CN209462835U - A kind of liquid cooling heat radiator structure based on diamond microchannel - Google Patents
A kind of liquid cooling heat radiator structure based on diamond microchannel Download PDFInfo
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- CN209462835U CN209462835U CN201821382409.4U CN201821382409U CN209462835U CN 209462835 U CN209462835 U CN 209462835U CN 201821382409 U CN201821382409 U CN 201821382409U CN 209462835 U CN209462835 U CN 209462835U
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- diamond
- microchannel
- liquid cooling
- cooling heat
- heat radiator
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Abstract
The utility model discloses a kind of liquid cooling heat radiator structures based on diamond microchannel, including the diamond substrate being stacked and diamond epitaxial layer, several diamond microchannels with certain intervals are set in diamond substrate, and diamond epitaxial layer is used in its surface bond object to be radiated.The problem of solving traditional heat-dissipating piece cannot apply in high temperature, and height radiates, the extreme environments such as deep-etching.
Description
[technical field]
The utility model belongs to micro-electromechanical system field, and in particular to a kind of liquid cooling based on diamond microchannel
Heat spreader structures.
[background technique]
With electronic equipment function it is powerful, chip processing capabilities are substantially improved, and chip can generate surprising heat,
Heat can weaken the performance of chip, or even reduce service life, and traditional heat dissipation technology can no longer meet radiating requirements.Therefore
The main challenge of semicon industry first is that how to radiate to chip, circuit board and system, heat sink material and radiating mode
Selection become particularly significant, the problem of research and development of Novel heat dissipation material must and be badly in need of at one.
Relative to the heat-conducting silicone grease reported at present, graphite, the traditional heat-dissipatings material such as metal, diamond has the thermally conductive of superelevation
Rate can export rapidly chip heat.Diamond also has brilliant mechanics, optics, acoustics, electricity and chemical property, makes
It is with the obvious advantage better than other materials on the problem of high power light electrical part radiates, and in high temperature, high radiation and dislikes
The splendid selection to work under bad environment.The high frequencies such as current gallium nitride, GaAs high-power electronic device is all in trial and Buddha's warrior attendant
Stone substrate bonding radiates.If heat transferred out by the method for microchannel conveying coolant with diamond substrate
It goes and radiating efficiency can be greatly improved.
Because of the high hardness of diamond and fabulous chemical stability, it is difficult to realize its height with conventional semiconductor technology
Accurate patterning, production diamond micro-structure, especially three dimensional diamond micro-structure are a technical problem always.
[utility model content]
The purpose of the utility model is to provide a kind of liquid cooling heat radiator structures based on diamond microchannel, to solve to pass
The problem of system cooling fin cannot be applied in high temperature, and height radiates, the extreme environments such as deep-etching.
The utility model uses a kind of following technical scheme: liquid cooling heat radiator structure based on diamond microchannel, packet
The diamond substrate being stacked and diamond epitaxial layer are included, several gold with certain intervals are set in diamond substrate
Hard rock microchannel, in the bonding object to be radiated in diamond epitaxial layer upper surface.
Further, diamond substrate is high temperature and pressure substrate, self-supporting diamond thin film or cvd diamond substrate.
Further, diamond microchannel is the groove being arranged in diamond substrate, and diamond microchannel is opened
It is closed above mouthful by diamond epitaxial layer.
Further, the channel width of diamond microchannel is 1 μm -100 μm, the channel depth of diamond microchannel
It is greater than 1:2 with the ratio of channel width.
Further, the epitaxy layer thickness of diamond epitaxial layer is greater than the half of channel width.
Further, object to be radiated is the semiconductor chip being bonded with diamond epitaxial layer.
Compared with prior art, the utility model at least has the advantages that realizing diamond three-dimensional miniflow leads to
Road liquid-cooling heat radiation structure makes semiconductor chip thermal that can run through diamond substrate bonded thereto and spreads and pass through therein
Coolant conducts, to make chip not because temperature problem influences working performance.
[Detailed description of the invention]
Fig. 1 is a kind of structural schematic diagram of the liquid cooling heat radiator structure based on diamond microchannel of the utility model.
Fig. 2 is that a kind of use state of liquid cooling heat radiator structure based on diamond microchannel of the utility model is illustrated
Figure.
Wherein, 1. diamond substrate, 2. diamond microchannels, 3. diamond epitaxial layers, 4. semiconductor chips, 5. miniflows
Channel depth, 6. microchannel width, 7. diamond epitaxy layer thickness.
[specific embodiment]
Below by drawings and examples, the technical solution of the utility model is described in further detail.
The utility model provides a kind of liquid cooling heat radiator structure based on diamond microchannel, such as Fig. 1 and Fig. 2 institute
Show, including the diamond substrate 1 being stacked and diamond epitaxial layer 3, between several of the interior setting of diamond substrate 1 has centainly
Every diamond microchannel 2, diamond epitaxial layer 3 be used in its surface bond object to be radiated.Object to be radiated be and gold
The semiconductor chip 4 or integrated circuit that hard rock epitaxial layer 3 is bonded.The radiator of the utility model uses full diamond, can
So that diamond microchannel 2 does not need to carry out it by other materials such as adhesives bonding of binding, and diamond has
There is the thermal conductivity of superelevation, can ensure good radiating efficiency.
Wherein, diamond substrate 1 can be high temperature and pressure substrate, self-supporting diamond thin film or cvd diamond lining
Bottom.The shape of diamond substrate 1 can be rectangle, circle, ellipse or other shapes.
Diamond microchannel 2 is the groove being arranged in diamond substrate 1, the upper surface of groove opening by diamond outside
Prolong the closing of layer 3.Deep trench is obtained by selectivity dry etching first, then passes through MPCVD technology transversal epitaxial growth diamond
Epitaxial layer 3 binds to channel, to form complete diamond microchannel 2.The manufacturing process can guarantee to make diamond
When microchannel 2, other sacrificial layer materials are not introduced, it is ensured that the thermal conductivity of radiator.
The channel width 6 of diamond microchannel 2 is 1 μm -100 μm, the channel depth 5 of diamond microchannel 2 and logical
The ratio of road width 6 is greater than 1:2.If 2 width of diamond microchannel is too small, cooled liquid stream amount will affect to influence to dissipate
The thermal efficiency；If 2 width of diamond microchannel is excessive, epitaxial layer 3 may give birth to since the bottom of diamond microchannel 2
It is long, so that microchannel structure cannot be formed；If the depth-to-width ratio of diamond microchannel 2 is less than 1:2, epitaxial layer 3 may
It can be grown since 2 bottom of diamond microchannel, so that microchannel structure cannot be formed.
The epitaxy layer thickness 7 of diamond epitaxial layer 3 is greater than the half of channel width 6.If the degree of extension thickness 3 is less than gold
The half of 2 width of hard rock microchannel, then diamond microchannel 2 can not be closed to bind to be formed completely by horizontal extension
Diamond microchannel 2.
A kind of production method of the liquid cooling heat radiator structure based on diamond microchannel of the utility model includes following step
It is rapid:
Step 1 etches several strip grooves with certain intervals in diamond substrate 1, and strip groove is gold
Hard rock microchannel 2.Lithographic method can be inductively coupled plasma etching, reactive ion etching or focused-ion-beam lithography
Deng.
Step 2, one layer of diamond layer 3 of extension on the surface that groove is arranged in diamond substrate 1.Epitaxy method is MPCVD
Extension.MPCVD, that is, vapor phase epitaxial growth.
As shown in Fig. 2, by a kind of liquid cooling heat radiator structure fabrication based on diamond microchannel it is good after, by semiconductor
Chip bonding is on epitaxial layer 3, so that it may radiate to semiconductor chip.
Embodiment
Such as Fig. 1, diamond microchannel liquid cooling heat radiator, diamond substrate 1 is the intrinsic diamond of high temperature and pressure synthesis.
Diamond microchannel 2 is first with Magnetron Sputtering Thin Film depositing technics, standard photolithography process and dry etch process, in Buddha's warrior attendant
It is prepared on stone lining bottom 1 with a thickness of 6 μm, 30 μm of width, 30 μm of spacing of Al strip array.Again by ICP etching technics, by Al item
Array is transferred to 1 surface of diamond substrate, etching condition are as follows: etching gas is oxygen and argon gas, and gas flow is respectively
50sccm and 20sccm etches power 800W, and chamber presses 10mTorr, and etching depth is 20 μm, and washes off Al item with sulfuric acid and nitric acid
Array forms diamond deep trouth on 1 surface of diamond substrate.Finally by 100 μm of Buddha's warrior attendant of MPCVD technology transversal epitaxial growth
Stone epitaxial layer 3 binds to channel, forms complete diamond microchannel, growth conditions are as follows: reaction gas is methane, hydrogen
Gas, gas flow are respectively 300sccm and 30sccm, grow air pressure 120Torr, underlayer temperature is 900 DEG C.After growth,
By diamond microfluidic channel system, it is bonded with semiconductor chip.
If it is intended to applying diamond microchannel in liquid cooling heat radiator, the difficult point for first having to overcome is how to make
Make diamond microchannel.Therefore, in order to obtain better heat dissipation performance, the utility model uses etching method and cross growth
Method has made the liquid cooling heat radiator based on diamond microchannel, and heat radiation substrate of the radiator as chip is greatly improved
Radiating efficiency, while being also in high temperature, height radiation, the ideal radiating element of the extreme environments such as deep-etching work.So as to improve
Because heat dissipation problem causes the hot of semiconductor chip, the problem of explosion.
The utility model realizes diamond three-dimensional microfluidic channel liquid-cooling heat radiation knot by etching method and cross growth method
Structure, heat radiation substrate of the system as chip make chip heat that can run through diamond substrate and spread and pass through therein cold
But agent conducts, and is greatly improved radiating efficiency, while being also in high temperature, height radiation, the work of the extreme environments such as deep-etching
Ideal dissipate device.
The above content is only to illustrate the technical idea of the utility model, and the protection model of the utility model cannot be limited with this
Enclose, it is all according to the utility model proposes technical idea, any changes made on the basis of the technical scheme each falls within this reality
Within protection scope with novel claims.
Claims (6)
1. a kind of liquid cooling heat radiator structure based on diamond microchannel, which is characterized in that including the diamond being stacked
Substrate (1) and diamond epitaxial layer (3), interior several of the setting of the diamond substrate (1) have the diamond of certain intervals micro-
Circulation road (2), the diamond epitaxial layer (3) are used to place object to be radiated on its surface.
2. a kind of liquid cooling heat radiator structure based on diamond microchannel as described in claim 1, which is characterized in that described
Diamond substrate (1) is high temperature and pressure substrate, self-supporting diamond thin film or cvd diamond substrate.
3. a kind of liquid cooling heat radiator structure based on diamond microchannel as claimed in claim 1 or 2, which is characterized in that
The diamond microchannel (2) is that groove in diamond substrate (1) is arranged, the diamond microchannel (2) it is upper
It is closed by diamond epitaxial layer (3) in opening face.
4. a kind of liquid cooling heat radiator structure based on diamond microchannel as claimed in claim 3, which is characterized in that described
The channel width (6) of diamond microchannel (2) is 1 μm -100 μm, the channel depth (5) of the diamond microchannel (2)
It is greater than 1:2 with the ratio of channel width (6).
5. a kind of liquid cooling heat radiator structure based on diamond microchannel as claimed in claim 4, which is characterized in that described
The epitaxy layer thickness (7) of diamond epitaxial layer (3) is greater than the half of the channel width (6).
6. a kind of liquid cooling heat radiator structure based on diamond microchannel as described in claim 4 or 5, which is characterized in that
The object to be radiated is the semiconductor chip (4) or integrated circuit being bonded with diamond epitaxial layer (3).
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| CN201821382409.4U CN209462835U (en) | 2018-08-23 | 2018-08-23 | A kind of liquid cooling heat radiator structure based on diamond microchannel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109068538A (en) * | 2018-08-23 | 2018-12-21 | 西安交通大学 | A kind of liquid cooling heat radiator structure and preparation method thereof based on diamond microchannel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068538A (en) * | 2018-08-23 | 2018-12-21 | 西安交通大学 | A kind of liquid cooling heat radiator structure and preparation method thereof based on diamond microchannel |
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