CN209150150U - LED component and lamp group array - Google Patents

Abstract

The utility model provides a kind of LED component and lamp group array, wherein, LED component includes: supporting structure, supporting structure includes supporting substrate and frame, frame is arranged on supporting substrate, and surrounds the cup chamber for chip, and frame has annular heavy platform structure, annular heavy platform structure sinks to being formed by the portion of upper surface of the close cup chamber of frame, and annular heavy platform structure has annular step surface；Package assembling, package assembling is arranged at annular heavy platform structure, and is overlapped in annular step surface, and package assembling is Nian Jie with frame by glue.The utility model solve LED component in the prior art package assembling and bracket installation connection procedure it is cumbersome, there is only the problems of installation accuracy difference, and there is a problem of LED component processing and manufacturing convenience difference and LED component product economy difference.

Description

LED component and lamp group array

Technical field

The utility model relates to technical field of LED light illumination, in particular to a kind of LED component and lamp group array.

Background technique

Ultraviolet LED or deep ultraviolet LED, with powerful biocidal efficacies, are made extensively with it in refrigerator or family's electric lighting With.

In order to ensure the service life of LED component chip, it usually needs be sealed protection to chip.Traditional packaging process It is middle that protection is sealed to chip using the organic materials such as silica gel, epoxy resin, but above-mentioned organic material is in high temperature, Gao Zi The job stability of LED component has been seriously affected to easily cause component failure using easy aged deterioration in external environment, because This, organic packages have gradually been eliminated in LED encapsulation technology field.

In the related technology, inorganic encapsulated is widely used, i.e., package assembling lid made of inorganic translucent material is located at use In on the bracket of carrying chip, and the two is bonded to play the role of encapsulating chip.

In the prior art, the installation connection procedure of package assembling and bracket is relatively complicated, generally requires to pass through welding procedure Realize, be unfavorable for positioning the two in this way there is a problem of installation accuracy difference, and welding procedure is at high cost, It is time-consuming and laborious, it is unfavorable for the promotion of LED component processing and manufacturing convenience and LED component product economy.

Utility model content

The main purpose of the utility model is to provide a kind of LED components and lamp group array, in the prior art to solve The package assembling of LED component and the installation connection procedure of bracket are cumbersome, and there is only the problems of installation accuracy difference, and exist LED component fabricates the problem of convenience difference and LED component product economy difference.

To achieve the goals above, one aspect according to the present utility model provides a kind of LED component, comprising: bracket Structure, supporting structure include supporting substrate and frame, and frame is arranged on supporting substrate, and surrounds the cup for chip Chamber, frame have annular heavy platform structure, and annular heavy platform structure sinks to being formed by the portion of upper surface of the close cup chamber of frame, ring Shape heavy platform structure has annular step surface；Package assembling, package assembling is arranged at annular heavy platform structure, and is overlapped on annular table On terrace, and package assembling is Nian Jie with frame by glue.

Further, it is formed after portion of upper surface sinking first distance H of the annular step surface by the close cup chamber of frame, First distance H is more than or equal to 0.05mm and is less than or equal to 0.3mm.

Further, first distance H is 0.15mm.

Further, annular step surface is horizontally extending, and the extension width L of annular step surface in the horizontal plane is big In equal to 0.05mm and less than or equal to 0.3mm.

Further, annular step surface is annular in circular ring shape or four sides.

Further, annular heavy platform structure also has a lateral ring wall face connecting with annular step surface, lateral ring wall face with The upper surface of the non-countersink of frame connects；Glue fills the gap between package assembling and frame, and covers ring-shaped step The upper surface of the non-countersink in face, lateral ring wall face and at least part frame.

Further, the upper surface of the non-countersink of frame is completely covered in glue.

Further, the outer edge of orthographic projection of the glue on the upper surface of the non-countersink of frame is in polygon, and The adjacent both sides of polygon are connected by arc transition.

Further, the peripheral surface of frame includes multiple outside wall surfaces being connected, the junction of two neighboring outside wall surface Along cambered surface transition.

Further, supporting substrate includes substrate body and connection lamella, and substrate body is made of ceramic, and connection lamella is The copper sheet frame of the upper surface of substrate body is mounted on using sintering process, frame is the metal framework connecting with copper sheet frame, frame It is formed by the stacked plating of multi-layer annular copper sheet.

Further, projection of the frame in the upper surface of connection lamella is located at the inside of the upper surface of connection lamella.

Further, package assembling is made of glass, and the outer surface of package assembling is the part of the surface or ellipsoid of spherical surface The part of the surface in face.

Further, cup is intracavitary is provided with electrode, and chip is the chip that ultraviolet light is connect and can issued with electrode.

Another aspect according to the present utility model, provides a kind of lamp group array, including support frame, with array on support frame Form arrangement be provided with multiple LED components, LED component is above-mentioned LED component.

Using the technical solution of the utility model, since the frame of supporting structure has annular heavy platform structure, annular heavy platform The setting of structure can play the role of convenient package assembling and supporting structure suitability is installed, while can also play to encapsulation The circumferential position-limiting action of component, that is to say, that when package assembling can just be sunk in annular heavy platform structure, just can complete The positioning of package assembling and supporting structure, and annular heavy platform structure can also play the circumferential limit function to package assembling.

In addition, the bottom surface overlap joint of package assembling is supported in the annular step surface of annular heavy platform structure, it is ensured that bracket knot Structure is to the stability of strutting system of package assembling, and bonding with frame convenient for package assembling, package assembling is Nian Jie with supporting structure, true Under the premise of having protected the two stable connection and there is good seal performance to cup chamber, the processing of LED component is significantly simplified Manufacturing process, convenient for controlling the processing and manufacturing cost of LED component.

As it can be seen that LED component provided by the present application not only assemble it is convenient, have good assembly precision, and fabricate work Skill is simple, is conducive to the promotion of LED component product economy.

Detailed description of the invention

The accompanying drawings constituting a part of this application is used to provide a further understanding of the present invention, this is practical Novel illustrative embodiments and their description are not constituteed improper limits to the present invention for explaining the utility model. In the accompanying drawings:

Fig. 1 shows a kind of main view schematic cross-sectional view of the LED component of alternative embodiment according to the present utility model；

Fig. 2 shows the schematic top plan views of the LED component that can show which glue coating position in Fig. 1；

Fig. 3 shows the main view schematic cross-sectional view of the supporting structure of the LED component in Fig. 1；

Fig. 4 shows the enlarged diagram at the A in Fig. 3.

Wherein, the above drawings include the following reference numerals:

10, supporting structure；100, cup chamber；11, supporting substrate；111, substrate body；112, lamella is connected；12, frame； 121, annular heavy platform structure；122, annular step surface；123, lateral ring wall face；124, peripheral surface；125, outside wall surface；20, it seals Arrangement；30, chip；40, glue；50, electrode.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model It clearly and completely describes, it is clear that described embodiment is only the utility model a part of the embodiment, rather than whole realities Apply example.Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as practical new to this Type and its application or any restrictions used.Based on the embodiments of the present invention, those of ordinary skill in the art are not having Every other embodiment obtained under the premise of creative work is made, is fallen within the protection scope of the utility model.

In order to solve LED component in the prior art package assembling and bracket installation connection procedure it is cumbersome, not only deposit In the problem of installation accuracy difference, and asking there are LED component processing and manufacturing convenience difference and LED component product economy difference Topic, the utility model provide a kind of LED component and lamp group array, wherein lamp group array includes support frame, with battle array on support frame The form arrangement of column is provided with multiple LED components, and LED component is above-mentioned and following LED component.

As shown in Figures 1 to 4, LED component includes supporting structure 10 and package assembling 20, and supporting structure 10 includes branch support group Plate 11 and frame 12, frame 12 is arranged on supporting substrate 11, and surrounds the cup chamber 100 for chip 30, and frame 12 has There is annular heavy platform structure 121, annular heavy platform structure 121 sinks to being formed by the portion of upper surface of the close cup chamber 100 of frame 12, Annular heavy platform structure 121 has annular step surface 122, and package assembling 20 is arranged at annular heavy platform structure 121, and is overlapped on ring On shape step surface 122, and package assembling 20 is Nian Jie with frame 12 by glue 40.

Since the frame 12 of supporting structure 10 has annular heavy platform structure 121, the setting of annular heavy platform structure 121 can be risen To the effect of convenient package assembling 20 and the installation of 10 suitability of supporting structure, while the circumferential direction to package assembling 20 can also be played Position-limiting action, that is to say, that when package assembling 20 can just be sunk in annular heavy platform structure 121, just can complete to encapsulate The positioning of component 20 and supporting structure 10, and annular heavy platform structure 121 can also play the circumferential limit function to package assembling 20 Energy.

In addition, the bottom surface overlap joint of package assembling 20 is supported in the annular step surface 122 of annular heavy platform structure 121, it is ensured that Stability of strutting system of the supporting structure 10 to package assembling 20, package assembling 20 bonding with frame 12 convenient for package assembling 20 It is Nian Jie with supporting structure 10, under the premise of ensuring the two stable connection and there is good seal performance to cup chamber 100, greatly The earth simplifies the process for machining and manufacturing of LED component, convenient for controlling the processing and manufacturing cost of LED component.

As it can be seen that LED component provided by the present application not only assemble it is convenient, have good assembly precision, and fabricate work Skill is simple, is conducive to the promotion of LED component product economy.

As shown in Figure 3 and Figure 4, in this application, annular heavy platform structure 121 also has and connect with annular step surface 122 Lateral ring wall face 123, lateral ring wall face 123 is connect with the upper surface of the non-countersink of frame 12；Glue 40 fills encapsulation group Gap between part 20 and frame 12, and cover annular step surface 122, lateral ring wall face 123 and at least part frame 12 The upper surface of non-countersink.This ensures that, glues 40 to have good bonding effect, glue to frame 12 and package assembling 20 After liquid 40 solidifies, frame 12 and package assembling 20 are stably formed integral structure, improve the structural soundness of LED component.

As shown in Figure 3 and Figure 4, annular step surface 122 sinks the by the portion of upper surface of the close cup chamber 100 of frame 12 It is formed after one distance H, optionally, first distance H is more than or equal to 0.05mm and is less than or equal to 0.3mm.The frame of this structure type Frame 12 is convenient for molding, and its specific structure plays convenient for assembling with package assembling 20, and reliably limits package assembling 20 The effect of position；In addition, passing through the numberical range of optimization first distance H, it can be ensured that lateral ring wall face 123 has enough height Degree, so as to obtain its specific surface area, so that having between lateral ring wall face 123 and the outer surface of package assembling 20 enough Big gap and the glue 40 that sufficient amount can be stored, be conducive to glue 40 frame 12 and package assembling 20 are carried out it is stable viscous It connects.

In a preferred embodiment of the present application, first distance H is 0.15mm.

As shown in figure 4, annular step surface 122 is horizontally extending, and the extension of annular step surface 122 in the horizontal plane Width L is more than or equal to 0.05mm and is less than or equal to 0.3mm.Pass through the extension width L of optimization annular step surface 122 in the horizontal plane Numberical range make it that there is enough connect between package assembling 20 to optimize the surface area of annular step surface 122 Supporting surface is touched, so that the stability of strutting system to package assembling 20 is improved, in addition, annular step surface 122 can also be coated with glue Liquid 40 plays the bonding effect to package assembling 20.

Optionally, annular step surface 122 is annular in circular ring shape or four sides.The annular step surface of such two kinds of structure type 122 all have convenient for molding and beautiful characteristic.

Optionally, the upper surface (showing in Fig. 2) of the non-countersink of frame 12 is completely covered in glue 40.In this way, true Glue 40 has been protected to be sufficient filling with to be promoted to the same of the sealing effect of cup chamber 100 gap between frame 12 and package assembling 20 When, the contact area of glue 40 Yu frame 12 is effectively increased, so that the adhesive force between glue 40 and frame 12 is increased, The connective stability between the glue 40 after solidifying and frame 12 is greatly improved.

Certainly, as shown in Fig. 2, in the present embodiment, glue 40 on the upper surface of the non-countersink of frame 12 just The outer edge of projection is in polygon, and the adjacent both sides of polygon are connected by arc transition.In this way, glue 40 is avoided to be attached to There is burr in edge on the upper surface of the non-countersink of frame 12, more favorably promotes the aesthetic appearance of LED component.

As shown in Figures 1 to 4, it in the illustrated embodiment of the application, for the ease of the processing and manufacturing to frame 12, and mentions The aesthetic appearance of LED component is risen, the peripheral surface 124 of frame 12 includes multiple outside wall surfaces 125 being connected, two neighboring outer wall The junction in face 125 is along cambered surface transition.

It should be noted that as shown in Fig. 1 of this application, electrode 50 is provided in cup chamber 100, chip 30 is and electrode 50 Connect and can issue the chip 30 of ultraviolet light.Glue 40 in the application is the silica gel with uvioresistant performance.In this way, avoiding Ultraviolet light or deep ultraviolet light cause glue 40 to corrode and caused the light transmission of coloured effect package assembling 20, to have Having ensures that LED component has the advantages that good luminous performance.

As shown in Figures 1 to 4, in this application, supporting substrate 11 includes substrate body 111 and connection lamella 112, substrate Ontology 111 is made of ceramic, and connection lamella 112 is the copper sheet frame that the upper surface of substrate body 111 is mounted on using sintering process, Frame 12 is the metal framework connecting with copper sheet frame, and frame 12 is formed by the stacked plating of multi-layer annular copper sheet.

In order to avoid the cutter frame 12 when being punched to LED component, as shown in Fig. 2, frame 12 is in connection lamella 112 The projection of upper surface is located at the inside of the upper surface of connection lamella 112.

Optionally, package assembling 20 is made of glass, and the outer surface of package assembling 20 is the part of the surface or ellipse of spherical surface The part of the surface of spherical surface.The package assembling 20 of structure type has more excellent translucent effect in this way.

It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.

Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments Up to the unlimited the scope of the utility model processed of formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each shown in attached drawing The size of a part is not to draw according to actual proportionate relationship.For skill known to person of ordinary skill in the relevant Art, method and apparatus may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as awarding Weigh part of specification.In shown here and discussion all examples, any occurrence should be construed as merely example Property, not as limitation.Therefore, the other examples of exemplary embodiment can have different values.It should also be noted that similar Label and letter similar terms are indicated in following attached drawing, therefore, once be defined in a certain Xiang Yi attached drawing, then with In attached drawing afterwards do not need that it is further discussed.

For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ", " ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction " Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and " in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and And respective explanations are made to the opposite description in space used herein above.

It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet Include " when, indicate existing characteristics, step, work, device, component and/or their combination.

It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, " Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein Or the sequence other than those of description is implemented.

The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.

Claims (14)

1. a kind of LED component characterized by comprising

Supporting structure (10), the supporting structure (10) include supporting substrate (11) and frame (12), frame (12) setting On the supporting substrate (11), and the cup chamber (100) for chip (30) is surrounded, the frame (12) has annular heavy Platform structure (121), the annular heavy platform structure (121) is by the frame (12) on the part of the cup chamber (100) Surface Subsidence is formed, and the annular heavy platform structure (121) has annular step surface (122)；

Package assembling (20), package assembling (20) setting are overlapped on the ring at the annular heavy platform structure (121) On shape step surface (122), and the package assembling (20) is Nian Jie with the frame (12) by glue (40).

2. LED component according to claim 1, which is characterized in that the annular step surface (122) is by the frame (12) The portion of upper surface sinking first distance H at the cup chamber (100) after formed, the first distance H is more than or equal to 0.05mm and be less than or equal to 0.3mm.

3. LED component according to claim 2, which is characterized in that the first distance H is 0.15mm.

4. LED component according to claim 1, which is characterized in that the annular step surface (122) is prolonged in the horizontal direction It stretches, and the extension width L of the annular step surface (122) in the horizontal plane is more than or equal to 0.05mm and is less than or equal to 0.3mm.

5. LED component according to claim 4, which is characterized in that the annular step surface (122) is in circular ring shape or four Side annular.

6. LED component according to claim 1, which is characterized in that it is described annular heavy platform structure (121) also have with it is described The lateral ring wall face (123) of annular step surface (122) connection, the lateral ring wall face (123) and the frame (12) not under The upper surface connection of heavy part；The glue (40) fills the gap between the package assembling (20) and the frame (12), And cover not sinking for the annular step surface (122), the lateral ring wall face (123) and at least part frame (12) Partial upper surface.

7. LED component according to claim 6, which is characterized in that the frame (12) are completely covered in the glue (40) Non- countersink upper surface.

8. LED component according to claim 6 or 7, which is characterized in that the glue (40) the frame (12) not The outer edge of orthographic projection on the upper surface of countersink is in polygon, and the adjacent both sides of the polygon pass through arc transition Connection.

9. LED component according to claim 1, which is characterized in that the peripheral surface (124) of the frame (12) includes more A outside wall surface (125) being connected, the junction of the two neighboring outside wall surface (125) is along cambered surface transition.

10. LED component according to claim 1, which is characterized in that the supporting substrate (11) includes substrate body (111) it is made of ceramic with connection lamella (112), the substrate body (111), the connection lamella (112) is using sintering For process Installation in the copper sheet frame of the upper surface of the substrate body (111), the frame (12) is to connect with the copper sheet frame Metal framework, the frame (12) are formed by the stacked plating of multi-layer annular copper sheet.

11. LED component according to claim 10, which is characterized in that the frame (12) is in the connection lamella (112) Upper surface projection be located at it is described connection lamella (112) upper surface inside.

12. LED component according to claim 1, which is characterized in that the package assembling (20) is made of glass, and institute The outer surface for stating package assembling (20) is the part of the surface of spherical surface or the part of the surface of ellipsoid.

13. LED component according to claim 1, which is characterized in that be provided with electrode (50), institute in the cup chamber (100) Stating chip (30) is the chip (30) that ultraviolet light is connect and can issued with the electrode (50).

14. a kind of lamp group array, which is characterized in that including support frame, arrangement is provided in an array manner on support frame as described above Multiple LED components, the LED component are LED component described in any one of claims 1 to 13.