CN209420180U - Wireless mobile communications mould group and its far end radio frequency component - Google Patents
Wireless mobile communications mould group and its far end radio frequency component Download PDFInfo
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- CN209420180U CN209420180U CN201821451331.7U CN201821451331U CN209420180U CN 209420180 U CN209420180 U CN 209420180U CN 201821451331 U CN201821451331 U CN 201821451331U CN 209420180 U CN209420180 U CN 209420180U
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Abstract
This application discloses a kind of wireless mobile communications mould group and its far end radio frequency component, transceiver, duplexer, power amplifier module, power module including shell and assembly in the housing；Printed circuit board is provided in transceiver, duplexer, power amplifier module and power module, each printed circuit board includes: core plate component, radiator and the second articulamentum, core plate component include the multi-layer coreboard being cascading and between the adjacent core plate first interval in the first articulamentum for connecting core plate, offer accommodation groove on core plate component；Radiator is at least partly accommodated in accommodation groove, and is placed in the second interval for being formed with that size is 0.05mm-0.2mm between the outer wall of the radiator of accommodation groove and the inner wall of accommodation groove, and the setting of the second articulamentum is in the second interval.It is connect by the proper adhesive layer of thickness with core plate component by the surface being located at radiator in core plate component, thus the stabilization that is connected firmly.
Description
Technical field
This application involves wireless communication technology fields, more particularly to a kind of wireless mobile communications mould group and its far end radio frequency
Component.
Background technique
Currently, in order to reduce the volume and installation space of each element in communication system, usually by antenna, tower amplifier,
The elements such as power amplifier are integrated in a remote radio unit (RRU) (Radio Remote Unit, RRU), to reduce volume.Respectively
Element can generate a large amount of heat at work, which will affect the service life of element, thus bury in the printed circuit boards
If radiator is to radiate to the electronic component on printed circuit board.Currently, the inbuilt radiator in radiator
It usually will appear the unstable phenomenon of bonding, radiator be easy to cause to fall off.
Utility model content
The application provides a kind of wireless mobile communications mould group and its far end radio frequency component, to solve heat dissipation dress in the prior art
Set the unstable technical problem of bonding.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of far end radio frequency component, wrap
Transceiver, duplexer, power amplifier module, the power module for including shell and being assemblied in the shell；The transceiver and described double
The connection of work device, the duplexer connect with the power amplifier module, the power module respectively with the transceiver, duplexer and institute
State power amplifier module electrical connection；Wherein, it is provided in the transceiver, duplexer, power amplifier module and the power module
Printed circuit board, each printed circuit board include: core plate component, including the multi-layer coreboard being cascading and are located at
The articulamentum in the first interval between the adjacent core plate, the articulamentum are used to connect the multi-layer coreboard to be formed
Core plate component is stated, and offers accommodation groove on the core plate component；Radiator is at least partly accommodated in the accommodation groove
In, and be placed between the outer wall of the radiator of the accommodation groove and the inner wall of the accommodation groove and be formed between second
Every the size at second interval is 0.05mm-0.2mm；Adhesive layer, setting is in second interval, for dissipating described
Thermal is fixed in the accommodation groove.
In order to solve the above technical problems, another technical solution that the application uses is: providing a kind of wireless mobile communications
Mould group, including far end radio frequency component as previously described.
Above-described embodiment has the beneficial effect that by being arranged second between the outer wall of radiator and the inner wall of accommodation groove
Interval, and the size at the second interval is 0.05mm-0.2mm, and adhesive layer is arranged in the second interval, in this way, radiator position
It is connect by the proper adhesive layer of thickness with core plate component in the surface in core plate component, thus the stabilization that is connected firmly.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the schematic diagram of internal structure of far end radio frequency component provided by the present application；
Fig. 2 is the attachment structure schematic diagram of each component part in Fig. 1；
Fig. 3 is the schematic cross-sectional view of one embodiment of printed circuit board；
Fig. 4 is the core plate component of printed circuit board shown in Fig. 3 and the structural schematic diagram that radiator is cooperatively connected；
Fig. 5 is the schematic cross-sectional view of another embodiment of printed circuit board；
Fig. 6 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Fig. 7 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Fig. 8 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Fig. 9 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Figure 10 is the core plate component of printed circuit board shown in Fig. 9 and the structural schematic diagram that radiator is cooperatively connected；
Figure 11 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Figure 12 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Figure 13 is the schematic cross-sectional view of the another embodiment of printed circuit board；
Figure 14 is the structural schematic diagram of one embodiment of radio communication mold group provided by the present application.
Specific embodiment
Below by the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described implementation
Example is merely a part but not all of the embodiments of the present application.Based on the embodiment in the application, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to the model of the application protection
It encloses.
Referring to Fig. 1, in the present embodiment, the far end radio frequency component include shell 100, transceiver 200, duplexer 300,
Power amplifier module 400 and power module 500.Wherein, transceiver 200, duplexer 300, power amplifier module 400 and power module
500 are mounted on shell 100.
Specifically, shell 100 includes first shell 110 and second shell 120, and duplexer 300 and power amplifier module 400 are arranged
On the inner wall of first shell 110, radiated by first shell 110；Transceiver 200 and power module 500 are arranged in second shell
On the inner wall of body 120, radiated by second shell 120.
Referring to Fig. 2, transceiver is connect with duplexer, duplexer is connect with power amplifier module, power module respectively with transmitting-receiving
Device, duplexer and power amplifier module connection, for providing power supply for transceiver, duplexer and power amplifier module.
Wherein, in transceiver, duplexer, power amplifier module and power module include electronic component and for installing
The printed circuit board of electronic component, electronic component are connected to each other, to form functional circuitry.
Further, as shown in figure 3, printed circuit board generally can include: core plate component 10, radiator 20 and viscous
Connect layer 30.Wherein, accommodation groove is offered on core plate component 10, radiator 20 is embedded in accommodation groove, and passes through adhesive layer 30
It is connect with core plate component 10.
Wherein, core plate component 10 may include multi-layer coreboard and articulamentum 14.Multi-layer coreboard is cascading, and adjacent
The first interval is reserved between core plate, the setting of articulamentum 14 is in the first interval, for adjacent core plate to be attached.
Specifically, as shown in figure 4, multi-layer coreboard may include the first core plate 122 and the second core plate 124.First core plate 122
Can be with the quantity of the second core plate 124 it is multiple, such as one, two, three etc..And first the quantity of core plate 122 can be with
The quantity of second core plate 124 is equal or unequal.The embodiment of the present application is not to the quantity of the first core plate 122 and the second core plate 124
It is defined.
In the embodiment shown in fig. 3, core plate component 10 include two the first core plates, 122, second core plates 124 and
Two articulamentums 14 between the first core plate 122 and the second core plate 124.First core plate 122, articulamentum 14, the first core plate
122, articulamentum 14 and the second core plate 124 stack gradually in sequence, to form the core plate component 10 of sandwich-like stepped construction.
Articulamentum 14 can be made of cohesive material, and be specifically as follows thermosetting material.Thermosetting material refers to: first
The material can soften flowing when secondary heating, be heated to certain temperature, generate chemical reaction, and interlinkage is made to solidify and be hardened；It is this
Variation be it is irreversible, hereafter, when heating again, which cannot soften flowing again.In the present embodiment, using semi-solid preparation
Piece makes articulamentum 14, and articulamentum 14 solidifies after being melted by prepreg forms.
In other embodiments, which can also be made of thermoplastic material.Wherein, thermoplastic material refers to:
Thermoplastic refers to the plastics with heating and softening, hardening by cooling characteristic.Soften when heating so that flowing, cooling is hardened, this
Process is reversible, and can be repeated.Common thermoplastic material include but is not limited to polyethylene, polypropylene, polyvinyl chloride,
Polystyrene, polyformaldehyde, poly- carbonic acid junket, polyamide, acrylics, other polyolefin and its copolymer, polysulfones, polyphenyl
Ether, chlorinated polyether etc..Molecular resin chain is all line style or branched structure in thermoplastic, without chemical bond between strand
It generates, softening flowing when heating, the cooling process being hardened is physical change.
In an example, the thermoplastic material may include: polyketone, Nomex, polyimides, polyetherimide,
Polyamidoimide, polyphenylene sulfide, polyphenylsulfone, fluoropolymer, polybenzimidazoles, their derivative or their combination.
Further, as shown in figure 3, the accommodation groove runs through each core plate and each articulamentum 14.
Specifically, as shown in Figure 3 and Figure 4, the first through slot through the first core plate 122 is offered on the first core plate 122
123, the second through slot 125 through the second core plate 124 is offered on the second core plate 124.First through slot 123 and the second through slot
125, which communicate with each other, to form a step-like accommodation groove.
The first through slot 123 when the first core plate 122 and the second core plate 124 are respectively multiple, on multiple first core plates 122
It is mutually aligned, the second through slot 125 on multiple second core plates 124 is mutually aligned, and 125 phase of the first through slot 123 and the second through slot
Mutually alignment.
Wherein, the cross sectional shape of the first through slot 123 and the second through slot 125 can be rectangle, square and round isotactic
Then shape, or irregular shape.The embodiment of the present application is not specifically limited.
In one embodiment, the cross-sectional area of the first through slot 123 can be greater than the second through slot 125 cross-sectional area, with
It is convex accommodation groove or L-type accommodation groove that vertical section is formed on core plate component 10.Optionally, the accommodation groove situation of convex is formed
Under, the center line of the first through slot 123 is overlapped with the center line of the second through slot 125.Wherein, cross section refers to along perpendicular to the first core
The section of the stacking direction of plate 122 and the second core plate 124 interception, and vertical section is then along the first core plate 122 and the second core plate 124
Stacking direction interception section.
Certainly, in other embodiments, the cross-sectional area of the first through slot 123 is also less than or is equal to the second through slot
125 cross-sectional area, to form vertical section on core plate component 10 as T-type accommodation groove or I type accommodation groove.
Further, as shown in figure 4, radiator 20 includes the first radiating part 22 to match with the first through slot 123, and
The second radiating part 24 to match with the second through slot 125.Wherein, the first radiating part 22 is placed in the first through slot 123, and second dissipates
Hot portion 24 is placed in the second through slot 125.
Wherein, the first radiating part 22 and the second radiating part 24 can be the integral structure made of same material, using this
20 structure of radiator of kind method production is simple, and cost is relatively low.
It is, of course, also possible to process the first radiating part 22 and the second radiating part respectively using the material of different heat conduction efficiencies
24, then the first radiating part 22 is connect with the second radiating part 24 such as by mode welding, conductive adhesive again.For example,
It can directly be contacted using higher second radiating part 24 of heat conduction efficiency with heater element, so as to be rapidly fever member
Part heat dissipation, so as to improve radiating efficiency.
Radiator 20 can be at least partly accommodated in accommodation groove.That is, radiator 20 can partially be accommodated in accommodating
In slot, it can also be accommodated in accommodation groove completely.
For example, length of the first radiating part 22 of radiator 20 along 124 stacking direction of the first core plate 122 and the second core plate
Greater than the depth of the first through slot 123.At this point, in side of first core plate 122 far from the second core plate 124, the first radiating part 22 is convex
For the outer surface of the first core plate 122.
Such as second radiating part 24 along 124 stacking direction of the first core plate 122 and the second core plate length be greater than second
The depth of through slot 125.At this point, in side of second core plate 124 far from the first core plate 122, the second radiating part 24 protrudes from second
The outer surface of core plate 124.
In the present embodiment, along the first core plate 122 and the second core plate 124 stacking direction along, the first radiating part 22
Length is equal to the depth of the first through slot 123, and the length of the second radiating part 24 is equal to the depth of the second through slot 125, to radiate
Device 20 can be just completely filled in accommodation groove, to reduce the volume of printed circuit board 100.
As shown in figure 3, perpendicular on the stacking direction of the first core plate 122 and the second core plate 124, the first radiating part 22
Cross-sectional area is greater than the cross-sectional area of the second radiating part 24, to form and accommodate the convex radiator 20 that groove shape matches.
Further, the heat dissipation being arranged on the printed circuit board in transceiver, duplexer, power amplifier module or power module
The multiple that the quantity of device 20 is 8.
In the embodiment shown in fig. 3, it is formed between the first radiating part 22 and the second radiating part 24 of radiator 20
Step surface is directly connected to the second core plate 124.The lateral wall of first radiating part 22 of radiator 20 and the inner sidewall of accommodation groove
Between have second interval, adhesive layer 30 setting second interval in, radiator 20 is connect with core plate component 10.
Since the surface of radiator 20 has roughness, when the width at the second interval is greater than 0.05mm, can just incite somebody to action
Radiator 20 is smoothly put into accommodation groove.Meanwhile if the second interval is excessive, more adhesive layer 30 is needed to be filled in second
In interval, cause to waste.Thus in order to solve problem above, in the embodiment of the present application, the size at the second interval of setting is
0.05mm-0.2mm.For example, second interval size can for 0.05mm, 0.08mm, 0.1mm, 0.13mm, 0.15mm,
0.18mm or 0.2mm.On the one hand radiator 20 is allowed easier to be placed into accommodation groove；On the other hand, guaranteeing to glue
While connecing intensity, adhesives used is less, and cost is relatively low.
Wherein, the material of adhesive layer 30 and the material of articulamentum 14 can be the same or different.In the present embodiment, it glues
The material for connecing layer 30 is identical as the material of articulamentum 14, and adhesive layer 30 and articulamentum 14 are integrally formed.
Specifically, at least one first interval is connected to the space at the second interval, and adhesive layer 30 and articulamentum 14 are to use
It solidifies and is formed after prepreg melting.The adhesive layer 30 in articulamentum 14 and the second interval in the first interconnected interval
It is integrally formed.
In the present embodiment, as shown in figure 3, first between the first core plate 122 and the second core plate 124 is spaced between second
Every interconnected.Prepreg is set in the first interval, when carrying out hot pressing, prepreg is melted into molten condition, flows into
In second interval.When hot pressing terminates, core plate component 10 after the cooling period, just forms one in the first interval and the second interval of connection
The adhesive layer 30 and articulamentum 14 namely adhesive layer 30 of body structure be flowed by the articulamentum 14 that melts second be spaced and solidify and
It is formed, the setting of the width at the second interval can allow the articulamentum 14 of melting smoothly to flow into the second interval in above-described embodiment at this time
And it fills up.By the way that adhesive layer 30 and articulamentum 14 to be integrally formed, it can simplify production procedure, improve production efficiency.
Wherein, in order to guarantee to fill up the second interval after the prepreg in the first interval melts, usually setting the
One interval is greater than the second interval, and the size at the second interval is usually arranged as 0.08mm-0.15mm.
Referring to Fig. 5, Fig. 5 is the schematic cross-sectional view of another embodiment of printed circuit board.The present embodiment and upper one
The difference of embodiment is that the first radiating part 22 is provided with Nian Jie between the end face and the second core plate 124 of the second core plate 124
Layer 30, is also equipped with adhesive layer 30 between the lateral wall of the second radiating part 24 and the inner sidewall of the second through slot 125.It is arranged first
Adhesive layer 30 between radiating part 22 and the second core plate 124 and between the second radiating part 24 and the second through slot 125 further increases
The big bond area of radiator 20 and core plate component 10, so that being bonded stronger.
Referring to Fig. 6, Fig. 6 is the schematic cross-sectional view of the another embodiment of printed circuit board.In a upper embodiment,
Be filled in adhesive layer 30 between the first radiating part 22 and the second core plate 124 be located at the first core plate 122 and the second core plate 124 it
Between 14 material of articulamentum it is identical, and adhesive layer 30 and articulamentum 14 are integrally formed.In the area of the present embodiment and a upper embodiment
It is not, being filled between the first radiating part 22 and the second core plate 124 is conductive adhesion layer 32.
Wherein, conductive adhesion layer 32 is the adhesive layer with conductive and adhesive effect.The material of conductive adhesion layer 32 can be with
It is the mixture for including conductive material and cohesive material.Wherein, conductive material can be metal or graphite；Cohesive material can be
Epoxy resin.
In one embodiment, conductive adhesion layer 32 can be conductive bonding material.So-called conductive bonding material can be with
It can also be semi-solid preparation form for the form of paste or pulpous state with certain fluidity.Wherein, semifixedization form is under room temperature
For solid-state, but there is certain mobility after being heated to certain temperature, then forms final solidification at a certain temperature.
Conductive bonding material is bonded in 22 neighbour of the first radiating part by the mode that printing or coating can be first passed through in production
On the second core plate 124 contacted on the step surface of nearly second core plate 124 or with the first radiating part 22, it is then put into radiator
20, and when the first core plate 122 and the pressing of the second core plate 124 are formed the sandwich structure of stacking, by radiator 20 and the
One core plate 122 and the bonding of the second core plate 124.
Wherein, which is for example led by what resin matrix, conducting particles and dispersing additive, auxiliary agent etc. formed
Electric glue.Wherein, resin matrix can be epoxy resin, organic siliconresin, polyimide resin, phenolic resin, polyurethane, propylene
The adhesive systems such as acid resin.These adhesives form the molecular structure of conducting resinl after hardening, provide mechanical property
Energy and adhesive property guarantee, and conductive filler particles is made to form channel.And conducting particles can be gold, silver, copper, aluminium, zinc, iron,
The powder and graphite and some conductive compounds of nickel, for realizing electric conductivity.
In addition, the conductive bonding material can also be conductive silver paste, conductive copper paste or electrically conductive paste etc..It is with conductive silver paste
Conductive silver paste can be coated on radiator 20 on the surface of the second core plate 124, and in the conductive silver when in use by example
Starch it is uncured before the region for coating conductive silver paste is mutually bonded, by solidification process later can by the conductive silver paste solidify shape
At conductive adhesion layer 32, thus radiator 20 and the second core plate 124 can be bonded.
Further, perpendicular on the stacking direction of the first core plate 122 and the second core plate 124, conductive adhesion layer 32
Cross-sectional area is less than the cross-sectional area of the first radiating part 22, and to prevent when carrying out hot pressing, conductive bonding material is heated after thawing
It flows into the second interval, causes the line pattern in core plate component 10 to be electrically connected with radiator 20, to cause short circuit.
It please continue to refer to Fig. 7, is formed fluted, and led on the end face that the first radiating part 22 is contacted with the second core plate 124
Electric adhesive layer 32 may be disposed in the groove.Therefore, when being pressed to the first core plate 122 and the second core plate 124, due to recessed
The limitation of slot may make conductive adhesion layer 32 to be filled in groove after thawing, avoids conductive adhesion layer 32 from overflowing and flows into the
Between the side wall of one radiating part 22 and the side wall of the first through slot 123, so as to avoid the route on the first core plate 122 directly with
Radiator 20 connection and it is short-circuit.
In the present embodiment, groove can be arranged around the second radiating part 24, so that conductive adhesion layer 32 can uniformly divide
Cloth promotes connective stability between radiator 20 and core plate component 10.
Further, on the direction that the first core plate 122 and the second core plate 124 are laminated, groove is by the second radiating part 24
The surface contacted with the second core plate 124 is recessed to be formed along the direction far from second core plate 124.
As shown in fig. 7, in the present embodiment, on the direction vertical with the first core plate 122, the cross section of groove is square
Shape.The length of the opening of groove is less than the lateral wall of the first radiating part 22 and the distance between the lateral wall of the second radiating part 24.
Specifically, on the stacking direction of the first core plate 122 and the second core plate 124, groove can be from the second radiating part 24
Lateral wall at start to extend, and extend at the lateral wall pre-determined distance of the first radiating part of distance 22, so that conductive viscous
The contact area for tying layer 32 and radiator 20 and the second core plate 124 is maximum, promotes connective stability.
The pre-determined distance is determined by the intensity of machining accuracy and recess sidewall, can according to need flexible selection,
The application is not specifically limited.
Certainly, on the stacking direction of the first core plate 122 and the second core plate 124, groove can also be from the second radiating part 24
Lateral wall at start to extend.For example, groove by with a distance from 24 side wall of the second radiating part be equal to 22 side wall of the first radiating part with
Start to extend at the one third of distance between second radiating part, 24 side wall, and extends to a distance from 24 side wall of the second radiating part
At 2/3rds of distance between 24 side wall of 22 side wall of the first radiating part and the second radiating part.It can according to need, flexibly
The setting position of groove is chosen, application is not construed as limiting herein.
Certainly, the length of the opening of groove can also be equal between 24 side wall of 22 side wall of the first radiating part and the second radiating part
Distance.
For example, in the embodiment shown in fig. 8, the length of the opening of groove is equal to 22 side wall of the first radiating part and second and dissipates
The distance between hot 24 side wall of portion.At the position close to 22 side wall of the first radiating part, the side wall of groove and the first radiating part 22
Side wall between there is an angle, and the angle is less than 90 degree.That is, in the stacking direction of the first core plate 122 and the second core plate 124
On, the cross section of groove can be arc-shaped, inverted trapezoidal or triangle etc..In the present embodiment, the shape of groove is triangle.
The length that the opening of groove is arranged is equal to the distance between 24 side wall of 22 side wall of the first radiating part and the second radiating part,
The contact area that conductive adhesion layer 32 and the second core plate 124 can be further increased, to further promote connective stability.
In the above-described embodiments, radiator 20 runs through printed circuit board, and electronic component is set up directly on radiator 20
On, to radiate.
As shown in figure 9, in the present embodiment, only through part core plate, radiator 20 are accommodated in part core plate to accommodation groove
In.
Specifically, in conjunction with Fig. 9 and Figure 10, core plate component 10 may include the first core plate 122 and second being cascading
Core plate 124.Wherein, the structure and quantity of the first core plate 122 and the second core plate 124 are as it was noted above, details are not described herein again.Accommodating
Slot runs through the first core plate 122 in the stacking direction, and by the second core plate 124.
Further, as shown in figure 9, being offered on the second core plate 124 along the first core plate 122 and the second core plate 124
Stacking direction runs through the second core plate 124 and extends to the mounting groove 40 of radiator 20, and the mounting groove 40 is for installing fever member
Part.
Wherein, the side wall of mounting groove 40 is located in radiator 20 in the projection on radiator 20.I.e. perpendicular to
On the stacking direction of one core plate 12 and the second core plate 14, the cross-sectional area of mounting groove 40 is less than the cross-sectional area of radiator 20.
In the embodiment shown in fig. 9, radiator 20 is directly to contact with the second core plate 124, in radiator 20
There is the second interval, the setting of adhesive layer 30 is in the second interval, by radiator between lateral wall and the inner sidewall of accommodation groove
20 connect with core plate component 10.
Wherein, second interval size and adhesive layer 30 with it is previously described identical, please refer to above-described embodiment, herein
It repeats no more.
The difference of embodiment shown in Figure 11 and embodiment shown in Fig. 9 is, radiator 20 and the second core plate 124 it
Between be folded with adhesive layer 30.The adhesive layer 30 being arranged between radiator 20 and the second core plate 124 further increases heat dissipation
The bond area of device 20 and core plate component 10, so that bonding is stronger.
The difference of embodiment shown in Figure 12 and embodiment shown in Figure 11 is, radiator 20 and the second core plate 124
Between be folded with conductive adhesion layer 32.Wherein, the material of conductive adhesion layer 32 and cross-sectional area please refer to described previously, herein
It repeats no more.The sandwiched conductive adhesion layer 32 between radiator 20 and the second core plate 124, can promote connecing for printed circuit board
Ground performance.
The difference of embodiment shown in Figure 13 and embodiment shown in Figure 12 is, radiator 20 and the second core plate 124
It directly contacts, and opens up on contact surface of the radiator 20 with the second core plate 124 fluted, the setting of conductive adhesion layer 32 is recessed
In slot, further to limit the spilling of conductive adhesion layer 32 and flow between the side wall of radiator 20 and the side wall of accommodation groove, from
And can to avoid the route on the first core plate 122 is directly connect with radiator 20 and it is short-circuit.
Wherein, the shape of groove is referred to the groove in above-described embodiment, and details are not described herein again.
Present invention also provides a kind of wireless mobile communications mould groups, please refer to Figure 14, wireless mobile communications mould group includes base
Tape handling unit, far end radio frequency component, interface connector and external interface module.Wherein, baseband processing unit passes through bus
Far end radio frequency component is controlled, baseband processing unit passes through external interface module connecting interface connector.
Wherein, the structure of far end radio frequency component is as it was noted above, please refer to above-described embodiment, and details are not described herein again.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content is applied directly or indirectly in other relevant
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of far end radio frequency component, which is characterized in that including shell and be assemblied in the shell transceiver, duplexer,
Power amplifier module, power module；The transceiver is connect with the duplexer, and the duplexer is connect with the power amplifier module, institute
Power module is stated to be electrically connected with the transceiver, duplexer and the power amplifier module respectively；
Wherein, it is provided with printed circuit board in the transceiver, duplexer, power amplifier module and the power module, often
One printed circuit board includes:
Core plate component, the company in the first interval including the multi-layer coreboard being cascading and between the adjacent core plate
Layer is connect, the articulamentum is used to connect the multi-layer coreboard to form the core plate component, and opens on the core plate component
Equipped with accommodation groove；
Radiator is at least partly accommodated in the accommodation groove, and be placed in the accommodation groove the radiator it is outer
The second interval is formed between wall and the inner wall of the accommodation groove, the size at second interval is 0.05mm-0.2mm；
Adhesive layer, setting is in second interval, for the radiator to be fixed in the accommodation groove.
2. far end radio frequency component according to claim 1, which is characterized in that the core plate includes the first core plate and the second core
Plate offers the first through slot through first core plate on first core plate, offers on second core plate through institute
The second through slot of the second core plate is stated, first through slot is connected to second through slot to form the accommodation groove.
3. far end radio frequency component according to claim 2, which is characterized in that the printed circuit board further includes conductive bond
Layer；
The radiator includes the first radiating part and the second radiating part, and first radiating part is accommodated in first through slot
Interior, second radiating part is placed in second through slot；
The conductive adhesion layer is located between second core plate and first radiating part, and perpendicular to first core
On the stacking direction of plate and second core plate, the cross-sectional area of the conductive adhesion layer is less than the transversal of first radiating part
Area.
4. far end radio frequency component according to claim 3, which is characterized in that second radiating part and second core plate
Formed fluted on the end face of contact, the conductive adhesion layer is arranged in the groove.
5. far end radio frequency component according to claim 1, which is characterized in that the core plate includes the first core plate and the second core
Plate, the accommodation groove runs through first core plate, and ends in second core plate.
6. far end radio frequency component according to claim 5, which is characterized in that the printed circuit board further includes conductive bond
Layer, the conductive adhesion layer are arranged between the radiator and second core plate, and the conductive adhesion layer with it is described
The area of radiator contact is less than the area on the surface that the radiator is contacted with the conductive adhesion layer.
7. far end radio frequency component according to claim 5, which is characterized in that be also provided with and run through on the printed circuit board
Second core plate and the mounting groove in the radiator is extended to, in the stacking of first core plate and second core plate
On direction, the side wall of the mounting groove is located in the radiator in the projection on the radiator.
8. far end radio frequency component according to any one of claims 1 to 7, which is characterized in that the articulamentum and described viscous
Layer is connect by solidify and being formed after prepreg melting, first interval is greater than described second and is spaced, described second be spaced it is big
Small is 0.08mm-0.15mm.
9. far end radio frequency component according to claim 1, which is characterized in that the transceiver, duplexer, power amplifier module or
The multiple that the quantity of the radiator in the power module is 8.
10. a kind of wireless mobile communications mould group, which is characterized in that the wireless mobile communications mould group includes that claim 1-9 appoints
Far end radio frequency component described in one.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451331.7U CN209420180U (en) | 2018-09-05 | 2018-09-05 | Wireless mobile communications mould group and its far end radio frequency component |
| TW108103936A TWI713419B (en) | 2018-02-09 | 2019-01-31 | Printed circuit board and method of manufacturing the same and electronic apparatus |
| TW108201644U TWM583663U (en) | 2018-02-09 | 2019-01-31 | Printed circuit board and electronic apparatus |
| US16/264,713 US10652992B2 (en) | 2018-02-09 | 2019-02-01 | Printed circuit board, method for manufacturing the same and electronic device |
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| CN201821451331.7U CN209420180U (en) | 2018-09-05 | 2018-09-05 | Wireless mobile communications mould group and its far end radio frequency component |
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| CN209420180U true CN209420180U (en) | 2019-09-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115996535A (en) * | 2023-03-23 | 2023-04-21 | 成都雷电微力科技股份有限公司 | Ka frequency band power amplifier architecture |
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2018
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115996535A (en) * | 2023-03-23 | 2023-04-21 | 成都雷电微力科技股份有限公司 | Ka frequency band power amplifier architecture |
| CN115996535B (en) * | 2023-03-23 | 2023-08-08 | 成都雷电微力科技股份有限公司 | Ka frequency band power amplifier architecture |
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