CN209496856U - Heat conductive insulating plate - Google Patents

Heat conductive insulating plate Download PDF

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Publication number
CN209496856U
CN209496856U CN201822117130.XU CN201822117130U CN209496856U CN 209496856 U CN209496856 U CN 209496856U CN 201822117130 U CN201822117130 U CN 201822117130U CN 209496856 U CN209496856 U CN 209496856U
Authority
CN
China
Prior art keywords
bulge
heat
silicon dioxide
dioxide layer
dielectric polymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201822117130.XU
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Chinese (zh)
Inventor
李洪彬
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Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201822117130.XU priority Critical patent/CN209496856U/en
Application granted granted Critical
Publication of CN209496856U publication Critical patent/CN209496856U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

Heat conductive insulating plate.With the high speed development of large air-cooled turbine generator and high-power electronic component, the performances such as the heat transfer of thermal conductivity and insulation system to insulating materials propose increasingly higher demands, and there are the deficiencies of heating conduction difference for insulating heat-conduction material used at present.The utility model composition includes: dielectric polymers (1), the dielectric polymers upper and lower surface is respectively provided with wavy bulge structure, the bulge-structure is connect with silicon dioxide layer (2), the shape of the silicon dioxide layer is corresponding with the bulge-structure, and the silicon dioxide layer is connect with heat-conducting layer (3).The utility model is used for insulating materials.

Description

Heat conductive insulating plate
Technical field:
The utility model relates to a kind of heat conductive insulating plates.
Background technique:
With the high speed development of large air-cooled turbine generator and high-power electronic component, to the thermally conductive of insulating materials Property and the performances such as heat transfer of insulation system propose increasingly higher demands, insulating heat-conduction material used at present, which exists, leads The deficiency of hot property difference.
Utility model content:
The purpose of the utility model is to provide a kind of heat conductive insulating plates.
Above-mentioned purpose is realized by following technical scheme:
A kind of heat conductive insulating plate, composition includes: dielectric polymers, the dielectric polymers upper and lower surface difference With wavy bulge structure, the bulge-structure is connect with silicon dioxide layer, the shape of the silicon dioxide layer and institute The bulge-structure stated is corresponding, and the silicon dioxide layer is connect with heat-conducting layer.
The heat conductive insulating plate, the heat-conducting layer are graphene/carbon nano-tube composite radiating coating.
The utility model has the advantages that
The utility model is respectively provided with wavy bulge structure by dielectric polymers upper and lower surface, the heat of quickening Conduction outward, accelerates the heat dissipation of dielectric polymers, and setting silicon dioxide layer can further increase the heating conduction of insulation board And insulation performance.
Detailed description of the invention:
Attached drawing 1 is the structural schematic diagram of the utility model.
Specific embodiment:
Embodiment 1:
A kind of heat conductive insulating plate, composition includes: dielectric polymers 1, the dielectric polymers upper and lower surface point Not Ju You wavy bulge structure, the bulge-structure connect with silicon dioxide layer 2, the shape of the silicon dioxide layer with The bulge-structure is corresponding, and the silicon dioxide layer is connect with heat-conducting layer 3.
Embodiment 2:
According to mentioned-above heat conductive insulating plate, the heat-conducting layer is graphene/carbon nano-tube composite radiating coating.
The bulge-structure contact surface of dielectric polymers upper and lower surface is arranged to concave-convex rough surface.
Rough surface includes one group of warty protrusion, between 0.1-100 microns of particle diameter distribution of warty protrusion, to increase that Tension intensity around here.
The heat conductive insulating plate technique index of the utility model is up to state standards, and technical level is domestically leading, by pair The test of actual product, thermal coefficient 1.40W/m-K, peel strength 27N/cm, 0.98 DEG C/W of average thermal resistance, breakdown potential 10 (KVAC) are pressed, thermal shock foaming test 5 minutes not stratified, not blistering.

Claims (1)

1. a kind of heat conductive insulating plate, composition includes: dielectric polymers, it is characterized in that: above and below the dielectric polymers Surface is respectively provided with wavy bulge structure, and the bulge-structure is connect with silicon dioxide layer, the silicon dioxide layer Shape is corresponding with the bulge-structure, and the silicon dioxide layer is connect with heat-conducting layer;The heat-conducting layer is graphene/carbon Nanotube composite radiating coating;
The bulge-structure contact surface of the dielectric polymers upper and lower surface is arranged to concave-convex rough surface, the rough surface Including one group of warty protrusion, between 0.1-100 microns of particle diameter distribution of the warty protrusion.
CN201822117130.XU 2018-12-17 2018-12-17 Heat conductive insulating plate Expired - Fee Related CN209496856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822117130.XU CN209496856U (en) 2018-12-17 2018-12-17 Heat conductive insulating plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822117130.XU CN209496856U (en) 2018-12-17 2018-12-17 Heat conductive insulating plate

Publications (1)

Publication Number Publication Date
CN209496856U true CN209496856U (en) 2019-10-15

Family

ID=68153225

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822117130.XU Expired - Fee Related CN209496856U (en) 2018-12-17 2018-12-17 Heat conductive insulating plate

Country Status (1)

Country Link
CN (1) CN209496856U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191015

Termination date: 20211217

CF01 Termination of patent right due to non-payment of annual fee