CN111162032A - High-efficient transfer system of two-sided processing of base plate - Google Patents
High-efficient transfer system of two-sided processing of base plate Download PDFInfo
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- CN111162032A CN111162032A CN201811317569.5A CN201811317569A CN111162032A CN 111162032 A CN111162032 A CN 111162032A CN 201811317569 A CN201811317569 A CN 201811317569A CN 111162032 A CN111162032 A CN 111162032A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer cleaning, and particularly relates to a high-efficiency transfer system for double-sided treatment of a substrate, which comprises a wafer box unit, a substrate transfer robot A, an intermediate unit, a first cleaning unit, a substrate transfer robot B and a second cleaning unit, wherein the wafer box unit is used for storing a wafer; the substrate transfer robot A is used for carrying out wafer transmission between the wafer box unit and the middle unit; the middle unit is used for caching and overturning the wafer; the substrate transfer robot B is used for carrying out wafer transmission between the intermediate unit and the cleaning unit; the first cleaning unit and the second cleaning unit are respectively arranged at two sides of the substrate transfer robot B and are used for cleaning the back and the front of the wafer. The invention achieves the effect that more substrates are sent out and sent into the transfer system within the highest unit time on the premise of the maximum speed of the robot, and solves the defect that the robot cannot transfer the substrates for processing in time due to more process sequences.
Description
Technical Field
The invention belongs to the technical field of wafer cleaning, and particularly relates to a high-efficiency transfer system for double-sided treatment of a substrate.
Background
The semiconductor industry has historically paid much attention to the development of the equipment industry. In fact, the yield of chip manufacture starts to decrease from 90 nm or less because more than 70% of the investment in the global semiconductor industry is used for purchasing devices, and one of the main reasons is that the cleaning of particles and contamination on the silicon wafer is difficult. As the wires are made thinner to below 45 nm, essentially the entire process is cleaned once every two steps, and almost every step is not cleaned if a higher yield is desired. Advanced semiconductor cleaning equipment has long been dominated by several industry-intensive countries in the united states, japan and europe, as the most critical one of the integrated circuit industry chain. As semiconductor processes move from 2D to 3D, finfets present new challenges to silicon wafer cleaning, and patterned structure wafer cleaning is much more complex in technology and requirements than cleaning of flat surfaces. Along with the reduction of the line width and the increase of the depth-to-width ratio, the difficulty of the cleaning process is rapidly increased, and the importance degree of the silicon wafer cleaning is increasingly highlighted. In the traditional cleaning process, because the cleaning formula time is relatively short, the output of the cleaning equipment is limited by the productivity of the robot, the cleaning unit cannot be fully utilized, along with the increase of cleaning steps, a factory can only purchase more cleaning equipment, a large amount of factory space is occupied, the factory building of a purification room is small in size and large in size, and the output of the cleaning equipment is not limited by the robot which is a topic always concerned about.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide an efficient substrate double-side processing transfer system, so as to solve the problem that in the existing substrate transfer process, due to the fact that the robot has many process sequences, the substrate cannot be transferred in time for processing.
In order to achieve the purpose, the invention adopts the following technical scheme:
a high-efficiency transfer system for double-sided treatment of a substrate comprises a wafer box unit, a substrate transfer robot A, an intermediate unit, a first cleaning unit, a substrate transfer robot B and a second cleaning unit, wherein the wafer box unit is used for storing wafers; the substrate transfer robot A is used for carrying out wafer transmission between the wafer box unit and the middle unit; the intermediate unit is used for caching and overturning the wafer; the substrate transfer robot B is used for carrying out wafer transmission between the intermediate unit and the cleaning unit; the first cleaning unit and the second cleaning unit are respectively arranged on two sides of the substrate transfer robot B and used for cleaning the back and the front of the wafer.
The middle unit is arranged between the substrate transfer robot A and the substrate transfer robot B and comprises a substrate sending-out transition unit, a substrate front overturning unit and a substrate rear overturning unit which are arranged from bottom to top, wherein the substrate sending-out transition unit is used for caching cleaned wafers, and the substrate front overturning unit and the substrate rear overturning unit are used for overturning the wafers.
The first cleaning unit and the second cleaning unit are identical in structure and comprise an upper cleaning area and a lower cleaning area, a plurality of substrate front cleaning units are arranged in the upper cleaning area, and a plurality of back cleaning units are arranged in the lower cleaning area.
The substrate transfer robot B conveys the wafer with the back face facing upwards after being turned in the substrate front turning unit into the back face cleaning unit for back face cleaning, conveys the cleaned wafer in the back face cleaning unit into the substrate rear turning unit, turns the wafer to the front face upwards by the substrate rear turning unit, conveys the wafer with the front face upwards into the substrate front face cleaning unit for front face cleaning, and conveys the wafer with the front face upwards into the substrate sending-out transition unit through the substrate transfer robot B.
The substrate transfer robot A and the substrate transfer robot B both comprise mechanical arms and mechanical arms arranged at the tail ends of the mechanical arms, the mechanical arms comprise palms and two fingers arranged on two sides of the palms, and the edges of wafers are lifted through the two fingers to complete the conveying of the wafers.
The palm is provided with two palm supporting bulges between the fingers, and the palm supporting bulges and the two fingers support the edge part of the wafer together.
The film box units are multiple and arranged in a straight line shape.
The invention has the advantages and beneficial effects that: the invention achieves the effect that the robot can be sent out and sent into the transfer system in the highest unit time on the premise of the maximum speed of the robot, and solves the defect that the robot can not transfer the substrate to process in time due to multiple process sequences.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a side view of the present invention;
FIG. 3 is a schematic view of the structure of a robot hand of the substrate transfer robot according to the present invention;
FIG. 4 is a schematic diagram of a wafer grabbed by a robot according to the present invention.
In the figure: the device comprises a wafer box unit 1, a substrate transfer robot A2, a middle unit 3, a first cleaning unit 4, a substrate transfer robot B5, a second cleaning unit 6, a substrate sending transition unit 7, a substrate front overturning unit 8, a substrate rear overturning unit 9, a substrate back cleaning unit 10, a substrate front cleaning unit 11, a mechanical arm 12, a mechanical arm 13, a palm 131, a palm supporting bulge 132, a finger 133, a turnover mechanism 14, a wafer 15 and wafer positioning columns a, B, c and d.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-2, the present invention provides a high-efficiency transfer system for double-sided processing of a substrate, which includes a cassette unit 1, a substrate transfer robot a2, an intermediate unit 3, a first cleaning unit 4, a substrate transfer robot B5, and a second cleaning unit 6, wherein the cassette unit 1 is used for storing wafers; the substrate transfer robot A2 is used for wafer transmission between the cassette unit 1 and the middle unit 3; the middle unit 3 is used for caching and overturning the wafer; the substrate transfer robot B5 is used for wafer transfer between the intermediate unit 3 and the cleaning unit; the first cleaning unit 4 and the second cleaning unit 6 are respectively disposed at both sides of the substrate transfer robot B5, and are used to clean the back and front surfaces of the wafer.
As shown in fig. 2, the intermediate unit 3 is disposed between the substrate transfer robot a2 and the substrate transfer robot B5, and includes a substrate sending-out transition unit 7, a substrate front-turning unit 8, and a substrate rear-turning unit 9 disposed from bottom to top, where the substrate sending-out transition unit 7 is used for buffering cleaned wafers, and the substrate front-turning unit 8 and the substrate rear-turning unit 9 are used for turning the wafers.
In the embodiment of the present invention, two substrate front surface cleaning units 11 are disposed in the upper layer cleaning region of each of the first cleaning unit 4 and the second cleaning unit 6, and two back surface cleaning units 10 are disposed in the lower layer cleaning region. The film box units 1 are multiple and arranged in a straight line.
The substrate transfer robot B5 conveys the wafer with the inverted back side facing up in the front substrate overturning unit 8 into the back cleaning unit 10 for back cleaning, conveys the cleaned wafer in the back cleaning unit 10 into the back substrate overturning unit 9, overturns the wafer to the front side up by the back substrate overturning unit 9, conveys the wafer with the front side up into the front substrate cleaning unit 11 for front cleaning by the substrate transfer robot B5, and conveys the wafer with the front side up into the substrate sending-out transition unit 7 through the substrate transfer robot B5.
As shown in fig. 3, each of the substrate transfer robot a2 and the substrate transfer robot B5 includes a robot arm 12 and a robot arm 13 disposed at the end of the robot arm 12, the robot arm 13 includes a palm 131 and two fingers 133 disposed at two sides of the palm 131, and the two fingers 133 lift the edge of the wafer to complete the wafer transportation.
Further, the palm 131 is provided with a palm support protrusion 132 located between the two fingers 133, the palm support protrusion 132 and the two fingers 133 support the edge portion of the wafer together, as shown in fig. 4, the two fingers 133 avoid the wafer positioning pillars a, b, c, d on the turnover mechanism 14.
The finger 133 of the substrate transfer robot a2 can take and transfer the substrate in the cassette unit 1 and the substrate on the flip unit according to the use requirement, and the conventional mechanical finger can only take and transfer the substrate in the cassette.
The wafer transfer process of the invention is as follows:
the substrate transfer robot a2 takes out the substrate from the cassette unit 1 (the number of the substrates can be increased arbitrarily), and sends the substrate to the substrate front-overturning unit 8 to overturn the substrate, so that the back of the substrate is arranged above; the substrate transfer robot B5 takes out the substrate from the substrate pre-reversal unit 8, carries it into the substrate back surface cleaning unit 10, after cleaning by the substrate back surface cleaning unit 10, takes out the substrate from the substrate back surface cleaning unit 10 by the substrate transfer robot B5, carries it into the substrate post-reversal unit 9 to reverse the substrate so that the front surface of the substrate is positioned above, takes out the substrate from the substrate post-reversal unit 9 by the substrate transfer robot B5, carries it into the substrate front surface cleaning unit 11, after cleaning by the substrate front surface cleaning unit 11, takes it out from the substrate front surface cleaning unit 11 by the substrate transfer robot B5, carries it into the substrate carry-out transition unit 7, takes it out from the substrate carry-out transition unit 7 by the substrate transfer robot a2, and returns it to the cassette unit 1.
In the present invention, both the turnover mechanism 14 and the cleaning unit are known in the art.
The invention provides a high-efficiency transfer system for double-sided treatment of a substrate, which is characterized in that a wafer box unit, a substrate sending-out transition unit, a substrate front turning unit, a substrate rear turning unit, a substrate back cleaning unit and a substrate front cleaning unit are utilized to change the transfer sequence of a substrate transfer robot, so that more substrates can be sent out and sent into the transfer system within the highest unit time on the premise of the maximum speed of the substrate transfer robot, and the defect that the substrate transfer robot cannot transfer the substrate for treatment in time due to more process sequences is overcome.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, extension, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (7)
1. The high-efficiency transfer system for double-sided treatment of the substrate is characterized by comprising a wafer box unit (1), a substrate transfer robot A (2), an intermediate unit (3), a first cleaning unit (4), a substrate transfer robot B (5) and a second cleaning unit (6),
the wafer box unit (1) is used for storing wafers;
the substrate transfer robot A (2) is used for carrying out wafer transmission between the wafer box unit (1) and the middle unit (3);
the intermediate unit (3) is used for caching and overturning wafers;
the substrate transfer robot B (5) is used for carrying out wafer transmission between the intermediate unit (3) and the cleaning unit;
the first cleaning unit (4) and the second cleaning unit (6) are respectively arranged on two sides of the substrate transfer robot B (5) and used for cleaning the back and the front of the wafer.
2. The efficient transfer system for double-sided substrate processing according to claim 1, wherein the intermediate unit (3) is disposed between the substrate transfer robot a (2) and the substrate transfer robot B (5), and comprises a substrate sending-out transition unit (7), a substrate front-turning unit (8) and a substrate rear-turning unit (9) disposed from bottom to top, wherein the substrate sending-out transition unit (7) is used for buffering the cleaned wafer, and the substrate front-turning unit (8) and the substrate rear-turning unit (9) are used for turning the wafer.
3. The high-efficiency transfer system for double-sided substrate processing according to claim 2, wherein the first cleaning unit (4) and the second cleaning unit (6) have the same structure and each comprise an upper cleaning area and a lower cleaning area, the upper cleaning area is provided with a plurality of front substrate cleaning units (11), and the lower cleaning area is provided with a plurality of back cleaning units (10).
4. The efficient substrate double-sided processing transfer system according to claim 3, wherein the substrate transfer robot B (5) conveys the wafer with the back side facing upwards in the front substrate turnover unit (8) into the back side cleaning unit (10) for back side cleaning, conveys the wafer cleaned in the back side cleaning unit (10) into the back substrate turnover unit (9), turns the wafer to the front side upwards in the back substrate turnover unit (9), conveys the wafer with the front side facing upwards into the front substrate cleaning unit (11) for front side cleaning, and conveys the wafer with the front side facing upwards into the substrate sending-out transition unit (7) through the substrate transfer robot B (5).
5. The system for high-efficiency transfer of double-sided substrate processing according to claim 1, wherein the substrate transfer robot A (2) and the substrate transfer robot B (5) each comprise a robot arm (12) and a robot arm (13) disposed at an end of the robot arm (12), the robot arm (13) comprises a palm (131) and two fingers (133) disposed at two sides of the palm (131), and the two fingers (133) lift an edge of a wafer to complete wafer transportation.
6. The system of claim 5, wherein the palm (131) is provided with a palm support protrusion (132) located between the two fingers (133), and the palm support protrusion (132) and the two fingers (133) support the edge of the wafer together.
7. The system for high-efficiency transfer of double-sided processing of substrates as claimed in claim 1, wherein the cassette unit (1) is plural and arranged in a line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811317569.5A CN111162032A (en) | 2018-11-07 | 2018-11-07 | High-efficient transfer system of two-sided processing of base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811317569.5A CN111162032A (en) | 2018-11-07 | 2018-11-07 | High-efficient transfer system of two-sided processing of base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111162032A true CN111162032A (en) | 2020-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811317569.5A Pending CN111162032A (en) | 2018-11-07 | 2018-11-07 | High-efficient transfer system of two-sided processing of base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111162032A (en) |
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2018
- 2018-11-07 CN CN201811317569.5A patent/CN111162032A/en active Pending
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