CN209150148U - Supporting structure, LED component, support array and lamp group array - Google Patents
Supporting structure, LED component, support array and lamp group array Download PDFInfo
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- CN209150148U CN209150148U CN201822099709.8U CN201822099709U CN209150148U CN 209150148 U CN209150148 U CN 209150148U CN 201822099709 U CN201822099709 U CN 201822099709U CN 209150148 U CN209150148 U CN 209150148U
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Abstract
The utility model provides a kind of supporting structure, LED component, support array and lamp group array, wherein supporting structure includes: supporting substrate；Metal framework, metal framework is arranged on supporting substrate, and surrounds the cup chamber for chip, and projection of the metal framework in the upper surface of supporting substrate is located at the inside of the upper surface of supporting substrate.It is unreasonable that the utility model solves supporting structure in the prior art, when needing successively to cut lower LED component from lamp group array using cutter, the part that cutter is easy to surround glass chamber in the bracket with LED component is touched, cause bracket damage or tool damage, and influence the product yield of LED component, increase the cost of cutting operation, the problem of reducing the efficiency of cutting operation.
Description
Technical field
The utility model relates to technical field of LED light illumination, in particular to a kind of supporting structure, LED component, branch
Frame array and lamp group array.
Background technique
Ultraviolet LED or deep ultraviolet LED, with powerful biocidal efficacies, are made extensively with it in refrigerator or family's electric lighting
With.
In order to ensure the service life of LED component chip, it usually needs be sealed protection to chip.Traditional packaging process
It is middle that protection is sealed to chip using the organic materials such as silica gel, epoxy resin, but above-mentioned organic material is in high temperature, Gao Zi
The job stability of LED component has been seriously affected to easily cause component failure using easy aged deterioration in external environment, because
This, organic packages have gradually been eliminated in LED encapsulation technology field.
In the related technology, inorganic encapsulated is widely used, i.e., package lens lid made of inorganic translucent material is located at use
In on the bracket of carrying chip, and the two is bonded to play the role of encapsulating chip.
In the prior art, it is normally made of porcelain for carrying the bracket of chip, for convenience between package lens
Installation connection, while ensuring that the light issued to chip plays the role of convergence, ceramics bracket usually requires setting cup chamber.And it is existing
Supporting structure it is unreasonable, when needing using cutter successively to cut lower LED component from lamp group array, cutter be easy to
The part that glass chamber is surrounded in the bracket of LED component is touched, to cause bracket damage or tool damage, is not only affected
The product yield of LED component, and the cost of cutting operation is increased, reduce the efficiency of cutting operation.
Utility model content
The main purpose of the utility model is to provide a kind of supporting structure, LED component, support array and lamp group array,
It is unreasonable to solve supporting structure in the prior art, the LED component under needing successively to cut from lamp group array using cutter
When, the part that cutter is easy to surround glass chamber in the bracket with LED component is touched, bracket damage or tool damage are caused,
And the problem of influencing the product yield of LED component, increasing the cost of cutting operation, reduce the efficiency of cutting operation.
To achieve the goals above, one aspect according to the present utility model provides a kind of supporting structure, comprising: branch
Support group plate；Metal framework, metal framework is arranged on supporting substrate, and surrounds the cup chamber for chip, and metal framework
Projection in the upper surface of supporting substrate is located at the inside of the upper surface of supporting substrate.
Further, be projected as annular projection of the metal framework in the upper surface of supporting substrate, and the outside of annular projection
Along polygon is surrounded, the adjacent two wall surface junction cambered surface transition of the peripheral surface away from cup chamber side of metal framework connects
It connects.
Further, the outer edge of annular projection surrounds quadrangle, and adjacent two of the peripheral surface of metal framework
Wall surface junction is connected smoothly along circular arc.
Further, mounting distance H is formed between the outer edge of annular projection and the outer peripheral surface of supporting substrate.
Further, supporting substrate includes substrate body and metal connecting layer, and metal connecting layer is formed by sintering process
In the upper surface of substrate body, metal framework is arranged in metal connecting layer, and metal framework is in the upper surface of metal connecting layer
Projection be located at metal connecting layer upper surface inside.
Further, metal connecting layer is becket frame, the inner peripheral surface of metal framework and the inner peripheral surface of becket frame
Concordantly, and the projection of the upper surface in substrate body of metal connecting layer is located inside the upper surface of substrate body.
Further, metal connecting layer is becket frame, the peripheral surface of metal framework and the peripheral surface of becket frame
Between formed mounting distance L.
Further, metal framework includes stacked multiple layer metal frame, and multiple layer metal frame passes through electroplating technology molding and phase
The underlying metal frame for being fixedly connected, and being located at metal framework is fixed on the upper surface of metal connecting layer by electroplating technology molding.
Another aspect according to the present utility model provides a kind of LED component, comprising: supporting structure, supporting structure are upper
The supporting structure stated；Chip, chip be mounted on supporting structure cup is intracavitary and and pad solder；Package lens, package lens lid
It is located at the upper surface of the metal framework of supporting structure, with seal cup chamber.
Another aspect according to the present utility model, provides a kind of support array, including support frame, with array on support frame
Form arrangement be provided with multiple supporting structures, supporting structure is above-mentioned supporting structure.
Another aspect according to the present utility model, provides a kind of lamp group array, and lamp group array passes through to above-mentioned bracket
It encapsulates after the intracavitary successively chip of the cup of multiple supporting structures of array and successively and is formed.
Using the technical solution of the utility model, by during the initial stage machine-shaping of supporting structure to carrying out bracket
Structure optimization is oppositely arranged positional relationship with supporting substrate to the structure of metal framework and metal framework and optimizes, makes
Projection of the metal framework in the upper surface of supporting substrate on supporting substrate is located at the inside of the upper surface of supporting substrate.In this way,
So that the area of the upper surface of supporting substrate is greater than or equal to the area of the circumference of metal framework, it is convex to avoid metal framework
For the peripheral side of supporting substrate, to enable cutting tool directly to cut when cutting to lamp group array in the later period
It onto supporting substrate, effectively prevents cutting tool and touches metal framework, improve to the cutting essence that lamp group array is stable
Degree, while also improving by the product yield of multiple LED components under cutting.In addition, cutting tool will not be by metal frame
Colliding with for frame and damage, extend the service life of cutting tool, do not need frequently to replace cutting tool, reduce cutting operation
Cost.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide a further understanding of the present invention, this is practical
Novel illustrative embodiments and their description are not constituteed improper limits to the present invention for explaining the utility model.
In the accompanying drawings:
Fig. 1 shows a kind of main view schematic cross-sectional view of the supporting structure of alternative embodiment according to the present invention；
Fig. 2 shows the enlarged diagrams at the A in Fig. 1；
Fig. 3 shows perspective view of the metal framework of the supporting structure in Fig. 1 on the upper surface of supporting substrate；
Fig. 4 shows a kind of master of the LED component with the supporting structure in Fig. 1 of alternative embodiment according to the present invention
Depending on schematic cross-sectional view；
Fig. 5 shows a kind of bracket battle array with multiple supporting structures in Fig. 1 of alternative embodiment according to the present invention
The partial structural diagram of column；
Fig. 6 is shown after the intracavitary successively chip of cup of multiple supporting structures of the support array in Fig. 5 and successively
The partial structural diagram of the lamp group array of encapsulation and formation.
Wherein, the above drawings include the following reference numerals:
1, supporting structure；2, chip；3, package lens；100, support frame；10, supporting substrate；11, substrate body；12, golden
Belong to articulamentum；20, metal framework；21, cup chamber；22, metal frame；23, annular projection；231, outer edge；232, inside edge；40,
Pad.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that described embodiment is only the utility model a part of the embodiment, rather than whole realities
Apply example.Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as practical new to this
Type and its application or any restrictions used.Based on the embodiments of the present invention, those of ordinary skill in the art are not having
Every other embodiment obtained under the premise of creative work is made, is fallen within the protection scope of the utility model.
It is unreasonable in order to solve supporting structure in the prior art, when needing successively to cut from lamp group array using cutter
When lower LED component, the part that cutter is easy to surround glass chamber in the bracket with LED component is touched, cause bracket damage or
Tool damage, and the problem of influence the product yield of LED component, increase the cost of cutting operation, reduce the efficiency of cutting operation,
The utility model provides a kind of supporting structure 1, LED component, support array and lamp group array, wherein as shown in fig. 6, lamp group
Array is by successively after chip 2 and successively encapsulating shape in the cup chamber 21 to multiple supporting structures of above-mentioned support array
At, that is to say, that lamp group array includes multiple above-mentioned LED components, as shown in figure 5, support array includes support frame 100, branch
Arrangement is provided with multiple supporting structures 1 in an array manner on support 100, and supporting structure is above-mentioned and following supporting structure 1,
It should also be noted that, lamp group array can cut down the LED component in multiple such as 4 by cutting technique, as shown in figure 4, respectively
LED component includes supporting structure 1, chip 2 and package lens 3, and chip 2 is mounted in the cup chamber 21 of supporting structure 1 and and pad
40 welding, package lens 3 cover the upper surface for being located at the metal framework 20 of supporting structure 1, with seal cup chamber 21.
It should be noted that as shown in Figure 3 and Figure 4, pad 40 is the part-structure of supporting structure 1, part of it is formed
In the upper surface of the substrate body 11 of supporting structure 1, and it is located in cup chamber 21；In this application, chip 2 is chosen as to issue
The chip of ultraviolet light or deep ultraviolet light.
As depicted in figs. 1 and 2, supporting structure includes supporting substrate 10 and metal framework 20, and the setting of metal framework 20 is being propped up
On support group plate 10, and the cup chamber 21 for chip 2 is surrounded, and metal framework 20 is in the projection of the upper surface of supporting substrate 10
Positioned at the inside of the upper surface of supporting substrate 10.
By optimizing during the initial stage machine-shaping of supporting structure 1 to progress supporting structure 1, i.e., to metal framework 20
Structure and metal framework 20 be oppositely arranged positional relationship with supporting substrate 10 and optimize, make the metal on supporting substrate 10
Projection of the frame 20 in the upper surface of supporting substrate 10 is located at the inside of the upper surface of supporting substrate 10.In this way, making branch support group
The area of the upper surface of plate 10 is greater than or equal to the area of the circumference of metal framework 20, avoids metal framework 20 and protrudes from
The peripheral side of supporting substrate 10, to enable cutting tool to be cut directly into when cutting to lamp group array in the later period
It on supporting substrate 10, effectively prevents cutting tool and touches metal framework 20, improve the cutting stable to lamp group array
Precision, while also improving by the product yield of multiple LED components under cutting.
In addition, cutting tool will not be collided with and damage by metal framework 20, extend cutting tool uses the longevity
Life, does not need frequently to replace cutting tool, reduces the cost of cutting operation.
As shown in figure 3, metal framework 20 is projected as annular projection 23, and annular projection in the upper surface of supporting substrate 10
23 outer edge 231 surrounds polygon, adjacent two wall surface of the peripheral surface away from 21 side of cup chamber of metal framework 20
Junction cambered surface transition connection.In this application, the peripheral surface and inner peripheral surface of metal framework 20 extend along the vertical direction,
Surface blending is formed at the vertical edge of the peripheral surface of the metal framework 20 of this structure, not only makes the periphery of metal framework 20
Smooth surface, is conducive to the aesthetic appearance of lifting bracket structure 1, and prevents the peripheral surface of metal framework 20 from burr occur,
Reduce the product quality of LED component.
In the present embodiment, the outer edge 231 of annular projection 23 surrounds quadrangle, and the peripheral surface of metal framework 20
Two adjacent wall surface junctions are connected smoothly along circular arc.The manufacture easy to process of metal framework 20 of this structure type,
Advantageously reduce the overall processing manufacturing cost of supporting structure 1.
As shown in figure 3, in the present embodiment, the inside edge 232 of annular projection 23 surrounds polygon, the court of metal framework 20
Adjacent two wall surface junction cambered surface transition connection to the inner peripheral surface of 21 side of cup chamber.In this application, metal framework
20 peripheral surface and inner peripheral surface extends along the vertical direction, the vertical edge of the inner peripheral surface of the metal framework 20 of this structure
Place forms surface blending, not only makes the inner peripheral surface of metal framework 20 smooth, be conducive to be promoted emit beam to chip 2 it is anti-
Effect is penetrated, the luminous intensity of LED component is promoted, and prevents the inner peripheral surface of metal framework 20 from burr occur, reduces LED device
The product quality of part.
In the present embodiment, the inside edge 232 of annular projection 23 surrounds quadrangle, and the inner peripheral surface of metal framework 20
Two adjacent wall surface junctions are connected smoothly along circular arc.The manufacture easy to process of metal framework 20 of this structure type,
Advantageously reduce the overall processing manufacturing cost of supporting structure 1.
Certainly, in the alternative embodiment (not shown) of the application, the inside edge 232 of annular projection 23 surrounds circle
Or ellipse, so that cup chamber 21 is cylindric or elliptic cylindrical shape, is not only convenient for forming, and is conducive to promote metal framework
The luminescent properties of 20 inner peripheral surface.
As shown in Fig. 2, the outer edge 231 of annular projection 23 forms mounting distance between the outer peripheral surface of supporting substrate 10
H.In this way, further ensuring that cutting tool is cut directly into branch support group that can avoid open metal framework 20 to lamp group array
Plate 10 improves the product yield of LED component.
Optionally, mounting distance H is greater than 0 and is less than or equal to 0.5mm.
As depicted in figs. 1 and 2, supporting substrate 10 includes substrate body 11 and metal connecting layer 12, and metal connecting layer 12 is logical
Oversintering technological forming is in the upper surface of substrate body 11, and metal framework 20 is arranged in metal connecting layer 12, and metal framework
20 projection in the upper surface of metal connecting layer 12 is located at the inside of the upper surface of metal connecting layer 12.In this way, making metal frame
The bottom surface of frame 20 comes into full contact with metal connecting layer 12, improves connective stability between the two, and then improves bracket knot
The overall structure stability of structure 1.
In this application, metal connecting layer 12 is becket frame, and the inner peripheral surface of metal framework 20 is interior with becket frame
Perimeter surface is concordant.The inner wall whole smooth for making glass chamber 21 in this way is conducive to the product characteristic for promoting LED component.
Optionally, in the present embodiment, substrate body 11 is made of ceramic, and metal connecting layer 12 and metal framework 20 are by copper
At.The supporting structure 1 of this material combining form is convenient for the materials of Each part, has greatly saved the whole of supporting structure 1
Body fabricates cost.
As shown in Fig. 2, metal connecting layer 12 is becket frame, the peripheral surface of metal framework 20 and the periphery of becket frame
Mounting distance L is formed between surface.In this way, further ensuring that cutting tool can avoid open metal framework to lamp group array
20 and be cut directly into supporting substrate 10, improve the product yield of LED component.
Optionally, mounting distance L is greater than 0 and is less than or equal to 0.2mm.
Optionally, the projection of the upper surface in substrate body 11 of metal connecting layer 12 is located at the upper surface of substrate body 11
Inside, cutting tool cut to substrate body 11 when cutting supporting substrate 10 without cutting to metal connecting layer 12, further
The injury to cutter is reduced, avoids cutting to metal connecting layer 12 and substrate body 11 being made flash occur, influences appearance of device.
In this application, metal framework 20 includes stacked multiple layer metal frame 22, and multiple layer metal frame 22 passes through electroplating technology
It forms and is mutually fixedly connected, and the underlying metal frame 22 for being located at metal framework 20 is fixed on metal connection by electroplating technology molding
The upper surface of layer 12.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments
Up to the unlimited the scope of the utility model processed of formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each shown in attached drawing
The size of a part is not to draw according to actual proportionate relationship.For skill known to person of ordinary skill in the relevant
Art, method and apparatus may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as awarding
Weigh part of specification.In shown here and discussion all examples, any occurrence should be construed as merely example
Property, not as limitation.Therefore, the other examples of exemplary embodiment can have different values.It should also be noted that similar
Label and letter similar terms are indicated in following attached drawing, therefore, once be defined in a certain Xiang Yi attached drawing, then with
In attached drawing afterwards do not need that it is further discussed.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and
And respective explanations are made to the opposite description in space used herein above.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (11)
1. a kind of supporting structure characterized by comprising
Supporting substrate (10)；
Metal framework (20), the metal framework (20) is arranged on the supporting substrate (10), and surrounds for chip
(2) cup chamber (21), and projection of the metal framework (20) in the upper surface of the supporting substrate (10) is located at the support
The inside of the upper surface of substrate (10).
2. supporting structure according to claim 1, which is characterized in that the metal framework (20) is in the supporting substrate
(10) upper surface is projected as annular projection (23), and the outer edge (231) of the annular projection (23) surrounds polygon, institute
State the adjacent two wall surface junction cambered surface transition of the peripheral surface away from cup chamber (21) side of metal framework (20)
Connection.
3. supporting structure according to claim 2, which is characterized in that the outer edge (231) of the annular projection (23) encloses
Quadrangularly, and the adjacent two wall surface junction of the peripheral surface of the metal framework (20) seamlessly transits along circular arc and connects
It connects.
4. supporting structure according to claim 2, which is characterized in that the outer edge (231) of the annular projection (23) with
Mounting distance H is formed between the outer peripheral surface of the supporting substrate (10).
5. supporting structure according to claim 1, which is characterized in that the supporting substrate (10) includes substrate body (11)
With metal connecting layer (12), the metal connecting layer (12) is molded over the upper table of the substrate body (11) by sintering process
Face, the metal framework (20) are arranged on the metal connecting layer (12), and the metal framework (20) connects in the metal
Connect the upper surface of layer (12) projection be located at the metal connecting layer (12) upper surface inside.
6. supporting structure according to claim 5, which is characterized in that the metal connecting layer (12) is becket frame, institute
The inner peripheral surface for stating metal framework (20) is concordant with the inner peripheral surface of the becket frame, and the metal connecting layer (12)
The projection of the upper surface of the substrate body (11) is located inside the upper surface of the substrate body (11).
7. supporting structure according to claim 5, which is characterized in that the metal connecting layer (12) is becket frame, institute
State formation mounting distance L between the peripheral surface of metal framework (20) and the peripheral surface of the becket frame.
8. supporting structure according to claim 5, which is characterized in that the metal framework (20) includes stacked multilayer gold
Belong to frame (22), the multiple layer metal frame (22) is formed by electroplating technology and is mutually fixedly connected, and is located at the metal framework
(20) metal frame described in bottom (22) is fixed on the upper surface of the metal connecting layer (12) by electroplating technology molding.
9. a kind of LED component characterized by comprising
Supporting structure (1), the supporting structure (1) are supporting structure described in any item of the claim 1 to 8；
Chip (2), the chip (2) are mounted in the cup chamber (21) of the supporting structure (1) and weld with pad (40)；
Package lens (3), package lens (3) lid are located at the upper surface of the metal framework (20) of the supporting structure (1), with
Seal the cup chamber (21).
10. a kind of support array, which is characterized in that including support frame (100), on support frame as described above (100) in an array manner
Arrangement is provided with multiple supporting structures (1), and the supporting structure is supporting structure described in any item of the claim 1 to 8.
11. a kind of lamp group array, which is characterized in that the lamp group array passes through to the multiple of the support array in claim 10
Successively chip (2) encapsulates formation afterwards and successively in the cup chamber (21) of supporting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822099709.8U CN209150148U (en) | 2018-12-13 | 2018-12-13 | Supporting structure, LED component, support array and lamp group array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822099709.8U CN209150148U (en) | 2018-12-13 | 2018-12-13 | Supporting structure, LED component, support array and lamp group array |
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| Publication Number | Publication Date |
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| CN209150148U true CN209150148U (en) | 2019-07-23 |
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ID=67290068
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| Application Number | Title | Priority Date | Filing Date |
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| CN201822099709.8U Active CN209150148U (en) | 2018-12-13 | 2018-12-13 | Supporting structure, LED component, support array and lamp group array |
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| CN (1) | CN209150148U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3879587A1 (en) * | 2020-03-11 | 2021-09-15 | Lextar Electronics Corp. | Led package structure |
-
2018
- 2018-12-13 CN CN201822099709.8U patent/CN209150148U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3879587A1 (en) * | 2020-03-11 | 2021-09-15 | Lextar Electronics Corp. | Led package structure |
| US11670748B2 (en) | 2020-03-11 | 2023-06-06 | Lextar Electronics Corporation | LED package structure |
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