.According to this, at the connected up area of circuit layer 114 between the outer wall of conducting portion 232 and the outer wall of guide hole 120, be greater than the connected up area of circuit layer 114 between the outer wall of pipe portion 234 and the outer wall of guide hole 120.
Accordingly, between two conducting portions 232 and be able to maintain at the circuit layer 114 between the outer wall of conducting portion 232 and the outer wall of guide hole 120 under the prerequisite of circuit live width and help circuit densification.Pipe portion conducting portion
In sum, the utility model embodiment provides a kind of circuit board.Circuit board comprises conduction pipe, and conduction pipe is arranged in circuit substrate and comprises conducting portion and pipe portion.Conduction pipe is electrically connected by least one circuit layer in metal level and circuit substrate, and the external diameter of pipe portion is greater than the external diameter of conducting portion.According to this, compared to the connected up area between known catheters, the conduction pipe with different pore size provided by the utility model is impelled the connected up area change between conduction pipe and conduit or different conduction pipe.That is to say, the conducting portion of the various outer diameter having by conduction pipe and pipe portion, no matter and arrangement between conduction pipe and conduit or conduction pipe can help the connected up area change of circuit layer between it.Accordingly, at the circuit layer between conduction pipe and conduit or different conduction pipe, be able to maintain under the prerequisite of circuit live width and reach circuit densification.
The foregoing is only embodiment of the present utility model, it is not in order to limit scope of patent protection of the present utility model.Any those of ordinary skill in the art, within not departing from spirit of the present utility model and scope, the change of doing and the equivalence of retouching are replaced, and are still in scope of patent protection of the present utility model.
Claims (10)
1. a circuit board, is characterized in that, described circuit board comprises:
One circuit substrate, described circuit substrate has a first surface and a second surface relative with described first surface, described circuit substrate comprises two outer circuit layers, multilayer circuit layer and multilayer dielectric layer, described insulating barrier is alternately disposed between described circuit layer, and described insulating barrier and described circuit layer are between described outer circuit layer;
One first conduit, is arranged in described circuit substrate, and described the first conduit has a conductive layer, and described the first conduit is by wherein at least one electric connection of described conductive layer and described circuit layer; And
Conduction pipe, be arranged in described circuit substrate, described conduction pipe comprises a conducting portion and a pipe portion being connected with described conducting portion, described conduction pipe has a metal level, described conduction pipe is by wherein at least one electric connection of described metal level and described circuit layer, and the external diameter of wherein said pipe portion is greater than the external diameter of described conducting portion.
2. circuit board according to claim 1, it is characterized in that, between the outer wall of the outer wall of described conducting portion and described the first conduit, there is one first spacing, between the outer wall of described pipe portion and the outer wall of described the first conduit, there is one second spacing, and described the first spacing is greater than described the second spacing.
3. circuit board according to claim 2, it is characterized in that, described circuit board also comprises one second conduit, and described the second conduit is connected in series to form another conduction pipe with described the first conduit, and the external diameter of wherein said the second conduit is not identical with the external diameter of described the first conduit.
4. circuit board according to claim 3, is characterized in that, the external diameter of described the second conduit is less than the external diameter of described the first conduit.
5. circuit board according to claim 4, is characterized in that, have one the 3rd spacing, and described the 3rd spacing is greater than described the first spacing between the outer wall of described the second conduit and the outer wall of described conducting portion.
6. circuit board according to claim 4, is characterized in that, have one the 4th spacing, and described the 4th spacing is greater than described the second spacing between the outer wall of described the second conduit and the outer wall of described pipe portion.
7. circuit board according to claim 1, it is characterized in that, described circuit board comprises a plurality of conduction pipes, the outer wall of conducting portion and there is one first spacing between the outer wall of pipe portion described in another described in one of them, the outer wall of pipe portion and there is one second spacing between the outer wall of pipe portion described in another described in one of them, the outer wall of conducting portion and there is one the 3rd spacing between the outer wall of conducting portion described in another described in one of them, and described the 3rd spacing is greater than described the first spacing, described the first spacing is greater than described the second spacing.
8. circuit board according to claim 1, is characterized in that, described circuit board also comprises an insulation filling body, and described insulation filling body is disposed in described conduction pipe, and described insulation filling body contacts with described metal level.
9. circuit board according to claim 1, is characterized in that, the external diameter of described conduction pipe is reduced toward described conducting portion gradually from described pipe portion.
10. circuit board according to claim 1, is characterized in that, described conduction pipe comprises a plurality of conducting portions, and described conducting portion is connected with described pipe portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320577053.0U CN203504881U (en) | 2013-09-17 | 2013-09-17 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320577053.0U CN203504881U (en) | 2013-09-17 | 2013-09-17 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203504881U true CN203504881U (en) | 2014-03-26 |
Family
ID=50335818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320577053.0U Expired - Fee Related CN203504881U (en) | 2013-09-17 | 2013-09-17 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203504881U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI769781B (en) * | 2021-04-12 | 2022-07-01 | 先豐通訊股份有限公司 | Manufacturing method of circuit board |
-
2013
- 2013-09-17 CN CN201320577053.0U patent/CN203504881U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI769781B (en) * | 2021-04-12 | 2022-07-01 | 先豐通訊股份有限公司 | Manufacturing method of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140326 |