CN209399934U - Base board checking device - Google Patents

Base board checking device Download PDF

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Publication number
CN209399934U
CN209399934U CN201821975696.XU CN201821975696U CN209399934U CN 209399934 U CN209399934 U CN 209399934U CN 201821975696 U CN201821975696 U CN 201821975696U CN 209399934 U CN209399934 U CN 209399934U
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China
Prior art keywords
coating film
light
region
interference
laser
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Active
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CN201821975696.XU
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Chinese (zh)
Inventor
洪映周
洪德和
金玟奎
崔桢熏
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Gaoying Technology Co ltd
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Koh Young Technology Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0658—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of emissivity or reradiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

The disclosure proposes a kind of base board checking device.The base board checking device of the disclosure may include: light source, irradiate laser towards the coating film of a region coating on substrate；Optical sensor obtains coating film described in the reference light and the laser light generated by the surface reflection of the coating film as the laser and interference of light data caused by the interference between the measurement light that scatters；And processor, the interference of light data are based on, the thickness of the coating film corresponding with one region is exported.

Description

Base board checking device
Technical field
This disclosure relates to base board checking device and substrate inspecting method.
Background technique
It, can be with coated substrate for the element on protective substrate in the treatment process of substrate.This coating can be claimed For shape-preserving coating (conformal coating).In order to confirm whether the coating film on the substrate generated by means of coating is equal It is even to be applied as given thickness, the thickness check of shape-preserving coating film can be executed.
For the thickness check of coating film, the shooting of two dimension (2 Dimensional) fluorescence photo can be executed and checked.But It is that two dimensional image shooting, which checks, can only carry out being unable to measure the accurate thickness of coating film to the qualitative inspection of coating film thickness Degree value.In addition, two dimensional image shooting checks that when coating film is thin (example: about 30 μm), thickness measure can be highly difficult.
For the thickness check of coating film, it can be used and utilize OCT (Optical Coherence Tomography, light Learn coherence tomography) method.It is anti-due to reference mirror but when executing the thickness check of coating film using OCT Saturation (saturation) phenomenon of light is penetrated and occurred, mistake can occur in terms of thickness measure.In addition, due to the benchmark of OCT The constituent elements such as reflecting mirror, glass pane and beam splitter, it is difficult to realize the miniaturization of OCT.
Summary of the invention
The disclosure provides a kind of for measuring the technology of the coating film thickness of substrate for solving the above problems.
As an aspect of this disclosure, a kind of base board checking device can be proposed.The substrate of an aspect of this disclosure Check device may include: light source, irradiate laser towards the coating film of a region coating on substrate；Optical sensor, It obtains coating film described in the reference light and the laser light generated as the laser by the surface reflection of the coating film And interference of light data caused by the interference between the measurement light scattered；And processor, be based on the interference of light data, export with The thickness of one region coating film accordingly.
In one embodiment, processor can be based on the interference of light data, obtain the depth for showing the coating film The profile image of the section in direction determines the thickness of the coating film based on the boundary line on the profile image.
It in one embodiment, can further include the moving portion for keeping light source mobile.
In one embodiment, processor can export the anti-of the coating film surface based on the light quantity of the reference light Rate is penetrated, when the insufficient reflectivity predetermined of the reflectivity, the moving portion is can control, keeps the light source mobile.
In one embodiment, light source can irradiate the laser towards the coating film, the light passes along first direction Sensor can capture the reference light advanced to the opposite direction of the first direction and measurement light, obtain the interference of light number According to.
In one embodiment, light source can be arranged to the medium for being not through the laser except air and direct irradiation In the surface of the coating film.
In one embodiment, the surface of the coating film can mix the reflectivity of laser according in the coating film The fluorescent dye composite rate of the fluorescent dye of conjunction determines that it is super that the fluorescent dye composite rate is arranged to the reflectivity Cross the value of pre-set a reference value.
In one embodiment, coating film can be by means of in acrylic acid, urethane, polyurethane, silicon, epoxy, UV At least one substance for being selected in (Ultra Violet) curing material and IR (Infra Red) curing material and formed.
In one embodiment, the surface of coating film can be formed with curved surface.
As an aspect of this disclosure, a kind of substrate inspecting method can be proposed.The substrate of an aspect of this disclosure Inspection method may include: towards the step of the coating film of a region coating on substrate irradiates laser；It obtains by described Coating film described in the reference light and the laser light that laser is generated by the surface reflection of the coating film and the measurement scattered Caused by interference between light the step of interference of light data；And it is exported and one region phase based on the interference of light data The step of thickness for the coating film answered.
In one embodiment, the step of exporting the thickness of coating film may include: to be obtained based on the interference of light data The step of showing the profile image of the section of the depth direction of the coating film；And using the boundary line on the profile image as base Plinth, the step of determining the thickness of the coating film.
It in one embodiment, can be with further include: the light quantity based on reference light exports the reflectivity of the coating film surface The step of；And when the insufficient reflectivity predetermined of the reflectivity, make the step of the light source movement.
In one embodiment, laser can be along first direction, towards one area illumination, the reference light and survey Amount light can advance to the opposite direction of the first direction.
In one embodiment, laser can be not through the medium except air and direct irradiation described in coating film it is described Surface.
In one embodiment, the surface of the coating film can mix the reflectivity of laser according in the coating film The fluorescent dye composite rate of fluorescent dye determine that the fluorescent dye composite rate is arranged to the reflectivity and is more than The value of pre-set a reference value.
In one embodiment, coating film can be by means of in acrylic acid, urethane, polyurethane, silicon, epoxy, UV At least one substance for being selected in (Ultra Violet) curing material and IR (Infra Red) curing material and formed.
In one embodiment, the surface of coating film can be formed with curved surface.
According to various embodiment of the disclosure, even if base board checking device is given thickness (example: about 30 μm) in coating film Under thinner case below, it is also able to carry out accurate thickness measure.
According to various embodiment of the disclosure, base board checking device can be measured without constituent elements such as reference mirrors Film thickness is coated, measuring error caused by the saturated phenomenon of light is reduced.
According to various embodiment of the disclosure, base board checking device can be sampled by specific region, and it is whole to shorten substrate Coating film thickness measure need time.
Detailed description of the invention
Fig. 1 is the figure for showing one embodiment of base board checking device operation process of a certain embodiment.
Fig. 2 is the figure for showing one embodiment of base board checking device operation process of the disclosure.
Fig. 3 is the figure for showing the block diagram of check device 10 of disclosure multiplicity embodiment.
Fig. 4 is the figure for the boundary line for showing the profile image of an embodiment of the present disclosure and showing on profile image.
Fig. 5 is the figure for showing the depth direction measurement range of check device 10 of an embodiment of the present disclosure.
Fig. 6 is to show that the processor 110 of an embodiment of the present disclosure exports the thickness of coating film based on multiple boundary lines Process figure.
Fig. 7 is to show that the processor 110 of an embodiment of the present disclosure excludes a part of boundary line according to predetermined benchmark The figure of process outside.
Fig. 8 is the adjustment process for showing the thickness measurement zones based on coating film reflectivity of an embodiment of the present disclosure Figure.
Fig. 9 is to show that the check device 10 of an embodiment of the present disclosure passes through the photograph taking inspection using fluorescent dye Figure to the process for being sampled the region for executing the thickness measure based on the part OCT 170.
Figure 10 is to show that the check device 10 of an embodiment of the present disclosure according to element arrangements, is based on the portion OCT to that will execute The figure for dividing the region of 170 thickness measure to carry out the process of additional sampling.
Figure 11 is to show that the check device 10 of an embodiment of the present disclosure according to defect area, is based on the portion OCT to that will execute The figure for dividing the region of 170 thickness measure to carry out the process of additional sampling.
Figure 12 is to show that 10 pairs of check device of an embodiment of the present disclosure are surveyed the thickness based on the part OCT 170 is executed The neighboring region in the region of amount carries out the figure of the process of additional sampling.
Figure 13 is an implementation for showing the substrate inspecting method that can be executed by means of the check device 10 of the disclosure The figure of example.
Specific embodiment
Multiplicity embodiment described herein is the purpose for the technical idea for clearly stating the disclosure and illustrates, Do not really want to be limited to specific implementation form.The technical idea of the disclosure includes from the more of each embodiment described herein Sample changes the complete of (modifications), equivalent (equivalents), substitute (alternatives) and each embodiment The embodiment that portion or a part selectively combine.In addition, the interest field of the technical idea of the disclosure is not limited to following mention Various embodiment for showing illustrates it.
Including technical or scientific terms, as long as not defining differently, term used herein be can have The meaning that disclosure those of ordinary skill in the art are commonly understood by.
Such as " comprising " used herein, " may include ", " having ", " can have ", " having ", " can have " Deng expression, it is meant that there is the feature (example: function, operating or constituent element etc.) as object, however not excluded that other add The presence of feature.That is, this expression be interpreted as include will be including other embodiments a possibility that opening term (open- ended terms)。
The expression of odd number type used herein may include the meaning of complex number type as long as not indicating different on unity and coherence in writing Justice, this is applied equally to the singular type expression of claim record.
The expression such as " first " used herein, " second " or " first ", " second ", as long as not indicated on unity and coherence in writing Difference, in terms of censuring multiple objects of the same race, for an object to be different from another pair as and between non-limiting corresponding object Sequence or different degree.
" A, B and C " used herein, " A, B or C ", " A, B and/or C " or " at least one in A, B and C ", " A, B or The expression such as at least one in C ", " at least one in A, B and/or C ", may mean that each project enumerated or the project enumerated All possible combinations.For example, " A or B at least one " can all censure (1) at least one A, (2) at least one B, (3) At least one A and at least one B.
The expression of " portion " printed words used herein, may mean that software or such as FPGA (field- Programmable gate array, field programmable gate array), ASIC (application specific Integrated circuit, specific integrated circuit) hardware constituent element.But " portion " is not limited to hardware and software. " portion " both may be constructed to be stored in addressable storage medium, also may be constructed to obtain operation one or the processing more than it Device.In one embodiment, " portion " may include such as software sharing element of software sharing element, object-oriented, class composition The constituent element and processor of element and task constituent element, function, attribute, program, subprogram, the segment of program code, Driver, firmware, microcode, circuit, data, database, data structure, worksheet, display and parameter.
The expression of " being based on~" printed words used in this document, for describing in sentence or article comprising accordingly expressing Describe, to determine, the behavior of judgement or more than one factor for exerting one's influence of movement, the expression be not excluded for it is corresponding determine, The addition factor that the behavior or movement of judgement are exerted one's influence.
Certain constituent element (example: the first constituent element) " being connected to " or " being connected in " another constituent element used herein The expression of (example: the second constituent element) is not only certain described constituent element and is directly connected to or is connected in another constituent element, And it may mean that so that new another constituent element (example: third constituent element) is medium and connects or connects.
Expression " being configured~(configured to) " used herein, according to unity and coherence in writing, can have " be arranged~ ", " have~ability ", " change~", " formed~", the meanings such as " can carry out~".It accordingly expresses unlimited It may mean that in the meaning of " particularly being designed on hardware " for example, so-called be configured the processor for executing specific operating The general processor (generic-purpose processor) of its specific operating is able to carry out by runs software.
In order to illustrate various embodiment of the disclosure, the right angle with X-axis, Y-axis and the Z axis mutually directly handed over can be defined Coordinate system.The expression such as " X-direction " of rectangular coordinate system used herein, " Y direction ", " Z-direction ", as long as corresponding It is not defined differently especially in explanation, then may mean that two side directions of each axis stretching, extension of rectangular coordinate system.In addition, being added on each Before axis direction+symbol, it may mean that the pros into two side directions that corresponding axis direction stretches as some direction To, be added on before each axis direction-symbol, may mean that corresponding axis direction stretch two side directions in as residue one The negative direction in a direction.
In the disclosure, plate or even container of the substrate (substrate) as elements such as mounting semiconductor chips, can hold The effect of the connecting path of the electric signal of units and interelement.Substrate can use for production of integrated circuits etc., can With the generation of the materials such as silicon.Such as substrate can be printed circuit board (PCB, Printed Circuit Board), according to implementation Example, is properly termed as chip (wafer) etc..
In the disclosure, coating film can be by means of the coating for the element being intended on protective substrate and generate on substrate Film.When coating film thickness, film may rupture, and can also impact to the operating of substrate, thus need to coat coating film Must be relatively thin and uniform, to prevent coating film from rupturing.In one embodiment, coating film can be by means of in acrylic acid, crow It is selected in La Tan, polyurethane, silicon, epoxy, UV (Ultra Violet) curing material and IR (Infra Red) curing material At least one substance and formed.The coating film formed by means of above-mentioned substance, compared with coating film furthermore, after can be improved State the reflectivity of coating film surface and/or the backscattering rate of coating film.
In the disclosure, OCT (Optical Coherence Tomography) can be using the interference phenomenon of light come Capture the image technology of the intracorporal image of object.Using OCT, can obtain from the surface of subject to the display pair of depth direction As the image in internal portion.Generally based on interferometer, according to the wavelength of the light used, energy is differentiated to the depth direction of subject Power can be different.It, can be deeper into compared with as the Laser Scanning Confocal Microscope of another optical technology (confocal microscope) Permeable object body simultaneously obtains image.
With reference to the accompanying drawings, illustrate various embodiment of the disclosure.In attached drawing and the description of the drawings, to identical or real Same (substantially equivalent) constituent element, can assign identical appended drawing reference in matter.In addition, with In the explanation of lower multiplicity embodiment, it is convenient to omit repetition describes identical or corresponding constituent element, it is not intended that corresponding structure The embodiment is not included at element.
Fig. 1 is the figure for showing one embodiment of base board checking device operation process of a certain embodiment.The implementation of diagram The base board checking device of example can be the base board checking device of the type using reference mirror.In the illustrated embodiment, base Board checking device can further include light source 150, optical sensor 160, reference mirror 172 and/or beam splitter 171.
In the base board checking device using reference mirror, beam splitter 171 is adjustable to be irradiated from light source 150 Laser optical path, reference mirror 172 can reflect from beam splitter 171 transmit laser, generate reference light.It is illustrating Embodiment base board checking device in, laser can by the coating film of substrate 2 reflect and generate measurement light.It can be from reference light Interference of light data are obtained with the interference light of measurement light, base board checking device can generate profile image, measurement from interference of light data The thickness of coating film.
Specifically, light source 150 can irradiate laser.In one embodiment, light source 150 can be towards beam splitter 171 direct irradiation laser.In one embodiment, light source 150 can by optical fiber 174, by laser transfer to convex lens 173, It can be transmitted towards beam splitter 171 through the laser of convex lens 173.
The adjustable optical path of beam splitter 171, to pass through a part for the laser for receiving transmitting from light source 150, And towards the coating film of substrate 2, furthermore it is possible to adjust optical path, to reflect another part of laser, and towards baseline reflectance Mirror 172.
Adjustment optical path and make a part of the laser towards 2 coating film of substrate, can be anti-in the coating film of substrate 2 It penetrates.The reflected light can be known as measuring light.It measures light to advance towards beam splitter 171, can be passed by beam splitter 171 It is delivered to optical sensor 160.Adjustment optical path and make another part of the laser towards reference mirror 172, can be anti-by benchmark Penetrate the reflection of mirror 172.The reflected light is properly termed as reference light.Reference light can be transmitted to light sensing through beam splitter 171 Device 160.
Optical sensor 160 can capture the interference light that measurement light is interfered with reference light and formed, and obtain interference of light number According to.In the disclosure, interference of light data may mean that and obtain from interference light in the object bulk measurement based on OCT mode Data, wherein the interference light be irradiation light reflect from subject measurement light and irradiation light from reference mirror etc. instead The reference light penetrated interferes and the interference light that generates.According to characteristic (optical path, wavelength etc.) difference of measurement light and reference light, meeting Phenomenon is interfered, optical sensor can capture the interference phenomenon, obtain interference of light data.Furthermore it is possible to interference of light data Based on, generate the profile image of the section along depth direction of display coating film.Interference of light data are referred to as interference letter Number.It can use by means of reference light and measure the interference of light data of light, export using the base board checking device of reference mirror The thickness of the coating film coated on a substrate 2.
Fig. 2 is the figure for showing one embodiment of base board checking device operation process of the disclosure.The substrate of the disclosure is examined Looking into device can embody by means of the check device 10 of various embodiment.The base board checking device of the disclosure, which can be, not to be used The base board checking device of the type of foregoing reference mirror.
The check device 10 of various embodiment of the disclosure can use OCT, measure the thickness of the coating film of substrate 2.? In one embodiment, check device 10 can not use aforementioned basic reflecting mirror or scheduled glass pane etc., but utilize coating The reflected light of film surface measures the thickness of coating film.
Specifically, the check device 10 of the disclosure is not necessarily to reference mirror 172 or beam splitter 171, may include Light source 150 and/or optical sensor 160.The light source 150 of check device 10 can irradiate laser towards the coating film of substrate 2.This When, laser can be irradiated along first direction.First direction can be the straight line being tilted by a predetermined angle with the normal direction from substrate Corresponding direction.According to embodiment, first direction can also be identical as the normal direction of substrate.It is corresponding with the normal direction of substrate Axis be properly termed as Z axis.So-called Z-direction can be direction corresponding with the depth direction of coating film.As previously mentioned, light source 150 both can also can irradiate laser through optical fiber 174 and/or convex lens 173 with direct irradiation laser.
In the disclosure, x-axis and y-axis can be the axis respectively included in the corresponding plane in the surface of substrate 2.X-axis and y Axis mutually straight in respective planes can be handed over.In addition, x-axis and y-axis can be handed over directly with aforementioned z-axis respectively.
Laser can be in the surface reflection of coating film.Specifically, laser can reflect in the first face of diagram.In addition, Laser can rearward be scattered through coating film.Wherein, above-mentioned base can be played in the reflected light of coating film surface reflection Quasi-optical effect, scattering light can play the effect of above-mentioned measurement light.That is, at this point, reference light can be coated film table by laser Face is reflected and is generated, and measuring light by laser light coating film and can scatter and generate.Reflected light (that is, reference light) and scattering light (that is, measurement light) can advance to the opposite direction of above-mentioned first direction, generate interference light.That is, the laser of irradiation is done with above-mentioned Relating to light (that is, reflected light and scattering light) can advance along coaxial, and advance to mutual opposite direction.Optical sensor can capture to The interference light (that is, reflected light and scattering light) that the opposite direction of first direction is advanced.Optical sensor 160 can be from the interference light of capture Obtain interference of light data.Processor 110 can obtain the interference of light data from optical sensor 160, based on this, generate section Image exports the thickness in the coating film of the corresponding region coating of substrate 2.
As previously mentioned, above-mentioned reflected light and scattering light can in terms of the check device 10 of disclosure measurement coating film thickness To execute the reference light of the aforementioned base board checking device using reference mirror respectively and measure the effect of light.In other words, base Coating film of plate 2 itself can execute the effect of aforementioned basic reflecting mirror 172 according to its reflectivity.In one embodiment, Check device 10 can not configure the additional constituent element such as glass pane on the coating film of substrate 2.The check device of the disclosure Reflected light that coated film surface reflects is used as reference light and forms interference light by 10, thus can not additional demand glass pane etc. Element.
Fig. 3 is the figure for showing the block diagram of check device 10 of disclosure multiplicity embodiment.As previously mentioned, check device 10 can It may include additionally processor 110 and memory 120 to include light source 150 and optical sensor 160.In one embodiment In, at least one in these constituent elements of check device 10 can be omitted or other constituent elements can be appended to inspection dress Set 10.Additionally (additionally) or alternatively (alternatively), a part of constituent element can be with integration It embodies or is embodied with multiple individuals.At least part of constituent element can lead in the constituent element in the inside and outside portion of check device 10 Cross bus, GPIO (general purpose input/output, universal input/output), SPI (serial Peripheral interface, serial peripheral interface) or MIPI (mobile industry processor interface, Mobile Industry Processor Interface) etc. be connected with each other, sending and receiving data and/or signal.
Light source 150 is as previously mentioned, can irradiate laser towards the coating film of substrate 2.The configuration of light source 150, relative to base Relative position of plate etc. diversely can constitute (configured) respectively.In one embodiment, light source 150 can be aforementioned It is configured in z-axis.In one embodiment, the laser that can change wavelength in a short time can be used in light source 150, as a result, may be used To obtain interference of light data corresponding with different wavelength.In one embodiment, check device 10 also may include multiple Light source 150.
Optical sensor 160 can capture the interference light occurred by means of laser from coating film.Specifically, optical sensor 160 can capture by means of laser in the reflected light (that is, reference light) of coating film surface reflection and penetrate from coating film to predetermined After depth to the scattering light of backscattering (that is, measurement light) interference light that occurs.It is obtained using this interference light is captured The profile image on the basis of coating film surface can be generated in interference of light data.In one embodiment, optical sensor 160 can be with It is configured in aforementioned z-axis.In one embodiment, optical sensor 160 can not configure in z-axis, at this point, scheduled additional structure It can be adjusted at element, to make reflected light and the optical path of scattering light towards optical sensor 160.In one embodiment, Check device 10 may include multiple optical sensors 160.Optical sensor 160 can be embodied by means of CCD or CMOS.According to Light source 150 and optical sensor 160 can be referred to as the part OCT 170 of check device 10 by embodiment.
Processor 110 can control the check device 10 connecting with processor 110 at least with drive software (example: program) One constituent element.In addition, processor 110 can execute multiplicity calculation relevant to the disclosure, processing, data generation, processing Deng operating.In addition, data etc. can be loaded by processor 110 from memory 120, or it is stored in memory 120.
Processor 110 can obtain the interference of light data based on above-mentioned interference light from optical sensor 160.Processor 110 can With the interference of light data based on one or more than it, the coating film in a region coating of the substrate 2 for once irradiating laser is exported Thickness.It will be described later from the process of the thickness of interference of light data export coating film.
Memory 120 can store the data of multiplicity.The data stored in memory 120, as by means of check device 10 at least one constituent element and the data for obtaining or handling or use, may include software (example: program).Memory 120 It may include volatibility and or nonvolatile memory.Memory 120 can store one obtained from optical sensor 160 or Interference of light data more than it.In addition, memory 120 can store aftermentioned element arrangements information, element closeness information, Electrode position information.
In the disclosure, program may include for controlling check device 10 as the software stored in memory 120 The operating system of resource, application program and/or provide various function to application program and so that application program can be using inspection Look into the middleware etc. of the resource of device 10.
In one embodiment, check device 10 can further include communication interface (not shown).Communication interface can be with Execute the wirelessly or non-wirelessly communication between check device 10 and server or check device 10 and other external electronics.For example, Communication interface can execute based on LTE (long-term evolution, long term evolution), LTE-A (LTE Advance, it is advanced Long term evolution), CDMA (code division multiple access, CDMA), WCDMA (wideband CDMA, it is wide Band CDMA), WiBro (Wireless Broadband, WiMAX), WiFi (wireless fidelity, it is wireless to protect Very), bluetooth (Bluetooth), NFC (near field communication, near-field communication), GPS (Global Positioning System, global positioning system) or GNSS (global navigation satellite system, entirely Ball navigational satellite system) etc. modes wireless communication.For example, communication interface can be executed based on USB (universal serial Bus, universal serial bus), HDMI (high definition multimedia interface, high-definition media interface), RS-232 (recommended standard232) or POTS (plain old telephone service, Plan Old electricity Call business) etc. modes wire communication.
In one embodiment, processor 110 can control communication interface, obtain information from server.It is obtained from server The information obtained can store in memory 120.In one embodiment, the information obtained from server may include aftermentioned member Part arrangement information, element closeness information, electrode position information etc..
In one embodiment, check device 10 can also include aftermentioned additional light source 130 and additional optical sensor 140.Additional light source 130 and additional optical sensor 140 obtain the two dimensional image of the coating film about substrate 2, can be used for measuring The thickness of coating film.
In one embodiment, check device 10 can further include aftermentioned moving portion.Moving portion can along above-mentioned x, Y, z-axis keeps light source 150 and the part OCT 170 mobile.
In one embodiment, check device 10 can further include input unit (not shown).Input unit can be with It is the device inputted from external receiving for passing to the data of 10 at least one constituent element of check device.For example, input dress Set may include mouse, keyboard, touch tablet etc..
In one embodiment, check device 10 can further include output device (not shown).Output device can be with It is the device that various data such as the inspection result of check device 10, operating condition are supplied to user in the form of vision.Example Such as, output device may include display device, projector, hologram apparatus etc..
In one embodiment, check device 10 can become the device of various form.For example, check device 10 can be with It is in Portable Communications Unit, computer installation, multimedia portable device, wearable (wearable) device or above-mentioned apparatus Combined device a kind of or more than it.The check device 10 of the disclosure is not limited to device above-mentioned.
Various embodiment of the check device 10 of the disclosure can be combined with each other.Each embodiment can be according to possible whole Situation and combine, the embodiment for the check device 10 being composed also belongs to the scope of the present disclosure.In addition, the disclosure above-mentioned The inside/outside portion constituent element of check device 10 can be added according to embodiment, change, substitute or be deleted.In addition, inspection above-mentioned The inside/outside portion constituent element for looking into device 10 can be embodied with hardware component.
Fig. 4 is the figure for the boundary line for showing the profile image of an embodiment of the present disclosure and showing on profile image.Such as Preceding described, processor 110 can export the thickness of the coating film coated in 2 presumptive area of substrate from the interference of light data obtained. Processor 110 can generate profile image from interference of light data and export the thickness of coating film using the information on profile image.
In the disclosure, profile image may mean that in the object bulk measurement based on OCT mode, aobvious with two dimensional image The section along subject (coating film) depth direction shown.Profile image can the interference of light data based on measurement and generate.It cuts open Face image can have the corresponding boundary line (boundary striped) in the interface between same air and coating film, coating film and substrate.
Specifically, the interference of light data that processor 110 can be shot by optical sensor 160, obtain as shown in the figure Profile image.Profile image can be for substrate 2 and coating film, shows to-Z-direction, that is, shows cuing open to depth direction The image in face.That is, profile image can show the inside of the coating film from coating film surface to depth direction and substrate that pass through from.
The profile image 4010 of diagram can be by means of using the base board checking device of aforementioned basic reflecting mirror and can The profile image of acquisition.Profile image 4010 can have one or the boundary line 4050 more than it.It boundary line 4050 respectively can To be the interface between same air and coating film, that is, boundary line corresponding with coating film surface, or with coating film and corresponding coating The substrate 2 of film coating is to the corresponding boundary line in interface between electrode.It can benefit using the base board checking device of reference mirror With the interval between boundary line corresponding with each interface, the thickness of coating film is exported.
Specifically, when being the base board checking device using reference mirror, it can obtain and be with baseline reflectance mirror surface The profile image 4010 of benchmark.Base board checking device can determine to represent air and coating film from the profile image 4010 of diagram Between interface boundary line.In addition, base board checking device can determine to represent coating film and corresponding from profile image 4010 The boundary line at the interface between the substrate 2 of coating film coating.Base board checking device can export decision on profile image 4010 Two boundary lines between fore-and-aft distance, which is determined as to the thickness of coating film.
On the other hand, it when using base board checking device (example: check device 10) of the disclosure, can obtain with coating film Profile image 4020 on the basis of face.Profile image 4020 can have one or the boundary line 4040 more than it.Boundary line One of 4040 can be the corresponding boundary line in interface between same coating film and the substrate 2 or even electrode that corresponding coating film coats. Between the processor 110 of check device 10 can use between corresponding boundary line 4040 and the top 4030 of profile image 4020 Every exporting the thickness of coating film.
When being the check device 10 of the disclosure, processor 110, which can perceive, represents coating film and the coating of corresponding coating film Substrate 2 between interface boundary line 4040.In one embodiment, processor 110 can will be from profile image 4020 The boundary line that top is first appeared to depth direction is determined as corresponding boundary line 4040.In addition, for check device 10, by In utilization from the reflection photogenerated interference of light data of coating film surface reflection, thus profile image can be with the surface of coating film Origin is shown from coating film surface to-Z-direction, i.e., to the section of depth direction.Therefore, by means of check device 10 and It the top 4030 of the profile image 4020 of acquisition can be corresponding with the surface of coating film.Processor 110 can export the side of perception The fore-and-aft distance is determined as the thickness of coating film by the fore-and-aft distance between boundary line 4040 and the top of profile image 4,020 4030 Degree.In one embodiment, processor 110 can apply scheduled conversion coefficient (scaling in derived fore-and-aft distance Factor), derived value is determined as to the thickness of coating film.
In one embodiment, in the coating film thickness measure using the substrate 2 of OCT, laser, reflected light, scattering light And/or interference light can also be mobile by the simultaneously vacuum of non-air or other media.That is, light source 150 can be arranged to make laser The medium that is not through except air and direct irradiation are in coating film surface.
Fig. 5 is the figure for showing the depth direction measurement range of check device 10 of an embodiment of the present disclosure.Diagram is cutd open Face image 5010 can be the profile image obtained by means of using the base board checking device of aforementioned basic reflecting mirror.Accordingly cut open Face image 5010, which can have, to be represented the boundary line at interface between air and coating film and represents between coating film and substrate (PCB) The boundary line at interface.It (example: is checked in addition, the profile image 5020 of diagram can be by means of the base board checking device of the disclosure Device 10) and the profile image of acquisition.Corresponding profile image 5020, which can have, represents interface between coating film and substrate (PCB) Boundary line.
In one embodiment, profile image 5010 can be greater than profile image 5020.That is, profile image 5010 can be with Data volume than profile image 5020 is more.This is because being based on for the measurement of check device 10, different from the use of benchmark The situation of reflecting mirror will be used as reference light from the reflected light of the surface reflection of coating film, thus depth direction (- Z-direction) is surveyed Scope limitation is measured in the surface since coating film.
In the profile image 5030 of diagram, for the base board checking device using reference mirror, in order to be had The measurement result of meaning, it may be desirable to all in view of the element because mounting on a substrate 2 caused by difference in height measurement range 5040.But for the coating film thickness measure using check device 10, merely with the maximum anticipation thickness phase with coating film The measurement range 5050 answered, can obtain significant thickness measurement.In other words, check device 10 can reduce painting The measurement range of depth direction needed for overlay film thickness measure, calculation capacity needed for can reduce the processing of measurement result and is deposited Memory needed for storage.
In addition, for the coating film thickness measure using check device 10, due to not using reference mirror, thus can Fallibility is measured caused by reduce the saturated phenomenon because of reflected light.The light output of irradiation light is if it exceeds both quantify, then The light quantity of reflected light also increases, and interference signal can be saturated.If reaching saturation state, with the interference occurred by measurement object Independently there is interference signal in signal, can interfere accurately to measure.This saturated phenomenon is in the baseline reflectance using high reflectance In the case where mirror, it can be easier to occur.Check device 10 eliminates the use of reference mirror, existing because being saturated so as to reduce As caused measuring error.
Fig. 6 is to show that the processor 110 of an embodiment of the present disclosure exports the thickness of coating film based on multiple boundary lines Process figure.In one embodiment, check device 10 can use the presumptive area that is directed to stored in memory and obtain in advance The multiple profile images obtained export the thickness of coating film corresponding with corresponding region.For this purpose, can be obtained by repeatedly measuring Multiple profile images are simultaneously stored in memory.Therefore, check device 10 can export painting while minimizing influence of noise The thickness of overlay film.
As previously mentioned, processor 110 can interference of light data based on one or more than it, obtain a profile image. Base board checking device repeated multiple times can measure, and obtain multiple profile images 6010 of the presumptive area about substrate, multiple to cut open Face image can store in memory.Multiple profile images 6010 can distinguish the coating film of display base plate 2-z-axis, i.e. depth The section in direction.Multiple profile images 6010 can have the boundary line for representing the interface between coating film and substrate 2 respectively 6020。
Processor 110 can obtain multiple boundary lines 6020 from each profile image 6010.Processor 110 can will be more The boundary line of one of a boundary line 6020, be determined as representing the substrate 2 of coating film and the coating of corresponding coating film a region it Between interface boundary line 6030.Processor 110 can be based on the boundary line of decision, according to foregoing manner, export coating The thickness of film.
In one embodiment, processor 110 can export the average value (mean) of multiple boundary lines 6020, median (median) or mode value (mode), by the boundary line based on average value, median or mode value, be determined as representing coating film with The boundary line 6030 at interface between substrate 2.Processor can export one with respective interface based on the boundary line 6030 of decision The thickness of the corresponding coating film in region.
In the disclosure, average value can be after being added the value of all samplings divided by the total number acquisition of sampling Value.In the disclosure, median may mean that the value in the center of the value positioned at all samplings.Can by the value of sampling from it is small to Longer spread, when the number of sampling is odd number, using centrally located value as median, when the number of sampling is even number, with position Two average values being worth in center are median.In the disclosure, mode value may mean that occurrence frequency in the value of sampling Highest value.Especially in the disclosure, the average value of so-called boundary line, median or mode value, may mean that corresponding In profile image, average value, median or the mode value of the position coordinates that corresponding boundary line has.That is, when profile image is regarded For be made of x, y axis plane when, each point of the boundary line in corresponding profile image can have x, y-coordinate value.It is cutd open multiple In face image 6010, average value, median or the mode of x, y-coordinate value that multiple boundary lines 6020 are respectively provided with can be exported Value, can be the boundary determined by above-mentioned average value, median or mode value by the boundary line that the derived coordinate value determines Line 6030.
Fig. 7 is to show that the processor 110 of an embodiment of the present disclosure excludes a part of boundary line according to predetermined benchmark The figure of process outside.In one embodiment, processor 110 can export the average value of above-mentioned multiple boundary lines 6020, After foreclosing from derived average value beyond boundary line more than estimated rate, only using remaining boundary line, decision will be at For the boundary line on the basis of export coating film thickness.This can be suitable by will exceed given area in multiple boundary lines 6020 More boundary lines foreclose, to survey the excluded coating film thickness of value caused by obvious measuring error to execute Amount.It is possible thereby to realize more accurate thickness measure.
Specifically, processor 110 can export the first average value about multiple boundary lines 6020.Boundary line is averaged Value export process can execute as previously described.Processor 110 can will exceed derived first in multiple boundary lines 6020 Boundary line 7030 of the average value both more than fixed-ratio forecloses.That is, when being determined by the estimated rate of derived first average value Range when being the region between the dotted line 7020 of diagram, the boundary line 7010 for including in corresponding region is kept, and exceeds respective area The boundary line 7030 in domain can be excluded from processing later.Processor 110, which can export, will exceed ratio predetermined or more Boundary line 7030 foreclose after remaining boundary line 7010 the second average value.The average value export process of boundary line can be with It executes as previously mentioned.Processor 110 can be determined as the boundary line determined by derived second average value to represent coating film The boundary line at interface between substrate 2.Processor can export a region phase with respective interface based on the boundary line of decision The thickness for the coating film answered.
In one embodiment, processor 110 is not to utilize average value, and be available with median or mode value, is held The foregoing movement for excluding predetermined sides boundary line of row.For example, processor 110 can export in the first of multiple boundary lines 6020 Between be worth, exclude exceed the first median estimated rate boundary line, by the boundary of remaining boundary line determined by the second median Line is determined as that the boundary line on the basis of export coating film thickness will be become.It is same for mode value.In one embodiment, Average value, median, mode value also can be combined with each other use.
Fig. 8 is the adjustment process for showing the thickness measurement zones based on coating film reflectivity of an embodiment of the present disclosure Figure.In one embodiment, it when the reflectivity for coating film surface is scheduled a reference value or more, can be used without using benchmark The check device 10 of reflecting mirror.Pre-determined reference value can be coating film surface execution reference mirror 172 and act on required minimum The reflectivity of limit.In the thickness measure without using reference mirror of the disclosure, the reflectivity for coating film surface can anticipate Taste from coating film surface reflection and the ratio between the reflected light (that is, reference light) generated and the laser for being irradiated in coating film.
In one embodiment, check device 10 can be based on as being coated reflected light caused by film surface (that is, benchmark Light) light quantity, export the reflectivity of coating film, according to reflectivity, keep light source 150 or even the part OCT 170 mobile, execute thickness Measurement.Without using the check device 10 of reference mirror, interference of light data are obtained due to the reflectivity based on coating film, thus Subtle adjustment measurement object place, can obtain more meaningful measurement result and the reflectivity according to coating film.
Specifically, optical sensor 160 is in capture by above-mentioned reflected light (that is, reference light) and scattering light (that is, measurement light) It, can be with the light quantity of measuring basis light when caused interference light.Processor 110 can be based on the benchmark as caused by the coating film measured The light quantity of light exports the reflectivity in the z-axis direction in the corresponding region of coating film surface.The reflectivity in so-called z-axis direction, can To mean the ratio of the laser edge+z-axis direction reflection of irradiation.
Processor 110 when derived reflectivity is reflectivity predetermined or more, be judged as by corresponding reference light and One formed or interference of light data more than it are effective interference of light data, can use corresponding light interference data, export applies The thickness of overlay film.Minimal reflection needed for reflectivity predetermined executes reference mirror effect as coating film Rate can be above-mentioned scheduled a reference value.
Processor 110 can make light source 150 or even the portion OCT in the insufficient reflectivity predetermined of derived reflectivity Divide 170 movements, so that other regions 8020 of laser direction and the adjoining of initial measurement subject area 8010 are irradiated.In a reality It applies in example, check device 10 can further include moving portion.Moving portion can make light source 150 along x axis, y-axis and/or z-axis direction Or even the part OCT 170 is mobile.As previously mentioned, x-axis and y-axis be as the axis for including in plane corresponding with 2 surface of substrate respectively, It mutually can directly be handed in respective planes, z-axis can be axis corresponding with the normal direction of substrate.X-axis and y-axis can respectively with Aforementioned z axis is directly handed over.Processor 110 can control moving portion, make light source 150 or even the part OCT 170 along x-axis and/or y-axis side To movement, so that laser is irradiated towards with other adjacent regions 8020 of initial measurement subject area 8010.
In one embodiment, processor 110 can one based on acquisition or the capture more than it interference light point Resolution controls moving portion, adjusts the position of light source 150 or even the part OCT 170 in z-axis.That is, moving portion can be according to capture Interference light resolution ratio, move light source 150 or even the part OCT 170 along the z-axis direction.Interference light is for capturing by above-mentioned anti- Interference phenomenon caused by light (that is, reference light) and scattering light (that is, measurement light) is penetrated, therefore, if phenomenon is sufficiently interfered, it can It is determined with the phase difference determined according to the movement routine by laser, reflected light, scattering light.Processor 110 can control shifting Dynamic portion adjusts the position of light source 150 or even the part OCT 170 in z-axis, thereby executing being intended to obtain more specific interference light The adjustment of interference signal.
In the adjustment process 810 of the measured zone of diagram, the part OCT 170 can be moved by means of moving portion.Cause This, the measurement object region of the part OCT 170 or even the region 8010 of laser irradiation can be moved along x axis or y-axis.This may be Because the reflectivity of the coating film in original region 8010 is unable to reach predetermined benchmark.New irradiation area 8020 can be determined For coating film measurement thickness corresponding with new irradiation area 8020 can be considered or be similar to coating corresponding with original region 8010 The neighboring region of film thickness.The neighboring region in one region will be described later.In addition, new irradiation area 8020 is different from Original region 8010, can be decided to be reference light+z-axis directional reflectance ratio be predetermined benchmark more than region.In a reality Apply in example, new irradiation area 8020 can be decided to be reference light+z-axis directional reflectance ratio is high more set than original region 8010 Region more than ratio.
When observing the process in section 820, light source 150 is moved by means of moving portion, can be from original irradiation Laser is irradiated to new irradiation area 8020 in region 8010.In the illustrated embodiment, original irradiation area 8010, coating film The reflectivity in+z-axis direction can insufficient predetermined benchmark.This may be the coating film surface because of original irradiation area 8010, no With the normal parallel of substrate, but for inclination first retainer more than form.In addition, the resolution ratio of the interference light based on capture, Moving portion can be such that light source 150 or even the part OCT 170 moves along the z-axis direction.
In one embodiment, the irradiating angle of the laser of adjustable irradiation reaches to coat the reflectivity of film surface To more than a reference value.It in one embodiment, can be for the area illumination laser of coating film surface and substrate-parallel, to apply The reflectivity on overlay film surface reaches a reference value or more.
In one embodiment, coat film surface reflectivity can according to the fluorescent dye composite rate of corresponding coating film and It determines.In one embodiment, the coating film of fluorescent dye is mixed with compared with substrate furthermore, coats the reflectivity meeting of film surface It is higher.The fluorescent dye composite rate of coating film is higher, and the reflectivity for coating film surface also can be higher.That is, if using being mixed with The coating film of fluorescent dye, the then reflectivity for coating film surface increase, and therefore, can be easily performed based on anti-without using benchmark Penetrate the thickness measure of the check device 10 of mirror.In one embodiment, the fluorescent dye composite rate of coating film can be set to make The reflectivity that film surface must be coated is more than the value of pre-set a reference value.According to embodiment, a reference value is either coating Minimal reflectivity needed for film surface executes the effect of reference mirror 172, is also possible to the intention according to implementer And the value being arbitrarily arranged.
In addition, in one embodiment, the backscattering rate of coating film can also be according to the fluorescent dye of corresponding coating film Composite rate and determine.In one embodiment, the coating film of fluorescent dye is mixed with compared with substrate furthermore, after coating film Square scattered power can be higher.In the disclosure based in the thickness measure without using the check device 10 of reference mirror, coat The backscattering rate of film may mean that the scattering light (that is, measurement light) rearward scattered and the laser for being irradiated in coating film Between ratio.The fluorescent dye composite rate of coating film is higher, and the backscattering rate of coating film also can be higher.That is, if using It is mixed with the coating film of fluorescent dye, then the backscattering rate of coating film increases, and therefore, can be easily performed and be based on not using The thickness measure of the check device 10 of reference mirror.In one embodiment, the fluorescent dye composite rate of coating film can be set It is set to so that the backscattering rate of coating film is more than the value of pre-set a reference value.
In one embodiment, the surface of coating film can be formed with curved surface.In one embodiment, the surface of coating film With the curved surface of the curved surface, recess protruded relative to substrate or there can be the curved surface of any (arbitrary) shape to be formed.? It,, can be easily compared with the surface of coating film is the situation of plane when the surface of coating film is curved surface in one embodiment Execute the thickness measure based on the check device 10 without using reference mirror.
Fig. 9 is to show that the check device 10 of an embodiment of the present disclosure passes through the photograph taking inspection using fluorescent dye Figure to the process for being sampled the region for executing the thickness measure based on the part OCT 170.In one embodiment, it checks Device 10 can be directed to substrate entirety region, execute the photograph taking inspection that fluorescent dye is utilized, and be based on inspection result, according to Predetermined benchmark exports specific region, for derived region, executes the coating film thickness measure based on OCT.
Check device 10 can execute the photograph taking inspection that fluorescent dye is utilized to substrate 2 first.Photograph taking inspection It looks into and can be fluorescence photo shooting inspection.For the inspection, in the coating film that coats on a substrate 2, can be pre-mixed glimmering Photoinitiator dye.According to one embodiment, the check device 10 of the disclosure can further include additional light source 130 and/or additional light sensing Device 140.The addition light source 130 of check device 10 can irradiate ultraviolet light towards the coating film of substrate.The ultraviolet light of irradiation can be with It excites the fluorescent dye mixed in coating film and generates fluorescence.It is glimmering that the addition optical sensor 140 of check device 10 can capture this Light obtains the two dimensional image about substrate coating film.Two dimensional image can be two-dimensional fluoroscopic image according to embodiment.
Check device 10, according to predetermined benchmark, can be exported on substrate 2 based on the result of photograph taking inspection One or the region 3 more than it.Check device 10 can export the coating of the coating film coated on a substrate 2 from two dimensional image Amount.Check device 10 can obtain the brightness (luminance) each about 2 multiple regions of substrate from the two dimensional image obtained Information.If irradiating ultraviolet light, according to the amount of fluorescent dye, the brightness in each region of coating film can differently occur.Inspection Looking into device 10 can use the brightness in each region, export the coated weight of the coating film in each region.
Then, check device 10 can export given area 3 based on coated weight.For example, coated weight be set benchmark with Under region can be derived as given area 3.Check device 10 can be directed to derived region 3, additional to execute as previously described The thickness measure using the part OCT 170.The part OCT 170 of check device 10 can obtain the light about derived region 3 Interference data, based on the interference of light data of acquisition, the thickness of the additional measurement coating film that corresponding region 3 coats on substrate Degree.
In one embodiment, additional light source 130 can be arranged to irradiate ultraviolet light towards substrate, additional 130 phase of light source The relative position of substrate, ultraviolet irradiation angle, brightness of ultraviolet light etc. can be constituted diversely respectively (configured).In one embodiment, check device 10 may include multiple additional light sources 130.In one embodiment, Additional optical sensor 140 can capture the fluorescence occurred by means of laser from coating film.In one embodiment, check device 10 may include multiple additional optical sensors 140.Additional optical sensor 140 can be by means of CCD (Charged Coupled Device, charge coupled device) or CMOS (Complementary Metal-Oxide-Semiconductor, complementary type gold Belong to oxide semiconductor) and embody.
Figure 10 is to show that the check device 10 of an embodiment of the present disclosure according to element arrangements, is based on the portion OCT to that will execute The figure for dividing the region of 170 thickness measure to carry out the process of additional sampling.In one embodiment, processor 110 can export It is the same or similar area of arrangement of the amount of presetting region 3 below and element by the derived coated weight of two dimensional image Domain 4 controls the part OCT 170, exports the thickness about the region 4.In other words, processor 110 can be believed based on element arrangements Breath, the same or similar region of the arrangement of export element execute the thickness measure for utilizing OCT for the region.Element arrangements phase Same or similar region, the thickness value of the coating film of coating can be similar.Element arrangements and the same or similar region in a certain region, There can be similar coating film thickness.In the disclosure, element arrangements information can be shown in the element configured on substrate 2 The information of arrangement.Element arrangements information can show on a substrate 2, component mounter in the position of substrate 2, direction, occupy The information of size etc..
Firstly, processor 110 is as previously mentioned, the coated weight that can be obtained derived by two dimensional image is the amount of presetting Region 3 below.In one embodiment, processor 110 can use the part OCT 170, measure the thickness about the region 3. Processor 110 can on this basis, and export element arranges a region 4 on substrate 2 identical with institute export area 3.Phase Answering region 4 can be more than the region for the amount of presetting by the derived coated weight of two dimensional image (that is, not first area Region) in selection.Processor 110 can export corresponding region 4 based on element arrangements information above-mentioned.Processor 110 can To utilize the part OCT 170, the thickness about additional derived corresponding region 4 is exported.Processor 110 can control light source 150 and Optical sensor 160, obtain by means of the laser that is reflected from corresponding region 4 and the interference of light data generated.Processor 110 can be with base In the interference of light data of acquisition, the thickness about the coating film coated in corresponding region 4 is exported.In the disclosure, so-called processing Device 110 controls light source 150 and optical sensor 160 and obtains the interference of light data in a region, may mean that 150 court of light source To a corresponding area illumination laser, the acquisition of optical sensor 160 is done by the light that the interference light occurred from a corresponding region determines Relate to data.
In one embodiment, processor 110 can be arranged and the once derived area by means of two dimensional image with export element The similar region 4 in domain 3, the thickness measure using OCT can also be executed for the region 4.Wherein, whether element arrangements are similar, It can be judged based on the element arrangements information about two regions 3,4.Processor 110 can be based on element in the region 3,4 Configuration, type, form, electrode position of element of the area, element that occupy etc., the element arrangements for calculating two regions are similar Degree, according to the similar degree of calculating, determines whether the element arrangements in two regions are similar.
In one embodiment, processor 110 can be adjusted according to the element arrangements and the intensive degree of element on substrate 2 Whole above-mentioned luminance information, the luminance information based on adjustment export the coating film coated weight of corresponding region.Specifically, processing Device 110 can obtain the element arrangements information for representing the arrangement of element on substrate 2 from memory 120.Processor 110 can be based on Element arrangements information above-mentioned exports the element closeness information about each region on substrate 2.Processor 110 can be based on member Part closeness information, adjustment luminance information derived from two dimensional image.The high region of element closeness on a substrate 2, fluorescence dye The coating of material can be not uniform enough.In the high region of element closeness, that is, the intensive region of element, due to the accumulation of fluorescent dye, Brightness can measure high.Processor 110 adjusts the brightness letter of acquisition it is contemplated that the luminance distortion as caused by element closeness Breath.In this adjustment, the information of the accumulation of relationship between representation element closeness and brightness can be used, which can be into Row data base system is simultaneously stored in memory 120.Processor 110 can be exported based on the luminance information of adjustment about substrate 2 The coated weight of upper each region.
Figure 11 is to show that the check device 10 of an embodiment of the present disclosure according to defect area, is based on the portion OCT to that will execute The figure for dividing the region of 170 thickness measure to carry out the process of additional sampling.In one embodiment, processor 110 can export It is judged as defective region 5 on substrate 2 based on element arrangements information and two dimensional image, controls the part OCT 170, export is closed Thickness in the region.The predetermined defect of substrate 2 or coating film, such as the portion for having crackle (crack), removing, bumps, bending etc. Point, there can be mistake in the coating measurement checked by 2-dimentional photo shooting.Therefore, based on element arrangements information and/or Two dimensional image and be judged as there is the region 5 of predetermined fault location, can use the part OCT 170, the additional coating film thickness that executes is surveyed Amount.
Processor 110 can determine substrate 2 based on the element arrangements information obtained from memory 120 and/or two dimensional image On be judged as the region 5 for having predetermined defect.Two dimensional image can be the photo of the form of shooting actual substrate 2 and coating film.Member Part arrangement information can show the coating film for the form and anticipation that substrate 2 has according to predetermined dimension (specification) Coating form.Processor 110 can determine that present substrate 2 and coating film have with contrast element arrangement information and two dimensional image The region of feature beyond predetermined dimension.That is, individual features can be judged as defect by processor 110.Processor 110 can be led Region 5 existing for the defect out.
Processor 110 can use the part OCT 170, export the thickness about derived region 5.Processor 110 can be controlled Light source 150 and optical sensor 160 processed, obtain by means of the laser that is reflected from corresponding region 5 and the interference of light data generated.Processing Device 110 can export the thickness about the coating film coated in corresponding region 5 based on the interference of light data of acquisition.
In one embodiment, the export in the addition measurement object region based on defect area can be based on two with aforementioned The export for tieing up the addition measurement object region of image independently executes.
In addition, in one embodiment, processor 110 can be based on the position for representing the electrode that element has on substrate 2 Electrode position information, export includes the region of electrode section, controls the part OCT 170, executes and survey to the addition thickness in the region Amount.In the disclosure, electrode position information can show the position for the electrode that element has on substrate 2.For example, element It can have the electrode section of the subtle wiring in connecting element and substrate respectively.The electrode is referred to as element or core The pin of piece.Which part is electrode position information can be located on a substrate 2 with the electrode of representation element.In general, element Electrode section with component pin coacervation that is intensive and can having fluorescent dye, therefore, the thickness based on two dimensional image Measurement can be not accurate enough.Therefore, the part where the electrode of element executes the addition thickness measure for utilizing OCT, can be improved complete The accuracy of body thickness measurement process.
Processor 110 can know the electrode of element on substrate 2 based on the electrode position information obtained from memory 120 Positioned at where.Processor 110 can be with the region on the substrate 2 where leadout electrode.In one embodiment, corresponding region can be with The choosing in the region (that is, the not region of first area) that the coated weight obtained by two dimensional image is more than the amount of presetting It selects.
Processor 110 can use the part OCT 170, export the thickness about derived region.Processor 110 can be controlled Light source 150 and optical sensor 160 processed, obtain by means of the laser that is reflected from corresponding region and the interference of light data generated.Processing Device 110 can export the thickness about the coating film coated in corresponding region based on the interference of light data of acquisition.
Figure 12 is to show that 10 pairs of check device of an embodiment of the present disclosure are surveyed the thickness based on the part OCT 170 is executed The neighboring region in the region of amount carries out the figure of the process of additional sampling.In various embodiment according to the disclosure and derived substrate Region on 2 is adding the region 7 for executing thickness measure using OCT, check device 10 can also be for the region 7 Neighboring region 8 executes additional thickness measure using OCT.
Derived corresponding region 7 can be shot and check after 2-dimentional photo in terms of the accuracy of coating film thickness measure Later, the additional thickness measure place executed using OCT.The neighboring region of corresponding region 7 can be related to substrate 2 or coating film Connection has the characteristic similar with corresponding region 7.It therefore, can be for neighbour in order to ensure the accuracys of all thickness measure processes Region is connect, the addition thickness measure for utilizing OCT is executed.
Wherein, neighboring region may mean that when substrate 2 is divided into multiple regions, with the adjacent configuration of corresponding region 7 Region.In one embodiment, neighboring region may mean that the area to connect in multiple regions with 7 boundary line of corresponding region Domain.In one embodiment, neighboring region may mean that in multiple regions, on the basis of the center of corresponding region 7, be located at both Determine the region in radius.In one embodiment, when lateral, longitudinal corresponding axis with substrate is referred to as X-axis, Y-axis, Neighboring region can be positioned at corresponding region 7+X-direction ,-X-direction ,+Y direction ,-Y direction and with corresponding region 7 The region of Border line.In one embodiment, neighboring region may include sharing top with corresponding region 7 in multiple regions It puts and is located at the region on diagonal line.
In one embodiment, processor 110 can based on by means of two dimensional image derived coated weight and by means of The part OCT 170 and measure thickness value, again execute utilize OCT thickness measure.According to embodiment, can export can be from painting The difference value of the qualitative thickness value of corresponding region coating film derived from the amount of covering and the thickness value measured by means of OCT, when this When difference value is that value predetermined is above, it can be directed to corresponding region, execute the thickness measure for utilizing OCT again.In addition, root According to embodiment, it is based on derived coated weight and thickness value, when two values are unsatisfactory for predetermined benchmark, thickness survey can be executed again Amount.Wherein, from the point of view of based on relational between the coated weight and thickness that have measured, predetermined benchmark, which can be, is judged as derived At least one value is measured the benchmark used when mistake in coated weight or thickness.That is, when considering coated weight and thickness value, such as Fruit is judged as that measurement is wrong, then can execute measurement again.In addition, in one embodiment, processor 110 can be based on borrowing Help two dimensional image and the coated weight in a derived region and the thickness value in the region measured by means of the part OCT 170, For the neighboring region of corresponding region, the part OCT 170 is controlled, measures thickness again.
Figure 13 is an implementation of the substrate inspecting method that shows the check device 10 by means of the disclosure and can execute The figure of example.In the illustrated flow chart, each step of disclosed method or algorithm is successively illustrated, but each step is removed and successively held Row is outer, can also according to the disclosure can the sequence of any combination execute.Explanation based on this flow chart will not be to method or algorithm The situation for applying variation or revision forecloses, and is not meant to that arbitrary steps are necessary or preferred.In one embodiment In, at least part step can side by side, repeatedly or exploratoryly execute.In one embodiment, at least part walks Suddenly it can be omitted, or other steps can be added.
The check device 10 of the disclosure can execute the substrate inspection of disclosure multiplicity embodiment in terms of executing inspecting substrate Checking method.The substrate inspecting method of an embodiment of the present disclosure may include: the painting towards a region coating on substrate The step S100 of overlay film irradiation laser；It obtains and the surface reflection of film is coated by laser and the reference light that generates and through coating film And the step S200 of interference of light data caused by the interference between the measurement light scattered；And/or it is exported based on interference of light data The step S300 of the thickness of the coating film corresponding with one region.
In the step s 100, the light source 150 of check device 10 can be towards the coating of a region coating on substrate Film irradiates laser.In step s 200, optical sensor 160 can obtain the base for being coated the surface reflection of film by laser and being generated Quasi-optical and laser light coating film and scatter measurement light between interference caused by interference of light data.In step S300, place Interference of light data can be based on by managing device 110, export the thickness of coating film corresponding with said one region.
In one embodiment, the step S300 for exporting the thickness of coating film may include: that processor 110 is dry based on light The step of relating to data and obtaining the profile image of the section of the depth direction of display coating film；And/or with the side on profile image The step of thickness of coating film is determined based on boundary line.
In one embodiment, the step S300 for exporting the thickness of coating film may include: processor 110 from memory The step of obtaining the multiple profile images being obtained ahead of time for one region；And/or processor 110 is from multiple sectional views As upper multiple boundary lines decision benchmark boundary line, it is based on benchmark boundary line, exports coating film corresponding with said one region Thickness the step of.
In one embodiment, benchmark boundary line can be by the average value (mean) about the multiple boundary line, in Between value one of (median) and mode value (mode) determine boundary line.
In one embodiment, benchmark boundary line can be in the multiple boundary line by meeting pre-set benchmark The boundary line that the average value of boundary line determines.
In one embodiment, substrate inspecting method can be with further include: light quantity of the optical sensor 160 based on reference light and lead The step of coating the reflectivity of film surface out；And/or when the insufficient reflectivity predetermined of reflectivity, make the step of light source movement Suddenly.The movement can be executed by means of above-mentioned moving portion.
In one embodiment, laser can be along first direction, towards said one area illumination, reference light and measurement light It advances, can be captured by optical sensor to the opposite direction of first direction.In one embodiment, laser can be not through air it Outer medium and direct irradiation are in the surface of coating film.
Various embodiment of the disclosure can be in machine (machine) readable storage medium storing program for executing (machine-readable Storage medium) in be presented as software.Software can be the software for embodying disclosure multiplicity embodiment.Software can be with By the programmer of disclosure technical field from disclosure multiplicity embodiment inference.For example, can be can including machine for software The program of read command (example: code or code snippet).Machine according to the order read from storage medium as can be operated Device, such as can be computer.In one embodiment, machine can be the check device 10 of the embodiment of the present disclosure.One In a embodiment, the processor of machine can run the order of reading, and the constituent element of machine can execute and the corresponding command phase The function of answering.In one embodiment, processor can be the processor 110 of the embodiment of the present disclosure.Storage medium can be meaned The recording medium of all kinds of machine readable storing data (recording medium).Storage medium for example can wrap Include ROM (read-only memory), RAM (random access memory), CD-ROM (CD-ROM driver), tape, floppy disk, light number According to storage device etc..In one embodiment, storage medium can be memory 120.In one embodiment, storage medium It can be presented as by the form of being distributed in computer system of network connection etc..Software can be in computer system etc. Distribution storage, operation.Storage medium can be non-transitory (non-transitory) storage medium.Non-transitory storage medium Mean with semiparmanent data or provisional storage independently reality existing for medium (tangible medium), do not include The signal (signal) that temporary (transitory) is propagated.
Above according to various embodiment, illustrate that the technical idea of the disclosure, the technical idea of the disclosure are included in this public affairs Open achievable multiplicity displacement, deformation and change in the range of person of an ordinary skill in the technical field is appreciated that.In addition, this Kind displacement, deformation and change are interpreted as may include in appended claims.

Claims (9)

1. a kind of base board checking device, wherein include:
Light source irradiates laser towards the coating film of a region coating on substrate；
It is saturating to obtain the reference light and the laser generated by the laser by the surface reflection of the coating film for optical sensor Cross the coating film and scatter measurement light between interference caused by interference of light data；And
Processor is based on the interference of light data, exports the thickness of the coating film corresponding with one region.
2. base board checking device according to claim 1, wherein
The processor is based on the interference of light data, obtains the sectional view for showing the section of depth direction of the coating film Picture,
Based on the boundary line on the profile image, the thickness of the coating film is determined.
3. base board checking device according to claim 1, wherein
It further include the moving portion for keeping the light source mobile.
4. base board checking device according to claim 3, wherein
Light quantity of the processor based on the reference light exports the reflectivity of the coating film surface,
When the insufficient reflectivity predetermined of the reflectivity, the moving portion is controlled, keeps the light source mobile.
5. base board checking device according to claim 1, wherein
The light source irradiates the laser along first direction, towards the coating film,
The optical sensor captures the reference light advanced to the opposite direction of the first direction and measurement light, obtains the light Interference data.
6. base board checking device according to claim 1, wherein
The light source is arranged to the medium for being not through the laser except air and direct irradiation is described in the coating film Surface.
7. base board checking device according to claim 1, wherein
The film surface that coats is to the reflectivity of the laser, according to the fluorescent dye of the fluorescent dye mixed in the coating film Composite rate decision,
The fluorescent dye composite rate is arranged so that the reflectivity is more than the value of pre-set a reference value.
8. base board checking device according to claim 1, wherein
The coating film by means of acrylic acid, urethane, polyurethane, silicon, epoxy, UV (Ultra Violet) curing material and At least one substance for being selected in IR (Infra Red) curing material and formed.
9. base board checking device according to claim 1, wherein
The surface of the coating film is formed with curved surface.
CN201821975696.XU 2017-11-28 2018-11-28 Base board checking device Active CN209399934U (en)

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