CN208595441U - A kind of LED lamp panel - Google Patents

A kind of LED lamp panel Download PDF

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Publication number
CN208595441U
CN208595441U CN201820309521.9U CN201820309521U CN208595441U CN 208595441 U CN208595441 U CN 208595441U CN 201820309521 U CN201820309521 U CN 201820309521U CN 208595441 U CN208595441 U CN 208595441U
Authority
CN
China
Prior art keywords
led lamp
chips
lamp panel
red light
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820309521.9U
Other languages
Chinese (zh)
Inventor
王闯
辛双宇
朱革
姚传刚
陈双龙
周航健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bohai University
Original Assignee
Bohai University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bohai University filed Critical Bohai University
Priority to CN201820309521.9U priority Critical patent/CN208595441U/en
Application granted granted Critical
Publication of CN208595441U publication Critical patent/CN208595441U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of LED lamp panel, it include: substrate, multiple luminescence units and fluorescent adhesive layer, the substrate is cylindrical shell, the multiple luminescence unit is evenly arranged in the outer surface of cylindrical shell, institute's fluorescent adhesive layer is wrapped on multiple luminescence units, the luminescence unit includes a red light chips and multiple blue chips around red light chips setting, and the red light chips and blue chip are concatenated using metal wire.The LED lamp panel of the utility model, 360 ° of circumferential transmission that light can be achieved can effectively provide the colour rendering of LED lamp panel by the way that the luminescence unit of red light chips and blue chip composition is arranged on substrate, feux rouges intrinsic brightness height also will increase the brightness of product, to improve light efficiency.Substrate is made of transparent material, can further improve light extraction efficiency.

Description

A kind of LED lamp panel
Technical field
The utility model belongs to LED field, in particular to a kind of LED lamp panel.
Background technique
With the development of science and technology, LED light gradually replaces traditional illuminator.Existing LED light is provided with light emitting module, packet The lens for including substrate, being set to the LED chip of substrate side and being coated on LED chip surface.Existing substrate itself does not have Translucency, optical path at most can only realize 180 ° of planar transmissions in the side for being provided with LED chip, and Integral luminous angle is smaller, shadow Ring illuminating effect.Meanwhile fluorescent powder is arranged generally on blue-light LED chip and then obtains white light for existing LED light, LED light Whole colour rendering is lower.Also red fluorescence powder and yellow fluorescent powder by using peak value wavelength promote colour rendering index, But also resulting in light efficiency simultaneously accordingly reduces.
Utility model content
In order to solve the above technical problems, the purpose of the utility model is to provide a kind of LED lamp panel, light emitting angle is big, has High color rendering index (CRI) and high photosynthetic efficiency.
The utility model provides a kind of LED lamp panel, comprising: substrate, multiple luminescence units and fluorescent adhesive layer, the substrate are Cylindrical shell, the multiple luminescence unit are evenly arranged in the outer surface of cylindrical shell, and institute's fluorescent adhesive layer is wrapped in multiple shine On unit, the luminescence unit include a red light chips and around the red light chips setting four blue chips, it is described Red light chips and blue chip are concatenated using metal wire.
In the LED lamp panel of the utility model, the fluorescent adhesive layer is mixed with spread powder.
In the LED lamp panel of the utility model, the fluorescent adhesive layer mixes and is additionally provided with transparent adhesive layer between luminescence unit.
In the LED lamp panel of the utility model, the substrate is transparent substrate.
In the LED lamp panel of the utility model, the substrate is equipped with multiple thermal vias.
In the LED lamp panel of the utility model, the luminescence unit include a red light chips and four blue chips, four A blue chip is distributed in the quadrangle of the red light chips.
In the LED lamp panel of the utility model, the luminescence unit include a red light chips and three blue chips, three A blue chip is distributed in around the red light chips in Chinese character pin-shaped.
The utility model constitutes the main body of LED lamp panel, it can be achieved that 360 ° of light circumferential transmission by using cylindrical substrate, The luminescence unit formed by the way that red light chips and blue chip are arranged on substrate, can effectively provide the colour rendering of LED lamp panel, Feux rouges intrinsic brightness height also will increase the brightness of product, to improve light efficiency.Substrate is made of transparent material, can further improve Light extraction efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the LED lamp panel of the utility model.
Specific embodiment
As shown in Figure 1, a kind of LED lamp panel of the utility model, comprising: substrate 1, multiple luminescence units 2 and fluorescent adhesive layer 3.The substrate 1 is cylindrical shell, and the multiple 2 yuan of luminous list is evenly arranged in the outer surface of cylindrical shell, institute's fluorescent adhesive layer 3 It is wrapped on multiple luminescence units, the luminescence unit 2 includes a red light chips 21 and is arranged around the red light chips Multiple blue chips 22, the red light chips 21 and blue chip 22 are concatenated using metal wire.
In the utility model embodiment, since the fluorescent powder in the fluorescent adhesive layer 3 excites meeting by the blue chip 22 Yellow light is issued, and the yellow light cooperation that the blue light and the fluorescent powder that the blue chip 22 issues issue will form white light, in turn The LED lamp panel can be made to issue white light.Due to the colour rendering index of the blue chip 22 and fluorescent powder cooperation gained white light It is not high, therefore compensated by the way that the red light chips 21 are arranged, to obtain the light of low color temperature and high-color rendering simultaneously.The feux rouges The setting quantity of chip 21 is generally far fewer than the setting quantity of the blue chip 22, the blue chip 21 and red light chips 22 Allocation ratio can be specifically arranged according to required obtained light efficiency.
When it is implemented, luminescence unit 2 may include a red light chips 21 and four blue chips 22, four blue chips 22 are distributed in the quadrangle of the red light chips 21.
When it is implemented, luminescence unit 2 may include a red light chips 21 and three blue chips 22, three blue chips 22 are distributed in around the red light chips 21 in Chinese character pin-shaped.
In the LED lamp panel of the utility model, spread powder is mixed in the fluorescent adhesive layer 3.It is mixed into fluorescent adhesive layer 3 A certain proportion of spread powder can effectively improve luminous flux, make light source space colour temperature uniformity.
In the LED lamp panel of the utility model, transparent adhesive layer is additionally provided between the fluorescent adhesive layer 3 and luminescence unit 2. The distance between fluorescent adhesive layer 3 and luminescence unit 2 can be increased by the way that transparent adhesive layer is arranged, can be reduced since luminescence unit 2 dissipates The problem that thermally-induced fluorescent powder launching efficiency is low, light efficiency is low, decaying is big.
In the LED lamp panel of the utility model, the substrate 1 is transparent substrate.When it is implemented, it is preferred that only using having The transparent ceramic material of special optical property is made, while by means of the heat-resisting quantity, oxidative resistance, electricity of transparent ceramic material itself Insulating properties and resist the performances such as voltage resistance, sufficiently improves the overall quality of the LED lamp panel.Certainly, the substrate 1 also can be used as Other any suitable materials such as transparent plastic material resistant to high temperature are made.
In the LED lamp panel of the utility model, the substrate 1 is equipped with multiple thermal vias 11.
The above is only the preferred embodiment of the present invention, the thought being not intended to limit the utility model, it is all Within the spirit and principles of the utility model, it is practical new to should be included in this for any modification, equivalent replacement, improvement and so on Within the protection scope of type.

Claims (5)

1. a kind of LED lamp panel characterized by comprising substrate, multiple luminescence units and fluorescent adhesive layer, the substrate are cylinder Shell, the multiple luminescence unit are evenly arranged in the outer surface of cylindrical shell, and institute's fluorescent adhesive layer is wrapped in multiple luminescence units On, the luminescence unit includes a red light chips and multiple blue chips around red light chips setting, the feux rouges Chip and blue chip are concatenated using metal wire;The substrate is equipped with multiple thermal vias, and the substrate is transparent substrate.
2. LED lamp panel as described in claim 1, which is characterized in that the fluorescent adhesive layer is mixed with spread powder.
3. LED lamp panel as described in claim 1, which is characterized in that be additionally provided between the fluorescent adhesive layer and luminescence unit Bright adhesive layer.
4. LED lamp panel as described in claim 1, which is characterized in that the luminescence unit includes a red light chips and four Blue chip, four blue chips are distributed in the quadrangle of the red light chips.
5. LED lamp panel as described in claim 1, which is characterized in that the luminescence unit includes a red light chips and three Blue chip, three blue chips are distributed in around the red light chips in Chinese character pin-shaped.
CN201820309521.9U 2018-03-06 2018-03-06 A kind of LED lamp panel Expired - Fee Related CN208595441U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820309521.9U CN208595441U (en) 2018-03-06 2018-03-06 A kind of LED lamp panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820309521.9U CN208595441U (en) 2018-03-06 2018-03-06 A kind of LED lamp panel

Publications (1)

Publication Number Publication Date
CN208595441U true CN208595441U (en) 2019-03-12

Family

ID=65599820

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820309521.9U Expired - Fee Related CN208595441U (en) 2018-03-06 2018-03-06 A kind of LED lamp panel

Country Status (1)

Country Link
CN (1) CN208595441U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110120190A (en) * 2019-04-10 2019-08-13 深圳康佳电子科技有限公司 A kind of Micro LED display panel and its control method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110120190A (en) * 2019-04-10 2019-08-13 深圳康佳电子科技有限公司 A kind of Micro LED display panel and its control method

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190312

Termination date: 20200306

CF01 Termination of patent right due to non-payment of annual fee