CN208738551U - 高密度mini版芯片侧高速连接器及印刷电路板布局结构 - Google Patents
高密度mini版芯片侧高速连接器及印刷电路板布局结构 Download PDFInfo
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7017—Snap means
- H01R12/7023—Snap means integral with the coupling device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7017—Snap means
- H01R12/7029—Snap means not integral with the coupling device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
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Abstract
本实用新型提供一种高密度MINI版芯片侧高速连接器及一种印刷电路板布局结构。高密度MINI版芯片侧高速连接器包括一板端连接器、一线端连接器及一印刷电路板;所述板端连接器设置在所述印刷电路板上;所述板端连接器包括,一外壳、一板端连接器主体,所述板端连接器主体设置于所述外壳内;所述线端连接器包括,一壳体、一舌板,所述舌板固定于所述壳体;其中,所述外壳至少延伸出一引导件,所述壳体设有至少一用于与所述引导件对接的引导槽。本实用新型的连接器最大程度的利用了板端的空间,解决了CPU因散热模块尺寸扩大而占据板端空间的情况,并能够实现高速传输数据。
Description
技术领域
本发明涉及一种连接器,特别是涉及一种高密度MINI版芯片侧高速连接器。
背景技术
随着网络时代增进,对数据处理和传输速度的要求增加;相对应服务器、工作站、I/O存储器里的CPU的性能和元器件的密度同步提升,对元器件的尺寸与服务器散热有一定的挑战。一般散热器会占据印刷电路板上较大的空间,散热器与印刷电路板之间在高度方向上的间隔较小,传统的连接器不能配置在散热器的下方,从而很难利用散热器下方的多余空间,造成印刷电路板空间的浪费。
实用新型内容
本实用新型所要解决的技术问题是提供一种高密度MINI版芯片侧高速连接器。本实用新型的连接器尺寸小,高度设计成3.7mm以下,可以摆放在芯片的散热器底下,传输速度达到56Gbit/s。最大程度的利用了板端的空间,解决了CPU因散热模块尺寸扩大而占据板端空间的情况。
为了实现上述目的,本实用新型提供了一种高密度MINI版芯片侧高速连接器,包括有:
一板端连接器、一线端连接器及一印刷电路板;
所述板端连接器设置在所述印刷电路板上;
所述板端连接器包括,一外壳、一板端连接器主体,所述板端连接器主体设置于所述外壳内;
所述线端连接器包括,一壳体、一舌板,所述舌板固定于所述壳体;其中,
所述外壳至少延伸出一引导件,所述壳体设有至少一用于与所述引导件对接的引导槽。
上述的高密度MINI版芯片侧高速连接器,其中,所述引导件包括至少一焊接脚,所述焊接脚插设在所述印刷电路板上。
上述的高密度MINI版芯片侧高速连接器,其中,所述引导槽的边缘设有至少一导向凸块。
上述的高密度MINI版芯片侧高速连接器,其中,所述导向凸块由所述壳体延伸形成,且所述导向凸块至少包围部分所述引导槽。
上述的高密度MINI版芯片侧高速连接器,其中,所述引导件设置于所述至少一导向凸块与所述壳体之间。
上述的高密度MINI版芯片侧高速连接器,其中,所述外壳及所述壳体在所述印刷电路板上的高度小于3.7毫米。
上述的高密度MINI版芯片侧高速连接器,其中,所述外壳覆盖部份所述壳体。
上述的高密度MINI版芯片侧高速连接器,其中,所述壳体上还设置有用于与所述外壳卡扣的解锁卡扣。
上述的高密度MINI版芯片侧高速连接器,其中,所述引导件为两个,分别设置在所述外壳两侧;所述引导槽为两个,分别设置在所述壳体两侧。
本发明还提供一种印刷电路板布局结构,包括:连接器、芯片及设置在所述芯片上的一散热器,所述连接器设置于所述散热器的下方,所述连接器为上述任意一种所述的高密度MINI版芯片侧高速连接器。
本实用新型的有益功效在于:最大程度的利用了板端的空间,解决了CPU 因散热模块尺寸扩大而占据板端空间的情况,并能够实现高速传输数据。
以下结合附图和具体实施例对本实用新型进行详细描述,但不作为对本实用新型的限定。
附图说明
图1是本实用新型连接器分体状态的立体示意图;
图2是本实用新型连接器使用状态的立体示意图;
图3是本实用新型连接器俯视示意图;
图4是本实用新型连接器侧视示意图;
图5是本实用新型连接器连接部分放大示意图;
图6是本实用新型连接器解锁卡扣部分放大示意图;
图7是本实用新型连接器接合部分放大示意图;
图8是本实用新型板端连接器结构***示意图;
图9是使用本实用新型连接器的***结构示意图;
图10是本实用新型连接器结构***示意图。
其中,附图标记:
100、连接器
101、板端连接器外壳
102、板端连接器主体
103、线端壳体
104、舌板
105、解锁卡扣
106、板端连接器
107、线端连接器
109、印刷电路板
110、引导件
111、导向凸块
112、引导槽
113、焊接脚
114、卡扣凹槽
115、凹槽
116、台阶
117、导电端子
118、导电塑胶
具体实施方式
下面结合附图对本实用新型的结构原理和工作原理作具体的描述:
图1是本实用新型连接器分体状态的立体示意图。如图1所示,本实用新型的高密度MINI版芯片侧高速连接器100包括板端连接器106、线端连接器 107以及印刷电路板109。板端连接器106与线端连接器107两部分配合使用。
其中板端连接器106安装在印刷电路板109上,更包括板端连接器外壳 101以及板端连接器主体102,板端连接器主体102嵌入在板端连接器外壳101 内。
线端连接器107包括线端壳体103、舌板104、线端本体(图中未示出) 以及解锁卡扣105。舌板104被线端本体包覆,线端壳体103包覆并固定于线端本体上,解锁卡扣105安装在线端壳体103的两侧。
图2是本实用新型连接器使用状态的立体示意图。如图2所示,在使用时,将线端连接器107与板端连接器106对准并***板端连接器106,***后按下解锁卡扣105,使得线端连接器107与板端连接器106可以紧密结合。
图3是本实用新型连接器俯视示意图。如图3所示,本实用新型的连接器 100在线端连接器107与板端连接器106结合之后,主体部分长度为L,优选为18-20毫米,宽度为W,优选为13-15毫米。
图4是本实用新型连接器侧视示意图。如图4所示,本实用新型的连接器 100在线端连接器107与板端连接器106结合之后,主体部分的厚度为H,主体部分的厚度H小于3.7毫米。
图5是本实用新型连接器连接部分放大示意图。如图5所示,板端连接器外壳101的两侧具有板端连接器106向外延伸伸出的两个引导件110,引导件 110与板端连接器外壳101一体设置。线端壳体103的两侧具有向外延伸伸出的至少一个导向凸块111,导向凸块111与线端壳体103一体设置。线端壳体 103的两侧表面具有相向凹陷的引导槽112。导向凸块111设置于引导槽112 的边缘,且导向凸块111包围至少部份的引导槽112。
在将线端连接器107***板端连接器106时,需将板端连接器106的两个引导件110与线端连接器107的引导槽112对准之后,再将线端连接器107 ***板端连接器106。插接过程中,引导件110、导向凸块111以及引导槽112 相互配合,提供线端连接器107与板端连接器106的插接对位机制,防止在错误方向误插。
将线端连接器107***板端连接器106时,引导件110插接在引导槽112 中,使引导件110设置于线端壳体103及导向凸块111之间,位于引导件110 两侧的导向凸块111与引导件110抵接在一起,能够防止线端连接器107因线材弯折引起线端连接器107在对接方向之外的不当施力,降低板端连接器106 与线端连接器107对接时的损坏风险。
此外,在引导件110的一端还设置有一焊接脚113,焊接脚113由引导件 110延伸伸出而形成,与引导件110一体形成。焊接脚113插设在印刷电路板 109上,能够起到固定引导件110从而增强引导件110固定强度的作用。
图6是本实用新型连接器解锁卡扣部分放大示意图。在线端壳体103的外部两侧还设置有卡扣凹槽114,板端连接器外壳101的后端部设置有凹槽 115,在将线端连接器107***板端连接器106后,按下解锁卡扣105,解锁卡扣105扣入凹槽115,卡扣凹槽114抵接解锁卡扣105,引导槽112容置引导件110,因引导件110固定线端连接器107的线端壳体103,使线端连接器 107降低在垂直对接方向上的位移,其中导向凸块111及卡扣凹槽114设置于引导件110两侧,由于导向凸块111及卡扣凹槽114设置于引导件110两侧的设计,从而可以避免线端连接器107侧的线材过度弯折而带动线端连接器107 的移动,还可以避免连接器上翘,从而造成损坏。
图7是本实用新型连接器接合部分放大示意图。如图7所示,在线端壳体 103的上表面上,与板端连接器106的结合的部分设置有台阶116,使得线端连接器107与板端连接器106结合之后,线端壳体103的一部分嵌入在板端连接器外壳101内,两者形成一重叠部分,可以避免周边电路或器件对连接器造成的干扰。
图8是本实用新型板端连接器结构***示意图。如图8所示,板端连接器 106具体还包括上下两层端子117,在上下两层端子117之间设置有导电塑胶 118,用于优化连接器的信号完整性(Signal Integrity)谐振。
图9是使用本实用新型连接器的***结构示意图。如图9所示,使用本实用新型连接器100的***10包括芯片11、散热模块12以及连接器100,由图可以看出,连接器100设置在散热模块12的下方,并配置在芯片11的侧面。因此,可以充分利用散热模块12下方的空间,最大程度的利用了印刷电路板的空间,解决了CPU因散热模块尺寸扩大而占据空间的情况。
图10是本实用新型连接器结构***示意图。具体结构已进行描述,在此不再赘述。
当然,本实用新型还可有其它多种实施例,在不背离本实用新型精神及其实质的情况下,熟悉本领域的技术人员当可根据本实用新型作出各种相应的改变和变形,但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。
Claims (10)
1.一种高密度MINI版芯片侧高速连接器,包括:
一板端连接器、一线端连接器及一印刷电路板;
所述板端连接器设置在所述印刷电路板上;
所述板端连接器包括,一外壳、一板端连接器主体,所述板端连接器主体设置于所述外壳内;
所述线端连接器包括,一壳体、一舌板以及一线端本体,所述线端本体包覆所述舌板,所述壳体包覆于所述线端本体上;其中,
所述外壳至少延伸出一引导件,所述壳体设有至少一用于与所述引导件对接的引导槽。
2.根据权利要求1所述的高密度MINI版芯片侧高速连接器,其中,所述引导件包括至少一焊接脚,所述焊接脚插设在所述印刷电路板上。
3.根据权利要求1所述的高密度MINI版芯片侧高速连接器,其中,所述引导槽的边缘设有至少一导向凸块。
4.根据权利要求3所述的高密度MINI版芯片侧高速连接器,其中,所述导向凸块由所述壳体延伸形成,且所述导向凸块至少包围部分所述引导槽。
5.根据权利要求3所述的高密度MINI版芯片侧高速连接器,其中,所述引导件设置于所述至少一导向凸块与所述壳体之间。
6.根据权利要求3所述的高密度MINI版芯片侧高速连接器,其中,所述外壳及所述壳体在所述印刷电路板上的高度小于3.7毫米。
7.根据权利要求1所述的高密度MINI版芯片侧高速连接器,其中,所述外壳覆盖部份所述壳体。
8.根据权利要求1所述的高密度MINI版芯片侧高速连接器,其中,所述壳体上还设置有用于与所述外壳卡扣的解锁卡扣。
9.根据权利要求1所述的高密度MINI版芯片侧高速连接器,其中,所述引导件为两个,分别设置在所述外壳两侧;所述引导槽为两个,分别设置在所述壳体两侧。
10.一种印刷电路板布局结构,包括:连接器、芯片及设置在所述芯片上的一散热器,所述连接器设置于所述散热器的下方,所述连接器为根据权利要求1-9中任意一种所述的高密度MINI版芯片侧高速连接器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN201820826642.0U CN208738551U (zh) | 2018-05-30 | 2018-05-30 | 高密度mini版芯片侧高速连接器及印刷电路板布局结构 |
US16/397,406 US10833437B2 (en) | 2018-05-30 | 2019-04-29 | High-speed connector on high-density mini version chip side |
US17/036,413 US11322868B2 (en) | 2018-05-30 | 2020-09-29 | Electrical connector assembly with lockable structures |
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US11322868B2 (en) | 2018-05-30 | 2022-05-03 | Dongguan Luxshare Technologies Co., Ltd | Electrical connector assembly with lockable structures |
CN113161792A (zh) * | 2020-01-07 | 2021-07-23 | 东莞立讯技术有限公司 | 电连接器 |
CN113161792B (zh) * | 2020-01-07 | 2022-06-21 | 东莞立讯技术有限公司 | 电连接器 |
CN113410706A (zh) * | 2021-06-25 | 2021-09-17 | 中航光电科技股份有限公司 | 线缆连接器 |
CN113410706B (zh) * | 2021-06-25 | 2022-04-01 | 中航光电科技股份有限公司 | 线缆连接器 |
Also Published As
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US10833437B2 (en) | 2020-11-10 |
US20210013644A1 (en) | 2021-01-14 |
US11322868B2 (en) | 2022-05-03 |
US20190372251A1 (en) | 2019-12-05 |
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Effective date of registration: 20200603 Address after: 523808 Room 401, building 2, No. 5, information road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Dongguan Lixun Technology Co.,Ltd. Address before: 518104, Shenzhen, Guangdong, Baoan District province manhole street, oyster West, SANYO new industrial zone, A building, 2 floor Patentee before: Shenzhen Luxshare Precision Industry Co.,Ltd. |