CN209264608U - A kind of device using steady state method measurement film heating conduction - Google Patents
A kind of device using steady state method measurement film heating conduction Download PDFInfo
- Publication number
- CN209264608U CN209264608U CN201821995605.9U CN201821995605U CN209264608U CN 209264608 U CN209264608 U CN 209264608U CN 201821995605 U CN201821995605 U CN 201821995605U CN 209264608 U CN209264608 U CN 209264608U
- Authority
- CN
- China
- Prior art keywords
- sample
- vacuum
- control system
- test
- temperature control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005259 measurement Methods 0.000 title claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 83
- 238000012544 monitoring process Methods 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000005057 refrigeration Methods 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000001727 in vivo Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 20
- 239000010408 film Substances 0.000 abstract description 13
- 239000010409 thin film Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 210000004556 brain Anatomy 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002088 nanocapsule Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The utility model relates to material property representational fields, and in particular to a kind of device using steady state method measurement film heating conduction.The device includes: sample analysis room, vacuum acquiring system, temperature control system, signal monitoring and automatic production record, and sample is placed on the indoor test chip of sample analysis, and sample analysis room has vacuum-packed function；Vacuum acquiring system is connected with sample analysis room, provides the test environment of vacuum for sample；Temperature control system is heated, freezed or keep the temperature etc. to test chip and operated, and provides temperature variation testing environment for sample；Signal monitoring is connected with automatic production record with temperature control system, carries out automatic setting and the record of temperature.The utility model accurately measures thermal conductivity in the face of thin-film material, particularly with those because sample size is too small or the reasons such as translucency is high, and when not being available the progress heating conduction test of other commercial computer devices, its heating conduction can accurately and rapidly be obtained using the utility model laboratory apparatus.
Description
Technical field
The utility model relates to material property representational fields, and in particular to a kind of to measure film heating conduction using steady state method
Device.
Background technique
The heating conduction of material is its important physical attribute, and is different from the low-dimensional scale effect of material
" ballistic " transmission effects of conventional blocks material, greatly influence the conductivity properties and service performance of material, and low-dimensional is thermally conductive
Material has far-reaching and important influence in microelectronics system field of heat management.
However, traditional is suitable for surveying since low-dimensional materials show strong anisotropic heat conductivity and scale effect
The measuring device and principle of gauge block body thermal conductivity of material, such as: transient laser scintigraphy is completely not applicable, transient laser
Detection beam spot area is even greater than two-dimensional material size.
Steady state method is the basic definition based on thermal conductivity, is surveyed in the environment of near adiabatic using one-dimensional stable heat source signal
The temperature rise for measuring sample responds to calculate thermal conductivity.It is not excessive this approach application in the test of the heating conduction to two-dimensional material
On, then it needs to carry out designed, designed according to the particularity of material, has no commercialization electricity that can be general for these two-dimensional materials at present
Brain device.
Utility model content
The purpose of the utility model is to provide a kind of devices using steady state method measurement film heating conduction, utilize above-mentioned dress
Setting thermal conductivity can accurately be measured in the face to some thin-film materials, particularly with those because sample size it is too small or
The reasons such as translucency height, and be not available other commercial computer devices and carry out heating conduction test, this laboratory apparatus can be accurate, fast
Its heating conduction is obtained fastly.
To achieve the goals above, the technical solution of the utility model is as follows:
A kind of device using steady state method measurement film heating conduction, which includes sample analysis room, vacuum acquirement system
System, temperature control system, signal monitoring and automatic production record, specific structure are as follows:
Sample is placed on the indoor test chip of sample analysis, and sample analysis room is true required for providing for sample test
Empty, the circuit connection that relents test environment；Vacuum acquiring system is connected with sample analysis room, provides the test of vacuum for sample
Environment；Temperature control system is connected with the indoor heating refrigeration platform of sample analysis, and temperature control system, which is realized, to be heated test chip, makes
Cold or heat preservation, provides temperature variation testing environment for sample；Signal monitoring is connected with automatic production record with temperature control system, carries out temperature
Degree it is automatic setting and record, synchronous signal monitoring and automatic production record also with the circuit of sample analysis indoor test chip into
Row connection.
The device using steady state method measurement film heating conduction, vacuum acquiring system and vacuum cavity use ripple
Pipe connection, vacuum meter is installed on the top of vacuum cavity, and is connect by conducting wire with data collecting card.
The device using steady state method measurement film heating conduction, in vacuum cavity, sample is placed on test core
On piece, test chip are connect by sample stage with external test circuitry；Sample stage and test chip are placed on heating refrigeration platform,
Sealing electrical connector is set to the side of vacuum cavity, the thermocouple that the lead of sample stage, heating are freezed on platform in vacuum cavity
Lead is drawn by sealing electrical connector.
The device using steady state method measurement film heating conduction, vacuum acquiring system are mechanical pump or molecular pump.
The device using steady state method measurement film heating conduction, the input terminal of temperature control system pass through lead and sample
It analyzes indoor heating refrigeration platform to be connected, the input terminal of the output end connection data collecting card of temperature control system, data collecting card
Output end is connected to computer.
The device using steady state method measurement film heating conduction, temperature control system is using PID or the temperature of position formula
Instrument is controlled, the output end of temperature control system is equipped with RS232 communication module, and temperature control system is acquired by RS232 communication module and data
Card connection.
The device using steady state method measurement film heating conduction, signal monitoring and automatic control system include electricity
Brain, data collecting card, micro-ohm table, D.C. regulated power supply, circuit changing switch, in which: the lead of D.C. regulated power supply passes through close
Envelope electrical connector is connect with sample stage, for being powered to test chip；Micro-ohm table by lead connect sample stage, micro-ohm table with
Circuit changing switch is set on the lead of sample stage connection, for the resistance variations on real-time monitoring test chip；Also, micro-ohm
Table, D.C. regulated power supply and circuit changing switch are connect by data collecting card with computer.
The utility model mentality of designing is as follows:
Firstly, for the heating conduction test of material, most typical Fourier's one-dimensional stable heat conduction model can be referred to,
Need to construct the state of this one dimensional heat transfer on sample.Secondly, need to be in view of other radiating modes pair such as convection current and heat radiations
Test the influence generated.
It is based on the main design phiolosophy of the above two o'clock, the utility model successfully utilizes above-mentioned apparatus to measure one
Thermal conductivity in the face of a little thin-film materials, particularly with some two-dimensional materials, they are because of itself translucency or sample size
In the micron-scale etc. reasons and be not available other heating conduction computer devices, the utility model can accurately and rapidly obtain it
Heating conduction numerical value.
It the advantages of the utility model and has the beneficial effect that:
1, the device of the utility model be based on steady state method carry out heating conduction test, principle is simple, test error it is small and
No matter sample whether light transmission, on the accuracy of test without influence.
2, the device of the utility model provides the test environment of vacuum for test, can be to avoid heat loss through convection to the standard of test
True property has an impact.
3, the device of the utility model heats thermometric using microchip, heat radiation can be avoided to test with high degree
Accuracy have an impact, and provide the chip of sizes, sample of the one direction size at 1 μm~1000 μm can be tested,
It can be with the lesser sample of measurement ruler cun.
4, all accessories of the device of the utility model are attached with computer, can carry out full-automatic testing, automatically
Change degree is higher.
5, the temperature that 150K~750K may be implemented in the temperature control system of the device of the utility model continuously regulates and controls, test scope
It is larger, meet the needs of test.
Detailed description of the invention
The experimental provision structure chart that Fig. 1 is done by the utility model.
Fig. 2 is test chip manufacturing flow chart.
Fig. 3 is test chip structure figure.
In figure: 1 --- sample analysis room；2 --- vacuum acquiring system；3 --- temperature control system；4 --- signal monitoring with
Automatic production record；5 --- carrying sample area；6 --- circuit connection region；11 --- test chip；12 --- sample stage；
13 --- vacuum cavity；14 --- sealing electrical connector；15 --- vacuum meter；16 --- heating refrigeration platform；41 --- computer；
42 --- data collecting card；43 --- micro-ohm table；44 --- D.C. regulated power supply；45 --- circuit changing switch.
Specific embodiment
It is practical below in conjunction with this in order to be more clear the objectives, technical solutions, and advantages of the embodiments of the present invention
Attached drawing in new embodiment, to the technical scheme in the embodiment of the utility model carry out it is clear, be fully described by.Obviously, institute
The embodiment of description is the utility model a part of the embodiment, rather than whole embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
As shown in Figure 1, the utility model using steady state method measurement film heating conduction device, the device mainly includes with
Lower system: sample analysis room 1, vacuum acquiring system 2, temperature control system 3, signal monitoring and automatic production record 4, specific structure is such as
Under:
Sample is placed on the test chip 11 in sample analysis room 1, and sample analysis room 1 has vacuum-packed function；Very
Empty acquisition system 2 is connected with sample analysis room 1, provides the test environment of vacuum for sample；Temperature control system 3 may be implemented to test
Chip 11 such as is heated, freezed or is kept the temperature at the operation, to provide temperature variation testing environment for sample；Signal monitoring and automatic note
Recording system 4 is connected with temperature control system 3, carries out automatic setting and the record of temperature, while it also tests core in sample analysis room 1
The circuit of piece 11 is attached, and is realized the processing to test data and record, is further realized autorun.
Sample analysis room 1 provides the test environment of required vacuum, the circuit connection that relents for sample test.Specifically
, vacuum acquiring system 2 is connect with vacuum cavity 13 using modes such as bellowss, and a high vacuum is given in vacuum cavity 13
Test environment.Vacuum meter 15 is installed on the top of vacuum cavity 13, and is connect by conducting wire with data collecting card 42, for monitoring
Vacuum degree in vacuum cavity 13, and by data transfer to data collecting card 42.Sealing electrical connector 14 is set to vacuum cavity
13 side, the lead of sample stage 12 in vacuum cavity 13, the thermocouple lead on heating refrigeration platform 16 are by sealing electrical connection
Part 14 is drawn, and under conditions of ensuring vacuum sealing, is played the role of the circuit inside and outside vacuum cavity 13 and is connected with thermocouple.Very
In cavity body 13, sample is placed on test chip 11, and test chip 11 is connect by sample stage 12 with external test circuitry.Together
When, sample stage 12 is placed on heating refrigeration platform 16, provides the test environment of continuous alternating temperature for test sample.
Testing chip 11 has a variety of different sizes, can be selected according to the size of sample, can test one direction length
In 1 μm~1000 μm of sample；Vacuum acquiring system 2 may include the combination pump group of the vacuum pumps such as mechanical pump and molecular pump.
The input terminal of temperature control system 3 is connected by lead with the heating refrigeration platform 16 in sample analysis room 1, temperature control system 3
Output end connection data collecting card 42 input terminal, the output end of data collecting card 42 is connected to computer 41.Temperature control system 3 uses
Be PID or position formula temperature controller, the continuous temperature for carrying out 150K~750K adjusts, while can be with signal monitoring and automatic note
Recording system 4 carries out both-way communication.The output end of temperature control system 3 is equipped with RS232 communication module, and temperature control system 3 is logical by RS232
News module is connect with data collecting card 42, and computer 41 can be used and carry out automatically controlling.
Signal monitoring and automatic control system 4 include computer 41, data collecting card 42, micro-ohm table 43, D.C. regulated power supply
44, circuit changing switch 45, in which: the lead of D.C. regulated power supply 44 is connect by sealing electrical connector 14 with sample stage 12,
For being powered to test chip 11；Micro-ohm table 43 connects sample stage 12 by lead, connect in micro-ohm table 43 with sample stage 12
Circuit changing switch 45 is set on lead, for the resistance variations on real-time monitoring test chip 11.Also, it is micro-ohm table 43, straight
Stream regulated power supply 44 and circuit changing switch 45 are all connect with computer 41 by data collecting card 42, computer 41 may be implemented to
The control of upper all parts, and there is automatic setting test temperature, automatically record and handle data, real-time rendering display test knot
The function of fruit.
In use, sample is placed on the test chip 11 in sample analysis room 1, vacuum acquiring system 2 provides for sample
The test environment of vacuum, temperature control system 3 provide test varying temperature environment for test, and signal monitoring and automatic production record 4 are then notes
Record processing data, and realize autorun.
The content of the present invention is further explained and described by the following examples.
Embodiment 1
In the present embodiment, the test method for testing the heating conduction of carbon nanocapsule thin film is as follows:
As Figure 1-Figure 2, the production process for testing chip 11 includes: that single Si piece → LPCVD that throws deposits Si3N4→ photoetching
Depositing electrode → chemical wet etching can modify the size of photolithography plate according to sample size, and then obtain various sizes of test
Chip.As shown in figure 3, the centre of test chip 11 is carrying sample area 5, the outside setting circuit of test chip 11 connects
Connect region 6.After the test chip 11 for making 100 μm of electrode spacings, sample to be tested is transferred to the carrying sample on test chip 11
Product region 5.Later, test chip 11 is placed on sample stage 12,11 circuit of chip and sample will be tested using gold wire bonder
Platform 12 connects in circuit connection region 6.Later, vacuum acquiring system 2 is opened, and opens computer 41, setting need to be to be tested
Temperature electricity, presses start button, and computer 41 can detect vacuum degree lower than 10-3It after Pa, begins to warm up or freezes, to 12 temperature of sample stage
Set temperature is spent, starts to test.Finally can be by test as the result is shown at the interface of computer 41, and can support leading for data
Out.
Embodiment the result shows that, device provided by the utility model thermal conductivity can carry out in the face to some thin-film materials
Accurate measurement particularly with those because sample size is too small or the reasons such as translucency is high, and is not available other commercial electricity
Brain device carries out heating conduction test, can accurately and rapidly obtain its heating conduction.To investigation of materials personnel to thin-film material
The research of hot physical performance greatly facilitates effect.
It is detailed to a kind of device progress using steady state method measurement film heating conduction provided by the utility model above
Introduction.Specific case used herein is illustrated the principles of the present invention and embodiment, and above embodiments are said
The bright method and core concept for being merely used to help understand the utility model.It should be pointed out that for the common skill of the art
For art personnel, without departing from the principle of this utility model, several improvement can also be carried out to the utility model and are repaired
Decorations, modifications and modifications also fall within the protection scope of the claims of the utility model.
Claims (7)
1. a kind of device using steady state method measurement film heating conduction, which is characterized in that the device includes sample analysis room, true
Empty acquisition system, temperature control system, signal monitoring and automatic production record, specific structure are as follows:
Sample is placed on the indoor test chip of sample analysis, and sample analysis room provides required vacuum, change for sample test
The test environment of mild circuit connection；Vacuum acquiring system is connected with sample analysis room, provides the test environment of vacuum for sample；
The indoor heating refrigeration platform of temperature control system and sample analysis is connected, temperature control system realize to test chip heated, freeze or
Person's heat preservation, provides temperature variation testing environment for sample；Signal monitoring is connected with automatic production record with temperature control system, carries out temperature
Automatic setting and record, circuit of the synchronous signal monitoring with automatic production record also with sample analysis indoor test chip are connected
It connects.
2. the device described in accordance with the claim 1 using steady state method measurement film heating conduction, which is characterized in that vacuum acquirement
System and vacuum cavity are connected using bellows, and vacuum meter is installed on the top of vacuum cavity, and is acquired by conducting wire and data
Card connection.
3. the device described in accordance with the claim 1 using steady state method measurement film heating conduction, which is characterized in that in vacuum chamber
In vivo, sample is placed on test chip, and test chip is connect by sample stage with external test circuitry；Sample stage and test core
Piece is placed on heating refrigeration platform, and sealing electrical connector is set to the side of vacuum cavity, the lead of sample stage in vacuum cavity,
Thermocouple lead on heating refrigeration platform is drawn by sealing electrical connector.
4. the device described in accordance with the claim 1 using steady state method measurement film heating conduction, which is characterized in that vacuum acquirement
System is mechanical pump or molecular pump.
5. the device described in accordance with the claim 1 using steady state method measurement film heating conduction, which is characterized in that temperature control system
Input terminal be connected by the indoor heating refrigeration platform of lead and sample analysis, the output end connection data collecting card of temperature control system
Input terminal, the output end of data collecting card is connected to computer.
6. utilizing the device of steady state method measurement film heating conduction according to claim 5, which is characterized in that temperature control system
Using PID or the temperature controller of position formula, the output end of temperature control system is equipped with RS232 communication module, and temperature control system passes through
RS232 communication module is connect with data collecting card.
7. the device described in accordance with the claim 1 using steady state method measurement film heating conduction, which is characterized in that signal monitoring
It include computer, data collecting card, micro-ohm table, D.C. regulated power supply, circuit changing switch with automatic control system, in which: direct current
The lead of regulated power supply is connect by sealing electrical connector with sample stage, for being powered to test chip；Micro-ohm table passes through lead
Sample stage is connected, circuit changing switch is set on the lead that micro-ohm table is connect with sample stage, tests chip for real-time monitoring
On resistance variations；Also, micro-ohm table, D.C. regulated power supply and circuit changing switch are connect by data collecting card with computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821995605.9U CN209264608U (en) | 2018-11-30 | 2018-11-30 | A kind of device using steady state method measurement film heating conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821995605.9U CN209264608U (en) | 2018-11-30 | 2018-11-30 | A kind of device using steady state method measurement film heating conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209264608U true CN209264608U (en) | 2019-08-16 |
Family
ID=67565302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821995605.9U Active CN209264608U (en) | 2018-11-30 | 2018-11-30 | A kind of device using steady state method measurement film heating conduction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209264608U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109444214A (en) * | 2018-11-30 | 2019-03-08 | 中国科学院金属研究所 | A kind of device using steady state method measurement film heating conduction |
-
2018
- 2018-11-30 CN CN201821995605.9U patent/CN209264608U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109444214A (en) * | 2018-11-30 | 2019-03-08 | 中国科学院金属研究所 | A kind of device using steady state method measurement film heating conduction |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105588958B (en) | A kind of quick multifunctional electronic component temperature characteristic measuring instrument and test cavity | |
| CN101290299B (en) | Variable thermal conductivity factor measuring apparatus and method | |
| CN104181195B (en) | Steady-state method-based heat conductivity coefficient measurement device | |
| CN103630851B (en) | A kind of LED radiating module entire thermal resistance measuring method and measuring system | |
| CN104422711B (en) | Variable temperature sample platform and thermoelectric property measuring method | |
| CN208334251U (en) | A kind of heat dissipation index measurement device | |
| CN101788513A (en) | Measurement device of thermal conductivity of materials and method thereof | |
| CN205826173U (en) | A kind of test system of quick response hot thermocouple response time | |
| CN109613051B (en) | Device and method for measuring Seebeck coefficient of material by using contrast method | |
| CN109781776A (en) | A kind of device and method that can measure the multiple thermoelectricity parameters of material simultaneously | |
| CN111964935A (en) | Thermoelectric device performance testing device | |
| CN209264608U (en) | A kind of device using steady state method measurement film heating conduction | |
| CN106596625A (en) | Method and device for measuring natural-convection heat transfer coefficient at micro-scale | |
| CN106124955B (en) | The transient electrical test method of liquid cold plate thermal resistance | |
| CN201697888U (en) | Thermal inertia index detection device for single material space enclosing structures | |
| CN110018350A (en) | A kind of conductor DC resistance quick, intelligent measuring system online | |
| CN107917929A (en) | A kind of parallel hot line heat conduction coefficient tester of high accuracy unstable state and its test method | |
| CN109444214A (en) | A kind of device using steady state method measurement film heating conduction | |
| CN201594082U (en) | Portable soil thermal resistivity measuring device | |
| CN106468678B (en) | A kind of pyroelectricity material device for measuring properties | |
| CN109557374A (en) | The test device and method of small resistive element temperature-coefficient of electrical resistance | |
| CN205120630U (en) | Metal coefficient of linear extensibility experimental system | |
| CN110275077A (en) | The electric measurement method of pyroelectric effect in a kind of width warm area high-intensity magnetic field | |
| CN206594091U (en) | The measurement apparatus of thermal conductivity factor under a kind of asphalt different temperatures | |
| CN207571063U (en) | A kind of high temperature heat transfer fabricmeter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211111 Address after: 110168 building 8b, No. 15-3, Hunnan East Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Liaoning cold core semiconductor technology Co., Ltd Address before: No. 72, Wenhua Road, Shenhe District, Shenyang, Liaoning 110016 Patentee before: Institute of metals, Chinese Academy of Sciences |