CN209602442U - Heat conductive silica gel laminated film - Google Patents
Heat conductive silica gel laminated film Download PDFInfo
- Publication number
- CN209602442U CN209602442U CN201822253497.4U CN201822253497U CN209602442U CN 209602442 U CN209602442 U CN 209602442U CN 201822253497 U CN201822253497 U CN 201822253497U CN 209602442 U CN209602442 U CN 209602442U
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- Prior art keywords
- silica gel
- conductive silica
- heat conductive
- heat
- peeling layer
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Abstract
The utility model discloses a kind of heat conductive silica gel laminated films comprising upper peeling layer, upper heat conductive silica gel lamella, corona layer, platinum plating graphene heat conducting film, lower heat conductive silica gel lamella and the lower peeling layer being successively bonded according to sequence from top to bottom are successively bonded according to sequence from top to bottom；It can protect by upper and lower peeling layer and scratched using preceding non-sticky and foreign object, upper and lower heat conductive silica gel lamella has good heat dissipation effect；Corona layer can promote the adhesive force between heat conductive silica gel lamella and platinum plating graphene heat conducting film, and the cost of adhesive, also promotion good heat conduction effect need to be used by not only reducing conventional thermal conductive material silica gel composite, extend service life；Platinum plating graphene heat conducting film has efficient heating conduction, efficiently solves the problems, such as the thermal resistance and inefficiency problem in traditional heat-dissipating film product, good combination property；In addition upper and lower peeling layer is degradable material, is the green material that country advocates, and degradable and plasticity is recycled, and is conducive to environmental protection.
Description
Technical field
The utility model relates to thermally conductive technical field of membrane, in particular to a kind of heat conductive silica gel laminated film.
Background technique
With the high speed development of intelligent electronic device, many equipment are all towards frivolous small direction including communication apparatus
Manufacture, and during the operation of electronic equipment, heat, while instrument heat dissipation the smaller the more difficult are inevitably generated, heat
Aggregation affects the runnability of sophisticated electronics, therefore the current industry development of heat dissipation performance for accelerating sophisticated electronics encounters
The problem of, and " heat-conducting silica gel sheet " is the various auxiliary materials such as addition metal oxide using silica gel as substrate, is synthesized by special process
A kind of heat-conducting medium material, in industry, also known as thermal conductive silicon rubber mat, thermally conductive silica gel piece, soft heat conductive pad, thermal conductive silicon rubber mat
Piece etc. is produced exclusively for the design scheme using gap transmitting heat, being capable of blind, completion heating position and heat dissipation
Heat transmitting between position, while the effects of also act as insulation, damping, sealing, it can satisfy setting for device miniaturization and ultrathin
Meter requires, and is great craftsmanship and usability, and the splendid conductive filler material of one kind that thickness is applied widely.
It is now all utilized in heat conductive silica gel on piece in the industry and first coats primer (glue and ontology solid), then applies or pastes
Double-sided adhesive glue is closed, due to the rough surface of back patch object, the autohesion of product is not enough to be adjacent to close thermally conductive film, is easy in processing procedure
In fall off, to do over again, this adds increased the use costs of glue, while consuming more times, during gluing, lead
Hot silica gel piece can increase thermal resistance because of the excessive of glue, influence heat dissipation effect.
The utility model of publication number " CN206408158U " entitled " a kind of single side add viscous heat-conducting silica gel sheet " discloses list
Face adds viscous heat-conducting silica gel sheet comprising and heat-conducting silica gel sheet ontology, the side of heat-conducting silica gel sheet ontology are provided with the first release film, the
The bottom of one release film is provided with heat-conducting silica gel sheet, and the bottom of heat-conducting silica gel sheet is provided with plus adhesion coating, and the bottom of adhesion coating is added to be arranged
There is the second release film, add the surface of adhesion coating coated with silica gel adhesive, the first release film is detachably connected with heat-conducting silica gel sheet, adds
Adhesion coating is detachably connected with the second release film, and the utility model is by applying one layer of very thin silicon in single side heat-conducting silica gel sheet lower surface
Gluing jelly reinforces its viscous force, but the silica gel adhesive is at high cost, and easily thermally decomposes aging, greatly reduces heat-conducting silica gel sheet
Service life, be unfavorable for long-term use；Its release film used is traditional non-degradable material simultaneously, is unfavorable for environmentally friendly section
Can, it can not realize and recycle.
Utility model content
In view of the above deficiencies, the utility model aim is to provide a kind of smart structural design, rationally, good heat conduction effect,
And the heat conductive silica gel laminated film that thermal stability is high.
To achieve the above object, provided technical solution is the utility model: a kind of heat conductive silica gel laminated film, packet
Include peeling layer, upper heat conductive silica gel lamella, corona layer, platinum plating graphene heat conducting film, lower heat conductive silica gel lamella and lower peeling layer, institute
State peeling layer, upper heat conductive silica gel lamella, corona layer, platinum plating graphene heat conducting film, lower heat conductive silica gel lamella and lower peeling layer by
It is successively bonded according to sequence from top to bottom, the platinum plating graphene heat conducting film includes graphene film and is plated on the graphene film
Plating platinum layer.
As a kind of improvement of the utility model, the upper peeling layer and lower peeling layer with a thickness of 10~120 microns.Institute
It states peeling layer and lower peeling layer is one or both of PLA film, PBAT film or PCL film component.The upper peeling layer is under
Peeling layer is all degradable material, is the green material that country advocates, and degradable and plasticity is recycled, and is conducive to ring
It protects.
As a kind of improvement of the utility model, the upper heat conductive silica gel lamella with a thickness of 20~300 microns.Under described
Heat conductive silica gel lamella with a thickness of 20~300 microns.The upper heat conductive silica gel lamella and lower heat conductive silica gel lamella are thermal conductivity
Silica gel piece has good heat dissipation effect.
As a kind of improvement of the utility model, the platinum plating graphene heat conducting film with a thickness of 30~100 microns.It is described
It is in cellular burr that the thermally conductive film surface of platinum plating graphene, which is equipped with,.Be conducive to promote Percentage bound and improve heat conduction efficiency, hangs down
Histogram to the coefficient of overall heat transmission be 390~550W/MK；The coefficient of overall heat transmission of horizontal direction is 900~1050W/MK, is further quickly dissipated
Heat solves the problems, such as thermal resistance and inefficiency problem in traditional heat-dissipating film product, has efficient heating conduction, stable mechanicalness
It can be with comprehensive heat dissipation performance.
The utility model has the following beneficial effects: the utility model smart structural design, rationally, can by upper and lower peeling layer
It is scratched with protection using preceding non-sticky and foreign object, upper and lower heat conductive silica gel lamella is thermal conductivity silica gel piece, has good heat dissipation
Effect；Corona layer can promote the adhesive force between heat conductive silica gel lamella and platinum plating graphene heat conducting film, avoid heat conductive silica gel
Lamella falls off and generates gap, and the cost of adhesive, replacement need to be used by being especially the reduction of conventional thermal conductive material silica gel composite
Bad heat conductor in traditional heat-dissipating film product, such as bonding agent, good heat conduction effect, and extend service life；Select platinum plating
Graphene heat conducting film has efficient heating conduction, efficiently solves the problems, such as the thermal resistance in traditional heat-dissipating film product and inefficient asks
Topic, good combination property；In addition upper and lower peeling layer is PLA film, PBAT film or PCL film, is degradable material, is that country advocates
Green material, degradable and plasticity is recycled, and is conducive to environmental protection.
Detailed description of the invention
Fig. 1 is the cross section structure schematic diagram of the utility model.
Specific embodiment
Embodiment: referring to Fig. 1, the utility model embodiment provides a kind of heat conductive silica gel laminated film comprising upper removing
Layer 1, upper heat conductive silica gel lamella 2, corona layer 3, platinum plating graphene heat conducting film 4, lower heat conductive silica gel lamella 5 and lower peeling layer 6.It is described
Upper peeling layer 1, upper heat conductive silica gel lamella 2, corona layer 3, platinum plating graphene heat conducting film 4, lower heat conductive silica gel lamella 5 and lower peeling layer
6 are successively bonded according to sequence from top to bottom.
The corona layer 3 with a thickness of 2~5 microns.The corona layer 3 can promote heat conductive silica gel lamella 2 and platinum plating graphite
Adhesive force between alkene heat conducting film 4 avoids heat conductive silica gel lamella 2 from falling off and generate gap, is especially the reduction of tradition and leads
Hot material silica gel composite need to use the cost of adhesive, and bad heat conductor in traditional heat-dissipating film product, such as bonding agent is substituted,
Good heat conduction effect, and extend service life.Particularly, sided corona treatment is carried out on the surface of platinum plating graphene heat conducting film 4,
It is struck by high-frequency electric spark, forms intensive aperture on the surface of platinum plating graphene heat conducting film 4, hole diameter is
0.05~0.08 micron, rough surface is become from smooth flat, forms the corona processing layer.
Specifically, the platinum plating graphene heat conducting film 4 includes graphene film 41 and the plating being plated on the graphene film 41
Platinum layer 42.Graphene film 41 has both high-termal conductivity and super flexible, and after being plated with platinum layer 42 on graphene film 41, formation has
The platinum plating graphene heat conducting film 4 of good ductility, thermal conductivity and electric conductivity.The platinum plating graphene heat conducting film 4 with a thickness of
30~100 microns, preferably 30 microns or 50 microns.Preferably, being equipped on 4 surface of platinum plating graphene heat conducting film is in honeycomb
The burr of shape.Be conducive to promote Percentage bound and improve heat conduction efficiency, the vertical direction coefficient of overall heat transmission is 390~550W/MK；Water
Square to the coefficient of overall heat transmission be 900~1050W/MK, further rapid cooling, the thermal resistance solved in traditional heat-dissipating film product is asked
Topic and inefficiency problem have efficient heating conduction, stable mechanical performance and comprehensive heat dissipation performance.
The upper peeling layer 1 and lower peeling layer 6 with a thickness of 10~120 microns, preferably 25 microns or 50 microns.This reality
Apply in example, the upper peeling layer 1 and lower peeling layer 6 select PLA film, peeling force in 1-5g, surface be it is flat and smooth, non-crystal point and
Sags and crests.In other embodiments, the upper peeling layer 1 and lower peeling layer 6 can also be selected in PLA film, PBAT film or PCL film
One or two kinds of components.The upper peeling layer 1 and all preferred degradable material of lower peeling layer 6, are the green rings that country advocates
Material is protected, degradable and plasticity is recycled, and is conducive to environmental protection.
The thickness of the upper heat conductive silica gel lamella 2 and lower heat conductive silica gel lamella 5 is 20~300 microns, and preferably 40 is micro-
Rice or 50 microns.The upper heat conductive silica gel lamella 2 and lower heat conductive silica gel lamella 5 are thermal conductivity silica gel piece, have good dissipate
Thermal effect is 150~250W/MK in the vertical direction coefficient of overall heat transmission.
Before use, can protect upper heat conductive silica gel lamella 2 and lower heat-conducting silica gel sheet by upper peeling layer 1 and lower peeling layer 6
Layer 5 is scratched using preceding non-sticky and foreign object.Peeling layer 1 and lower peeling layer 6 in removing, due to upper peeling layer 1 and lower peeling layer 6
For degradable material, degradable and plasticity is recycled, and is conducive to environmental protection.
In use, passing through upper heat conductive silica gel lamella 2 or lower heat conductive silica gel lamella 5 and hair by platinum plating graphene heat conducting film 4
Hot body or radiator fit, and attachment is close, have efficient heating conduction, efficiently solve the heat in traditional heat-dissipating film product
Resistance problem and inefficiency problem, good combination property.
According to the disclosure and teachings of the above specification, the utility model those skilled in the art can also be to above-mentioned reality
The mode of applying is changed and is modified.Therefore, the utility model is not limited to specific embodiment disclosed and described above, right
Some modifications and changes of the utility model should also be as falling into the protection scope of the claims of the present utility model.In addition, to the greatest extent
It is used some specific terms in pipe this specification, these terms are merely for convenience of description, not to the utility model
Any restrictions are constituted, using same or similar other membrane bodies, in scope of protection of the utility model.
Claims (8)
1. a kind of heat conductive silica gel laminated film, which is characterized in that it includes upper peeling layer, upper heat conductive silica gel lamella, corona layer, plating
Platinum graphene heat conducting film, lower heat conductive silica gel lamella and lower peeling layer, the upper peeling layer, upper heat conductive silica gel lamella, corona layer, plating
Platinum graphene heat conducting film, lower heat conductive silica gel lamella and lower peeling layer are successively bonded according to sequence from top to bottom, the platinum plating stone
Black alkene heat conducting film includes graphene film and the plating platinum layer being plated on the graphene film.
2. heat conductive silica gel laminated film according to claim 1, which is characterized in that the upper peeling layer is PLA film, PBAT
One of film or PCL film.
3. heat conductive silica gel laminated film according to claim 1 or 2, which is characterized in that the upper peeling layer with a thickness of
10~120 microns.
4. heat conductive silica gel laminated film according to claim 1, which is characterized in that the thickness of the upper heat conductive silica gel lamella
It is 20~300 microns.
5. heat conductive silica gel laminated film according to claim 1, which is characterized in that the thickness of the platinum plating graphene heat conducting film
Degree is 30~100 microns.
6. heat conductive silica gel laminated film according to claim 1 or 5, which is characterized in that the platinum plating graphene heat conducting film
It is in cellular burr that surface, which is equipped with,.
7. heat conductive silica gel laminated film according to claim 1, which is characterized in that the thickness of the lower heat conductive silica gel lamella
It is 20~300 microns.
8. heat conductive silica gel laminated film according to claim 1, which is characterized in that the lower peeling layer with a thickness of 10~
120 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822253497.4U CN209602442U (en) | 2018-12-29 | 2018-12-29 | Heat conductive silica gel laminated film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822253497.4U CN209602442U (en) | 2018-12-29 | 2018-12-29 | Heat conductive silica gel laminated film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209602442U true CN209602442U (en) | 2019-11-08 |
Family
ID=68397804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822253497.4U Active CN209602442U (en) | 2018-12-29 | 2018-12-29 | Heat conductive silica gel laminated film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209602442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865380A (en) * | 2021-09-16 | 2021-12-31 | 青岛海信日立空调***有限公司 | Total heat exchanger core and total heat exchanger |
-
2018
- 2018-12-29 CN CN201822253497.4U patent/CN209602442U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865380A (en) * | 2021-09-16 | 2021-12-31 | 青岛海信日立空调***有限公司 | Total heat exchanger core and total heat exchanger |
| CN113865380B (en) * | 2021-09-16 | 2023-10-31 | 青岛海信日立空调***有限公司 | Total heat exchanger core and total heat exchanger |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP02 | Change in the address of a patent holder |
Address after: Room 101, building 1, No. 1, Nanba street, Heshi Road, Qiaotou town, Dongguan City, Guangdong Province Patentee after: DONGGUAN DINGLI FILM TECHNOLOGY Co.,Ltd. Address before: 523000, Dongguan, Guangdong Province, Qiaotou town, Wo Wo Village, Second Industrial Road, No. 47, first floor Patentee before: DONGGUAN DINGLI FILM TECHNOLOGY Co.,Ltd. |