CN208767274U - The efficient transmission system of substrate double treatment - Google Patents
The efficient transmission system of substrate double treatment Download PDFInfo
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- CN208767274U CN208767274U CN201821825648.2U CN201821825648U CN208767274U CN 208767274 U CN208767274 U CN 208767274U CN 201821825648 U CN201821825648 U CN 201821825648U CN 208767274 U CN208767274 U CN 208767274U
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- substrate
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- cleaning
- transfer robot
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Abstract
The utility model belongs to wafer cleaning technical field, in particular to a kind of efficient transmission system of substrate double treatment, including piece housing unit, substrate transfer robot A, temporary location, the first cleaning unit, substrate transfer robot B and the second cleaning unit, wherein piece housing unit is for storing wafer；Substrate transfer robot A between piece housing unit and temporary location for carrying out wafer transfer；Caching and overturning of the temporary location for wafer；Substrate transfer robot B between temporary location and cleaning unit for carrying out wafer transfer；First cleaning unit and the second cleaning unit are respectively arranged at the two sides of substrate transfer robot B, for wafer the back side and front clean.The utility model reaches to send out in the transmission system highest unit time and is sent into substrate and more acts under the premise of robot speed is maximum, solves robot since process sequences are more, cannot the drawbacks of transferring substrates are handled in time.
Description
Technical field
The utility model belongs to wafer cleaning technical field, in particular to a kind of efficient transmission system of substrate double treatment.
Background technique
Semicon industry always attaches great importance to the development of equipment manufacture industry.Have 70% or more in the investment of global semiconductor industry
For purchase of equipment, in fact, the yield of chip manufacturing begins to be declined, one of the main reasons from 90 nanometers or less
The particulate matter that is that on silicon wafer, pollution are difficult to clean.As line becomes carefully, to 45 nanometers hereinafter, substantially entire work
In skill, every two step will do primary cleaning, if expecting that almost every step process all be unable to do without cleaning to higher yield.As integrated
A link of most critical in circuit industry chain, sophisticated semiconductor cleaning equipment is for a long time by the several of the U.S., Japan and Europe
A industrial powers are dominated.As semiconductor technology moves towards 3D by 2D, FinFET proposes new challenge, figure knot to Wafer Cleaning
For structure wafer cleaning compared to the cleaning of flat surfaces, technology and requirement will be much more complex.As line width reduces, the increasing of depth-to-width ratio
Add, cleaning process difficulty also increases rapidly, and the significance level of Wafer Cleaning is increasingly prominent.During conventional clean, due to cleaning
The formula time is relatively short, and the output of cleaning equipment is limited to the production capacity of robot, cleaning unit cannot be made full use of, with clear
Wash step play increase, factory can only buy more cleaning equipments, occupy a large amount of hall space, the workshop inch of land of Clean room is such as
Very little gold, allowing cleaning equipment output to be not only restricted to robot is the topic paid close attention to all the time.
Utility model content
In view of the above-mentioned problems, the purpose of this utility model is to provide a kind of efficient transmission system of substrate double treatment, with
It solves in existing substrate transmittance process, robot, cannot transferring substrates the drawbacks of being handled in time since process sequences are more.
To achieve the goals above, the utility model uses following technical scheme:
A kind of efficient transmission system of substrate double treatment, including piece housing unit, substrate transfer robot A, temporary location,
One cleaning unit, substrate transfer robot B and the second cleaning unit, wherein piece housing unit is for storing wafer；The substrate passes
Robot A is passed for carrying out wafer transfer between housing unit and temporary location at described；The temporary location is for wafer
Caching and overturning；The substrate transfer robot B between the temporary location and cleaning unit for carrying out wafer transfer；Institute
It states the first cleaning unit and the second cleaning unit is respectively arranged at the two sides of the substrate transfer robot B, for wafer
The back side and front are cleaned.
The temporary location is set between the substrate transfer robot A and the substrate transfer robot B, including by
Under supreme setting substrate send out transition element, roll-over unit after roll-over unit and substrate before substrate, wherein substrate sends out transition
Unit is used to cache the wafer after cleaning, and roll-over unit is used for turning over for wafer after roll-over unit and the substrate before the substrate
Turn.
First cleaning unit is identical with the second cleaning unit structure, includes that upper layer cleaning area and lower layer are cleaned
Area, multiple substrate front side cleaning units are provided in the upper layer cleaning area, and it is clear to be equipped with multiple back sides in the lower layer cleaning area
Wash unit.
The substrate transfer robot B is used to overturn the face-up wafer of back in roll-over unit before the substrate and conveys
Wafer Backside Cleaning is carried out in the Wafer Backside Cleaning unit, then is delivered to the base for the wafer finished is cleaned in Wafer Backside Cleaning unit
After plate in roll-over unit, roll-over unit is for overturning wafer to face-up, the substrate transfer robot B after the substrate
Positive cleaning is carried out for face-up wafer to be delivered in the substrate front side cleaning unit, and will be after positive cleaned
Wafer be delivered to the substrate out of described substrate front side cleaning unit and send out in transition element.
The substrate transfer robot A and substrate transfer robot B includes mechanical arm and is set to the machinery
The manipulator of arm end, the manipulator include palm and two fingers for being set to the palm two sides, pass through two fingers
The conveying of wafer is completed at the edge for lifting wafer.
The palm is equipped with the palm support protrusion being located between two fingers, the palm support protrusion and two
A finger supports the edge part of wafer together.
Described housing unit is multiple, and arranges in "-" type.
The advantages of the utility model and beneficial effect are: the utility model reaches under the premise of robot speed is maximum
It sends out in the transmission system highest unit time and is sent into basic more effects, solve robot since process sequences are more, it cannot
The drawbacks of timely transferring substrates are handled.
Detailed description of the invention
Fig. 1 is the top view of the utility model；
Fig. 2 is the side view of the utility model；
Fig. 3 is the structural schematic diagram of the manipulator of substrate transfer robot in the utility model；
Fig. 4 is the structural schematic diagram that robot grabs wafer in the utility model.
In figure: 1 is piece housing unit, and 2 be substrate transfer robot A, and 3 be temporary location, and 4 be the first cleaning unit, and 5 be base
Plate transfer robot B, 6 be the second cleaning unit, and 7 send out transition element for substrate, and 8 be roll-over unit before substrate, and 9 is after substrates
Roll-over unit, 10 be substrate back cleaning unit, and 11 be substrate front side cleaning unit, and 12 be mechanical arm, and 13 be manipulator, 131
It is palm support protrusion for palm, 132,133 be finger, and 14 be turnover mechanism, and 15 be wafer, and a, b, c, d are wafer positioning column.
Specific embodiment
In order to keep the purpose of this utility model, technical solution and advantage clearer, with reference to the accompanying drawing and it is embodied
The utility model is described in detail in example.
As shown in Figs. 1-2, a kind of efficient transmission system of substrate double treatment provided by the utility model, including piece housing unit
1, substrate transfer robot A2, temporary location 3, the first cleaning unit 4, substrate transfer robot B5 and the second cleaning unit 6,
Middle housing unit 1 is for storing wafer；Substrate transfer robot A2 is used to carry out between piece housing unit 1 and temporary location 3 brilliant
Circle transmission；Caching and overturning of the temporary location 3 for wafer；Substrate transfer robot B5 is used for single in temporary location 3 and cleaning
Wafer transfer is carried out between member；First cleaning unit 4 and the second cleaning unit 6 are respectively arranged at the two of substrate transfer robot B5
Side, for wafer the back side and front clean.
As shown in Fig. 2, temporary location 3 is set between substrate transfer robot A2 and substrate transfer robot B5, including
The substrate that is arranged from the bottom to top sends out before transition element 7, substrate roll-over unit 9 after roll-over unit 8 and substrate, and wherein substrate is sent out
Transition element 7 is used to cache the wafer after cleaning, overturning of the roll-over unit 9 for wafer after roll-over unit 8 and substrate before substrate.
First cleaning unit 4 is identical with 6 structure of the second cleaning unit, include upper layer cleaning area and lower layer cleaning area, on
It is provided with multiple substrate front side cleaning units 11 in layer cleaning area, is equipped with multiple Wafer Backside Cleaning units 10 in lower layer cleaning area.
In the embodiments of the present invention, it is respectively provided in the upper layer cleaning area of the first cleaning unit 4 and the second cleaning unit 6
There are two substrate front side cleaning unit 11, two Wafer Backside Cleaning units 10 are equipped in lower layer cleaning area.Piece housing unit 1 is more
It is a, and arranged in "-" type.
Substrate transfer robot B5 is delivered to Wafer Backside Cleaning for the face-up wafer of back is overturn before substrate in roll-over unit 8
Wafer Backside Cleaning is carried out in unit 10, then will be cleaned the wafer finished in Wafer Backside Cleaning unit 10 and be delivered to roll-over unit 9 after substrate
Interior, roll-over unit 9 overturns wafer to face-up after substrate, and face-up wafer is delivered to by substrate transfer robot B5
Positive cleaning is carried out in substrate front side cleaning unit 11, the wafer after front has been cleaned is delivered to by substrate transfer robot B5
Substrate is sent out in transition element 7.
As shown in figure 3, substrate transfer robot A2 and substrate transfer robot B5 include mechanical arm 12 and are set to machine
The manipulator 13 of 12 end of tool arm, manipulator 13 include palm 131 and two fingers 133 for being set to 131 two sides of palm, are passed through
Two fingers 133 lift the edge of wafer, complete the conveying of wafer.
Further, palm 131 is equipped with the palm support protrusion 132 being located between two fingers 133, and palm support is convex
Rise 132 and two fingers 133 support the edge part of wafer together, as shown in figure 4, two fingers 133 avoid turnover mechanism 14
On wafer positioning column a, b, c, d.
The finger 133 of substrate transfer robot A2 can fetch and deliver the substrate in piece housing unit 1 according to requirements and take
The substrate on roll-over unit is sent, traditional mechanical finger can only generally fetch and deliver the substrate in film magazine.
The wafer transmittance process of the utility model is:
Substrate transfer robot A2 takes out substrate from piece housing unit 1 (quantity can arbitrarily increase), turns over before being sent into substrate
Turn unit 8 and carry out substrate overturning, makes substrate back as top；Substrate transfer robot B5 before substrate roll-over unit 8 by base
Plate takes out, and is sent into substrate back cleaning unit 10, will by substrate transfer robot B5 after the cleaning of substrate back cleaning unit 10
Substrate takes out from substrate back cleaning unit 10, and roll-over unit 9 carries out substrate overturning after being sent into substrate, makes substrate front side as upper
Side, substrate transfer robot B5 roll-over unit 9 after substrate take out substrate, substrate front side cleaning unit 11 are sent into, through substrate
It after front cleaning unit 11 cleans, will be taken out from substrate front side cleaning unit 11 by substrate transfer robot B5, and be sent into substrate and send
Transition element 7 out, then substrate is sent out into transition element 7 from substrate by substrate transfer robot A2 and is taken out, return to piece housing unit
1。
In the utility model, turnover mechanism 14 and cleaning unit are the prior art.
A kind of efficient transmission system of substrate double treatment provided by the utility model, feature using piece housing unit,
Roll-over unit, substrate back cleaning unit and substrate front side cleaning after roll-over unit, substrate before substrate submitting transition element, substrate
Unit, the pass order for changing substrate transfer robot reach to reach under the premise of substrate transfer robot speed is maximum
Feeding substrate is sent out in the transmission system highest unit time more to act on, and solves substrate transfer robot due to technique time
Sequence is more, cannot transferring substrates the drawbacks of being handled in time.
The foregoing is merely the embodiments of the present invention, are not intended to limit the protection scope of the utility model.It is all
Any modification, equivalent substitution and improvement made within spirit of the present utility model and principle, extension etc., are all contained in this reality
With in novel protection scope.
Claims (7)
1. a kind of efficient transmission system of substrate double treatment, which is characterized in that including piece housing unit (1), substrate transfer robot A
(2), temporary location (3), the first cleaning unit (4), substrate transfer robot B (5) and the second cleaning unit (6), wherein
Described housing unit (1) is for storing wafer；
The substrate transfer robot A (2) is for carrying out wafer transfer between described housing unit (1) and temporary location (3)；
Caching and overturning of the temporary location (3) for wafer；
The substrate transfer robot B (5) is for carrying out wafer transfer between the temporary location (3) and cleaning unit；
First cleaning unit (4) and the second cleaning unit (6) are respectively arranged at the two of the substrate transfer robot B (5)
Side, for wafer the back side and front clean.
2. the efficient transmission system of substrate double treatment according to claim 1, which is characterized in that the temporary location (3)
It is set between the substrate transfer robot A (2) and the substrate transfer robot B (5), including the base being arranged from the bottom to top
Plate sends out transition element (7), roll-over unit (9) after roll-over unit (8) and substrate before substrate, and wherein substrate sends out transition element
(7) for cache the wafer after cleaning, before the substrate after roll-over unit (8) and the substrate roll-over unit (9) for wafer
Overturning.
3. the efficient transmission system of substrate double treatment according to claim 2, which is characterized in that first cleaning unit
(4) identical with the second cleaning unit (6) structure, it include upper layer cleaning area and lower layer cleaning area, the upper layer cleaning area
Multiple substrate front side cleaning units (11) are inside provided with, are equipped with multiple Wafer Backside Cleaning units (10) in the lower layer cleaning area.
4. the efficient transmission system of substrate double treatment according to claim 3, which is characterized in that the substrate transmits machine
The face-up wafer of overturning back in roll-over unit (8) before the substrate is delivered to the Wafer Backside Cleaning unit (10) by people B (5)
Interior carry out Wafer Backside Cleaning, then the wafer finished will be cleaned in Wafer Backside Cleaning unit (10) and be delivered to roll-over unit after the substrate
(9) in, roll-over unit (9) overturns wafer to face-up after the substrate, and the substrate transfer robot B (5) will be positive
Wafer upward, which is delivered in the substrate front side cleaning unit (11), carries out positive cleaning, and the wafer after front has been cleaned passes through
The substrate transfer robot B (5) is delivered to the substrate and sends out in transition element (7).
5. the efficient transmission system of substrate double treatment according to claim 1, which is characterized in that the substrate transmits machine
People A (2) and the substrate transfer robot B (5) include mechanical arm (12) and the machine for being set to the mechanical arm (12) end
Tool hand (13), the manipulator (13) include palm (131) and two fingers (133) for being set to the palm (131) two sides,
The edge that wafer is lifted by two fingers (133), completes the conveying of wafer.
6. the efficient transmission system of substrate double treatment according to claim 5, which is characterized in that on the palm (131)
It is raised (132) equipped with the palm support being located between two fingers (133), the palm support raised (132) with two
The finger (133) supports the edge part of wafer together.
7. the efficient transmission system of substrate double treatment according to claim 1, which is characterized in that described housing unit (1)
To be multiple, and arranged in "-" type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821825648.2U CN208767274U (en) | 2018-11-07 | 2018-11-07 | The efficient transmission system of substrate double treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821825648.2U CN208767274U (en) | 2018-11-07 | 2018-11-07 | The efficient transmission system of substrate double treatment |
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| Publication Number | Publication Date |
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| CN208767274U true CN208767274U (en) | 2019-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821825648.2U Active CN208767274U (en) | 2018-11-07 | 2018-11-07 | The efficient transmission system of substrate double treatment |
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| CN (1) | CN208767274U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739828A (en) * | 2020-08-12 | 2020-10-02 | 山东元旭光电股份有限公司 | Automatic wafer brushing machine |
-
2018
- 2018-11-07 CN CN201821825648.2U patent/CN208767274U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739828A (en) * | 2020-08-12 | 2020-10-02 | 山东元旭光电股份有限公司 | Automatic wafer brushing machine |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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| CP03 | Change of name, title or address |