CN208963722U - Multilayer cover band construction - Google Patents

Multilayer cover band construction Download PDF

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Publication number
CN208963722U
CN208963722U CN201821074527.9U CN201821074527U CN208963722U CN 208963722 U CN208963722 U CN 208963722U CN 201821074527 U CN201821074527 U CN 201821074527U CN 208963722 U CN208963722 U CN 208963722U
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CN
China
Prior art keywords
copolymer
main surface
lid band
polymer
band
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Active
Application number
CN201821074527.9U
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Chinese (zh)
Inventor
朱燚磊
拉尔夫·R·罗伯茨
艾军
沈时骏
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3M Innovative Properties Co
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3M Innovative Properties Co
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Priority to CN201821074527.9U priority Critical patent/CN208963722U/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/40—Closed containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2465/00—Presence of polyphenylene
    • C09J2465/006—Presence of polyphenylene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Abstract

The utility model provides a kind of carrier band product comprising heat seal lid band and the carrier band with multiple pits.The multilayer cover band includes thermoplastic base layer, thermoplasticity bed course, antistatic layer and heat sealing layer.The antistatic layer has polymeric binder or copolymer binder and the PEDOT-PSS being dispersed in the polymeric binder or copolymer binder (poly- 3,4-rthylene dioxythiophene-polystyrolsulfon acid).The sealant is heat-activatable adhesive.

Description

Multilayer cover band construction
Technical field
The heat seal lid band that the utility model relates to apply for electronic component packing.It specifically, can be by lid band heat seal Facilitate the storage, transport and installation of small-sized electronic part to carrier band.
Background technique
As electronic component becomes increasingly to minimize, storage, transport and the processing of this base part become more and more difficult, And special method is gradually formed.A kind of such method is using carrier band.Carrier band can be formed of a variety of materials, but usually It is plastic material, is formed to have the band of multiple longitudinally concave portions or concave portion, the multiple longitudinally concave portion or recessed Portion is intended to keep all parts to prevent them to be in contact with each other or be otherwise damaged.Such concave portion must have Upper opening, component are placed in recessed portion by the upper opening, are then generally had to by lid band sealed opening.
It is multiple-layer laminated polymer foam structure for a kind of material of the lid with suggestion used in punching press carrier band, as the U.S. is special Described in benefit 4,657,137.The lid band is needed using at least two individual layers, and by providing thin plastics or bubble flexible Prepared by foam layer, wherein firm and stable base is laminated to the thin plastics or froth bed.
Carrier band disclosed in United States Patent (USP) 4,964,405 has the lid band pasted with adhesive, which only seals recessed Concave portion and make guidance perforation stay open.
Have for example, at least commonly used in the lid band of carrier band partly with the adhesive coating of such as Ethylene/vinyl acetate Nylon-type substrate.See, for example, United States Patent (USP) 4,963,405.
It is to provide suitable lid band using carrier band and a problem of lid band, all parts is sealed, and can't be with Certain mode causes the pollution of adhesive or remover.Carrier band or lid band must also provide some protections for preventing static development, Static development can damage such fine electronic component；In fact, the winding and backing off of lid band can be added by generating electrostatic charge Acute problems.Lid band is usually made as having electrostatic dissipation band among adhesive, which derives from The metal of steam coating.Band covering adhesive is not showed a film by the triboelectric charge that discharge is formed come guard block simultaneously It rings.But such band is opaque, it means that component cannot be observed in its concave portion, and they are very expensive.
In United States Patent (USP) 6,171,672, electrostatic dissipation coating is disclosed, contains carbon, cation, anion and Fei Te Fixed organic polymer conductor.Ion salt is not permanent coating, and may be leached, and pollution problem is increased.In addition, it Be humidity dependence and can be corrosive.In addition, such carbon and metal are opaque.In U.S. Patent Publication Lid band is described in 2003/0049437 comprising the conductive coating containing conducting polymer dispersions.
Utility model content
The heat seal lid band that the utility model relates to apply for electronic component packing.It specifically, can be by lid band heat seal Facilitate the storage, transport and installation of small-sized electronic part to carrier band.The utility model includes lid band.In some embodiments In, lid band includes base, bed course, antistatic layer and sealant.Base have the first main surface and the second main surface, and including With a thickness of 10-20 microns of thermoplastic polymer.Bed course has the first main surface and the second main surface, and wherein the first of bed course is main Surface is contacted with the second main surface of base or the first main surface of bed course is bonded to the second main table of base with bonding mode Face, and bed course includes the polymeric thermoplastic composition or copolymer thermoplastic composition with a thickness of 20-35 microns.It is antistatic Layer has the first main surface and the second main surface, wherein the first main surface is contacted with the second main surface of bed course, and antistatic Layer is comprising polymeric binder or copolymer binder and is dispersed in polymeric binder or copolymer binder PEDOT-PSS (poly- 3,4-rthylene dioxythiophene-polystyrolsulfon acid), wherein PEDOT-PSS accounts for the 5-30 weight of antistatic layer Measure %.Sealant has the first main surface and the second main surface, wherein the second of the first main surface of sealant and antistatic layer Main surface contact, and sealant includes heat-activatable adhesive, and wherein heat-activatable adhesive includes with a thickness of 0.5-2.0 microns Polymer composition or copolymer compositions.Lid band bonds range at least 135 DEG C of thermal activation, and when being exposed to Between, the condition of temperature, humidity or their combination when, lid band keeps lid band peel adhesion, and lid belt is just like 23 DEG C temperature and 50% relative humidity under measured in the second main surface of sealant 106-1011The sheet resistance of ohm (SR) value.
The invention also discloses products.In some embodiments, product includes: carrier band, which includes multiple Pit；And lid band, the lid band are bonded to carrier band and seal multiple pits.Lid band is as described above.
Detailed description of the invention
Referring to the detailed description below in conjunction with attached drawing to the various embodiments of the utility model, this can be more fully understood Application.
Fig. 1 shows the cross-sectional view of the exemplary implementation scheme of the multilayer cover band of the utility model.
Fig. 2 shows the cross-sectional views of the exemplary implementation scheme of the multilayer of the utility model carrier band construction.
In being described below of shown embodiment, with reference to attached drawing and by way of illustration in the drawings It is shown in which that the various embodiments of the utility model can be practiced.It should be appreciated that not departing from the scope of the utility model In the case of, using embodiment and the change in structure can be carried out.Attached drawing is not necessarily drawn to scale.Used in attached drawing Similar number indicates similar component.It will be appreciated, however, that carrying out indicate indicator using number in given attached drawing is not purport The component of same numbers label is utilized in limiting another attached drawing.
Specific embodiment
As electronic component becomes increasingly to minimize, storage, transport and the processing of this base part become more and more difficult, And special method is gradually formed.A kind of such method is using carrier band.Carrier band can be formed of a variety of materials, but usually It is plastic material, is formed to have the band of multiple longitudinally concave portions or concave portion, the multiple longitudinally concave portion or recessed Portion is intended to keep all parts to prevent them to be in contact with each other or be otherwise damaged.Such concave portion is usually claimed For " pit " and there is upper opening, component is placed in recessed portion by the upper opening, then usually by lid band Sealed opening.
Other than typical case is with required characteristic, lid needs many special features with construction, such as relatively low At a temperature of seal, as time goes by stable peel value with allow it is consistent removal etc..These special characteristics include covering There is conductive layer, to prevent the triboelectrification when lid band is attached to carrier band or removes lid band from carrier band in band.
In general, lid band construction is multi-layer product, therefore interlayer adhesion is important Consideration.In other words, when making Used time, band construction must keep together when being applied to carrier band, transport or storage and removing lid band from carrier band.If lid Any layer in band is easy decomposition or lost integrity, then entire lid band construction may fail.Particularly, conductive layer is (also referred to as For antistatic layer) it may be easily affected by the influence of environmental condition.The environmental condition that lid band is likely encountered is heat and/or heat and humidity Combination.It is desirable that even if the peel adhesion value for covering band is also kept over time when being exposed to various environmental conditions Stablize.In the present context, stable peel value means initial peel adhesion value and aging peel adhesion value very phase Seemingly, and will not undergo indicating cover band construction in one or more layers integrality lose be greatly reduced.Therefore, it is intended that exploitation is not Only having desired adhesion characteristic, (such as relatively low seal temperature and peel value stable over time are consistent to allow Removal), but also there is the lid band for being exposed to conductive anti-static layer stable when wet condition.
In the present invention, lid band will be described and is constructed using the carrier band of lid band.Lid band be include base, it is bed course, anti- The multi-ply construction of electrostatic layer and sealant.Lid band have down to 135 DEG C thermal activation bond range, and be exposed to the time, When the condition of temperature, humidity or their combination, lid band keeps lid band peel adhesion, and lid belt is just like at 23 DEG C Temperature and 50% relative humidity under measured in the second main surface of sealant 106-1011The sheet resistance (SR) of ohm Value.Peel adhesion value is kept to refer to peel adhesion when being exposed to the condition of time, temperature, humidity or their combination It keeps being basically unchanged in a certain range of time, temperature and humidity condition.Although although it is contemplated that peel adhesion has Some variations, but initial peel adhesion and to be exposed to the peel adhesion after time, temperature, humidity or their combination logical It is often similar, and will not significantly reduces.When being exposed to time, temperature or humidity condition, the significant drop of peel adhesion Low one or more layers (usually antistatic layer) for showing lid band is unstable.Although lid band can be subjected to various times, temperature and wet Degree condition, but have suitable for these some typical ranges of the lid with construction.As for ageing time, usual ageing time is several It, reaches 30 days or even longer in some embodiments.As for aging temperature, typical temperature is in room temperature to 60 DEG C of range It is interior.As for humidity, usual humidity 50%RH (relative humidity) typical environment humidity to high humidity (such as 95%RH) In the range of.The combination of raised temperature (being higher than room temperature) and humidity level be also it is possible, such as 52 DEG C and 95%RH.Below Lid band will be described in further detail and constructed using the carrier band of lid band.
Unless otherwise specified, expression characteristic size, amount used in specification and claims and physics are special All numbers of property should be understood to be modified by term " about " in all cases.Therefore, unless indicated to the contrary, otherwise exist The numerical parameter listed in description above and the appended claims is approximation, these approximations can be according to this field Technical staff is sought the desired characteristic obtained using teachings disclosed herein and changed.The numerical value stated with end value Range includes all numbers (such as 1 to 5 includes 1,1.5,2,2.75,3,3.80,4 and 5) and the range for being included within the scope of this Interior any range.
Unless the content clearly, otherwise as used in this specification and the appended claims, singular shape Formula "one", "an" and " described " cover the embodiment with multiple referring to thing.For example, covering to the reference of " one layer " Embodiment with a layer, two layers or more layer.Unless the context clearly dictates otherwise, otherwise as this explanation with Used in the appended claims, term "or" is generally used with the meaning for including "and/or".
As used herein, term " adhesive " refers to the combination of polymers that can be used for being adhered to each other two adherends Object.The example of adhesive is heat-activatable adhesive and contact adhesive.
Heat-activatable adhesive is not tacky at room temperature, but becomes tacky at elevated temperatures and can be bonded to substrate. The T of these adhesivesg(glass transition temperature) or fusing point (Tm) it is usually above room temperature.When temperature is increased more than TgOr TmWhen, storage Energy modulus usually reduces and adhesive becomes tacky.
Pressure-sensitive adhesive composition well known within the skill of those ordinarily skilled has the property including following: (1) strong And lasting adherence, (2) with finger gently once pressing and can adhere to, (3) are enough to be maintained at the ability on adherend, and (4) have Enough cohesive strengths from adherend to be cleanly removed.It has been found that function well as contact adhesive material be through design and It prepares and shows required viscoplasticity, so that adherence, peel adhesion and shearing retentivity reach the poly- of required balance Close object.The appropriate balance of acquired character is not simple method.
Term " (methyl) acrylate " refers to the monomeric acrylic or methacrylate of alcohol.Acrylate and methyl Acrylate monomer or oligomer are commonly referred to as " (methyl) acrylate " herein.Referred to as " (methyl) acrylate-functional " Material is the material comprising one or more (methyl) acrylate groups.
Term " Tg " and " glass transition temperature " are used interchangeably.If measurement, unless otherwise stated, Tg value is logical Differential scanning calorimetry (DSC) is crossed with 10 DEG C/min of determination of scan rate.In general, not measuring the Tg value of copolymer, but make With well known Fox formula, calculated using the monomer Tg value provided by monomer supplier, as understood by those skilled in the art 's.
As used herein, term " conductivity " means the measurement for the ability that charge moves in material." resistivity " is electricity The inverse of conductance.
As used herein, term " lid band " refers to that the band for adhering to carrier band surface, the carrier band have for accommodating With the concave portion of transport chip and other sensitive electronic components.
As used herein, term " concave portion " refers to individual carrier, such as the pit or cupuliform that are formed in carrier band Slot, commonly used in keeping the individual unit of a certain product.Such part usually pass through vacuum forming, thermoforming, molding or other Already known processes are formed.
As used herein, term " room temperature " or " environment temperature " are used interchangeably and refer to 20 DEG C -25 DEG C of temperature.
As used herein, term " adjacent " when being directed to two layers it is meant that this two layers is mutually adjoined, not no between two parties spacious therebetween Open space.They can be in direct contact with one another (for example, being laminated together) or there may be interlayers.
Unless otherwise specified, all percentages, ratio and the amount of this paper are by weight.
Disclosed herein is lid bands.Lid band is the multi-ply construction for including base, bed course, antistatic layer and sealant.It will be detailed Each of these layers are described.
Base has the first main surface and the second main surface, and including thermoplastic polymer.A variety of thermoplastic polymers It is suitable.Suitable polymer includes polyethylene terephthalate polymer or polyimide thermoplastic's property material.Due to it Extensive availability and desired characteristic, polyethylene terephthalate polymer be specially suitable.Base, which can have, to appoint What suitable thickness, usual thickness is in the range of 10-20 microns.
Second main surface of base is adjacent with following bed courses.Base can be bonded to pad with layer contacts or with bonding mode Layer.First main surface of base can be that unmodified or it may include various coatings or layer.It can be with the of base The suitable layer of one main surface contact or the example of coating include that such as anti-scraping coating of hard conating or anti-stick coating such as remove painting Layer.A variety of release coatings are suitably arranged in the first main surface of base.Specially suitable release coating is including, for example, being used in volume Material on the strip product back side processed is then unwound when in use with allowing band to be rolled-up and keeping complete.Such material Sometimes referred to as low adherency gum layer or LAB.Developed various LAB makes together with various adhesives With.Lid suitable for the utility model is included in United States Patent (USP) 7,411,020 with the example of the suitable LAB of construction or release coating Water base fluorochemical materials described in (Carlson et al.) are gathered described in United States Patent (USP) 5,753,346 (Leir et al.) Stripping composition, United States Patent (USP) 2 described in silicone release coating, United States Patent (USP) 7,229,687 (Kinning et al.), Polyethylene N- alkyl carbamate (polyurethane), United States Patent (USP) 6,204,350 described in 532,011 (Dalquist et al.) It is organic described in moisture-curable material described in (Liu et al. people) and United States Patent (USP) 5,290,615 (Tushaus et al.) Polysiloxanes-polyurea copolymers remover.
Multilayer cover band construction further includes bed course.Bed course has the first main surface and the second main surface, wherein the first of bed course Main surface is adjacent with the second main surface of base as described above.In the present context, adjacent with the second main surface of base to refer to First main surface of bed course is contacted with the second main surface of base or the first main surface of bed course is bonded to base with bonding mode Second main surface of layer.
The thermoplastic material of multiple polymers or copolymer can be used in bed course.In many embodiments, bed course packet Containing polymer or copolymer based on ethylene.The example of polymer or copolymer suitably based on ethylene includes ethylene-acetate Vinyl ester copolymers, polyethylene, vinyl-vinyl acetate copolymer and polyethylene blend and polyethylene and ethylene-second The alternating layer of vinyl acetate.In some embodiments, the polymer based on ethylene or copolymer include containing 10-30 weight % The vinyl-vinyl acetate copolymer of vinyl acetate.
Bed course can have the suitable thickness of wide scope.In some embodiments, bed course has 20-35 microns of thickness.
In some embodiments, the layer that base and bed course can be a separately formed, is laminated or with bonding mode It is bonded together to form compound structure.In other embodiments, the compound structure including base and bed course is commercially available, And state when can buy uses, without assembling these layers.Include polyethylene terephthalate and ethylene/second The example of the commercially available compound structure of alkene-vinyl acetate blend layer includes that many contracts are derived from as described in embodiment part Contain packaging material Co., Ltd (ZhongHe Tongshen Lamination) and king's plastic packaging Co., Ltd (Wangzhe Those of Lamination).
Multilayer cover band further includes antistatic layer.Antistatic layer has the first main surface and the second main surface.Antistatic layer First main surface is contacted with the second main surface of bed course.Antistatic layer includes polymeric binder or copolymer binder and divides The conductive particle being dispersed in polymeric binder or copolymer binder.
Although various types of conductive particle can be used, such as metal oxide particle of carbon nanotube, Sb doped Or carbon black granules, but usually conductive particle includes PEDOT-PSS (poly- 3,4-rthylene dioxythiophene-polystyrolsulfon acid) particle. PEDOT-PSS is the polymeric blends of two kinds of ionomers.One of mixture component is by gathering for sulfonated polystyrene Sodium styrene sulfonate is constituted.Part sulfonyl is by deprotonation and has negative electrical charge.Another poly- (3, the 4- ethylene dioxy bases of component Thiophene) or PEDOT be a kind of conjugated polymer, with positive charge and be based on polythiophene.Electrically charged macromolecular is formed together greatly Molecule salt.It is commercially available that PEDOT-PSS can be used as aqueous dispersion.
In some embodiments, antistatic layer includes the conductive particle of 5-30 weight %, usually PEDOT-PSS.Weight Amount percentage is calculated by dry weight, it means that percentage, which refers in coating, have been dried to remove any volatile component (such as Solvent or water) material.
Multiple polymers and copolymer material are suitable as the binder of antistatic layer.In general, binder material includes changing The acrylate polymer or copolymer, the polymer of styrene-based or copolymer or their combination of property.In some realities It applies in scheme, the polymeric binder or copolymer binder of antistatic layer include modified acrylate polymer or copolymerization Object.In other embodiments, the polymeric binder of antistatic layer or copolymer binder include the polymerization of styrene-based Object or copolymer.In other embodiments, polymeric binder or copolymer binder are copolymerized comprising Acrylate-styrene bipolymer Object.In some embodiments, antistatic layer binder be can be with NEOCRYL A-1091 from Massachusetts Wilmington The commercially available modified styrene copolymer of DSM N. V. (DSM, Wilmington, MA).In general, the polymer of antistatic layer is viscous Knot agent or copolymer binder are water-soluble or water dispersibles.
For antistatic layer, the sensibility to heat and humidity is a serious problems, and therefore, it is desirable to poly- It closes object binder or copolymer binder layer material is moisture repellent material.A variety of methods can be used to define or measure moisture resistance.? In the utility model, polymeric binder or copolymer binder layer material are moisture repellent materials, so that it is small to impregnate 24 in water Shi Hou, the intake of water is less than 5 weight %.
In some specific embodiments, antistatic layer is the drying layer formed by dispersion mixture, the dispersion Body mixture includes aqueous dispersion and PEDOT-PSS (poly- 3, the 4- ethylene two of polymeric binder or copolymer binder Oxygen thiophene-polystyrolsulfon acid) aqueous dispersion, wherein polymeric binder or copolymer binder material are moisture-resistant materials Material, so that the intake of water is less than 5 weight % after when dipping 24 is small in water.
Lid band further includes sealant.As antistatic layer provides antistatic property for lid band, sealant provides lid The adhesion characteristic of band.Sealant have the first main surface and the second main surface, wherein the first main surface of sealant with it is antistatic The second main surface contact of layer.Sealant is layer of heat activated adhesive, and lid band can be adhered to carrier band to form carrier band structure It makes.Heat-activatable adhesive is not tacky at room temperature, but becomes tacky at elevated temperatures and can be bonded to substrate.These are viscous The T of mixtureg(glass transition temperature) or fusing point (Tm) it is usually above room temperature.When temperature is increased more than TgOr TmWhen, storage modulus It usually reduces and adhesive becomes tacky.
Various heat-activatable adhesives are suitable in lid band.Specially suitable heat-activatable adhesive is that those are provided for lid band The required characteristic of relatively low hot sticky junction temperature and the adhesive of consistent peel adhesion is also provided, consistent removing bonding Power mean peel adhesion not at any time, the combination of temperature, humidity or these factors and change.In general, heat-activatable adhesive is It covers and bonds range with the thermal activation provided down to 135 DEG C of temperature, or in other words, heat-activatable adhesive provides at least for lid band 135 DEG C of thermal activation bonds range temperature.Although it is generally desirable that down to 135 DEG C at a temperature of heat seal the utility model lid Band construction, but in some embodiments, it may be suitable in 135 DEG C to 170 DEG C or even 140 DEG C to 160 DEG C of temperature Lower heat seal lid band construction.
Various polymer materials or copolymer material are suitable for the heat-activatable adhesive composition of sealant.It is especially suitable Heat-activatable adhesive composition include at least one polymer or copolymer for being based on (methyl) acrylate.In some implementations In scheme, it is 50,000- that at least one polymer or copolymer based on (methyl) acrylate, which includes weight average molecular weight, 100,000 grams/mol of (methyl) acrylate polymer or copolymer.In other embodiments, at least one base In the polymer or copolymer of (methyl) acrylate include the mixed of at least two (methyl) acrylate polymers or copolymer The mixture of conjunction object, at least two (methyl) acrylate polymer or copolymer includes that weight average molecular weight is 50,000- 100,000 grams/mol of (methyl) acrylate polymer or copolymer and weight average molecular weight is 100,000-200,000 Gram/mol (methyl) acrylate polymer or copolymer.
Other than above-mentioned polymer or copolymer component, heat-activatable adhesive composition also may include one or more additional Component.The example of suitable annexing ingredient includes tackifier, plasticizer, stabilizer and filler.The example of filler includes that particle is filled out Expect such as silica dioxide granule or polymeric beads.The example of polymeric beads includes such as polyacrylate pearl.Annexing ingredient can be with Any suitable amount exists.In some embodiments, the granular filler comprising silica polymer or polymeric beads is with about 5-20 weight % is present in heat-activatable adhesive composition.
Sealant can have the suitable thickness of wide scope.In general, range of the sealant thickness in 0.5-2.0 micron thickness It is interior.
Disclosed herein is with the stable antistatic property of time, temperature and humidity and with desired bonding spy Property multilayer cover band construction.Lid belt is just like the second main surface at 23 DEG C of temperature and 50% relative humidity in sealant On measure 106-1011Sheet resistance (SR) value of ohm.In addition, lid band bonds range temperature at least 135 DEG C of thermal activation Degree and the peel adhesion kept when being exposed to time, temperature and humidity condition.In some embodiments, lid band has From the peel adhesion value of the 30-70gf (gram force) of carrier band.As described above, the holding of peel adhesion refers to initial peel adhesion Force value and aging peel adhesion value are closely similar without being substantially reduced.Although lid band can be subjected to various times, temperature and wet Degree condition, but have suitable for these some typical ranges of the lid with construction.The range of aging condition can mould in various manners Imitative or simulation, and a series of aging conditions are desirable.As for ageing time, usual ageing time is several days, one Reach 30 days in a little embodiments or even longer.As for aging temperature, typical temperature is in the range of room temperature is to 60 DEG C.As for wet Degree, usual humidity is in the range of the typical environment humidity of 50%RH (relative humidity) is to high humidity (such as 95%RH). The combination of raised temperature (being higher than room temperature) and humidity level be also it is possible, such as 52 DEG C and 95%RH.
There is disclosed herein include having the carrier band of multiple pits and being bonded to carrier band and seal the multiple pit Or the product of the lid band of concave portion.Lid band is described in the above and includes: main with the first main surface and second The base on surface, the base include the thermoplastic polymer with a thickness of 10-20 microns；With the first main surface and the second main surface Bed course, wherein the first main surface of bed course is contacted with the second main surface of base or the first main surface of bed course is with the side of bonding Formula is bonded to the second main surface of base, and bed course is comprising the polymeric thermoplastic composition with a thickness of 20-35 microns or altogether Polymers thermoplastic compounds；Antistatic layer with the first main surface and the second main surface, wherein the first main surface and bed course The contact of second main surface, and antistatic layer comprising polymeric binder or copolymer binder and is dispersed in polymer bonding PEDOT-PSS (poly- 3,4-rthylene dioxythiophene-polystyrolsulfon acid) in agent or copolymer binder, wherein PEDOT-PSS Account for the 5-30 weight % of antistatic layer；And the sealant with the first main surface and the second main surface, wherein the of sealant One main surface is contacted with the second main surface of antistatic layer, and sealant includes heat-activatable adhesive, and wherein the thermal activation is viscous Mixture includes the polymer composition or copolymer compositions with a thickness of 0.5-2.0 microns.Lid band has at least 135 DEG C of heat living Change bonding range, and when being exposed to the condition of time, temperature, humidity or their combination, lid band keeps lid band removing Bonding force, and lid belt measures in the second main surface of sealant just like at 23 DEG C of temperature and 50% relative humidity 106-1011Sheet resistance (SR) value of ohm.
Carrier band is well understood in electronic field.In general, carrier band is made of thermoplastic, polymeric materials.In some implementations In scheme, carrier band includes that polystyrene or polycarbonate carry.
In general, by electronic component be placed on carrier band pit in, and by lid band be placed on carrier band pits opening on it is right It afterwards will lid band heat seal.Heat seal be suitable for lid band and carrier band between formed stablize bonding at a temperature of carry out.Usually exist Carrier band is sealed at a temperature of at least 135 DEG C.In some embodiments, at 135 DEG C to 170 DEG C, 135 DEG C to 160 DEG C or even Carrier band is sealed at a temperature of 140 DEG C to 160 DEG C.
When the electronic component in carrier band construction is delivered to its desired position, lid band is removed to allow for removing electronics Component.In order to promote the process, it is expected that heat seal bond is stablized over time, this means the bonding force of heat seal bond not It substantially change over time.Wish peel adhesion in the range of 30-70 gram force (gf).
It can be by further understanding the utility model referring to attached drawing.The embodiment that multilayer cover band is shown in FIG. 1.Figure 1 is the cross-sectional view of lid band 100 comprising base polymer layers 110, pad polymer layer 120, antistatic layer 130 and heat seal Layer 140.These layers are only illustrative and are not drawn on scale.Each of these layers have been further described above.
Fig. 2 shows the top view of carrier band construction 200, carrier band construction includes the recessed pit for accommodating electronic component 230 210, and cover and seal the lid band 220 of the electronic component 230 in recessed pit 210.
The utility model includes following embodiments:
These embodiments are related to lid band.Embodiment 1 is a kind of lid band, comprising: base, the base have the first master Surface and the second main surface, the base include the thermoplastic polymer with a thickness of 10-20 microns；Bed course, the bed course have First main surface and the second main surface, wherein the first main surface of bed course contacted with the second main surface of base or bed course One main surface is bonded to the second main surface of base with bonding mode, and the bed course includes the polymer with a thickness of 20-35 microns Thermoplastic compounds or copolymer thermoplastic composition；Antistatic layer, the antistatic layer have the first main surface and the second master Surface, wherein the first main surface is contacted with the second main surface of bed course, the antistatic layer includes polymeric binder or copolymerization Object binder and the PEDOT-PSS being dispersed in polymeric binder or copolymer binder (poly- 3,4- ethylene dioxy thiophene Pheno-polystyrolsulfon acid), wherein PEDOT-PSS accounts for the 5-30 weight % of antistatic layer；And sealant, the sealant tool There are the first main surface and the second main surface, wherein the first main surface of sealant is contacted with the second main surface of antistatic layer, institute Stating sealant includes heat-activatable adhesive composition, and wherein the heat-activatable adhesive composition includes with a thickness of 0.5-2.0 microns Polymer composition or copolymer compositions；And its middle cover belt has at least 135 DEG C of thermal activation bonding range, in exposure When the condition of time, temperature, humidity or their combination, lid band keep lid band peel adhesion, and lid belt just like 10 measured in the second main surface of sealant at 23 DEG C of temperature and 50% relative humidity6-1011The surface electricity of ohm Hinder (SR) value.
Embodiment 2 is lid band described in embodiment 1, wherein base include polyethylene terephthalate polymer or Polyimide thermoplastic's property material.
Embodiment 3 is lid band described in embodiment 1 or 2, and wherein bed course includes the polymer based on ethylene or copolymerization Object.
Embodiment 4 is lid band described in embodiment 3, wherein polymer or copolymer based on ethylene include ethylene- Vinyl acetate copolymer, polyethylene, vinyl-vinyl acetate copolymer and polyethylene blend or polyethylene and second Alkene-vinyl acetate alternating layer.
Embodiment 5 is lid band described in embodiment 3, wherein polymer or copolymer based on ethylene include containing The vinyl-vinyl acetate copolymer of 10-30 weight % vinyl acetate.
Embodiment 6 is lid band described in any one of embodiment 1-5, wherein the polymeric binder of antistatic layer or Copolymer binder include modified acrylate polymer or copolymer, the polymer of styrene-based or copolymer or Their combination.
Embodiment 7 is lid band described in embodiment 6, the wherein polymeric binder of antistatic layer or copolymer bonding Agent includes modified acrylate polymer or copolymer.
Embodiment 8 is lid band described in embodiment 6, the wherein polymeric binder of antistatic layer or copolymer bonding Agent includes the polymer or copolymer of styrene-based.
Embodiment 9 is that lid band described in embodiment 6, wherein polymeric binder or copolymer binder include propylene Acid esters-styrol copolymer.
Embodiment 10 is lid band described in any one of embodiment 1-9, and wherein antistatic layer is to be mixed by dispersion The drying layer that object is formed, the dispersion mixture includes: the aqueous dispersion of polymeric binder or copolymer binder；With And the aqueous dispersion of PEDOT-PSS (poly- 3,4-rthylene dioxythiophene-polystyrolsulfon acid)；Wherein polymeric binder or Copolymer binder material is moisture repellent material, so that the intake of water is less than 5 weight % after when dipping 24 is small in water.
Embodiment 11 is lid band described in any one of embodiment 1-10, wherein the heat-activatable adhesive group of sealant Closing object includes at least one polymer or copolymer for being based on (methyl) acrylate.
Embodiment 12 is lid band described in embodiment 11, wherein at least one is based on (methyl) acrylate Polymer or copolymer include (methyl) acrylate polymer that weight average molecular weight is 50,000-100,000 grams/mol or total Polymers.
Embodiment 13 is lid band described in embodiment 11, wherein at least one is based on (methyl) acrylate The mixture of polymer or copolymer including at least two (methyl) acrylate polymers or copolymer, described at least two The mixture of (methyl) acrylate polymer or copolymer includes that weight average molecular weight is 50,000-100,000 grams/mol (methyl) third that (methyl) acrylate polymer or copolymer and weight average molecular weight are 100,000-200,000 grams/mol Olefine acid ester polymer or copolymer.
Embodiment 14 is lid band described in any one of embodiment 1-13, and wherein heat-activatable adhesive composition also wraps Containing with granular filler existing for about 5-20 weight %, which includes silica dioxide granule or polymeric beads.
The invention also discloses products.Embodiment 15 is a kind of product, comprising: carrier band, the carrier band include more A pit；And lid band, the lid band are bonded to carrier band and seal multiple pits；Wherein the lid band includes: base, the base Layer has the first main surface and the second main surface, and the base includes the thermoplastic polymer with a thickness of 10-20 microns；Bed course, The bed course has the first main surface and the second main surface, and wherein the first main surface of bed course is contacted with the second main surface of base Or the first main surface of bed course is bonded to the second main surface of base with bonding mode, the bed course includes with a thickness of 20-35 The polymeric thermoplastic composition or copolymer thermoplastic composition of micron；Antistatic layer, the antistatic layer have the first master Surface and the second main surface, wherein the first main surface is contacted with the second main surface of bed course, the antistatic layer includes polymer Binder or copolymer binder and the PEDOT-PSS being dispersed in polymeric binder or copolymer binder (poly- 3,4- Ethene dioxythiophene-polystyrolsulfon acid), wherein PEDOT-PSS accounts for the 5-30 weight % of antistatic layer；And sealant, institute Stating sealant has the first main surface and the second main surface, wherein the second main table of the first main surface of sealant and antistatic layer Face contact, the sealant include heat-activatable adhesive composition, wherein the heat-activatable adhesive composition include with a thickness of 0.50-2.0 microns of polymer composition or copolymer compositions；And its middle cover belt has at least 135 DEG C of thermal activation viscous Range is tied, when being exposed to the condition of time, temperature, humidity or their combination, lid band keeps lid band peel adhesion, and And lid belt is just like 10 measured in the second main surface of sealant at 23 DEG C of temperature and 50% relative humidity6-1011 Sheet resistance (SR) value of ohm.
Embodiment 16 is product described in embodiment 15, wherein carrier band includes that polycarbonate or polystyrene carry.
Embodiment 17 is product described in embodiment 15 or 16, and middle cover band is sealed from a temperature of at least 135 DEG C Carrier band peel value in the range of 30-70 gram force (gf).
Embodiment 18 is product described in any one of embodiment 15-17, and wherein base includes poly terephthalic acid Second diester polymer or polyimide thermoplastic's property material.
Embodiment 19 is product described in any one of embodiment 15-18, and wherein bed course includes poly- based on ethylene Close object or copolymer.
Embodiment 20 is product described in embodiment 19, wherein polymer or copolymer based on ethylene include second Alkene-vinyl acetate copolymer, polyethylene, vinyl-vinyl acetate copolymer and polyethylene blend or polyethylene and The alternating layer of ethane-acetic acid ethyenyl ester.
Embodiment 21 is product described in embodiment 19, wherein polymer or copolymer based on ethylene include containing The vinyl-vinyl acetate copolymer of 10-30 weight % vinyl acetate.
Embodiment 22 is product described in any one of embodiment 15-21, wherein the polymer bonding of antistatic layer Agent or copolymer binder include modified acrylate polymer or copolymer, the polymer of styrene-based or copolymer, Or their combination.
Embodiment 23 is that product described in embodiment 22, the wherein polymeric binder of antistatic layer or copolymer are viscous Tying agent includes modified acrylate polymer or copolymer.
Embodiment 24 is that product described in embodiment 22, the wherein polymeric binder of antistatic layer or copolymer are viscous Tie the polymer or copolymer that agent includes styrene-based.
Embodiment 25 is that product described in embodiment 22, wherein polymeric binder or copolymer binder include third Olefin(e) acid ester-styrol copolymer.
Embodiment 26 is product described in any one of embodiment 15-25, and wherein antistatic layer is to be mixed by dispersion The drying layer that object is formed is closed, the dispersion mixture includes: the aqueous dispersion of polymeric binder or copolymer binder； And the aqueous dispersion of PEDOT-PSS (poly- 3,4-rthylene dioxythiophene-polystyrolsulfon acid)；Wherein polymeric binder Or copolymer binder material is moisture repellent material, so that the intake of water is less than 5 weight % after when dipping 24 is small in water.
Embodiment 27 is product described in any one of embodiment 15-26, wherein the heat-activatable adhesive of sealant Composition includes at least one polymer or copolymer for being based on (methyl) acrylate.
Embodiment 28 is product described in embodiment 27, wherein at least one is based on (methyl) acrylate Polymer or copolymer include (methyl) acrylate polymer that weight average molecular weight is 50,000-100,000 grams/mol or total Polymers.
Embodiment 29 is product described in embodiment 27, wherein at least one is based on (methyl) acrylate The mixture of polymer or copolymer including at least two (methyl) acrylate polymers or copolymer, described at least two The mixture of (methyl) acrylate polymer or copolymer includes that weight average molecular weight is 50,000-100,000 grams/mol (methyl) third that (methyl) acrylate polymer or copolymer and weight average molecular weight are 100,000-200,000 grams/mol Olefine acid ester polymer or copolymer.
Embodiment 30 is product described in any one of embodiment 15-29, and wherein heat-activatable adhesive composition is also Comprising with granular filler existing for about 5-20 weight %, which includes silica dioxide granule or polymeric beads.
Embodiment 31 is product described in any one of embodiment 15-30, and wherein thermal activation bonding range is 135 ℃-170℃。
Embodiment 32 is product described in any one of embodiment 15-30, and wherein thermal activation bonding range is 135 ℃-160℃。
Embodiment 33 is product described in any one of embodiment 15-30, and wherein thermal activation bonding range is 140 ℃-160℃。
Embodiment 34 is product described in any one of embodiment 15-33, wherein peel adhesion is kept to be up to 30 It.
Embodiment 35 is product described in any one of embodiment 15-34, wherein being exposed to 60 DEG C of highest of temperature When spending, lid band keeps peel adhesion.
Embodiment 36 is product described in any one of embodiment 15-34, wherein being exposed to 52 DEG C of highest of temperature When the relative humidity of degree and highest 95%, lid band keeps peel adhesion.
Embodiment
Examples provided below and comparative example help to understand the utility model, and these embodiments and comparative example are not It should be understood the limitation to the scope of the utility model.Unless otherwise stated, in the rest part of embodiment and specification All numbers, percentage, ratio etc. be by weight, and all reagents used in embodiment derive from or purchased from one As chemical supplier, the Sigma-Aldrich (Sigma-A1drich of such as St. Louis Corp., Saint Louis, MO, US).
Following abbreviation: DEG C=degree Celsius, J/cm is used in this section2=joules per cm, min=minutes, ft/ Min=feet/min, m/min=ms/min, V=volts, cm=centimetres, g=grams, gf=gram force, μm=micron, wt%= Weight percent.
Sample preparation procedure
Base and bed course
Using by biaxially oriented polyethylene terephthalate (BOPET) base and ethane-acetic acid ethyenyl ester (EVA) pad Layer (derives from Jiangsu Province, China Yixing king's plastic packaging Co., Ltd (Yixing Wangzhe Lamination, Jiangsu, China) ITF0160) substrate that constitutes prepares exemplary cap band.The substrate contains the VA of 18 mass %, and with 56 DEG C of dimension Card softening temperature (data from manufacturer).
Antistatic layer
By the way that 550g water is added to (PEDOT-PSS points with 1.22wt% solid of 50g ORGACON ICP 1010 Granular media, purchased from Moeurll, Belgium AGFA Special Products company (AGFA Specialty Products, Mortsel, Belgium)) antistatic layer AS-1 is prepared.25g NEOCRYL A-1091 (tool is slowly added into the mixture under stiring There is modified styrene copolymer's dispersion of 44% solid, the Royal DSM Engineered Plastics (DSM purchased from Belgian Hank Engineering Plastics, Genk, Belgium)), form stable blue dispersion.In coating and drying, this point Granular media generates the antistatic coating with 94.7% copolymer binder.
Inverting rubbing method by contact will be on the roll-to-roll side EVA for being applied to substrate of dispersion.It is using volume factor 19.8cm3/m2Three spiral pattern intaglio plate items (gravure bar).Before the coating, it exposes the substrate in 5.17J/cm2Function In embedded nitrogen corona treatment under rate level.Linear velocity is 10ft/min (3m/min), and intaglio plate roller speed is 15ft/ min(4.6m/min).After coating, the film is made to be respectively set as 65 DEG C, 65 DEG C and 75 DEG C of 3 stage drying boxes by temperature.
By the way that into 50g ORGACON ICP 1010, addition 50g water and 350g isopropanol are antistatic to prepare under stiring Layer AS-2.Other than without using sided corona treatment, which is applied on substrate under the same conditions with production AS-1.
Antistatic layer AS-3 is prepared in a manner of identical with antistatic layer AS-1, and carries out following modification.Use 6m/min Linear velocity and 12m/min intaglio plate roller speed by the roll-to-roll side EVA for being applied to substrate of dispersion.After coating, keep the film logical Excess temperature is respectively set as 50 DEG C, 55 DEG C, 60 DEG C and 65 DEG C of 4 stage drying boxes.
Sealant
Table 1-4 lists the preparation of polymer and sealant used in sealant.Seal layer formulation SL1, SL2, SL3 and SL4 includes SSX-102 pearl (the polymethyl methacrylate spheric granules that highly cross-linked average diameter is 2 μm, purchased from Japan east The Sekisui Chemical Co., Ltd (Sekisui Plastics, Tokyo, Japan) in capital).Made using ethyl acetate (EtOAc) For solvent.By fluoropolymer resin being slowly added into ethyl acetate under stiring until formation is uniformly distributed to prepare sealing Layer formulation.
Table 1: sealing layer material
* the information obtained from the tables of data of manufacturer.
Table 2: sealing layer formulation SL1 to SL4, in parts by weight
Table 3: sealing layer formulation SL5 to SL10
Table 4: sealing layer formulation SL11 to SL12
Exemplary and comparative property lid band
It covers and uses the substrate (base+bed course), antistatic summarized in table 5 with embodiment 1 to 10 and comparative example CE1 and CE2 Layer formulation is prepared with the various combinations for sealing layer formulation.
In order to prepare embodiment 1 to 8, antistatic coating AS-3 is coated with using the three spiral pattern intaglio plate items of 140# The substrate of (preparation as described above) is roll-to-roll to coat selected sealant.Linear velocity is 6m/min, and intaglio plate roller speed is 12m/min.After coating, the film is made to be respectively set as 50 DEG C, 55 DEG C, 60 DEG C and 65 DEG C of 4 stage drying boxes by temperature.
In order to prepare embodiment 9 and 10 and comparative example CE1 and CE2, be coated with the substrate of specified antistatic coating with The linear velocity of 10ft/min (3m/min) and the intaglio plate roller speed of 15ft/min (4.6m/min) is roll-to-roll coats suitable sealing Layer.After coating, the film is made to be respectively set as 65 DEG C, 65 DEG C and 75 DEG C of embedded 3 stage drying box by temperature.Comparative example CE1 and CE2 is free of binder in antistatic layer.
Table 5: lid band construction
Carrier band
Using polycarbonate carrier band, (3M 3000 is carried, the 3M company (3M purchased from St.Paul, Minnesota Company, St.Paul, MN, USA)) assessment exemplary cap band.The size of carrier band is as follows: width=8mm；In between pit Center to center distance (spacing)=4mm；Nominal size=3.15mm long × 2.77mm wide of pit × 1.22mm is deep.
Test method
Use ARES-G2 rheometer (the TA instrument public affairs purchased from Delaware, USA Newcastle of parallel-plate geometry Take charge of (TA Instruments, New Castle, DE, US)) layer formulation SL5 is sealed extremely by dynamic mechanical analysis (DMA) measurement The crossover temperature of polymer used in SL10.Start temperature is 80 DEG C, and terminating temperature is 180 DEG C, and temperature is with the speed of 5 DEG C/min Rate increases, and frequency of oscillation is 1.0Hz.Crossover temperature is measured as the temperature of loss modulus (G ") equal to storage modulus (G ') when Degree；That is, temperature when tan (δ)=G "/G '=1.
Before peel strength measurement, the part 20cm by each lid with sample is in desired sticking temperature, 0.09MPa Pressure and under 40 milliseconds of residence time use MBM-4000 sealer (the European Li Meijia semiconductor purchased from lachaux-de-fonds ,switzerland Co., Ltd (Ismeca Europe Semiconductor, La Chaux-de-Fonds, Switzerland)) it is sealed to 3M The empty part of 3000 carrier bands.Use the PT-55 peel test force instrument (V-TEK company (V- purchased from Minn. Man Kaituo TEK, Mankato, MN, US)) measurement peel strength.Dduring test, maximum peeling force, minimum peeling force and average stripping are recorded Value from power.The difference between maximum peeling force and minimum peeling force is calculated as peeling force range.
Available sealant temperature (UST) is bonded to 3M 3000 and brings measurement by that will cover band sample.Because of peeling force It is slightly increased with sticking temperature, so adjusting sticking temperature until peeling force is about 45gf, and is by the thermograph Available sealant temperature.Record the peeling force range under UST.
Use 152-1 type surface/volume resistance meter (Cui Ke bicycle company purchased from New York, United States Luo Ke baud city (TREK, Lockport, NY, US)), sheet resistance is measured using the test voltage of two o'clock Resistance probe and 100V.
By HAZE-GARD measuring instrument (purchased from the Bi Ke auxiliary agent of German Wei Saier and instrument company (BYK Additives And Instruments, Wesel, Germany)) measure mist degree and transmissivity.
As a result
Table 6 summarizes sealing characteristics of the lid with embodiment 1-8, and the crossover temperature phase with polymer used in sealant Compare.
Table 6: the characteristic of embodiment 1 to 8
By the optical characteristics and electricity of the optical characteristics of embodiment 9 and 10 and electrical characteristics and comparative example CE1 and CE2 in table 7 Characteristic is compared.Table 8 and table 9 summarize before and after aging under the conditions of following two groups respectively embodiment 9,10, CE1 and The stripping performance of CE2: at 60 DEG C and at 52 DEG C and under 95% relative humidity (RH).
Table 7: the optical characteristics and electrical characteristics of band are covered
Table 8: the peeling force (sticking temperature=145 DEG C and pressure=0.09MPa) of aging rear cover band at 60 DEG C
Table 9: at 52 DEG C and 95%RH aging rear cover band peeling force (sticking temperature=145 DEG C and pressure= 0.09MPa)
Table 10 lists the minimum peeling force (min) of the function as sticking temperature, maximum peeling force (max), average stripping From power and peeling force range.Process window is confirmed as minimum peel strength greater than 30gf and maximum peeling strength is less than 70gf Temperature range.Table 10 shows that embodiment 9 can bond in about 135 DEG C -160 DEG C of process window, and embodiment 10 can It is bonded in about 140 DEG C -160 DEG C of process window.
Table 10: peeling force of the lid band under various sticking temperatures
Although specific embodiment is illustrated and has been described for the purpose for illustrating preferred embodiment herein, It will be appreciated by those persons skilled in the art that under the premise of not departing from the scope of the utility model, various substitutions and/or Equivalent embodiments can replace the specific embodiment of illustration and description.This application is intended to cover described herein preferred Any modification and change of embodiment.It is therefore apparent that the utility model is intended to only by claims and its wait similar shapes The limitation of formula.

Claims (20)

1. a kind of lid band, which is characterized in that the lid band includes:
Base, the base have the first main surface and the second main surface, and the base includes the thermoplastic with a thickness of 10-20 microns Property polymer；
Bed course, the bed course has the first main surface and the second main surface, wherein first main surface of the bed course and institute First main surface of second main surface contact or the bed course of stating base is bonded to the base with bonding mode Second main surface of layer, the bed course include polymeric thermoplastic composition or the copolymer heat with a thickness of 20-35 microns Plastic composition；
Antistatic layer, the antistatic layer have the first main surface and the second main surface, wherein first main surface with it is described Second main surface of bed course contacts, and the antistatic layer includes polymeric binder or copolymer binder and is dispersed in PEDOT-PSS (poly- 3,4- ethene dioxythiophene-polystyrene sulphur in the polymeric binder or copolymer binder Acid), wherein the PEDOT-PSS accounts for the 5-30 weight % of the antistatic layer；And
Sealant, the sealant has the first main surface and the second main surface, wherein the described first main table of the sealant Face is contacted with second main surface of the antistatic layer, and the sealant includes heat-activatable adhesive, wherein the heat is living Changing adhesive includes the polymer composition or copolymer compositions with a thickness of 0.5-2.0 microns；And
Wherein it is described lid band at least 135 DEG C thermal activation bond range, be exposed to the time, temperature, humidity or they Combined condition when, lid band keeps lid band peel adhesion, and lid band is in 23 DEG C of temperature and 50% Relative humidity under measured in second main surface of the sealant 106-1011Sheet resistance (SR) value of ohm.
2. lid band according to claim 1, wherein the base includes polyethylene terephthalate polymer or polyamides Imines thermoplastic material.
3. lid band according to claim 1, wherein the bed course includes polymer or copolymer based on ethylene.
4. lid band according to claim 3, wherein the polymer or copolymer based on ethylene includes ethylene-acetate second Enoate copolymer, polyethylene, vinyl-vinyl acetate copolymer and polyethylene blend or polyethylene and ethylene-acetate The alternating layer of vinyl acetate.
5. lid band according to claim 3, wherein the polymer or copolymer based on ethylene includes containing 10-30 weight Measure the vinyl-vinyl acetate copolymer of % vinyl acetate.
6. lid band according to claim 1, wherein the polymeric binder of the antistatic layer or copolymer binder packet Containing modified acrylate polymer or copolymer, the polymer of styrene-based or copolymer or their combination.
7. lid band according to claim 6, wherein the polymeric binder of the antistatic layer or copolymer binder packet Containing modified acrylate polymer or copolymer.
8. lid band according to claim 6, wherein the polymeric binder of the antistatic layer or copolymer binder packet Polymer or copolymer containing styrene-based.
9. lid band according to claim 6, wherein the polymeric binder or copolymer binder include acrylate- Styrol copolymer.
10. lid band according to claim 1, wherein the antistatic layer is the drying layer formed by dispersion mixture, The dispersion mixture includes:
The aqueous dispersion of the polymeric binder or copolymer binder；And
The aqueous dispersion of PEDOT-PSS (poly- 3,4- ethene dioxythiophene-polystyrolsulfon acid)；
Wherein the polymeric binder or copolymer binder material are moisture repellent materials, so that when dipping 24 is small in water Afterwards, the intake of water is less than 5 weight %.
11. lid band according to claim 1, wherein the heat-activatable adhesive of the sealant is based on comprising at least one The polymer or copolymer of (methyl) acrylate.
12. lid band according to claim 11, wherein at least one polymer based on (methyl) acrylate or Copolymer includes (methyl) acrylate polymer or copolymer that weight average molecular weight is 50,000-100,000 grams/mol.
13. lid band according to claim 11, wherein at least one polymer based on (methyl) acrylate or Copolymer includes the mixture of at least two (methyl) acrylate polymers or copolymer, described at least two (methyl) propylene The mixture of acid ester polymer or copolymer includes (methyl) acrylic acid that weight average molecular weight is 50,000-100,000 grams/mol (methyl) acrylate polymer that ester polymer or copolymer and weight average molecular weight are 100,000-200,000 grams/mol Or copolymer.
14. lid band according to claim 11, wherein the heat-activatable adhesive also includes with about 5-20 weight % presence Granular filler, the granular filler includes silica dioxide granule or polymeric beads.
15. a kind of product, which is characterized in that the product includes:
Carrier band, the carrier band include multiple pits；And
Lid band, the lid band are bonded to the carrier band and seal the multiple pit；Wherein the lid band includes:
Base, the base have the first main surface and the second main surface, and the base includes the thermoplastic with a thickness of 10-20 microns Property polymer；
Bed course, the bed course has the first main surface and the second main surface, wherein first main surface of the bed course and institute First main surface of second main surface contact or the bed course of stating base is bonded to the base with bonding mode Second main surface of layer, the bed course include polymeric thermoplastic composition or the copolymer heat with a thickness of 20-35 microns Plastic composition；
Antistatic layer, the antistatic layer have the first main surface and the second main surface, wherein first main surface with it is described Second main surface of bed course contacts, and the antistatic layer includes polymeric binder or copolymer binder and is dispersed in PEDOT-PSS (poly- 3,4- ethene dioxythiophene-polystyrene sulphur in the polymeric binder or copolymer binder Acid), wherein the PEDOT-PSS accounts for the 5-30 weight % of the antistatic layer；And
Sealant, the sealant has the first main surface and the second main surface, wherein the described first main table of the sealant Face is contacted with second main surface of the antistatic layer, and the sealant includes heat-activatable adhesive, wherein the heat is living Changing adhesive includes the polymer composition or copolymer compositions with a thickness of 0.50-2.0 microns；And
Wherein it is described lid band at least 135 DEG C thermal activation bond range, be exposed to the time, temperature, humidity or they Combined condition when, lid band keeps lid band peel adhesion, and lid band is in 23 DEG C of temperature and 50% Relative humidity under measured in second main surface of the sealant 106-1011Sheet resistance (SR) value of ohm.
16. product according to claim 15, wherein the carrier band includes that polycarbonate or polystyrene carry.
17. product according to claim 15, wherein the lid band is from the carrier band sealed at a temperature of at least 135 DEG C Peel value in the range of 30-70 gram force (gf).
18. product according to claim 15, wherein the product 140-160 DEG C at a temperature of heat seal, and institute Peel adhesion is stated in the range of 30-70 gram force (gf).
19. product according to claim 15, wherein be exposed to aging in 30 days, 60 DEG C of highest of temperature or they When combined condition, the lid band keeps lid band peel adhesion.
20. product according to claim 15, wherein be exposed to 52 DEG C of highest temperature and highest 95% it is relatively wet When the condition of degree, the lid band keeps lid band peel adhesion.
CN201821074527.9U 2018-07-06 2018-07-06 Multilayer cover band construction Active CN208963722U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020008369A1 (en) * 2018-07-06 2020-01-09 3M Innovative Properties Company Multi-layer cover tape constructions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020008369A1 (en) * 2018-07-06 2020-01-09 3M Innovative Properties Company Multi-layer cover tape constructions
CN110683208A (en) * 2018-07-06 2020-01-14 3M创新有限公司 Multi-layer cover tape construction

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